CN1160793C - 具有“埋置的极板式电极”的集成半导体存储器装置 - Google Patents
具有“埋置的极板式电极”的集成半导体存储器装置 Download PDFInfo
- Publication number
- CN1160793C CN1160793C CNB971983739A CN97198373A CN1160793C CN 1160793 C CN1160793 C CN 1160793C CN B971983739 A CNB971983739 A CN B971983739A CN 97198373 A CN97198373 A CN 97198373A CN 1160793 C CN1160793 C CN 1160793C
- Authority
- CN
- China
- Prior art keywords
- electrode
- source area
- semiconductor body
- groove
- pole plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 79
- 238000003860 storage Methods 0.000 title claims abstract description 55
- 239000003990 capacitor Substances 0.000 claims abstract description 26
- 230000004888 barrier function Effects 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 25
- 238000009413 insulation Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
Landscapes
- Semiconductor Memories (AREA)
- Dram (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19640215A DE19640215C1 (de) | 1996-09-30 | 1996-09-30 | Integrierte Halbleiterspeicheranordnung mit "Buried-Plate-Elektrode" |
DE19640215.8 | 1996-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1231767A CN1231767A (zh) | 1999-10-13 |
CN1160793C true CN1160793C (zh) | 2004-08-04 |
Family
ID=7807380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB971983739A Expired - Lifetime CN1160793C (zh) | 1996-09-30 | 1997-09-26 | 具有“埋置的极板式电极”的集成半导体存储器装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6627934B1 (zh) |
EP (1) | EP0931347A1 (zh) |
JP (1) | JP3898766B2 (zh) |
KR (1) | KR100291565B1 (zh) |
CN (1) | CN1160793C (zh) |
DE (1) | DE19640215C1 (zh) |
TW (1) | TW364202B (zh) |
WO (1) | WO1998015007A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9305929B1 (en) | 2015-02-17 | 2016-04-05 | Micron Technology, Inc. | Memory cells |
US10134982B2 (en) | 2015-07-24 | 2018-11-20 | Micron Technology, Inc. | Array of cross point memory cells |
US10396145B2 (en) | 2017-01-12 | 2019-08-27 | Micron Technology, Inc. | Memory cells comprising ferroelectric material and including current leakage paths having different total resistances |
US11170834B2 (en) | 2019-07-10 | 2021-11-09 | Micron Technology, Inc. | Memory cells and methods of forming a capacitor including current leakage paths having different total resistances |
CN117337029A (zh) * | 2022-06-24 | 2024-01-02 | 长鑫存储技术有限公司 | 一种半导体结构及其形成方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR900001836B1 (ko) * | 1985-07-02 | 1990-03-24 | 마쯔시다덴기산교 가부시기가이샤 | 반도체기억장치 및 그 제조방법 |
EP0236089B1 (en) * | 1986-03-03 | 1992-08-05 | Fujitsu Limited | Dynamic random access memory having trench capacitor |
US4794434A (en) * | 1987-07-06 | 1988-12-27 | Motorola, Inc. | Trench cell for a dram |
JPH0797626B2 (ja) * | 1987-10-31 | 1995-10-18 | 日本電気株式会社 | Mis型半導体記憶装置 |
JPH01146354A (ja) * | 1987-12-02 | 1989-06-08 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH0262073A (ja) * | 1988-08-26 | 1990-03-01 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH0272663A (ja) * | 1988-09-07 | 1990-03-12 | Fujitsu Ltd | 半導体記憶装置 |
US5225698A (en) * | 1989-08-12 | 1993-07-06 | Samsung Electronics Co., Inc. | Semi-conductor device with stacked trench capacitor |
DE3931381A1 (de) * | 1989-09-20 | 1991-03-28 | Siemens Ag | Halbleiterschichtaufbau mit vergrabener verdrahtungsebene, verfahren fuer dessen herstellung und anwendung der vergrabenen verdrahtungsebene als vergrabene zellplatte fuer drams |
JPH0513676A (ja) | 1991-07-02 | 1993-01-22 | Toshiba Corp | 半導体装置 |
JP2994110B2 (ja) * | 1991-09-09 | 1999-12-27 | 株式会社東芝 | 半導体記憶装置 |
JP3151684B2 (ja) * | 1992-04-24 | 2001-04-03 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JPH06216336A (ja) * | 1992-10-27 | 1994-08-05 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JPH0786427A (ja) | 1993-09-10 | 1995-03-31 | Toshiba Corp | 半導体装置およびその製造方法 |
JP3224916B2 (ja) | 1993-09-10 | 2001-11-05 | 株式会社東芝 | 半導体装置の製造方法 |
KR0123751B1 (ko) * | 1993-10-07 | 1997-11-25 | 김광호 | 반도체장치 및 그 제조방법 |
JPH07193141A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | 半導体記憶装置 |
-
1996
- 1996-09-30 DE DE19640215A patent/DE19640215C1/de not_active Expired - Lifetime
-
1997
- 1997-09-26 JP JP51613498A patent/JP3898766B2/ja not_active Expired - Fee Related
- 1997-09-26 WO PCT/DE1997/002219 patent/WO1998015007A1/de not_active Application Discontinuation
- 1997-09-26 CN CNB971983739A patent/CN1160793C/zh not_active Expired - Lifetime
- 1997-09-26 EP EP97912027A patent/EP0931347A1/de not_active Withdrawn
- 1997-09-27 TW TW086114127A patent/TW364202B/zh not_active IP Right Cessation
-
1999
- 1999-03-16 KR KR1019997002211A patent/KR100291565B1/ko not_active IP Right Cessation
- 1999-03-30 US US09/281,696 patent/US6627934B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20000036160A (ko) | 2000-06-26 |
CN1231767A (zh) | 1999-10-13 |
JP3898766B2 (ja) | 2007-03-28 |
DE19640215C1 (de) | 1998-02-19 |
US6627934B1 (en) | 2003-09-30 |
WO1998015007A1 (de) | 1998-04-09 |
JP2000503814A (ja) | 2000-03-28 |
TW364202B (en) | 1999-07-11 |
EP0931347A1 (de) | 1999-07-28 |
KR100291565B1 (ko) | 2001-05-15 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER OWNER: SIEMENS AKTIENGESELLSCHAFT Effective date: 20130217 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130217 Address after: German Neubiberg Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: Siemens AG Effective date of registration: 20130217 Address after: Munich, Germany Patentee after: QIMONDA AG Address before: German Neubiberg Patentee before: Infineon Technologies AG |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160111 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: QIMONDA AG |
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CX01 | Expiry of patent term |
Granted publication date: 20040804 |
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