CN115066726A - 布线电路基板 - Google Patents

布线电路基板 Download PDF

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Publication number
CN115066726A
CN115066726A CN202080095672.9A CN202080095672A CN115066726A CN 115066726 A CN115066726 A CN 115066726A CN 202080095672 A CN202080095672 A CN 202080095672A CN 115066726 A CN115066726 A CN 115066726A
Authority
CN
China
Prior art keywords
wiring
terminal
layer
wiring pattern
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080095672.9A
Other languages
English (en)
Chinese (zh)
Inventor
藤村仁人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN115066726A publication Critical patent/CN115066726A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/02—Driving or moving of heads
    • G11B21/10—Track finding or aligning by moving the head ; Provisions for maintaining alignment of the head relative to the track during transducing operation, i.e. track following
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
    • G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
    • G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/596—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following for track following on disks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202080095672.9A 2020-02-17 2020-11-12 布线电路基板 Pending CN115066726A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-024024 2020-02-17
JP2020024024A JP7493952B2 (ja) 2020-02-17 2020-02-17 配線回路基板
PCT/JP2020/042346 WO2021166340A1 (ja) 2020-02-17 2020-11-12 配線回路基板

Publications (1)

Publication Number Publication Date
CN115066726A true CN115066726A (zh) 2022-09-16

Family

ID=77390583

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080095672.9A Pending CN115066726A (zh) 2020-02-17 2020-11-12 布线电路基板

Country Status (4)

Country Link
US (1) US12108529B2 (cg-RX-API-DMAC7.html)
JP (1) JP7493952B2 (cg-RX-API-DMAC7.html)
CN (1) CN115066726A (cg-RX-API-DMAC7.html)
WO (1) WO2021166340A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024168241A (ja) 2023-05-23 2024-12-05 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070295534A1 (en) * 2006-06-22 2007-12-27 Nitto Denko Corporation Wired circuit board
US20080000673A1 (en) * 2006-06-29 2008-01-03 Nitto Denko Corporation Wired circuit board
JP2008276922A (ja) * 2007-04-04 2008-11-13 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスク
JP2016051881A (ja) * 2014-09-02 2016-04-11 日東電工株式会社 配線回路基板
CN106852009A (zh) * 2015-12-07 2017-06-13 日东电工株式会社 带电路的悬挂基板和带电路的悬挂基板的制造方法
KR20180062098A (ko) * 2016-11-30 2018-06-08 엘지디스플레이 주식회사 백라이트유닛 및 이를 포함하는 액정표시장치
JP2018206459A (ja) * 2017-06-09 2018-12-27 日東電工株式会社 回路付サスペンション基板
CN110603905A (zh) * 2017-04-28 2019-12-20 日东电工株式会社 柔性布线电路基板、柔性布线电路基板的制造方法以及拍摄装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339834B2 (ja) * 2005-08-23 2009-10-07 日東電工株式会社 回路付サスペンション基板の製造方法
US8097811B2 (en) 2007-04-04 2012-01-17 Dai Nippon Printing Co., Ltd. Substrate for suspension
US8758910B2 (en) * 2010-06-29 2014-06-24 Dai Nippon Printing Co., Ltd. Substrate for suspension, and production process thereof
JP5810492B2 (ja) * 2010-09-01 2015-11-11 大日本印刷株式会社 サスペンション用基板、サスペンション、およびサスペンション用基板の製造方法
JP6043613B2 (ja) * 2012-12-11 2016-12-14 日東電工株式会社 回路付サスペンション基板
JP6360707B2 (ja) * 2014-04-21 2018-07-18 日東電工株式会社 配線回路基板
JP6466680B2 (ja) * 2014-10-14 2019-02-06 日東電工株式会社 回路付サスペンション基板
JP6420643B2 (ja) 2014-11-28 2018-11-07 日東電工株式会社 回路付サスペンション基板
JP6687490B2 (ja) 2016-09-07 2020-04-22 日東電工株式会社 回路付サスペンション基板および回路付サスペンション基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070295534A1 (en) * 2006-06-22 2007-12-27 Nitto Denko Corporation Wired circuit board
US20080000673A1 (en) * 2006-06-29 2008-01-03 Nitto Denko Corporation Wired circuit board
JP2008276922A (ja) * 2007-04-04 2008-11-13 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスク
JP2016051881A (ja) * 2014-09-02 2016-04-11 日東電工株式会社 配線回路基板
CN106852009A (zh) * 2015-12-07 2017-06-13 日东电工株式会社 带电路的悬挂基板和带电路的悬挂基板的制造方法
KR20180062098A (ko) * 2016-11-30 2018-06-08 엘지디스플레이 주식회사 백라이트유닛 및 이를 포함하는 액정표시장치
CN110603905A (zh) * 2017-04-28 2019-12-20 日东电工株式会社 柔性布线电路基板、柔性布线电路基板的制造方法以及拍摄装置
JP2018206459A (ja) * 2017-06-09 2018-12-27 日東電工株式会社 回路付サスペンション基板

Also Published As

Publication number Publication date
WO2021166340A1 (ja) 2021-08-26
US12108529B2 (en) 2024-10-01
US20230156914A1 (en) 2023-05-18
JP2021128813A (ja) 2021-09-02
JP7493952B2 (ja) 2024-06-03

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