CN114747301B - 电路基板以及电路基板的制造方法 - Google Patents

电路基板以及电路基板的制造方法 Download PDF

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Publication number
CN114747301B
CN114747301B CN202080078909.2A CN202080078909A CN114747301B CN 114747301 B CN114747301 B CN 114747301B CN 202080078909 A CN202080078909 A CN 202080078909A CN 114747301 B CN114747301 B CN 114747301B
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CN
China
Prior art keywords
low
tapered
ceramic material
insulating layer
circuit board
Prior art date
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Application number
CN202080078909.2A
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English (en)
Chinese (zh)
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CN114747301A (zh
Inventor
加藤知树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of CN114747301A publication Critical patent/CN114747301A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080078909.2A 2019-11-14 2020-10-06 电路基板以及电路基板的制造方法 Active CN114747301B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019206202 2019-11-14
JP2019-206202 2019-11-14
PCT/JP2020/037876 WO2021095401A1 (ja) 2019-11-14 2020-10-06 回路基板及び回路基板の製造方法

Publications (2)

Publication Number Publication Date
CN114747301A CN114747301A (zh) 2022-07-12
CN114747301B true CN114747301B (zh) 2024-06-04

Family

ID=75912649

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080078909.2A Active CN114747301B (zh) 2019-11-14 2020-10-06 电路基板以及电路基板的制造方法

Country Status (5)

Country Link
US (1) US12133328B2 (https=)
JP (1) JP7243856B2 (https=)
CN (1) CN114747301B (https=)
DE (1) DE112020004962T5 (https=)
WO (1) WO2021095401A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240072459A1 (en) * 2022-08-31 2024-02-29 Innolux Corporation Electrical connection structure and electronic device
WO2025173541A1 (ja) * 2024-02-13 2025-08-21 株式会社村田製作所 回路基板

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196548U (https=) * 1984-11-30 1986-06-21
JPH0714421A (ja) * 1993-06-23 1995-01-17 Murata Mfg Co Ltd バイアホール用導電性ペーストおよびそれを用いた多層セラミック基板
CN1281331A (zh) * 1999-07-19 2001-01-24 国际商业机器公司 带锚定焊盘的多层陶瓷衬底
JP2005026368A (ja) * 2003-06-30 2005-01-27 Tdk Corp 放熱用ビアホールを備えた積層基板および該基板を用いたパワーアンプモジュール
JP2008034884A (ja) * 2007-10-18 2008-02-14 Hitachi Metals Ltd セラミック積層基板およびこれを用いた積層電子部品
CN101371624A (zh) * 2006-01-23 2009-02-18 日立金属株式会社 导体浆料、多层陶瓷基板以及多层陶瓷基板的制造方法
JP2010171157A (ja) * 2009-01-22 2010-08-05 Sanyo Electric Co Ltd 電子素子用パッケージ及び電子部品
JP2012009609A (ja) * 2010-06-24 2012-01-12 Jtekt Corp 多層回路基板
CN104053302A (zh) * 2009-06-11 2014-09-17 罗杰斯公司 介电材料、由其形成子组件的方法以及由此形成的子组件
JP2015018857A (ja) * 2013-07-09 2015-01-29 三菱電機株式会社 高放熱基板、部品の放熱構造
JP2015038909A (ja) * 2012-07-13 2015-02-26 イビデン株式会社 配線板及びその製造方法
CN108029203A (zh) * 2015-09-18 2018-05-11 株式会社村田制作所 陶瓷多层基板
CN208597204U (zh) * 2016-01-07 2019-03-12 株式会社村田制作所 多层基板以及电子设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386339A (en) 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
JP2002234781A (ja) 2001-02-06 2002-08-23 Murata Mfg Co Ltd 銅メタライズ組成物ならびにそれを用いたセラミック配線基板およびその製造方法
US20070040245A1 (en) * 2003-11-17 2007-02-22 Jsr Corporation Anisotropic conductive sheet, manufacturing method thereof, and product using the same
JP4780939B2 (ja) 2004-07-28 2011-09-28 京セラ株式会社 発光装置
JP4493399B2 (ja) 2004-05-19 2010-06-30 京セラ株式会社 複合シート及び積層部品の製造方法
JP4748161B2 (ja) 2005-07-12 2011-08-17 株式会社村田製作所 多層配線基板及びその製造方法
JP2007208193A (ja) 2006-02-06 2007-08-16 Alps Electric Co Ltd セラミック基板
JP2008186919A (ja) 2007-01-29 2008-08-14 Alps Electric Co Ltd 積層セラミック配線板
JP5024348B2 (ja) * 2009-03-23 2012-09-12 株式会社デンソー 基板の表面に樹脂絶縁膜のパターンを形成する方法及び半導体装置
US8563873B2 (en) * 2009-03-31 2013-10-22 Ibiden Co., Ltd. Substrate with metal film and method for manufacturing the same
KR20110036149A (ko) * 2009-10-01 2011-04-07 삼성전기주식회사 다층 세라믹 기판 및 그 제조 방법
JP2015038910A (ja) * 2012-07-13 2015-02-26 イビデン株式会社 配線板及びその製造方法
JP5999063B2 (ja) * 2013-10-08 2016-09-28 株式会社村田製作所 セラミック多層基板

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196548U (https=) * 1984-11-30 1986-06-21
JPH0714421A (ja) * 1993-06-23 1995-01-17 Murata Mfg Co Ltd バイアホール用導電性ペーストおよびそれを用いた多層セラミック基板
CN1281331A (zh) * 1999-07-19 2001-01-24 国际商业机器公司 带锚定焊盘的多层陶瓷衬底
JP2005026368A (ja) * 2003-06-30 2005-01-27 Tdk Corp 放熱用ビアホールを備えた積層基板および該基板を用いたパワーアンプモジュール
CN101371624A (zh) * 2006-01-23 2009-02-18 日立金属株式会社 导体浆料、多层陶瓷基板以及多层陶瓷基板的制造方法
JP2008034884A (ja) * 2007-10-18 2008-02-14 Hitachi Metals Ltd セラミック積層基板およびこれを用いた積層電子部品
JP2010171157A (ja) * 2009-01-22 2010-08-05 Sanyo Electric Co Ltd 電子素子用パッケージ及び電子部品
CN104053302A (zh) * 2009-06-11 2014-09-17 罗杰斯公司 介电材料、由其形成子组件的方法以及由此形成的子组件
JP2012009609A (ja) * 2010-06-24 2012-01-12 Jtekt Corp 多層回路基板
JP2015038909A (ja) * 2012-07-13 2015-02-26 イビデン株式会社 配線板及びその製造方法
JP2015018857A (ja) * 2013-07-09 2015-01-29 三菱電機株式会社 高放熱基板、部品の放熱構造
CN108029203A (zh) * 2015-09-18 2018-05-11 株式会社村田制作所 陶瓷多层基板
CN208597204U (zh) * 2016-01-07 2019-03-12 株式会社村田制作所 多层基板以及电子设备

Also Published As

Publication number Publication date
JP7243856B2 (ja) 2023-03-22
US12133328B2 (en) 2024-10-29
CN114747301A (zh) 2022-07-12
JPWO2021095401A1 (https=) 2021-05-20
US20220272837A1 (en) 2022-08-25
WO2021095401A1 (ja) 2021-05-20
DE112020004962T5 (de) 2022-06-30

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