CN114310828A - 具备抗静电破坏的掩膜盒及其加工方法 - Google Patents

具备抗静电破坏的掩膜盒及其加工方法 Download PDF

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CN114310828A
CN114310828A CN202110684543.XA CN202110684543A CN114310828A CN 114310828 A CN114310828 A CN 114310828A CN 202110684543 A CN202110684543 A CN 202110684543A CN 114310828 A CN114310828 A CN 114310828A
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base
depth
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邱铭乾
庄家和
李怡萱
温星闵
薛新民
林韵孜
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Gudeng Precision Industrial Co Ltd
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Abstract

一种具备抗静电破坏的掩膜盒及其加工方法，所述掩膜盒包含一底座及多个支撑元件。底座具有一承载面，该承载面形成有一凹槽，该凹槽具有一底面。支撑元件围绕该底座的承载面并配置成支撑一掩膜。该凹槽具有一深度，该深度于该承载面至该底面之间延伸，该深度介于300μm至3400μm之间，借此削弱该承载面上微粒所受的静电力。本申请能够借由控制掩膜盒底座中的凹槽加工深度或凹槽底面表面与掩膜朝下表面之间的间距，而有效削弱掩膜残留电压对于底座表面微粒的影响，进而降低微粒被吸引至掩膜的朝下表面，避免图案区遭污染。

Description

具备抗静电破坏的掩膜盒及其加工方法
技术领域
本发明关于一种掩膜盒及其加工方法，特别是一种具有抗静电破坏能力的掩膜盒及其加工方法。
背景技术
目前极紫外光(EUV)工艺中，所涉及的掩膜需以专用的EUV掩膜盒保护。图1显示一种用于容置所述EUV掩膜的掩膜盒，具有由一外盒100及一内盒110所定义而成的内层和外层容置空间。外盒100包含一盒盖101和一底座102，两者结合定义出容置该内盒110的一容置空间。内盒110包含一盒盖111和一底座112，其通过特殊的手段结合以定义出具密封效果的一容置空间来容置一掩膜120。
具体而言，当掩膜120被容置在内盒110中时，掩膜120的边缘或底部由底座112上的多个支撑元件1121所支撑，使掩膜112的朝下表面略高于掩膜120的一朝上承载面1122。所述朝上承载面(1122，后简称承载面)是由多个支撑元件1121所围绕的面，且承载面1122的面积一般大于掩膜120的图案区域面积(图中未示)。此外，所述承载面1122与位于底座112周围用于接触盒盖111的朝上接触面1123不同，朝上接触面1123一般是环状表面。
当掩膜120从曝光设备中取出时，掩膜120会残留一定电压，一般大于50V。若将具有该状态下的掩膜120放回内盒110，底座112上的微粒则可能被吸附至掩膜120底部，而当微粒附着在掩膜120的图案区域，该掩膜120在下一次曝光程序中会产生图型缺陷。
图2示意带电荷掩膜120接近底座112的一连续过程。以带负电荷的掩膜120靠近底座112，其中该底座112因接地而不带电荷，但底座112的一上表面(如前述承载面1122)存在一微粒P。当带电掩膜120靠近底座112达某一程度，掩膜120的负电荷所产生的电场会引起底座112的上表面连同微粒P产生正电荷。当掩膜120更接近底座112，所述静电场的强度则足以吸引微粒P，使微粒P脱离底座112的上表面而附着至掩膜120的底部。显然，将底座112接地仍无法克服所有静电产生的缺陷。
有鉴于此静电所带来的掩膜缺陷，有必要发展一种具备抗静电破坏的掩膜盒来容置上述带有静电荷的掩膜。
发明内容
图3示意微粒P受到重力(Fw)和静电力(Fe)的作用，其中F为合力，q为电荷量，E为静电场，m为微粒的质量，g为重力常数，V为电压，d为掩膜的底部至底座的上表面之间距。换言之，引起底座上的微粒P附着至掩膜底部的因素，可包含微粒的尺寸(重量)、掩膜带电量及掩膜底部至底座上表面的距离。
据此，本发明的目的在于提出一种具备抗静电破坏的掩膜盒，包含：一底座，具有一承载面，该承载面形成有一凹槽，该凹槽具有一底面；及多个支撑元件，围绕该底座的承载面并配置成支撑一掩膜，使该凹槽具有一深度，该深度于该承载面至该底面之间延伸，该深度介于300μm至3400μm之间，借此削弱该承载面上微粒所受的静电力。
在一具体实施例中，该底座还具有一朝上接触面，该朝上接触面围绕该承载面，且该朝上接触面用于接触一盒盖以形成密封的一容置空间。
在一具体实施例中，该凹槽具有一环形边缘，该环形边缘围绕的一区域面积等于或大于该掩膜的一图案区域面积。
在一具体实施例中，该凹槽具有一环形边缘，该环形边缘围绕的一区域足以涵盖该掩膜的一图案区域。
在一具体实施例中，该凹槽具有一矩形边缘，该矩形边缘具有一长度和一宽度，该长度为138mm，该宽度为110mm。
在一具体实施例中，该掩膜的一残留电压大于50V，该深度至少大于400μm。
本发明的另一目的在于提出一种具备抗静电破坏的掩膜盒，包含：一底座，具有一上表面，该上表面为机械加工所形成的一挠曲表面；及多个支撑元件，围绕该上表面并配置成支撑一掩膜，使该掩膜的一朝下表面与该上表面之间形成一间距，该间距至少大于300μm之间，借此削弱该上表面上微粒所受的静电力。
在一具体实施例中，该底座还具有一朝上接触面，该朝上接触面围绕该上表面，且该朝上接触面用于接触一盒盖以形成密封的一容置空间。
在一具体实施例中，该上表面的一面积等于或大于该掩膜的一图案区域面积。
在一具体实施例中，该上表面的一区域足以涵盖该掩膜的一图案区域。
在一具体实施例中，该上表面具有一矩形边缘，该矩形边缘具有一长度和一宽度，该长度为138mm，该宽度为110mm。
在一具体实施例中，该掩膜的一残留电压大于50V，该间距至少大于400μm。
本发明的尚一目的在于提出一种掩膜盒的加工方法，实施于一掩膜盒的一底座，该底座具有一承载面及多个支撑元件，该多个支撑元件围绕该底座的承载面并配置成支撑一掩膜。该加工方法包含：以机械加工该承载面而使该承载面上形成有一凹槽，该凹槽具有一底面；因应该掩膜具有一残留电压，加工该凹槽使该凹槽具有一深度，该深度至少大于300μm。
在一具体实施例中，当该残留电压大于50V，该深度至少大于400μm。
在一具体实施例中，当该残留电压大于100V，该深度至少大于400μm。
在一具体实施例中，当该残留电压大于200V，该深度大至少于800μm。
在一具体实施例中，当该残留电压大于400V，该深度至少大于1600μm。
附图说明
参照下列图式与说明，可更进一步理解本发明。非限制性与非穷举性实例系参照下列图式而描述。在图式中的构件并非必须为实际尺寸；重点在于说明结构及原理。
图1例示一种已知掩膜盒的分解图。
图2示意带电掩膜接近掩膜盒底座的一连续过程。
图3示意一微粒受到静电力和重力的作用。
图4例示本发明掩膜盒的分解图。
图5例示掩膜盒底座的一立体图。
图6为根据图5的一剖面图。
图7为图5掩膜盒底座的一俯视图。
图8为图5掩膜盒底座的一仰视图。
图9A示意掩膜图案区域和凹槽涵盖区域的关系；图9B示意掩膜与凹槽底面之间的间距。
图10为掩膜盒底座的另一实施例的立体图。
图11A至图11D说明掩膜的不同残留电压、不同微粒尺寸及不同间距对于微粒所受净力(net force)的影响。
【符号说明】
100 外盒
101 盒盖
102 底座
110 内盒
111 盒盖
112 底座
1121 支撑元件
1122 朝上承载面、承载面
1123 朝上接触面
120 掩膜
P 微粒
200 外盒
201 盒盖
202 底座
210 内盒
211 盒盖
212 底座
2121 支撑元件
2122 承载面
2123 朝上接触面
2124 凹槽
220 掩膜
600 底面
601 壁
D 深度
800 定位结构
900 掩膜
901 掩膜图案区域
902 凹槽区域、凹槽涵盖区域
903 底面
904 承载面
G 间距
1001 围墙
1002 上表面
1003 朝上接触面
具体实施方式
底下将参考图式更完整说明本发明，并且借由例示显示特定范例具体实施例。不过，本主张主题可具体实施于许多不同形式，因此所涵盖或申请主张主题的建构并不受限于本说明书所揭示的任何范例具体实施例；范例具体实施例仅为例示。同样，本发明在于提供合理宽阔的范畴给所申请或涵盖之主张主题。
本说明书内使用的词汇“在一实施例”并不必要参照相同具体实施例，且本说明书内使用的“在其他(一些/某些)实施例”并不必要参照不同的具体实施例。其目的在于例如主张的主题包括全部或部分范例具体实施例的组合。
图4例示本发明掩膜盒的一分解图，其如同图1的配置包含一外盒200及一内盒210。外盒200还包含一盒盖201和一底座202，两者定义容置内盒210的容置空间。内盒210还包含一盒盖211和一底座212，两者定义容纳一掩膜220的容置空间。本发明的改良主要在于底座212的结构，外盒200及内盒盒盖211的其他细节将在后续描述中省略。
底座212具有多个支撑元件2121、一朝上承载面(之后简称承载面2122)及一朝上接触面2123。支撑件2121位于承载面2122和朝上接触面2123之间，且环绕着承载面2122。支撑件2121可配置成不同的态样以支撑掩膜220的底部或侧面边缘。举例而言，本实施例的每一个支撑元件2121具有用于限制掩膜220横向位移的两个限位柱以及用于接触掩膜的朝下表面而将掩膜抬升于承载面2122上方的一支撑销。支撑销的高度可决定掩膜朝下表面至承载面2122之间的一间距。承载面2122基本上为一平面，但实际上承载面2122的至少一部分有因为机械加工而形成的挠曲表面，其通常无法为肉眼所识别。承载面2122还加工形成有一凹槽2124，凹槽2124大致上位于承载面2122的中央且被承载面2122环绕。当掩膜220被放置在支撑元件2121上时，掩膜220的图案区会正对着凹槽2124。
图5显示较多的底座212细节，而图6显示根据图5虚线的剖面图。可以看到承载面2122和底座212周围的朝上接触面2123之间形成有一沟槽(未编号)，其用于捕捉盒盖211和底座212结合时从两者之间进入的微粒。图6清楚显示承载面2122高于朝上接触面2123，这样的配置有助于创造结构障碍，增加所述微粒落在承载面2122的困难度，确保内盒210的洁净度。在其他可能的实施例中，承载面2122和朝上接触面2123可以是相同的高度或者承载面2122较低，沟槽也可以被填满。凹槽2124是由一底面600和一壁601所定义而成，使凹槽2124具有一深度D。所述深度D为加工深度，亦指自承载面2122至凹槽底面600的垂直落差，如图示靠近壁601的深度D。由于凹槽2124也是通过机械加工成形，底面600可能存在挠曲(deflection)的现象。
图7显示图5底座212的俯视图，其中可看到凹槽2124的开口(即由承载面的内缘定义而成)和底面600为一矩形，且开口和底面600的面积大致上相同。在一实施例中，所述矩形的长度为138mm，宽度为110mm。凹槽2124的位置大致上位于承载面2122的中央，未靠近任何一侧。图8显示图5底座212的仰视图，可看见底座212的底部配置有多个定位结构800，其用于将底座212定位于工艺机台中。
图9A为俯视视角，其主要示意一掩膜900的一掩膜图案区域(901，由实线围绕而成)与底座凹槽区域902的关系。可看到，虚线可为定义所述凹槽开口的一环形边缘，其定义凹槽涵盖区域902至少大于掩膜图案区域901。在这样的配置下，确保掩膜图案区域的每一个位置都面对凹槽的底面。图9B为侧视角，其主要示意掩膜图案区域901的朝下表面与凹槽的底面903之间存在一间距G。根据掩膜被支撑的所在高度，掩膜的下表面904的高度可以非常接近底座的承载面高度，亦即掩膜的下表面904与凹槽的底面600之间距离相当于凹槽的深度(如图6所示深度D)。在一实施例中，凹槽的所述深度D界于300μm至3400μm之间，或3400μm至3750μm之间。换言之，间距G至少大于300μm。据此，当一带静电的掩膜被放置于底座上时，借由该凹槽深度D或间距G的控制可有效削弱底座承载面上微粒所受的静电力，降低微粒被吸引至掩膜朝下表面的机会。
图10显示本发明底座的另一实施例。与图5相比，可看到图10底座中的承载面的区域已被大幅缩减而凹槽涵盖的区域则增加，形成由一围墙1001环绕的一上表面1002，且围墙1001的高度仍高于朝上接触面1003以增加污染微粒进入上表面1002的困难度。在某些实施例中，围墙1001可被省略，而仅由如图中的沟槽将朝上接触面和上表面隔开。同样地，当放置于底座上的掩膜的一朝下表面与上表面1002之间形成有一间距，且恰当控制上表面1002的深度，例如围墙1001的垂直高度界于300μm至3400μm之间，或使掩膜的下表面与上表面1002之间的间距至少大于300μm，则可有效削弱底座的上表面少微粒所受静电力。
图11A至图11D说明掩膜的不同残留电压、不同微粒尺寸及不同凹槽深度对于微粒所受净力的影响。图11A显示六种尺寸的微粒在如第六和九B图所示意的配置中，尤其这些微粒是位在凹槽底面903上且掩膜的残留电压为400V，该深度D与微粒所受净力(netforce)的关系曲线，在这当中可看到当深度大于1600μm时，所有微粒的净力转为负值代表微粒的受力方向朝下，意即有效削弱这些微粒受到的静电力。同样地，图11B显示这些尺寸的微粒在掩膜的残留电压为200V的环境中，该深度D与微粒所受净力的关系曲线，在这当中可看到当深度大于800μm时，可有效削弱这些微粒受到的静电力。图11C显示这些尺寸的微粒在掩膜的残留电压为100V的环境中，该深度D与微粒所受净力的关系曲线，在这当中可看到当深度大于400μm时，可有效削弱这些微粒受到的静电力。图11D显示这些尺寸的微粒在掩膜的残留电压为50V的环境中，该深度D与微粒所受净力的关系曲线，在这当中可看到当深度大于400μm时，可有效削弱这些微粒受到的静电力。尽管图中未以颜色区分各尺寸微粒的曲线，但本领域技术者根据图式揭露内容仍足以区别各曲线的趋势差异而理解上述说明。
基于上述说明可知，本发明提出一种掩膜盒，借由控制掩膜盒底座中的凹槽加工深度或凹槽底面表面(上表面)与掩膜朝下表面之间的间距，而有效削弱掩膜残留电压对于底座表面微粒的影响，进而降低微粒被吸引至掩膜的朝下表面，避免图案区遭污染。

Claims (17)

1.一种具备抗静电破坏的掩膜盒，其特征在于，包含：
一底座，具有一承载面，所述承载面形成有一凹槽，所述凹槽具有一底面；及
多个支撑元件，围绕所述底座的承载面并配置成支撑一掩膜，
其中所述凹槽具有一深度，所述深度于所述承载面至所述底面之间延伸，所述深度介于300μm至3400μm之间，借此削弱所述承载面上微粒所受的静电力。
2.根据权利要求1所述的掩膜盒，其特征在于，所述底座还具有一朝上接触面，所述朝上接触面围绕所述承载面，且所述朝上接触面用于接触一盒盖以形成密封的一容置空间。
3.根据权利要求1所述的掩膜盒，其特征在于，所述凹槽具有一环形边缘，所述环形边缘围绕的一区域面积等于或大于所述掩膜的一图案区域面积。
4.根据权利要求1所述的掩膜盒，其特征在于，所述凹槽具有一环形边缘，所述环形边缘围绕的一区域足以涵盖所述掩膜的一图案区域。
5.根据权利要求1所述的掩膜盒，其特征在于，所述凹槽具有一矩形边缘，所述矩形边缘具有一长度和一宽度，所述长度为138mm，所述宽度为110mm。
6.根据权利要求1所述的掩膜盒，其特征在于，所述掩膜的一残留电压大于50V，所述深度至少大于400μm。
7.一种具备抗静电破坏的掩膜盒，其特征在于，包含：
一底座，具有一上表面，所述上表面为机械加工所形成的一挠曲表面；及
多个支撑元件，围绕所述上表面并配置成支撑一掩膜，使所述掩膜的一朝下表面与所述上表面之间形成一间距，所述间距至少大于300μm，借此削弱所述上表面上微粒所受的静电力。
8.根据权利要求7所述的掩膜盒，其特征在于，所述底座还具有一朝上接触面，所述朝上接触面围绕所述上表面，且所述朝上接触面用于接触一盒盖以形成密封的一容置空间。
9.根据权利要求7所述的掩膜盒，其特征在于，所述上表面的一面积等于或大于所述掩膜的一图案区域面积。
10.根据权利要求7所述的掩膜盒，其特征在于，所述上表面的一区域足以涵盖所述掩膜的一图案区域。
11.根据权利要求7所述的掩膜盒，其特征在于，所述上表面具有一矩形边缘，所述矩形边缘具有一长度和一宽度，所述长度为138mm，所述宽度为110mm。
12.根据权利要求7所述的掩膜盒，其特征在于，所述掩膜的一残留电压大于50V，所述间距至少大于400μm。
13.一种掩膜盒的加工方法，其特征在于，实施于一掩膜盒的一底座，所述底座具有一承载面及多个支撑元件，所述多个支撑元件围绕所述底座的承载面并配置成支撑一掩膜，所述加工方法包含：
以机械加工所述承载面而使所述承载面上形成有一凹槽，所述凹槽具有一底面；
因应所述掩膜具有一残留电压，加工所述凹槽使所述凹槽具有一深度，所述深度至少大于300μm。
14.根据权利要求13所述的方法，其特征在于，当所述残留电压大于50V，所述深度至少大于400μm。
15.根据权利要求13所述的方法，其特征在于，当所述残留电压大于100V，所述深度至少大于400μm。
16.根据权利要求13所述的方法，其特征在于，当所述残留电压大于200V，所述深度至少大于800μm。
17.根据权利要求13所述的方法，其特征在于，当所述残留电压大于400V，所述深度至少大于1600μm。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589650A (zh) * 2022-04-18 2022-06-07 合肥清溢光电有限公司 一种大尺寸掩膜版下料装盒对位夹具

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113819901B (zh) * 2020-06-19 2023-11-07 长鑫存储技术有限公司 光学传感器的姿态调整装置及方法、自动物料运输系统
CN114660902A (zh) * 2020-12-23 2022-06-24 长鑫存储技术有限公司 曝光机
US11687011B2 (en) * 2021-08-30 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle carrier and associated methods
TWI830502B (zh) * 2022-11-17 2024-01-21 家碩科技股份有限公司 自動量測光罩載具之流量的治具

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758192A (ja) * 1993-08-12 1995-03-03 Nikon Corp 基板収納ケース
JP2000098585A (ja) * 1998-09-25 2000-04-07 Seiko Epson Corp 半導体製造装置および半導体製造装置の保管装置
US20040018437A1 (en) * 2002-07-29 2004-01-29 Umc Japan Photomask covered with light-transmissive and electrically-conductive polymer material
CN1538239A (zh) * 2003-04-15 2004-10-20 力晶半导体股份有限公司 光掩模传送支撑座及光掩模传送方法
JP2005079297A (ja) * 2003-08-29 2005-03-24 Canon Inc 原版搬送装置及び半導体露光装置
CN1980841A (zh) * 2004-09-10 2007-06-13 日本华而卡工业株式会社 玻璃基板容纳箱、玻璃基板调换装置、玻璃基板管理装置、玻璃基板流通方法、密封部件及使用该密封部件的密封构造
CN201091030Y (zh) * 2007-09-30 2008-07-23 家登精密工业股份有限公司 掩膜盒与掩膜传送盒及其支撑件
US20170294326A1 (en) * 2016-04-06 2017-10-12 Entegris, Inc. Substrate container with window retention spring
TWM552993U (zh) * 2017-05-31 2017-12-11 Chung King Enterprise Co Ltd 光罩盒
CN107561853A (zh) * 2016-06-30 2018-01-09 三星电子株式会社 用于光掩模的薄膜以及包括该薄膜的曝光装置
CN108375872A (zh) * 2017-01-25 2018-08-07 家登精密工业股份有限公司 极紫外光光罩容器

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661253A (en) * 1969-12-04 1972-05-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3719273A (en) * 1971-01-11 1973-03-06 Chisso Corp Packing vessel for thin sheet materials
JPH0427949A (ja) * 1990-05-24 1992-01-30 Fujitsu Ltd レチクルケース
US5740845A (en) * 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
US5999397A (en) * 1997-10-27 1999-12-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method for preventing electrostatic discharge damage to an insulating article
JP2000208603A (ja) 1999-01-18 2000-07-28 Mitsubishi Electric Corp 基板の収納ケ―ス、基板の収納方法、および基板の輸送方法
US6364595B1 (en) * 1999-02-10 2002-04-02 Asyst Technologies, Inc. Reticle transfer system
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
US6239863B1 (en) * 1999-10-08 2001-05-29 Silicon Valley Group, Inc. Removable cover for protecting a reticle, system including and method of using the same
US6196391B1 (en) * 2000-01-20 2001-03-06 Taiwan Semiconductor Manufacturing Company, Ltd Electrostatic discharge-free container for insulating articles
JP2001253491A (ja) * 2000-03-14 2001-09-18 Fujitsu Ltd 半導体装置製造用部材の収納運搬ケース
US6338409B1 (en) * 2000-04-13 2002-01-15 International Business Machines Corporation Reticle SMIF pod in situ orientation
WO2002008831A2 (en) * 2000-07-06 2002-01-31 Pri Automation, Inc. Reticle storage and retrieval system
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
US20020089656A1 (en) * 2001-01-09 2002-07-11 Cheng Guo Containers for lithography mask and method of use
TW503553B (en) * 2001-06-27 2002-09-21 Taiwan Semiconductor Mfg Mask case and mask structure with active anti-ESD function
TW542400U (en) * 2001-08-22 2003-07-11 Taiwan Semiconductor Mfg Photo-mask box with an anti-electrostatic function
JP4355488B2 (ja) * 2002-05-13 2009-11-04 富士通株式会社 分子汚染監視システム
US20030213716A1 (en) * 2002-05-17 2003-11-20 Brian Cleaver Wafer shipping and storage container
JP2003234399A (ja) * 2003-02-10 2003-08-22 Seiko Epson Corp Ｌｃｄパネル搬送用トレー
JP2006103795A (ja) * 2004-09-10 2006-04-20 Nippon Valqua Ind Ltd ガラス基板収納ケース、ガラス基板入替装置、ガラス基板管理装置、ガラス基板流通方法、シール部材及びこのシール部材を用いたシール構造
US7380668B2 (en) * 2004-10-07 2008-06-03 Fab Integrated Technology, Inc. Reticle carrier
TW200615713A (en) * 2004-11-08 2006-05-16 Gudeng Prec Ind Co Ltd Container capable of preventing the crystallization of photomasks
JP2006173276A (ja) * 2004-12-14 2006-06-29 Miraial Kk レチクル処理システム
US7607543B2 (en) 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
US20060201958A1 (en) 2005-02-27 2006-09-14 Tieben Anthony M Mask container
US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
JP4482655B2 (ja) * 2005-04-22 2010-06-16 ゴールド工業株式会社 精密基板収納容器のガスケット
SG10201400835QA (en) * 2005-09-27 2014-07-30 Entegris Inc Reticle Pod
TWI417649B (zh) 2005-12-28 2013-12-01 尼康股份有限公司 十字標記運送裝置、曝光裝置、十字標記運送方法以及十字標記的處理方法
CN101370616B (zh) * 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US7581372B2 (en) * 2006-08-17 2009-09-01 Microtome Precision, Inc. High cleanliness article transport system
JP2008096652A (ja) * 2006-10-11 2008-04-24 Nikon Corp レチクルカバー、アウターケースおよび露光装置
JP4999597B2 (ja) * 2007-08-08 2012-08-15 ミライアル株式会社 枚葉式ウエハケース
TWM331511U (en) * 2007-08-10 2008-05-01 Gudeng Prec Industral Co Ltd Container
CN201107547Y (zh) * 2007-09-29 2008-08-27 家登精密工业股份有限公司 金属光罩盒
CN101970315B (zh) * 2007-12-18 2013-05-15 诚实公司 用于控制衬底污染的方法和设备
TWI411563B (zh) * 2009-09-25 2013-10-11 Gudeng Prec Industral Co Ltd 光罩盒
TWI378887B (en) 2009-12-29 2012-12-11 Gudeng Prec Industral Co Ltd Reticle pod and supporting components therebetween
JP5005778B2 (ja) * 2010-02-15 2012-08-22 家登精密工業股▲ふん▼有限公司 レチクルポッド
JP5015280B2 (ja) * 2010-02-26 2012-08-29 Ｔｄｋ株式会社 基板収納ポッドおよびその蓋部材並びに基板の処理装置
JP5398595B2 (ja) * 2010-03-04 2014-01-29 東京エレクトロン株式会社 基板収納装置
TWI389828B (zh) * 2010-07-21 2013-03-21 Gudeng Prec Industral Co Ltd 具有感測器之光罩盒
TWI414464B (zh) * 2011-01-11 2013-11-11 Gudeng Prec Ind Co Ltd 具有固定結構之極紫外光光罩儲存傳送盒
TWI541928B (zh) * 2011-10-14 2016-07-11 晶元光電股份有限公司 晶圓載具
US20130174640A1 (en) * 2012-01-10 2013-07-11 Texas Instruments Incorporated Pod having top cover aperture for detecting surrounding gas within the pod
JP5959302B2 (ja) 2012-05-16 2016-08-02 信越ポリマー株式会社 基板収納容器
US9412632B2 (en) * 2012-10-25 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle pod
WO2015066484A1 (en) * 2013-10-31 2015-05-07 Entegris, Inc. A modular reticle pod system
US20150131071A1 (en) * 2013-11-08 2015-05-14 Samsung Electronics Co., Ltd. Semiconductor device manufacturing apparatus
JP6320309B2 (ja) * 2015-01-19 2018-05-09 信越化学工業株式会社 ペリクル収納容器
EP3504591B1 (en) * 2016-08-27 2022-05-11 Entegris, Inc. Reticle pod having side containment of reticle
CN108107672B (zh) * 2016-11-25 2021-03-02 上海微电子装备（集团）股份有限公司 一种掩模版版盒
US11249392B2 (en) * 2017-01-25 2022-02-15 Gudeng Precision Industrial Co., Ltd EUV reticle pod
TWI623810B (zh) * 2017-01-26 2018-05-11 家登精密工業股份有限公司 光罩盒
JP7357432B2 (ja) * 2017-10-10 2023-10-06 信越化学工業株式会社 Ｅｕｖ用ペリクルフレーム、ペリクル、ペリクル付露光原版、露光方法、及び半導体の製造方法
TWI763002B (zh) * 2018-01-11 2022-05-01 家登精密工業股份有限公司 快拆式氣閥與使用該快拆式氣閥之基板容器及其安裝方法與拆卸方法
JP7110663B2 (ja) * 2018-03-28 2022-08-02 Tdk株式会社 ウエハ収容容器及びウエハ収容容器の清浄化方法
JP7234527B2 (ja) * 2018-07-30 2023-03-08 Tdk株式会社 センサー内蔵フィルタ構造体及びウエハ収容容器
US11508592B2 (en) * 2018-10-29 2022-11-22 Gudeng Precision Industrial Co., Ltd Reticle retaining system
US20200144086A1 (en) 2018-11-07 2020-05-07 Entegris, Inc. Reticle support for a container
US11442370B2 (en) * 2019-10-16 2022-09-13 Gudeng Precision Industrial Co., Ltd Reticle retaining system
US20210358787A1 (en) * 2020-05-14 2021-11-18 Gudeng Precision Industrial Co., Ltd. Reticle pod provided with holding pins and method for holding reticle
KR20210143412A (ko) * 2020-05-20 2021-11-29 삼성전자주식회사 레티클 포드의 세정 방법 및 세정 시스템
US11822257B2 (en) * 2021-03-12 2023-11-21 Gudeng Precision Industrial Co., Ltd. Reticle storage pod and method for securing reticle

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758192A (ja) * 1993-08-12 1995-03-03 Nikon Corp 基板収納ケース
JP2000098585A (ja) * 1998-09-25 2000-04-07 Seiko Epson Corp 半導体製造装置および半導体製造装置の保管装置
US20040018437A1 (en) * 2002-07-29 2004-01-29 Umc Japan Photomask covered with light-transmissive and electrically-conductive polymer material
CN1538239A (zh) * 2003-04-15 2004-10-20 力晶半导体股份有限公司 光掩模传送支撑座及光掩模传送方法
JP2005079297A (ja) * 2003-08-29 2005-03-24 Canon Inc 原版搬送装置及び半導体露光装置
CN1980841A (zh) * 2004-09-10 2007-06-13 日本华而卡工业株式会社 玻璃基板容纳箱、玻璃基板调换装置、玻璃基板管理装置、玻璃基板流通方法、密封部件及使用该密封部件的密封构造
CN201091030Y (zh) * 2007-09-30 2008-07-23 家登精密工业股份有限公司 掩膜盒与掩膜传送盒及其支撑件
US20170294326A1 (en) * 2016-04-06 2017-10-12 Entegris, Inc. Substrate container with window retention spring
CN107561853A (zh) * 2016-06-30 2018-01-09 三星电子株式会社 用于光掩模的薄膜以及包括该薄膜的曝光装置
CN108375872A (zh) * 2017-01-25 2018-08-07 家登精密工业股份有限公司 极紫外光光罩容器
TWM552993U (zh) * 2017-05-31 2017-12-11 Chung King Enterprise Co Ltd 光罩盒

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589650A (zh) * 2022-04-18 2022-06-07 合肥清溢光电有限公司 一种大尺寸掩膜版下料装盒对位夹具

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