CN112136210A - 由三个堆叠的接合副构成的复合组件 - Google Patents

由三个堆叠的接合副构成的复合组件 Download PDF

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Publication number
CN112136210A
CN112136210A CN201980031989.3A CN201980031989A CN112136210A CN 112136210 A CN112136210 A CN 112136210A CN 201980031989 A CN201980031989 A CN 201980031989A CN 112136210 A CN112136210 A CN 112136210A
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China
Prior art keywords
pair
solder
joint pair
joining
brazeable
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CN201980031989.3A
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English (en)
Inventor
T·辛纳
E·聚斯克
J·齐普里斯
C·席勒
A·克鲁奇
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of CN112136210A publication Critical patent/CN112136210A/zh
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Abstract

本发明涉及一种由三个堆叠的接合副(10、20、30)构成的复合组件(1)和一种用于连接由三个接合副(10、20、30)构成的叠层的相应方法。三个堆叠的接合副(10、20、30)通过上钎焊层(3)并且通过下钎焊层(5)材料连接地相互连接，其中上接合副(10)和下接合副(30)在其高度方面被固定并且彼此间具有预先给定的距离(H)，其中由具有第一熔化温度的第一钎料形成的上钎焊层(3)构造在所述上接合副(10)与中间接合副(20)之间，并且由具有更高的第二熔化温度的第二钎料形成的第二钎焊层(5)构造在所述中间接合副(20)与所述下接合副(30)之间，并且其中所述上接合副(10)具有向上敞开的以第一钎料填充的钎料补偿开口(14)，所述第一钎料从所述钎料补偿开口流入到所述上接合副(10)和所述中间接合副(20)之间的间隙中以便填充所述间隙。

Description

由三个堆叠的接合副构成的复合组件
技术领域
本发明涉及一种根据独立权利要求1的类型的、由三个堆叠的接合副构成的复合组件。一种用于连接由三个接合副构成的叠层的方法也是本发明的主题。
背景技术
功率电子器件中的结构元件或者接合副通常通过回流钎焊过程彼此热连接和电连接。为了能够成本低廉地制造具有多个结构元件或者接合副和钎焊部位的复杂结构，在一个步骤中钎焊全部的连接部位。在该过程期间，在钎料中发生大约50％的容积收缩。这导致上结构元件或接合副下沉到下结构元件或下接合副上。在由三个接合副构成的叠层中，在该叠层中，上接合副和下接合副在其高度上被固定，这样的下沉由于结构而不可能。由于在钎焊过程期间容积收缩，由此会导致钎料连接面积的减小和/或构造缩孔。这可以导致电阻和热阻的提高并且由此导致功能的降低直至寿命的降低。
由文献DE 102 52 577 B4公开了一种用于通过毛细管钎料流产生钎焊连接的方法。所公开的用于连接第一钎焊伙伴和第二钎焊伙伴的方法包括以下步骤：将第一钎焊伙伴、第二钎焊伙伴和钎料堆放置成，使得第一钎焊伙伴的表面与第二钎焊伙伴的表面对置，并且钎料堆布置在相对置的表面的连接区域外并且与该连接区域相邻，其中在连接区域中的钎焊伙伴的对置的表面能够通过钎料堆的钎料浸润，并且加热钎焊伙伴和钎料堆，使得钎料堆熔化并且通过毛细力被拉到连接区域中，以便通过连接层连接钎焊伙伴。在此，第一钎焊伙伴是衬底并且第二钎焊伙伴是半导体结构元件，半导体结构元件小于衬底。
发明内容
具有独立权利要求1的特征的、由三个堆叠的接合副构成的复合组件以及具有独立权利要求10的特征的、用于连接由三个接合副构成的叠层的方法分别具有的优点是，在由三个接合副构成的叠层中的钎焊过程期间的容积收缩可以通过合适地选择钎料和接合副的几何形状来补偿。由此可以保证接合副彼此间足够大的连接面积。在电连接和热散热方面的结构功能性以有利的方式超过所有公差范围地得到保证。
本发明的实施方式提供了一种由三个堆叠的接合副构成的复合组件，所述接合副通过上钎焊层和通过下钎焊层材料连接地相互连接，其中上接合副和下接合副在其高度方面被固定并且彼此间具有预先给定的距离。在此，由具有第一熔化温度的第一钎料形成的上钎焊层构造在上接合副与中间接合副之间，并且由具有更高的第二熔化温度的第二钎料形成的第二钎焊层构造在中间接合副与所述下接合副之间。此外，所述上接合副具有向上敞开的以第一钎料填充的钎料补偿开口，所述第一钎料从所述钎料补偿开口流入到所述上接合副与所述中间接合副之间的间隙中以便填充所述间隙。
此外，提出一种用于连接由三个接合副构成的叠层的方法，其中上接合副和下接合副在其高度方面被固定并且彼此间具有预先给定的距离。该方法包括以下步骤：将第一焊膏施加到上接合副的可钎焊的第一表面上和中间接合副的可钎焊的第二表面上，使得上接合副与中间接合副之间的间隙用第一焊膏填充，第一焊膏的第一钎料具有第一熔化温度。用第一焊膏填充第一接合副中的向上敞开的钎料补偿开口，将第二焊膏施加到中间接合副的可钎焊的第三表面上和下接合副的可钎焊的第四表面上，使得中间接合副与下接合副之间的间隙用第二焊膏填充，所述第二焊膏的第二钎料具有更高的第二熔化温度。将叠层在回流钎焊炉(Reflow-
Figure BDA0002774529640000021
)中加热到高于第二熔化温度的温度，并且随后冷却叠层，使得在冷却阶段期间首先下钎焊层凝固，而上钎焊层仍是熔融液态的，并且导致中间接合副下降并且中间接合副整面连接到下接合副上，其中在所述中间接合副与所述上接合副之间的现在更大的间隙用来自所述向上敞开的钎料补偿开口中的所述熔融液态的钎料来补充填充，从而在所述钎料补偿开口的留空的情况下出现所述中间接合副到所述上接合副的整面连接。
作为第一钎料，例如可以使用锡银铜钎料(SAC)。作为第二钎料例如可以使用锡铜钎料(SnCu)，锡铜钎料具有比锡银铜钎料(SAC)更高的熔化温度并且在冷却过程期间首先凝固。
通过在从属权利要求中所列举的措施和改进方案，可以有利地改进在独立权利要求1中所记载的由三个堆叠的接合副构成的复合组件。
特别有利的是，上钎焊层在钎料补偿开口的留空的情况下可整面地构造在上接合副的可钎焊的第一表面与中间接合副的可钎焊的第二表面之间。下钎焊层可以整面地构造在中间接合副的可钎焊的第三表面与下接合副的可钎焊的第四表面之间。通过各个接合副彼此的整面的材料连接的连接，能够以有利的方式实现最佳的电连接和热连接。
在复合组件的一种有利的设计方案中，向上敞开的钎料补偿开口可以构造在中间接合副的可钎焊的第二表面上方并且穿通可钎焊的第一表面。由此，第一钎料可以在钎焊过程期间直接流入到上接合副与中间接合副之间的间隙中。
在复合组件的另一种有利的设计方案中，向上敞开的钎料补偿开口具有如下容积：即该容积至少是在上接合副与中间接合副之间的间隙的容积的两倍。由此可以有利地确保，即使在大的容积收缩的情况下也可以有足够量的第一钎料流入到上接合副与中间接合副之间的间隙中。
在复合组件的另一有利的设计方案中，第一接合副例如可以是冲压格栅。第二接合副例如可以是DBC衬底(DBC：直接键合铜Direct Bonded Coper)。第三接合副例如可以是散热片。
这里，第一DBC铜结构可以构造第二接合副的可钎焊第二的表面，并且第二DBC铜结构可以构造第二接合副的可钎焊的第三表面。DBC衬底可以有利地提供在冲压格栅与散热片之间非常好的电绝缘和非常好的导热性。此外，第一钎焊层和第二钎焊层与键合连接相比具有明显更低的电阻。
附图说明
在附图中示出了本发明的实施例并且在下面的描述中详细进行阐述。在附图中，相同的附图标记表示实施相同或相似功能的部件或元件。
图1示出了由三个堆叠的接合副构成的、根据本发明的复合组件的第一实施例在钎焊过程之前的示意性的截面图。
图2示出了图1所示的、根据本发明的复合组件在钎焊过程之后的示意性的截面图。
图3示出了电路模块的截取部分的示意性的俯视图，该电路模块具有由三个堆叠的接合副构成的、根据本发明的复合组件的第二实施例。
图4示出了图3所示的、根据本发明的复合组件沿着剖切线IV-IV的示意性的截面图。
图5示出了图3中的根据本发明的复合组件沿着剖切线V-V的示意性的截面图。
具体实施方式
如在图1至图5中所示，由三个堆叠的接合副10、20、30构成的根据本发明的复合组件1、1A的所示实施例分别包括上接合副10、中间接合副20和下接合副30，它们通过上钎焊层3和通过下钎焊层5材料连接地相互连接。在此，上接合副10和下接合副30在其高度上被固定并且彼此具有预先给定的距离H。由具有第一熔化温度的第一钎料形成的上钎焊层3构造在上接合副10与中间接合副20之间。由具有更高的第二熔化温度的第二钎料形成的第二钎焊层5构造在中间接合副20与下接合副30之间。此外，上接合副10具有向上敞开的以第一钎料填充的钎料补偿开口14，第一钎料从该钎料补偿开口流入到上接合副10与中间接合副20之间的间隙中以便填充所述间隙。
如图1至图5中进一步所示，上钎焊层3在钎料补偿开口14的留空的情况下整面地构造在上接合副10的可钎焊的第一表面12与中间接合副20的可钎焊的第二表面22之间。下钎焊层5整面地构造在中间接合副20的可钎焊的第三表面24和下接合副30的可钎焊的第四表面32之间。
如图1至图5中进一步所示，向上敞开的钎料补偿开口14在所示的实施例中构造在中间接合副20的可钎焊的第二表面22上方并且穿通上接合副10的可钎焊的第一表面12。此外，向上敞开的钎料补偿开口14具有如下容积，该容积至少是上接合副10与中间接合副20之间的间隙的容积的两倍。
如图3至图5中进一步所示，所示出的根据本发明的复合组件1A的第二实施例由三个接合副10、20、30构成，所述接合副是电路模块的一部分。在此，第一接合副10是冲压格栅10A，第二接合副20是DBC衬底20A(DBC：Direct Bonded Coper直接键合铜)并且第三接合副30是散热片30A。此外，第一DBC铜结构22A构造第二接合副20的可钎焊的第二表面22，并且第二DBC铜结构24A构造第二接合副20的可钎焊的第三表面22。
用于连接由三个接合副10、20、30构成的叠层的根据本发明的方法的实施方式，其中上接合副10和下接合副30在其高度上被固定并且彼此具有预先给定的距离H，该方法包括以下步骤：将第一焊膏施加到上接合副10的可钎焊的第一表面12上和中间接合副20的可钎焊的第二表面22上，使得上接合副10与中间接合副20之间的间隙用第一焊膏填充，第一焊膏的第一钎料具有第一熔化温度。用第一焊膏填充第一接合副10中的向上敞开的钎料补偿开口14。将第二焊膏施加到中间接合副20的可钎焊的第三表面24和下接合副30的可钎焊的第四表面32上，使得中间接合副20与下接合副30之间的间隙用第二焊膏填充，所述第二焊膏的第二钎料具有更高的第二熔化温度。图1示出在回流钎焊炉中的钎焊过程之前的由三个接合副10、20、30构成的这样制备的叠层。如图1中进一步所示，在所示实施例中，上接合副10与中间接合副20之间的间隙以及下接合副30与中间接合副20之间的间隙分别完全用对应的焊膏填充。在所示出的实施例中，在第一接合副10中的向上敞开的钎料补偿开口14也完全用第一焊膏填充。
叠层在回流钎焊炉中被加热到高于第二熔化温度的温度。接着冷却叠层，使得在冷却阶段期间首先下钎焊层5凝固，而上钎焊层3仍是熔融液态的，并且导致中间接合副20的下降并且中间接合副20整面连接到下接合副30上。在所述中间接合副20与所述上接合副10之间的现在更大的间隙用来自所述向上敞开的钎料补偿开口14中的所述熔融液态的钎料来补充填充，从而在所述钎料补偿开口14的留空的情况下出现所述中间接合副20到所述上接合副10的整面连接。
图2示出在钎焊过程之后的由三个接合副10、20、30构成的叠层。如图2中进一步可见，在钎焊过程之前引入到钎料补偿开口14中的第一钎料几乎完全流入到在上接合副10与中间接合副20之间的间隙中，以便补偿第一钎料的容积损失和中间接合副20在回流钎焊炉中的钎焊过程期间的下降。
在所示出的实施例中，作为用于上钎焊层3的第一钎料使用锡锡银铜钎料(SAC)。在所示出的实施例中，具有比第一钎焊层3的锡银铜钎料(SAC)更高的熔化温度的锡铜钎料(SnCu)用作用于下钎焊层5的第二钎料。由此，下钎焊层5的第二钎料在冷却过程期间在上钎焊层3的第一钎料之前凝固。
本发明的实施方式例如可以被用于逆变器中的所有功率模块，并且一般地也可以在功率降低的情况下被应用在模制的开关模块中。

Claims (10)

1.一种由三个堆叠的接合副(10、20、30)构成的复合组件(1、1A)，所述接合副通过上钎焊层(3)并且通过下钎焊层(5)材料连接地相互连接，其中上接合副(10)和下接合副(30)在其高度方面被固定并且彼此间具有预先给定的距离(H)，其中由具有第一熔化温度的第一钎料形成的上钎焊层(3)构造在所述上接合副(10)与中间接合副(20)之间，并且由具有更高的第二熔化温度的第二钎料形成的第二钎焊层(5)构造在所述中间接合副(20)与所述下接合副(30)之间，并且其中所述上接合副(10)具有向上敞开的、以所述第一钎料填充的钎料补偿开口(14)，所述第一钎料从所述钎料补偿开口流入到所述上接合副(10)与所述中间接合副(20)之间的间隙中以便填充所述间隙。
2.根据权利要求1所述的复合组件(1、1A)，其特征在于，所述上钎焊层(3)在所述钎料补偿开口(14)的留空的情况下整面地构造在所述上接合副(10)的可钎焊的第一表面(12)与所述中间接合副(20)的可钎焊的第二表面(22)之间。
3.根据权利要求1或2所述的复合组件(1、1A)，其特征在于，所述下钎焊层(5)整面地构造在所述中间接合副(20)的可钎焊的第三表面(24)与所述下接合副(30)的可钎焊的第四表面(32)之间。
4.根据权利要求2或3所述的复合组件(1、1A)，其特征在于，向上敞开的所述钎料补偿开口(14)构造在所述中间接合副(20)的可钎焊的第二表面(22)上方并且穿通可钎焊的第一表面(12)。
5.根据权利要求1至4中任一项所述的复合组件(1、1A)，其特征在于，向上敞开的所述钎料补偿开口(14)具有如下容积，该容积至少是所述上接合副(10)与所述中间接合副(20)之间的间隙的容积的两倍。
6.根据权利要求1至5中任一项所述的复合组件(1、1A)，其特征在于，所述第一接合副(10)是冲压格栅(10A)。
7.根据权利要求1至6中任一项所述的复合组件(1、1A)，其特征在于，所述第二接合副(20)是DBC衬底(20A)。
8.根据权利要求7所述的复合组件(1、1A)，其特征在于，第一DBC铜结构(22A)构造所述第二接合副(20)的可钎焊的第二表面(22)，并且第二DBC铜结构(24A)构造所述第二接合副(20)的可钎焊的第三表面(24)。
9.根据权利要求1至8中任一项所述的复合组件(1、1A)，其特征在于，所述第三接合副(30)是散热片(30A)。
10.一种用于连接由三个接合副(10、20、30)构成的叠层的方法，其中上接合副(10)和下接合副(30)在其高度方面被固定并且彼此间具有预先给定的距离(H)，所述方法具有以下步骤：
将第一焊膏施加到所述上接合副(10)的可钎焊的第一表面(12)上和中间接合副(20)的可钎焊的第二表面(22)上，从而利用所述第一焊膏填充所述上接合副(10)与所述中间接合副(20)之间的间隙，所述第一焊膏的第一钎料具有第一熔化温度，
利用所述第一焊膏填充所述第一接合副(10)中的向上敞开的钎料补偿开口(14)，
将第二焊膏施加到所述中间接合副(20)的可钎焊的第三表面(24)上和所述下接合副(30)的可钎焊的第四表面(32)上，从而利用所述第二焊膏填充所述中间接合副(20)与所述下接合副(30)之间的间隙，所述第二焊膏的第二钎料具有更高的第二熔化温度，
将所述叠层在回流钎焊炉中加热到高于所述第二熔化温度的温度，并且
随后冷却所述叠层，使得在冷却阶段期间首先所述下钎焊层(5)凝固，而所述上钎焊层(3)仍是熔融液态的，并且这导致所述中间接合副(20)下降并且所述中间接合副(20)整面连接到所述下接合副(30)上，其中利用来自向上敞开的所述钎料补偿开口(14)中的熔融液态的钎料填充在所述中间接合副(20)与所述上接合副(10)之间的更大的间隙，从而在所述钎料补偿开口(14)的留空的情况下实现所述中间接合副(20)到所述上接合副(10)的整面的连接。
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