KR20110066855A - 접합 구조 및 그 제조 방법 - Google Patents

접합 구조 및 그 제조 방법 Download PDF

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KR20110066855A
KR20110066855A KR1020100119615A KR20100119615A KR20110066855A KR 20110066855 A KR20110066855 A KR 20110066855A KR 1020100119615 A KR1020100119615 A KR 1020100119615A KR 20100119615 A KR20100119615 A KR 20100119615A KR 20110066855 A KR20110066855 A KR 20110066855A
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solder
glass
substrate
conductor layer
functional element
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KR1020100119615A
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KR101301382B1 (ko
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에이지 사까모또
쇼헤이 하따
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가부시키가이샤 히타치세이사쿠쇼
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Abstract

Pb를 포함한 땜납을 대체하여 고온 환경 하에서 고신뢰 접합을 유지할 수 있는 접합 재료로서, 접합부가 고온 환경에 견딜 수 있고, 고신뢰 접합을 유지할 수 있는 접합 구조를 제공하는 데에 있다. 본 발명은, 제1 부재(5)와 제2 부재(1)의 접합 구조에서, 땜납(3)과 글래스(4)에 의해서, 제1 부재(5)와 제2 부재(1)를 접합하고, 글래스(4)가 땜납(3)을 밀봉하고 있음으로써, 도전성을 확보함과 함께, 고온 시에 땜납 용융에 의한 유출을 억제하여, 내구성을 향상시킬 수 있다.

Description

접합 구조 및 그 제조 방법{JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF}
본 발명은, 글래스와 땜납을 이용한 접합 구조에 관한 것이다.
종래의 접합 형태로서는, 접속부에 땜납이 이용되어 있는(예를 들면 특허 문헌 1 참조) 것이 알려져 있다. 특허 문헌 1에는, 기판간을 땜납으로 접합하고, 기판 상에 형성된 도체층의 보호와, 기판의 수명을 연장시키는 것을 목적으로, 도체층 및 기판 표면을 글래스로 덮고 있다.
[특허 문헌 1] 일본 특허 공개 제2009-182238호 공보
현재, 자동차의 엔진룸 내와 같이 200℃ 이상의 고온 환경으로 되는 영역의 기판과 기능 소자의 도체층의 전기적 접합에 이용하는 접합 재료에는 Pb를 포함한 땜납이 사용되고 있다. 고온 환경 하에서 사용 가능한 접합 재료로서 85％ 이상의 Pb를 포함한 Sn-Pb 땜납의 대체 기술이 지금으로서는 없기 때문에, Pb 등의 유해성이 염려되는 물질을 규제하고 있는 RoHS 지령(Restriction of Hazardous Substances)에서, Sn-Pb 땜납을 사용하는 것이 허가되어 있다. 그러나, 금후는, Sn-Pb 땜납도 사용 금지로 되는 것이 예상된다. 이 경우의 과제는, Sn-Pb 땜납 이외에 200℃ 이상의 고온 환경 하에서 장기간, 고신뢰 접합을 유지할 수 있는 접합 재료가 존재하지 않는 것이다. 따라서, Sn-Pb 땜납을 대체하여 고온 환경 하에서 고신뢰 접합을 유지할 수 있는 접합 기술이 요구되고 있다.
본 발명의 목적은, 상기 과제를 해결하기 위해, 접합부가 고온 환경에 견딜 수 있고, 고신뢰 접합을 유지할 수 있는 접합 형태를 제공하는 데에 있다.
상기 목적을 달성하기 위해, 본 발명에서는, 제1 부재와 제2 부재를 땜납과 글래스를 이용하여 접합한다. 이 때에, 글래스가 땜납을 밀봉하도록 함으로써, 고온에서 용융한 땜납의 유출을 글래스로 억지한다.
본 발명에 따르면, 땜납 접합부가 글래스로 피복되어 있는 접합 형태이므로, 땜납의 융점 이상의 고온 환경에서 땜납이 용융하여도, 땜납이 접합부의 주위로 유출되는 일이 없으므로, 고온 환경 하에서 글래스로 접합부의 강도를 유지할 수 있어, 고온 환경 하에서 사용되어지는 부재의 접합이 가능하게 된다.
또한, 본 발명에 따르면, 땜납 접합부가 글래스로 피복되어 있기 때문에, 내후성이 우수하다.
도 1은 본 발명의 일 실시예에 따른 기능 소자를 기판 상에 실장하기 전의 상태를 도시하는 단면도.
도 2는 본 발명에 따른 기본 구조인 기능 소자를 기판 상에 실장한 상태를 도시하는 단면도.
도 3은 본 발명에 따른 기본 구조인 기능 소자를 기판 상에 실장하기 전의 상태를 도시하는 단면도로서, 땜납 상에 형성된 글래스의 일부를 제거하고 있는 상태를 도시하는 단면도.
도 4는 본 발명에 따른 기본 구조인 기능 소자를 기판 상에 실장하기 전의 상태를 도시하는 단면도로서, 기능 소자의 접합면측에 형성된 도체층의 일부에 요철 형상의 도체층이 형성되어 있는 상태를 도시하는 단면도.
도 5는 본 발명에 따른 제2 실시 형태에 대해서 도시하는 도면.
도 6은 본 발명에 따른 제2 실시 형태에 대해서 도시하는 도면.
도 7은 본 발명에 따른 제2 실시 형태에 대해서 도시하는 도면.
도 8은 본 발명에 따른 제2 실시 형태에 대해서 도시하는 도면.
이하, 본 발명에 따른 기판과 기판 및 기판과 기능 소자를 접합하고, 접합부가 글래스로 피복되어 있는 접합 형태 및, 글래스로 땜납을 피복함으로써 제작되는 접합 재료의 제조 방법에 대해서 도 1 내지 도 8을 참조하면서 설명한다.
<실시예 1>
본 발명에 따른 제1 실시 형태인 200℃ 이상의 고온 환경 하에서 사용되는 다이오드 등의 기능 소자(1)의 접합에 대해서, 도 1 내지 도 4를 이용하여 설명한다.
도 2는, 본 실시예에 따른 접합 구조의 단면도이다. 기판(5) 상에 기능 소자(1)가, 땜납(3)과 글래스(4)에 의해서 접합되어 있다. 기능 소자(1)로서는 예를 들면 SiC가 주성분으로 되어 있는 파워 반도체이며, 그 주면에는, 도전층(2, 6)이 형성되어 있다. 기판(5)은, 예를 들면 SiC를 주성분으로 하는 기판, 메탈 코어 기판 등의 방열성이 우수한 기판이며, 그 기능 소자(1)측의 주면에는 도체층(7)이 형성되어 있다. 본 실시예에서는, 기판(5)과 기능 소자(1)를 땜납으로 접합함으로써, 기판(5) 상의 도체층(7)과 기능 소자(1) 상의 도체층(2)을 전기적으로 접속하고 있다. 또한 접합부의 땜납(3)을 글래스(4)로 덮음으로써, 방열성이 우수하고, 사용 환경이 200℃ 이상의 고온에서도 장기간의 접합 신뢰성을 유지할 수 있다. 글래스(4)도, 기판(1)과 기능 소자(1)를 접합하고 있고, 또한 땜납(3)을 밀봉하고 있다. 글래스는, 글래스 프릿, 글래스 페이스트 등, 접합 부재ㆍ밀봉 부재로 알려져 있고, 강고하고 내열성이 높은 접합을 실현할 수 있는 것이 알려져 있다. 그러나 글래스는 전기 전도성이 낮으므로, 도체로서 이용할 수는 없다. 본 실시예에서는, 땜납(3)에 의해서 전기 전도성을 담보하고, 땜납을 글래스(4)에 의해 밀봉하여 접합함으로써, 내열성을 높이고 있다. 예를 들면, 글래스(4)로서 땜납(3)보다도 융점이 높은 것을 사용함으로써, 땜납(3)이 용융하여도, 글래스가 밀봉하고 있음으로써, 땜납(3)이 곧바로 유출되는 일은 없으며, 온도가 저하되면 땜납(3)이 응고되어 원래대로 된다. 따라서, 땜납(3)과 글래스(4)의 접합에 의해서, 내구성과 내열성을 높일 수 있다.
또한, 접속하는 대상으로서는, 본 실시예에서는 기판(5)과 기능 소자(1)로 하고 있지만 이에 한정되는 것이 아니라, 2개 이상의 부재를 접합하는 것이면 다른 부재라도 적용 가능하다. 기능 소자(1)로서는, 파워 반도체로 한정되는 것이 아니라, 다양한 종류의 기능 소자가 적용 가능하지만, 파워 반도체 등 고온으로 되기 쉬운 기능 소자의 경우에는 특히 고내열성의 효과를 발휘할 수 있다. 또한, 파워 반도체로서는 SiC로 한정되는 것이 아니라, GaN 등에도 적용 가능하다. 또한, 땜납에는 Pb를 포함하지 않는 땜납을 이용하고, 글래스에는 Pb를 포함하지 않는 것을 이용함으로써, RoHS 지령에서 Sn-Pb 땜납 규제 후에도 사용을 제한받는 일은 없다. 기능 소자(1)인 파워 반도체에 외부로부터 송전하는 것, 및 파워 반도체로부터 발생하는 열을 방열하기 위해 제1 도체층(2), 제2 도체층(6) 및 제3 도체층(7)에는 Cu 또는 Cu 합금, Al 또는 Al 합금, Ni 또는 Ni 합금의 금속, 또는 Au 또는 Au 합금으로 구성되는 금속으로 형성된다.
다음으로, 본 실시예에 따른 접합 구조의 형성 프로세스의 개략에 대해서 설명한다.
도 1은, 기능 소자(1)를 기판(5) 상에 실장하기 전의 단면도이다. 도 3은, 기능 소자(1)를 기판(5) 상에 실장하기 전에 땜납(3)의 접합면측에 형성되어 있는 글래스(4)를 제거한 상태의 단면도이다. 도 2는 기능 소자(1)를 기판(5) 상에 실장한 후의 완성된 접합 구조의 단면도이다. 도 4는, 기능 소자(1)의 접합면측의 일부에 요철 형상을 갖는 도체층(2)이 형성된 상기 기능 소자(1)를 기판(5) 상에 실장하기 전의 단면도이다.
우선, 기판(5)의 접합면측에 전극으로 되는 제3 도체층(7)을 포토리소그래피 기술을 이용한 반도체 프로세스에 의해 형성한다. 다음으로 도체층(7) 상에 땜납(3)을 증착, 스퍼터, 도금, 혹은 스크린 인쇄 기술을 이용하여 형성한다. 형성한 땜납을 완전히 덮도록 글래스(4)를 스크린 인쇄 기술을 이용하여 인쇄한다. 다음으로, 100℃ 내지 150℃ 정도의 온도의 환경에 상기 글래스(4)를 인쇄한 기판을 방치하여 글래스(4)를 건조시킨다. 그 후, 기능 소자(1)인 파워 반도체를 접합하기 전에, 도 3과 같이 기능 소자(1)가 접합하는 측의 주면의 글래스(4)를 연마 등으로 제거하고, 땜납(3)을 노출시킨다. 이렇게 함으로써, 파워 반도체를 기판(5) 상에 접합 시에, 파워 반도체측에 형성된 제1 도체층(2)이, 땜납(3)의 노출된 부분에 접한다. 그 후, 가열한 상태에서 글래스(4)로 파워 반도체와 기판(7)을 접합할 수 있는 온도로 유지하고, 기판(5)과 기능 소자(1)를 접합하고, 냉각함으로써, 글래스(4)를 이용한 접합과 땜납(3)을 이용한 금속적인 접합을 동시에 실현할 수 있다. 이 때, 가열에 의해 땜납(3)은 용융하고, 글래스(4)는 연화되지만 완전하게 용융하는 것은 아니므로, 땜납(3)과 글래스(4)가 조금만 혼합되어, 독립한 상태로 접합할 수 있다. 글래스는 접속 가능 온도에 비해 내구 온도가 높으므로, 완성된 접속 구조는 내열성이 높은 것으로 된다.
또한, 기능 소자인 파워 반도체를 접합하기 전에, 도 4와 같이 제1 도체층(2)을 요철 형상으로 함으로써, 글래스를 제거하는 공정을 생략하여도 된다. 요철 형상은, 전사 기술이나 나노 임프린트 기술이나 용액을 사용한 웨트 에칭을 적용함으로써 형성한다. 요철은, 땜납(3) 상의 글래스(4)의 두께보다도 큰 것이 바람직하다. 이렇게 함으로써, 파워 반도체를 기판(5) 상에 접합의 가열 시에, 제1 도체층(2)의 볼록부에 의해 연화 상태의 글래스(4)를 돌파하고, 제1 도체층(2)과 땜납(3)이 접하여, 글래스(4)에 의해 파워 반도체와 기판(7)을 접합할 수 있다.
본 발명에 따르면, 땜납 접합부가 글래스로 피복되어 있는 접합 형태이므로, 땜납의 융점 이상의 고온 환경에서 땜납이 용융하여도, 땜납이 접합부의 주위로 유출되는 일이 없으므로, 고온 환경 하에서 사용되는 부재의 접합이 가능하게 된다.
또한, 본 발명에 따르면, 땜납은 접합부가 글래스로 피복되어 있고, 그 글래스에 의해 땜납 접합부 주변이 접합되어 있기 때문에, 고온 환경 하에서 땜납이 용융하여도 글래스로 접합부의 강도를 유지할 수 있다. 그 때문에, 접합부의 강도를 보강하는 목적으로 언더 필을 사용할 필요는 없으며, 언더 필의 재료비 삭감 및 언더 필을 접합부에 주입하는 공정을 삭감할 수 있다.
또한, 본 발명에 따르면, 땜납 접합부가 글래스로 피복되어 있는 접합 형태이므로, 땜납의 융점 이상의 고온 환경에서 땜납이 용융하여도, 땜납이 접합부의 주위로 유출되는 일이 없으므로, 고온 환경 하에서 땜납이 용융한 상태를 유지할 수 있기 때문에 피접합재의 열팽창 계수의 차에 의해 생기는 열응력을 저감할 수 있다.
<실시예 2>
다음으로 본 발명에 따른 제2 실시 형태에 대해서 도 5 내지 도 8을 이용하여 설명한다. 제2 실시 형태에서, 제1 실시 형태와 서로 다른 점은, 땜납(3)을 이용하여 접합하는 대신에, 범프 형상의 접합 금속(땜납 또는 금속)(8)을 이용하여 접합하는 것이다.
도 5는 기능 소자(1)를 기판(5) 상에 실장하기 전의 단면도이다. 도 6은 기능 소자(1)를 기판(5) 상에 실장한 후의 단면도이다. 도 7은, 기능 소자(1)를 기판(5) 상에 실장하기 전에 범프 형상의 땜납 또는 금속(8)의 접합면측에 형성되어 있는 글래스(4)를 제거한 상태의 단면도이다. 도 8은, 기능 소자(1)의 접합면측의 일부에 요철 형상을 갖는 도체층(2)이 형성된 상기 기능 소자(1)를 기판(5) 상에 실장하기 전의 단면도이다.
완성된 접합 구조는, 도 6에 도시한 바와 같이, 기판(5)과 기능 소자(1)가 글래스(4)와 글래스(4)에 밀봉된 범프 형상의 접합 부재(8)에 의해서 접합되고, 실시예 1과 마찬가지로 높은 내구성과 내열성을 갖는다. 또한, 복수의 접합 금속(8)에 의해서 접합되므로, 미세한 배선 패턴에도 적용 가능하다.
본 실시예에서의 접합 구조의 제조 방법에서는, 실시예 1과 마찬가지로 기판(5) 상에 접합 금속(8)을 형성하고, 그 위에 글래스(4)를 형성하고, 도 7과 같이 글래스(4)의 일부를 제거하고, 가열에 의해 접합 금속(8)과 글래스(4)를 용융시켜 기능 소자(1)를 접합한다. 여기서, 도 8에 도시한 바와 같이, 기능 소자(1)측에 형성하는 접합 금속(8)을, 선단이 뾰족한 범프 형상의 금속으로 함으로써, 범프 형상이 글래스를 돌파하여 접합시킬 수 있어, 글래스(4)의 일부를 제거하는 공정을 생략할 수 있다.
상기한 바와 같은 제2 실시 형태로 함으로써, 미세한 배선 패턴의 실장에도 대응 가능하게 된다.
<실시예 3>
다음으로 본 발명에 따른 제3 실시 형태에 대해서 설명한다. 제3 실시 형태는, 제1 및 제2 실시 형태에서 설명한 땜납(3)의 표면에, 또한 Ag막 혹은 Au막이 형성되어 있고, Ag막을 형성하는 경우에는, 또한 Ag막의 표면에 Au막이 형성되고, 땜납 표면의 산화를 방지하고 있다. Ag막은 0.1㎛ 정도의 두께로, 산화 방지 능력을 발휘하고, 특히 논플럭스의 접속 프로세스에 유효한 기술이다. 단, Ag막 혹은 Au막의 형성은 필수는 아니다. 예를 들면, 플럭스를 사용할 수 있는 경우나, 땜납 표면의 산화 방지를 하지 않아도 양호한 접속을 할 수 있는 경우 등, Ag막 혹은 Au막의 형성이 필요없는 경우도 있다.
이상 설명한 바와 같이, 제3 실시 형태에 따르면, 땜납의 습윤성을 향상시키는 기능이 있는 플럭스를 땜납에 도포하는 것도 플럭스를 세정하는 것도 필요없기 때문에, 플럭스 잔사에 의해서 배선부를 부식시켜 전자 부품이 고장나는 일도 방지하는 것이 가능하게 된다.
1 : 기능 소자
2 : 제1 도체층(기능 소자의 접합면측)
3 : 땜납
4 : 글래스
5 : 기판
6 : 제2 도체층(기능 소자의 접합면과 반대측)
7 : 제3 도체층(기판(1)의 접합면측)
8 : 범프 형상의 땜납 또는 금속
9 : 범프 형상의 도체층

Claims (13)

  1. 제1 부재와 제2 부재를 접합한 접합 구조에 있어서,
    상기 제1 부재와 상기 제2 부재는, 땜납에 의해 접속되어 있고, 상기 땜납은, 글래스에 의해서 밀봉되어 있는 땜납인 것을 특징으로 하는 접합 구조.
  2. 제1항에 있어서,
    상기 제1 부재와 상기 제2 부재는, 상기 땜납 및 상기 글래스에 의해서 접합되어 있는 것을 특징으로 하는 접합 구조.
  3. 제1항에 있어서,
    상기 땜납의 전체가, 상기 제1 및 제2 부재와 상기 글래스에 의해서 덮여져 있는 것을 특징으로 하는 접합 구조.
  4. 제1항에 있어서,
    상기 제1 부재 및 상기 제2 부재는, 상기 땜납과 접합되는 부분에 도체층을 구비하고 있는 것을 특징으로 하는 접합 구조.
  5. 제4항에 있어서,
    상기 제1 부재 및 제2 부재의 도체층의 재료가 Cu 혹은 Cu 합금, Al 혹은 Al 합금, Ni 혹은 Ni 합금의 금속, 또는 Au 혹은 Au 합금 중 어느 하나인 것을 특징으로 하는 접합 구조.
  6. 제1항에 있어서,
    상기 접합에서 이용되는 땜납의 표면에, Ag, Au 혹은 Ag와 Au를 적층하여 구성되는 막이 형성되어 있는 것을 특징으로 하는 접합 구조.
  7. 제6항에 있어서,
    상기 땜납의 표면에, 상기 Ag, Au 혹은 Ag와 Au를 적층하여 구성되는 막이 증착, 스퍼터 또는 도금에 의해 형성되는 것을 특징으로 하는 접합 구조.
  8. 제1항에 있어서,
    상기 제1 부재와 상기 제2 부재와의 사이에, 상기 땜납과 그것을 밀봉하는 글래스가 복수 형성되어 있는 것을 특징으로 하는 접합 구조.
  9. 제1항에 있어서,
    상기 제1 부재는 기판이며,
    상기 제2 부재는, 기능 소자인 것을 특징으로 하는 접합 구조.
  10. 제1 부재와 제2 부재를 접합한 접합 구조의 제조 방법에 있어서,
    땜납, 제1 기판, 표면에 땜납 패턴을 형성하는 공정과,
    상기 땜납 패턴 상에, 땜납 패턴을 덮도록 글래스를 형성하는 공정과,
    상기 글래스가 상기 땜납 패턴을 밀봉하도록, 상기 땜납 패턴 및 상기 글래스에 상기 제2 부재를 접합하는 공정을 포함하는 접합 구조의 제조 방법.
  11. 제10항에 있어서,
    상기 제2 부재의 접합 전에, 상기 글래스의 일부를 제거하여 상기 땜납 패턴을 노출시키는 공정을 포함하는 것을 특징으로 하는 접합 구조의 제조 방법.
  12. 제10항에 있어서,
    상기 제2 부재 상에, 상기 땜납 패턴에 접합시키는 도체층을 갖고,
    상기 도체층은, 요철 형상을 갖는 것을 특징으로 하는 접합 구조의 제조 방법.
  13. 제10항에 있어서,
    상기 제2 부재 상에, 상기 땜납 패턴에 접합시키는 도체층을 갖고,
    상기 도체층은, 범프 형상을 갖는 것을 특징으로 하는 접합 구조의 제조 방법.
KR1020100119615A 2009-12-11 2010-11-29 접합 구조 및 그 제조 방법 KR101301382B1 (ko)

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