CN1119447A - 磷改性的环氧树脂及其制备方法和应用 - Google Patents

磷改性的环氧树脂及其制备方法和应用 Download PDF

Info

Publication number
CN1119447A
CN1119447A CN94191474A CN94191474A CN1119447A CN 1119447 A CN1119447 A CN 1119447A CN 94191474 A CN94191474 A CN 94191474A CN 94191474 A CN94191474 A CN 94191474A CN 1119447 A CN1119447 A CN 1119447A
Authority
CN
China
Prior art keywords
phosphorus
modified epoxy
epoxy resin
resin according
structural unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94191474A
Other languages
English (en)
Chinese (zh)
Inventor
W·V·根特兹科
J·胡博
H·卡皮特萨
W·罗格勒
H·J·克莱纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Siemens Corp
Original Assignee
Hoechst AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19934308184 external-priority patent/DE4308184A1/de
Application filed by Hoechst AG, Siemens Corp filed Critical Hoechst AG
Publication of CN1119447A publication Critical patent/CN1119447A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
    • C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN94191474A 1993-03-15 1994-03-10 磷改性的环氧树脂及其制备方法和应用 Pending CN1119447A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19934308184 DE4308184A1 (de) 1993-03-15 1993-03-15 Epoxidharzmischungen
DEP4308184.3 1993-03-15

Publications (1)

Publication Number Publication Date
CN1119447A true CN1119447A (zh) 1996-03-27

Family

ID=6482839

Family Applications (2)

Application Number Title Priority Date Filing Date
CN94191474A Pending CN1119447A (zh) 1993-03-15 1994-03-10 磷改性的环氧树脂及其制备方法和应用
CN94191463A Expired - Fee Related CN1046949C (zh) 1993-03-15 1994-03-10 环氧树脂混合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN94191463A Expired - Fee Related CN1046949C (zh) 1993-03-15 1994-03-10 环氧树脂混合物

Country Status (15)

Country Link
US (1) US5648171A (cg-RX-API-DMAC7.html)
EP (2) EP0689559B1 (cg-RX-API-DMAC7.html)
JP (2) JPH08507814A (cg-RX-API-DMAC7.html)
KR (2) KR960701118A (cg-RX-API-DMAC7.html)
CN (2) CN1119447A (cg-RX-API-DMAC7.html)
AT (1) ATE154369T1 (cg-RX-API-DMAC7.html)
CA (2) CA2158362A1 (cg-RX-API-DMAC7.html)
CZ (2) CZ240095A3 (cg-RX-API-DMAC7.html)
DE (2) DE4340834A1 (cg-RX-API-DMAC7.html)
FI (2) FI954292A0 (cg-RX-API-DMAC7.html)
HU (2) HU214671B (cg-RX-API-DMAC7.html)
PL (2) PL175777B1 (cg-RX-API-DMAC7.html)
RU (2) RU2126426C1 (cg-RX-API-DMAC7.html)
TW (2) TW261622B (cg-RX-API-DMAC7.html)
WO (2) WO1994021706A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880507A (zh) * 2010-07-02 2010-11-10 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW294693B (cg-RX-API-DMAC7.html) * 1994-09-09 1997-01-01 Siemens Ag
DE19613066C2 (de) * 1996-04-01 1998-09-10 Clariant Gmbh Verfahren zur Herstellung phosphormodifizierter Epoxidharze
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
DE19619095A1 (de) 1996-05-06 1997-11-13 Schill & Seilacher Flammfeste Epoxidharze und Flammschutzmittel für Epoxidharze
DE59711794D1 (de) * 1996-09-26 2004-08-26 Siemens Ag Epoxidharzmischungen
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
DE19917428A1 (de) 1999-04-19 2000-10-26 Clariant Gmbh Flammwidrige phosphormodifizierte Epoxidharze
US7916492B1 (en) 1999-08-12 2011-03-29 Ibiden Co., Ltd. Multilayered printed circuit board
JP4535559B2 (ja) * 2000-04-04 2010-09-01 イビデン株式会社 多層プリント配線板
JP4530469B2 (ja) * 2000-04-04 2010-08-25 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
EP1363922B1 (en) * 2001-02-15 2006-07-26 Great Lakes Chemical Corporation Novel hydroxyaryl phosphine oxides mixture, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
US6887950B2 (en) * 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
JP2002275244A (ja) * 2001-03-19 2002-09-25 Dainippon Ink & Chem Inc エポキシ樹脂組成物
AT411061B (de) * 2001-11-30 2003-09-25 Solutia Austria Gmbh Wässrige härter für wässrige epoxidharzdispersionen
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
RU2247752C1 (ru) * 2003-10-06 2005-03-10 Казанский государственный технический университет им. А.Н. Туполева (КГТУ им. А.Н. Туполева) Способ получения электроизоляционного компаунда
JP5250972B2 (ja) * 2004-02-27 2013-07-31 東レ株式会社 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、一体化成形品、繊維強化複合材料板、および電気・電子機器用筐体
WO2005092945A1 (ja) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
CN1960997B (zh) 2004-05-28 2014-05-07 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
GB2451233A (en) * 2007-07-21 2009-01-28 Leigh S Paints Intumescent coating composition
US20090110835A1 (en) * 2007-10-31 2009-04-30 Pressley Mark W Additives for improved adhesion to oily substrates
EP2083030A1 (en) * 2008-01-15 2009-07-29 Cytec Surface Specialties Austria GmbH Water-borne epoxy resin systems
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101591471B (zh) * 2008-05-26 2011-03-16 台燿科技股份有限公司 处理无卤素铜箔基板材料的树脂组合物
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
RU2422273C1 (ru) * 2009-12-10 2011-06-27 Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" Способ формования изделий из эпоксидной смолы
US9267030B2 (en) * 2010-01-29 2016-02-23 Blue Cube Ip Llc Compositions having phosphorus-containing compounds
CN102304322B (zh) * 2011-08-31 2013-07-31 蚌埠市英路光电有限公司 一种耐热聚酯亚胺漆包线漆及其制备方法
CN102304320A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 一种低温环保聚酯亚胺漆包线漆及其制备方法
CN102304321A (zh) * 2011-08-31 2012-01-04 蚌埠市英路光电有限公司 酚型聚酯漆包线漆及其制备方法
US9181628B2 (en) * 2011-09-14 2015-11-10 Prc-Desoto International, Inc. Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating
CN102559014B (zh) * 2011-12-14 2014-05-28 东华大学 一种电动工具转子用无溶剂滴浸漆及其制备方法
RU2573003C2 (ru) * 2013-11-28 2016-01-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Эпоксивинилэфирная смола и огнестойкий полимерный композиционный материал на ее основе
RU2569537C1 (ru) * 2014-09-19 2015-11-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Комсомольский-на-Амуре государственный технический университет" (ФГБОУ ВПО "КнАГТУ") Способ получения слоистого пластика
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
CN108191840B (zh) * 2017-12-13 2020-11-24 华南理工大学 一种含六氢三嗪结构环氧树脂预聚物及其制备方法
CN109400957B (zh) * 2018-07-19 2020-11-27 中国科学院宁波材料技术与工程研究所 一种生物碱磷酸盐阻燃剂及其制备方法
WO2020197561A1 (en) * 2019-03-28 2020-10-01 Safran Cabin Inc. Fire retardant epoxy resin
WO2021074684A1 (en) * 2019-10-18 2021-04-22 Toray Industries, Inc. Flame retardant epoxy resin composition
JP7757957B2 (ja) * 2019-10-18 2025-10-22 東レ株式会社 難燃剤組成物、繊維強化複合材料
EP3926024A1 (de) * 2020-06-17 2021-12-22 Clariant International Ltd Phosphorhaltige flammschutzmittelmischungen, ein verfahren zu ihrer herstellung und ihre verwendung sowie epoxidharzformulierungen, die diese flammschutzmittelmischungen enthalten

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732367A (en) * 1956-01-24 ruuivj
GB191110794A (en) * 1911-05-04 1912-04-11 John Dugmore Improvements in or relating to Studs, Solitaires, Buttons or the like.
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
US3364159A (en) * 1965-09-27 1968-01-16 Argus Chem Curing vicinal epoxy compounds and curing compositions therefor
GB1112139A (en) * 1967-01-13 1968-05-01 Shell Int Research Curable polyepoxide compositions for making flame retardant articles
US3862148A (en) * 1968-09-11 1975-01-21 Merck & Co Inc P-(-)-(cis-1,2-epoxypropyl)-isohypophosphoric acid compounds
DE2743680C2 (de) * 1977-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Selbstverlöschende Verbundwerkstoffe
GB8610067D0 (en) * 1986-04-24 1986-05-29 Steetley Refractories Ltd Coated magnesium hydroxide
DE3776642D1 (de) * 1986-12-15 1992-03-19 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.
EP0384939B1 (de) * 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharz-Formmassen
ATE107677T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880507A (zh) * 2010-07-02 2010-11-10 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法
CN101880507B (zh) * 2010-07-02 2013-03-13 石家庄市金达特种涂料有限公司 一种膨胀型水性防火清漆及制备方法

Also Published As

Publication number Publication date
FI954292L (fi) 1995-09-13
JPH08507814A (ja) 1996-08-20
KR100304600B1 (ko) 2001-11-22
WO1994021706A1 (de) 1994-09-29
JPH08507813A (ja) 1996-08-20
DE4340834A1 (de) 1994-09-22
FI954321A0 (fi) 1995-09-14
CZ224695A3 (en) 1996-01-17
PL175777B1 (pl) 1999-02-26
RU2126426C1 (ru) 1999-02-20
CZ287737B6 (en) 2001-01-17
CA2158362A1 (en) 1994-09-29
CA2158366A1 (en) 1994-09-29
CN1046949C (zh) 1999-12-01
DE59403119D1 (de) 1997-07-17
PL176714B1 (pl) 1999-07-30
CZ240095A3 (en) 1996-01-17
HUT73149A (en) 1996-06-28
HU9502671D0 (en) 1995-11-28
TW261622B (cg-RX-API-DMAC7.html) 1995-11-01
FI954292A7 (fi) 1995-09-13
KR960701118A (ko) 1996-02-24
PL310629A1 (en) 1995-12-27
CN1119444A (zh) 1996-03-27
KR960701115A (ko) 1996-02-24
ATE154369T1 (de) 1997-06-15
PL310630A1 (en) 1995-12-27
FI954292A0 (fi) 1995-09-13
FI954321L (fi) 1995-09-14
EP0689560A1 (de) 1996-01-03
RU2116323C1 (ru) 1998-07-27
EP0689559B1 (de) 1997-06-11
US5648171A (en) 1997-07-15
HU213902B (en) 1997-11-28
HUT73868A (en) 1996-10-28
FI107612B (fi) 2001-09-14
WO1994021705A1 (de) 1994-09-29
HU9502639D0 (en) 1995-11-28
TW261623B (cg-RX-API-DMAC7.html) 1995-11-01
HU214671B (hu) 1998-04-28
EP0689559A1 (de) 1996-01-03

Similar Documents

Publication Publication Date Title
CN1119447A (zh) 磷改性的环氧树脂及其制备方法和应用
RU2129570C1 (ru) Модифицированная фосфором эпоксидная смола, способ ее получения и ее применение
US6534179B2 (en) Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
US5773533A (en) Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener
TW316918B (cg-RX-API-DMAC7.html)
US5959043A (en) Phosphorus-containing dicarboxylic reaction product of epoxy resins and phosphorus acid (anhydride) with hardener
US5624979A (en) Stabilized phosphorus-modified epoxy resins and their use
US5830973A (en) Phosphorus-modified epoxy resins comprising epoxy resins and phosphorus-containing compounds
US5880247A (en) Phosphorus-containing dicarboxylic acid (anhydride)-modified epoxy resin
US5854361A (en) Process for preparing phosphorus-modified epoxy resins
TW572964B (en) Flame retarded epoxy resin composition
US5811188A (en) Phosphorus-modified epoxy resins, processes for their preparation and their use
US5900469A (en) Storage-stable, phosphorus-modified epoxy resins
US5854371A (en) Phosphorus-modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent
CA2196575A1 (en) Phosphorus-modified epoxide resins, process for producing the same and their use
KR19980074387A (ko) 에폭시 수지, 인 함유 화합물 및 경화제를 포함하는 인 개질된 에폭시 수지 혼합물

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned