CN110023034B - 研磨垫及其制造方法 - Google Patents
研磨垫及其制造方法 Download PDFInfo
- Publication number
- CN110023034B CN110023034B CN201780070421.3A CN201780070421A CN110023034B CN 110023034 B CN110023034 B CN 110023034B CN 201780070421 A CN201780070421 A CN 201780070421A CN 110023034 B CN110023034 B CN 110023034B
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- Prior art keywords
- fiber
- polishing pad
- sea
- polishing
- nonwoven fabric
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims abstract description 172
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 37
- 239000000835 fiber Substances 0.000 claims abstract description 181
- 239000011230 binding agent Substances 0.000 claims abstract description 51
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 51
- 239000002131 composite material Substances 0.000 claims abstract description 41
- 229920001971 elastomer Polymers 0.000 claims abstract description 28
- 239000000806 elastomer Substances 0.000 claims abstract description 28
- 229920001410 Microfiber Polymers 0.000 claims description 52
- 229920000642 polymer Polymers 0.000 claims description 26
- 229920000728 polyester Polymers 0.000 claims description 15
- 239000004952 Polyamide Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 239000011800 void material Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 23
- 239000002121 nanofiber Substances 0.000 description 19
- 230000003746 surface roughness Effects 0.000 description 19
- 239000006061 abrasive grain Substances 0.000 description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 description 16
- 239000005020 polyethylene terephthalate Substances 0.000 description 16
- 239000002002 slurry Substances 0.000 description 15
- 238000000227 grinding Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 229920002292 Nylon 6 Polymers 0.000 description 11
- 238000005470 impregnation Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- 239000003513 alkali Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- 229920001778 nylon Polymers 0.000 description 9
- 208000016261 weight loss Diseases 0.000 description 9
- 239000004677 Nylon Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000009987 spinning Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000013585 weight reducing agent Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000004220 aggregation Methods 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229920005749 polyurethane resin Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- ODPYDILFQYARBK-UHFFFAOYSA-N 7-thiabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2SC2=C1 ODPYDILFQYARBK-UHFFFAOYSA-N 0.000 description 4
- 229920001634 Copolyester Polymers 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920003225 polyurethane elastomer Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical group C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 230000001112 coagulating effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- YXTFRJVQOWZDPP-UHFFFAOYSA-M sodium;3,5-dicarboxybenzenesulfonate Chemical compound [Na+].OC(=O)C1=CC(C(O)=O)=CC(S([O-])(=O)=O)=C1 YXTFRJVQOWZDPP-UHFFFAOYSA-M 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- 238000003809 water extraction Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- SOHCOYTZIXDCCO-UHFFFAOYSA-N 6-thiabicyclo[3.1.1]hepta-1(7),2,4-triene Chemical group C=1C2=CC=CC=1S2 SOHCOYTZIXDCCO-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 1
- 229960003375 aminomethylbenzoic acid Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical group C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- JMLPVHXESHXUSV-UHFFFAOYSA-N dodecane-1,1-diamine Chemical compound CCCCCCCCCCCC(N)N JMLPVHXESHXUSV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- DDLUSQPEQUJVOY-UHFFFAOYSA-N nonane-1,1-diamine Chemical compound CCCCCCCCC(N)N DDLUSQPEQUJVOY-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- XJIAZXYLMDIWLU-UHFFFAOYSA-N undecane-1,1-diamine Chemical compound CCCCCCCCCCC(N)N XJIAZXYLMDIWLU-UHFFFAOYSA-N 0.000 description 1
- 239000011782 vitamin Substances 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
- 235000013343 vitamin Nutrition 0.000 description 1
- 150000003722 vitamin derivatives Chemical class 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000000733 zeta-potential measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/005—Making abrasive webs
- B24D11/006—Making abrasive webs without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
- D04H1/43825—Composite fibres
- D04H1/43828—Composite fibres sheath-core
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
- D04H1/43825—Composite fibres
- D04H1/4383—Composite fibres sea-island
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
- D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
- D04H1/43835—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
-
- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
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- D04H1/44—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling
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- D04H1/44—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling
- D04H1/46—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
- D04H1/48—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres in combination with at least one other method of consolidation
- D04H1/485—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres in combination with at least one other method of consolidation in combination with weld-bonding
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- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
- D04H1/541—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres
- D04H1/5412—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres sheath-core
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- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
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- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
- D04H1/541—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres
- D04H1/5416—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres sea-island
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- D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
- D04H1/541—Composite fibres, e.g. sheath-core, sea-island or side-by-side; Mixed fibres
- D04H1/5418—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
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- D—TEXTILES; PAPER
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- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
- D04H1/542—Adhesive fibres
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- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
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- D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
- D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
- D04H1/54—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by welding together the fibres, e.g. by partially melting or dissolving
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- D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
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Abstract
本发明的课题在于提供一种寿命长且研磨速率高、能够实现被加工物的高度的平坦性的研磨垫及其制造方法,解决方法是从含有由海成分和岛直径为10~2500nm的岛成分构成的海岛型复合纤维与粘结剂纤维的无纺布中,除去上述海成分,赋予高分子弹性体。
Description
技术领域
本发明涉及用于对半导体基板、半导体设备、化合物半导体基板、化合物半导体设备等各种设备进行研磨的研磨垫及其制造方法。
背景技术
近年来,伴随集成电路的高集成化和多层配线化,对形成集成电路的半导体晶片等要求高度的平坦性。而且,作为用于研磨该半导体晶片等的研磨方法,已知有化学机械研磨(CMP)。化学机械研磨是边滴加磨粒的浆料边利用研磨垫研磨被加工物的表面的方法。另外,研磨半导体晶片等时,存在因加工困难而研磨时间变长,加工成本变大的问题。
基于这样的理由,需要一种能够实现被加工物的优异的平坦性和高研磨速率的研磨垫。同时还要求研磨垫的寿命长。
然而,被加工物的优异的平坦性和高研磨速率是相反的要求事项,兼顾两者是极其困难的。即,为了实现被加工物的优异的平坦性,有利的是具有柔软且平滑的面的研磨垫。另一方面,为了实现高研磨速率,有利的是具有硬且凹凸大的表面的研磨垫。
例如,在专利文献1中,提出了使用极细纤维和高分子弹性体的研磨垫。然而,由于在使高分子弹性体浸渗于基材后将海岛型复合纤维制成极细纤维,所以存在研磨垫内的空隙多而过于柔软的问题。这样的研磨垫难以成为高硬度,因此难以实现被加工物的优异的平坦性、长寿命化。
另外,在专利文献2中,提出了使用极细纤维的由致密的无纺布和高分子弹性体构成的研磨垫。在该研磨垫中,利用由长纤维的极细纤维构成的纤维束维持高的刚性。然而,由于研磨垫被致密化而空隙率较低,所以存在难以充分蓄积研磨磨粒,难以实现高研磨速率的问题。
现有技术文献
专利文献
专利文献1:日本特开2012-071415号公报
专利文献2:日本特开2015-063782号公报
发明内容
本发明提供寿命长且研磨速率高、能够实现被加工物的优异的平坦性的研磨垫及其制造方法。
本发明人等为了实现上述的课题而进行了深入研究,结果发现通过巧妙地设计使用的纤维的种类、表面状态等,可得到寿命长且研磨速率高、能够实现被加工物的优异的平坦性的研磨垫,进而经过反复潜心地研究而完成了本发明。
如此,根据本发明,可提供“一种研磨垫,其特征在于,含有纤维直径为10~2500nm的极细纤维、粘结剂纤维和高分子弹性体。”。
此时,优选空隙率为50%以上且弯曲强度为5.0N/mm2以上。另外,优选表面起绒。另外,在上述极细纤维中ζ电位优选为-20mV以下。另外,上述极细纤维优选由聚酰胺或聚酯构成。另外,上述粘结剂纤维优选为皮芯型复合纤维。另外,上述极细纤维与粘结剂纤维的重量比(极细纤维/粘结剂纤维)优选为50/50~97/3的范围内。
另外,根据本发明,可提供“一种研磨垫的制造方法,其特征在于,从含有由海成分和岛直径为10~2500nm的岛成分构成的海岛型复合纤维与粘结剂纤维的无纺布,除去上述海成分,赋予高分子弹性体”。
此时,上述海岛型复合纤维与粘结剂纤维的单纤维纤度比(海岛型复合纤维:粘结剂纤维)优选为1:0.49~1:0.70的范围内。另外,上述无纺布优选为针刺无纺布。另外,上述无纺布的单位面积重量优选为300~600g/m2的范围内。另外,在上述无纺布中,纵向或横向的拉伸强度优选为100N/cm以上。另外,优选进一步使表面起绒。
根据本发明,能够提供寿命长且研磨速率高、能够实现被加工物的优异的平坦性的研磨垫及其制造方法。
具体实施方式
本发明的研磨垫含有极细纤维、粘结剂纤维和高分子弹性体。其中,上述极细纤维优选为从以可溶性树脂作为海成分的海岛型复合纤维中溶解除去海成分而得的纤维。
优选上述极细纤维的ζ电位与研磨剂所具有的ζ电位相比,纤维的ζ电位位于负数侧。数值上优选具有﹣20mV以下(更优选为﹣40~﹣80mV)的ζ电位。作为研磨剂所具有的ζ电位,优选为﹣40~﹣80mV的范围。通过使用这样的极细纤维,能够防止研磨磨粒粒子的凝聚,增加对加工基板作用的磨粒数,更容易同时实现高研磨速率和低表面粗糙度(擦伤少)。如果极细纤维的ζ电位大,则在与研磨剂配合时,研磨剂的ζ电位向正数侧转移,发生研磨磨粒粒子的凝聚,作用磨粒数减少,存在研磨速率下降的趋势。另外,还有可能表面粗糙度变差,容易产生擦伤。
作为构成上述极细纤维的聚合物,可以为任意的聚合物。其中,作为优选例可举出纤维形成性优异的聚酰胺(尼龙)、聚酯、聚烯烃、聚苯硫醚等。
在此,作为聚酰胺系树脂,除了将6-氨基己酸、11-氨基十一酸、12-氨基十二酸、对氨基甲基苯甲酸等氨基酸,ε-己内酰胺、ω-十二内酰胺等内酰胺作为主要原料的聚酰胺以外,还可例示将琥珀酸、戊二酸、己二酸、癸二酸、丙二酸、琥珀酸、戊二酸、庚二酸、辛二酸、壬二酸、十一烷二酸、十二烷二酸、十四烷二酸、十五烷二酸、十八烷二酸等脂肪族二羧酸,以及对苯二甲酸、间苯二甲酸、萘二甲酸等芳香族二羧酸作为主要酸成分,将丁二胺、己二胺、1,5-戊二胺、2-甲基戊二胺、壬二胺、十一烷二胺、十二烷二胺等作为二胺成分的共聚聚酰胺等。
另外,作为聚酯树脂,从纺纱性、极细纤维的物性的观点考虑,优选聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯等。
在不损害本发明的目的的范围内,该聚合物中可以含有共聚成分。可共聚的化合物中,作为酸成分,例如,可例示间苯二甲酸、环己烷二甲酸、己二酸、二聚酸、癸二酸、2,6-萘二甲酸等二羧酸类,作为二醇成分,例如,可例示乙二醇、二乙二醇、丁二醇、新戊二醇、环己烷二甲醇、聚乙二醇、聚丙二醇等。当然不限于这些。
作为聚苯硫醚树脂,作为其结构单元,例如可例示由对苯硫醚单元、间苯硫醚单元、邻苯硫醚单元、苯硫醚砜单元、苯硫醚酮单元、苯硫醚醚单元、二苯硫醚单元、含有取代基的苯硫醚单元、含有支链结构的苯硫醚单元等构成。其中,优选含有70摩尔%以上(更优选为90摩尔%以上)的对苯硫醚单元。更进一步优选聚(对苯硫醚)。
在上述极细纤维中,纤维直径需为10~2500nm的范围内。纤维直径小于10nm时,每根单纤维的强力小,可能发生摩擦引起的单纤维断裂,难以使用。另一方面,如果纤维直径大于2500nm,则极细纤维特有的致密性下降,被研磨物的表面粗糙度变大,可能得不到近年要求的水平的性能。作为极细纤维的纤维直径,优选为200~1000nm(更优选为400~700nm)的范围。为这样的范围时,纤维间的空隙间隔适当,能够保持大量的磨粒。如果纤维直径过大,则纤维间的空隙间隔变宽,其结果,作用磨粒数有可能减少,研磨速率降低。相反,如果纤维直径过小,则纤维间空隙变小,磨粒的保持性有可能下降。
上述的纤维直径可以用透射式电子显微镜TEM在倍率30000倍下拍摄单纤维的截面照片来测定。此时,可以利用具有长度测量功能的TEM的测长功能来测定。另外,无长度测量功能的TEM中,可以通过扩印所拍摄的照片,在考虑比例尺的情况下用尺测定。
此时,单纤维的横截面形状为圆形截面以外的异形截面时,采用单纤维的横截面的外接圆的直径作为单纤维直径。
本发明中,上述极细纤维优选集合而呈纤维束的形状。此时,作为构成一根纤维束的极细纤维的个数为200~20000根(更优选为400~1000根)时,容易确保适当的柔软性,因而优选。
作为上述极细纤维的长度,为30~100mm(更优选为40~80mm)的范围时,在极细纤维间或与粘结剂纤维之间容易产生良好的缠绕,因而优选。
此外,本发明的研磨垫需含有粘结剂纤维。作为粘结剂纤维的纤维直径(单纤维直径),优选比上述极细纤维大。特别优选为1~20μm的范围内。如果该纤维直径过小,则拉伸强度低,在制造工序中有可能成为褶皱产生的原因。相反,如果纤维直径过大,则由极细纤维和粘结剂纤维构成的结构体的质地有可能变差。
应予说明,粘结剂纤维的单纤维的截面形状为圆形截面以外的异形截面时,本发明中将外接圆的直径作为纤维直径。另外,这样的纤维直径可以通过用透射式电子显微镜拍摄纤维的横截面来测定。
另外,作为粘结剂纤维的长度,优选与极细纤维的长度同等。具体而言为30~100mm(更优选为40~80mm)的范围的长度时,在极细纤维间(极细纤维束间)或与粘结剂纤维之间容易发生良好的缠绕,因而优选。
作为上述粘结剂纤维,优选高熔点的热塑性树脂存在于芯、低熔点的热塑性树脂存在于皮部的皮芯型纤维。作为这样的树脂的组合,作为构成芯的树脂,优选为聚酯树脂、聚酰胺树脂。特别优选为聚对苯二甲酸乙二醇酯树脂。另外,作为皮部的低熔点的热塑性树脂,优选为聚烯烃树脂。其中优选为聚乙烯,更优选为高密度聚乙烯。
另外,上述粘结剂纤维可以为未拉伸纤维。作为该未拉伸纤维,优选以600~1500m/分钟的纺丝速度纺丝的未拉伸聚酯纤维。作为聚酯,可举出聚对苯二甲酸乙二醇酯、聚对苯二甲酸丙二醇酯、聚对苯二甲酸丁二醇酯。从生产率、在水中的分散性等理由出发,优选聚对苯二甲酸乙二醇酯或以其为主成分的共聚聚酯。
而且在本发明的研磨垫中,优选极细纤维被粘结剂纤维束缚。特别优选在由极细纤维构成的纤维束在保持其形状的情况下被粘结剂纤维束缚。利用粘结剂纤维进行点粘接,从而可成为柔软性优异且形态保持性也优异的研磨垫。
本发明的研磨垫中使用的极细纤维与粘结剂纤维的重量比优选为50/50~97/3。通过这样使极细纤维的比率为50%以上,容易保持由极细纤维和粘结剂纤维构成的结构体的厚度、硬度,能够抑制工序中的褶皱产生,具有使研磨垫内的纤维的密度分布变稳定的效果。极细纤维的重量比例过小时,磨粒的保持性有可能变得不充分。相反,如果极细纤维的重量比例过大,则纤维结构体过于柔软,有可能成为中间工序中产生褶皱的诱因。
在本发明的研磨垫中,作为仅是纤维的密度(堆积密度),优选为0.09g/cm3以上(更优选为0.10~0.15g/cm3)的范围。该密度过小时,向研磨垫表面露出的极细纤维变少,有磨粒的保持量变少的趋势,研磨速率有可能下降。
在本发明的研磨垫中,优选至少任一表面(优选为两面)起绒。起绒主要是由极细纤维带来的。通过使用这样的极细纤维,能够防止研磨磨粒粒子的凝聚,增加对加工基板作用的磨粒数,更容易同时实现高研磨速率和被加工物的优异的平滑性(低表面粗糙度、擦伤少)。
另外,在本发明的研磨垫中,空隙率优选为50%以上(更优选为50~65%,特别优选为55~60%)。通过成为这样的空隙率,从而能在研磨垫内含有大量浆料,因此给予被加工物的化学反应变多,研磨速率提高。
应予说明,空隙率(%)利用下述式计算。
空隙率(%)=(1-(堆积密度/理论密度))×100
其中,理论密度为构成材料的加权平均密度,利用下述式计算。
理论密度(g/cm3)=1÷((树脂比率(%)/100/树脂密度)+(纤维比率(%)/100/纤维密度))
此外在本发明的研磨垫中,弯曲强度(bending strength)优选为5.0N/mm2(0.51kgf/mm2)以上。更优选为5.9~19.6N/mm2(0.6~2.0kgf/mm2),特别优选为7.8~15.7N/mm2(0.8~1.6kgf/mm2)。如果弯曲强度小于5.0N/mm2,则因研磨时的加工压力使研磨垫变形,空隙被压坏,另外,研磨垫与被加工物间的缝隙变小,浆料难以进入,因此可能使研磨速率下降,进而被加工物的平坦性也变差。另一方面,如果弯曲强度(bending strength)大于19.6N/mm2,则研磨垫过硬,因此可能使研磨垫与被加工物的接触面积减小,研磨速率下降,同时被加工物的表面粗糙度也变差。应予说明,弯曲强度(bending strength)是基于JIS K 6911测定的。
此外,本发明的研磨垫必须含有上述的极细纤维、粘结剂纤维以及高分子弹性体。
作为高分子弹性体,可以使用聚氨酯弹性体、丙烯腈、丁二烯橡胶、天然橡胶、聚氯乙烯等。其中,从加工性方面考虑,优选聚氨酯弹性体。作为该高分子弹性体的赋予方法,可以采用涂布或浸渗该高分子弹性体后,以湿式或干式使其凝固的方法,或者以乳液、胶乳状涂布或浸渗后用干式干燥和固定的方法等各种方法。
在本发明的研磨垫中,其树脂比率以研磨垫重量对比,优选为40~80重量%。如果树脂比率过少,则存在研磨垫的硬度变低,研磨被加工物时的平坦性变差的趋势。相反,如果树脂比率过大,则研磨垫的空隙率小,研磨被加工物时,磨粒的替换变差,存在研磨速率变低的趋势。
另外,如果高分子弹性体还存在于由极细纤维构成的纤维束的内部,则形状保持性提高,故而优选。
此外,研磨垫的表面粗糙度(KES表面粗糙度SMD)优选为1~10μm。如果表面粗糙度过小,则在研磨时,磨粒可能难以进入研磨垫与加工基板之间,作用磨粒数减少,研磨速率下降,被加工物的表面粗糙度也变差。相反,如果该表面粗糙度过大,则研磨后的被加工物的平坦性可能变差。
另外,用A型硬度计测定上述研磨垫的硬度时优选为70度以上。进一步优选为80~95度的范围。如果该硬度过小,则研磨被加工物时的被加工物的平坦性可能变差。
本发明的研磨垫例如可以通过以下的制造方法得到。即,一种研磨垫的制造方法,其特征在于,从含有由海成分和岛直径为10~2500nm的岛成分构成的海岛型复合纤维与粘结剂纤维的无纺布,除去上述海成分,赋予高分子弹性体。
构成海岛型复合纤维的岛成分的树脂与构成上述的极细纤维的树脂相同,可以为任意的聚合物。作为优选例特别举出纤维形成性优异的聚酰胺、聚酯、聚烯烃、聚苯硫醚等。
另一方面,作为构成海成分的可溶性树脂,可以使用能够在如氢氧化钠、氢氧化钾、碳酸钠、碳酸钾这样的碱金属化合物水溶液或者甲苯、三氯乙烯等有机溶剂中溶解的聚合物。其中,在本发明的制造方法中,在使用这样的海岛型复合纤维和粘结剂纤维而得到无纺布之后且在赋予高分子弹性体之前,除去海岛型复合纤维的海成分。由于赋予高分子弹性体之前的无纺布仅仅依靠缠绕和与粘结剂纤维的结合来保持其形态,因此优选温和条件的提取处理。特别优选用碱减量法、热水提取法溶解除去海成分。
因此,作为海成分,优选为特定量的间苯二甲酸-5-磺酸钠和间苯二甲酸共聚的共聚聚酯,特定量的5-钠间苯二甲酸、间苯二甲酸和聚烷撑二醇或其衍生物共聚的共聚聚酯,特定量的间苯二甲酸-5-磺酸钠、间苯二甲酸和脂肪族二羧酸共聚的共聚聚酯等。此外,也优选使形成海成分的成分与聚乙二醇进行共聚。
上述海岛型复合纤维可以利用国际公开第2005/095686号册子、国际公开第2008/130019号册子中公开的方法来制造。即,作为熔融纺丝中使用的喷丝头,可以使用具有用于形成岛成分的中空销组或微细孔组(无销)的喷丝头等任意的喷丝头。例如,可以为将从中空销或微细孔挤出的岛成分与以填充其间的形式设计流路的海成分流进行合流并对其进行压缩而形成海岛截面之类的纺丝喷丝头。将喷出的海岛型复合纤维用冷却风固化,利用设定为规定的牵引速度的旋转辊或喷射器牵引而得到未拉伸纱(双折射率Δn优选为0.05以下。)。该牵引速度没有特别限定,优选为200~5000m/分钟。200m/分钟以下时,生产率可能下降。另外,5000m/分钟以上时,纺丝稳定性可能下降。
得到的未拉伸纱根据需要可以直接供于剪切工序或其后的提取工序(碱减量加工),也可以经由拉伸工序、热处理工序制成拉伸纱后,供于剪切工序或其后的提取工序(碱减量加工)。此时,拉伸工序可以为用不同的步骤进行纺丝和拉伸的另外拉伸方式,也可以使用在一个工序内在纺丝后立即进行拉伸的直接拉伸方式。剪切工序和提取工序的顺序可以相反。
上述剪切优选将未拉伸纱或拉伸纱直接或者捆束成数十根~数百万根单位的纱束后用切断机、转刀等进行剪切。
接下来,使用上述的海岛型复合纤维和如上所述的粘结剂纤维,得到无纺布。此时,上述海岛型复合纤维与粘结剂纤维的单纤维纤度比(海岛型复合纤维:粘结剂纤维)为1:0.49~1:0.70的范围内时,能够减少无纺布的密度不均,故而优选。
另外,缠绕方法可以采用针刺、水刺等公知的方法。特别优选为进行容易产生物理缠绕的基于针刺的机械缠绕的方法。
在上述无纺布中,无纺布的单位面积重量优选为300~600g/m2的范围内。
另外,上述无纺布中,纵向或横向的拉伸强度优选为100N/cm以上(优选纵向和横向的拉伸强度均为130~200N/cm)。该拉伸强度低时,容易成为在减量工序等中产生褶皱的原因。另外在研磨时极细纤维容易脱离,研磨垫的寿命有可能变短。
接下来,从无纺布中除去海岛型复合纤维中含有的海成分。提取海成分的方法没有特别限制,优选不损伤粘结剂纤维的温和的碱减量处理、热水提取处理。
通过上述处理,无纺布中含有的海岛型复合纤维成为极细纤维。在上述无纺布(浸渗处理前)中,优选进行热处理使纤维的堆积密度为0.09g/cm3以上。进一步优选为0.10~0.15g/cm3的纤维密度。
接下来,对无纺布赋予高分子弹性体。作为上述高分子弹性体,可以使用聚氨酯弹性体、丙烯腈、丁二烯橡胶、天然橡胶、聚氯乙烯等。其中,从加工性方面考虑,优选聚氨酯弹性体。作为上述高分子弹性体的赋予方法,可以采用在涂布或浸渗该高分子弹性体后,以湿式或干式使其凝固的方法,或者以乳液、胶乳状涂布或浸渗后用干式使其干燥和固定的方法等各种方法。
作为高分子弹性体的赋予方法,优选为2步的赋予。特别优选在第1步附着柔软的树脂,在第2步附着硬的树脂,对表面赋予具有高模量的高分子弹性体。或者优选进行在第1步赋予成为多孔的湿式浸渗聚氨酯等,在第2步赋予成为充实层的干式高分子弹性体处理。
接下来,优选通过对至少任一表面(优选为两面)进行研磨而形成极细纤维的绒头。
如此得到的研磨垫成为研磨速率高、寿命长且同时具有低表面粗糙度的研磨垫。而且采用该研磨垫,能够以高研磨速率研磨使被加工物(例如半导体基板、半导体设备、化合物半导体基板、化合物半导体设备等各种设备)具有高度的平坦性且具有低表面粗糙度。
实施例
以下通过实施例对本发明进行具体说明。然而本发明并不限定于此。应予说明,以下的实施例中的评价和特性值通过以下的测定法求出。
(1)无纺布的物性
单位面积重量(g/m2)和强伸度(N/cm,%)基于JIS L1913求出。厚度(mm)基于JISL1085求出。由这些值算出单位面积重量/厚度即堆积密度(g/cm3)。此外,透气度(cm3/cm2·sec)基于JIS L1096-A求出。
(2)研磨垫的物性
与无纺布的物性同样地,单位面积重量(g/m2)基于JIS L1913求出。厚度(mm)基于JIS L1085求出。由这些值算出单位面积重量/厚度即堆积密度(g/cm3)。
利用下述式算出空隙率(%)。
空隙率(%)=(1-(堆积密度/理论密度))×100
其中,理论密度为构成材料的加权平均密度,由下述式算出。
理论密度(g/cm3)=1÷((树脂比率(%)/100/树脂密度)+(纤维比率(%)/100/纤维密度))
应予说明,尼龙6纤维的密度为1.222g/cm3,聚氨酯树脂的密度为1.180g/cm3。
研磨垫的硬度是基于JIS K6253,使用日本高分子计器株式会社制DD2-A型测定的。压缩·弹性模量(%)基于JIS L1096求出。接触角(°)基于JIS R3257求出。弯曲强度如下求出:试验片为1片样品的高度、试验宽度为25mm宽,基于JIS K 6911求出。
(3)KES表面粗糙度SMD(μm)
将0.5mm直径5mm宽度的钢琴丝(piano wire)以10gf(9.8cN)压在试样上,求出以0.1cm/sec的速度移动试样时的表面粗糙度的平均偏差。
(4)研磨性能
(4-1)研磨速率(μm/h)
使用直径380mm的研磨垫,使用单面研磨机按照下述条件测定3英尺(7.62cm)蓝宝石晶片的每1小时的研磨量。
浆料浓度:20wt%
浆料量:500ml/min
压力:350g/cm2
研磨时间:60min
转速:头/台板(平台)=50rpm/49rpm
使用浆料:二氧化硅(Fujimi Incorporated公司制“COMPOL80”)
(4-2)晶片的表面粗糙度Ra(nm)
用原子力显微镜测定基板中心部10μm见方的表面粗糙度。该表面粗糙度Ra越小,越具有优异的平坦性。
(5)ζ电位(mV)
将测定对象的纤维剪成0.2mm长,调节成纤维/纯化水=1g/1000g的浓度,用混合机搅拌直至充分分散,制成纤维用的测定试样(以下称为“纳米纤维分散液”或“NF分散液”)。
另一方面,按照以固体成分计成为研磨剂(原液)/NF分散液=2/3的方式制备测定用样品并封入毛细管,制成纤维·研磨剂混合物用的ζ电位的测定试样。值为分别测定3次的平均值。
[实施例1]
使用尼龙(Ny)6作为岛成分,使用间苯二甲酸-5-磺酸钠共聚的聚对苯二甲酸乙二醇酯作为海成分,进行纺丝、拉伸,得到海:岛=30:70、岛数=836、单纤维纤度5.6dtex的海岛型复合纤维后,切断成44mm的长度。
将该海岛型复合纤维70wt%和单纤维直径11.1μm、长度44mm的聚对苯二甲酸乙二醇酯(PET)/熔点130℃的高密度聚乙烯(PE)(芯/皮重量比=50/50)的粘结剂短纤维30wt%通过针刺进行机械缠绕后,进行热处理(150℃、1分钟)而得到海岛型复合纤维被粘结剂纤维保持的片材。
其后,在浓度5g/L的氢氧化钠溶液中以90℃进行60分钟处理(碱减量处理),提取除去海岛型复合纤维的海成分,制作由纳米纤维短纤维束(单纤维直径0.7μm×836根)62wt%和固定该纤维束的粘结剂短纤维38wt%构成的单位面积重量330g/m2的无纺布,其中,上述纳米纤维短纤维束由尼龙6构成。
接下来,将聚氨酯树脂(100%模量20MPa)通过湿式工序对得到的无纺布实施1次浸渗,接着对两面进行切割使厚度为1.30mm。进一步将聚氨酯树脂(100%模量15MPa)通过干式工序浸渗2次。将此时的空隙率调整为54.3%。最后对两面进行磨轮加工,在形成绒头(起绒)的同时使表面平滑,在背面贴附粘性胶带制成研磨垫。将该研磨垫的构成和研磨性能示于表1。
[实施例2]
将实施例1的研磨垫的空隙率变更为58.9%,除此之外,与实施例1同样地进行,得到研磨垫。将该研磨垫的构成和研磨性能示于表1。
[实施例3]
将实施例1的研磨垫的空隙率变更为46.5%,除此之外,与实施例1同样地进行,得到研磨垫。将该研磨垫的构成和研磨性能示于表1。
[实施例4]
将实施例1的研磨垫的空隙率变更为61.8%,除此之外,与实施例1同样地进行,得到研磨垫。将该研磨垫的构成和研磨性能示于表1。
[表1]
实施例1、2的研磨垫因具有适当的硬度且空隙多,所以能够含有大量浆料,化学作用大,能够实现高研磨速率。并且,通过使纳米纤维以束的形式存在,能够在纤维间空隙保持大量磨粒,作用效率提高,能够实现被加工物的优异的平坦性和高研磨速率。
[参考例1]
使用尼龙6作为岛成分,使用使苯二甲酸-5-磺酸钠共聚的聚对苯二甲酸乙二醇酯作为海成分,进行纺丝、拉伸,得到海:岛=30:70、岛数=836、纤度5.6dtex的海岛型复合纤维,切断成44mm的长度。
将该海岛型复合纤维70wt%和单纤维直径14.4μm、长度44mm的聚对苯二甲酸乙二醇酯/高密度聚乙烯(熔点130℃)(芯/皮重量比=50/50)的粘结剂短纤维30wt%通过针刺进行机械缠绕,进行热处理(150℃、1分钟)而得到被粘结剂纤维保持的海岛型复合纤维的片材。
其后,在浓度5g/L的氢氧化钠溶液中以90℃进行60分钟处理(碱减量处理),提取除去海岛型复合纤维的海成分,制作由纳米纤维短纤维束(单纤维直径0.7μm×836根)62wt%和固定该纤维束的粘结剂短纤维38wt%构成的单位面积重量319g/m2的无纺布,其中,上述纳米纤维短纤维束由尼龙6构成。将该研磨垫用无纺布的物性示于表2。
[参考例2]
将参考例1的粘结剂纤维变更为单纤维直径15.1μm,除此之外,与参考例1同样地制作无纺布。将该研磨垫用无纺布的物性示于表2。
[参考例3]
使用将参考例1的岛成分由尼龙6变更为聚对苯二甲酸乙二醇酯(PET)的海岛复合纤维,除此之外,与参考例1同样地制作无纺布。将该研磨垫用无纺布的物性示于表2。
[参考例4]
使用聚对苯二甲酸乙二醇酯,进行纺丝、拉伸,以单纤维直径18.5μm切断成长度为51mm。将该短纤维通过针刺进行机械缠绕,制作单位面积重量308g/m2的无纺布。将该研磨垫用无纺布的物性示于表2。
[参考例5]
将参考例1的粘结剂纤维变更为单纤维直径11.2μm,除此之外,与参考例1同样地制作无纺布。将该研磨垫用无纺布的物性示于表2。
[参考例6]
使用将参考例5的岛成分由尼龙6变更为聚对苯二甲酸乙二醇酯(PET)的海岛复合纤维,除此之外,与参考例5同样地制作无纺布。将该研磨垫用无纺布的物性示于表2。
对于参考例1~3的无纺布而言,无纺布的长度方向的密度不均小。使用该无纺布的研磨垫的纤维密度均匀,因此从研磨垫表层到下层为相同的纤维密度,即便因使用而研磨垫的厚度减小,研磨性能也没有变化,寿命长。并且,能够稳定地生产并提供具有该优异的研磨性能的研磨垫。
[参考例7]
对以下的实施例中使用的材料测定ζ电位的结果,各自的ζ电位为尼龙(Ny6)纳米纤维“-66.9mV”,聚酯(PET)纳米纤维“-25.1mV”。
此外,上述的研磨速率测定用的二氧化硅浆料(1)(Fujimi Incorporated公司制“COMPOL80”,粒径72nm)的ζ电位为“-57.7mV”。另外,二氧化硅浆料(2)(FujimiIncorporated公司制“DSC-0902”)的ζ电位为“-58.4mV”。另外,测定试验后的浆料的粒径的结果,二氧化硅浆料(1)为“122nm”,二氧化硅浆料(2)为“125nm”。
接下来,对纳米纤维和二氧化硅浆料的混合物测定ζ电位和试验后的粒径的结果,成为了下述表3的结果。
ζ电位比使用的浆料小(在负数侧大)的尼龙纳米纤维,即使在与浆料(研磨剂)混合时,ζ电位也没有向正数侧变化,抑制了试验后的磨粒粒子的凝聚。与此相对,ζ电位比使用的浆料大的(在正数侧)聚酯纳米纤维,在与浆料(研磨剂)混合时,与研磨剂本来的ζ电位相比向正数侧变化,虽然是少许但仍引起了磨粒粒子的凝聚。
[表3]
[实施例5]
使用尼龙6(Ny6)作为岛成分,使用使苯二甲酸-5-磺酸钠共聚的聚对苯二甲酸乙二醇酯作为海成分,进行纺丝、拉伸,得到海:岛=30:70、岛数=836、单纤维纤度5.6dtex的海岛型复合纤维后,切断成44mm的长度。
将该海岛型复合纤维70wt%和单纤维直径11.1μm、长度44mm的聚对苯二甲酸乙二醇酯/高密度聚乙烯(熔点130℃)(芯/皮重量比=50/50)的粘结剂短纤维30wt%通过针刺进行机械缠绕,进行热处理(150℃,1分)而得到被粘结剂纤维保持的海岛型复合纤维的片材。
其后,在浓度5g/L的氢氧化钠溶液中以90℃进行60分钟处理(碱减量处理),提取除去海岛型复合纤维的海成分,制作由纳米纤维短纤维束(单纤维直径0.7μm×836根)62wt%和固定该纤维束的粘结剂短纤维38wt%构成的单位面积重量330g/m2的无纺布,其中,上述纳米纤维短纤维束由尼龙6构成。
接下来,将聚氨酯树脂(100%模量35MPa)通过干式工序对得到的无纺布实施1次浸渗,接着对两面进行切割使厚度为1.3mm。进一步将聚氨酯树脂(100%模量100MPa)通过干式工序浸渗2次。最后对两面进行磨轮加工(起绒加工),在形成绒头的同时使表面平滑,在背面贴附粘性胶带制成研磨垫。将该研磨垫的构成和研磨性能示于表4。
[实施例6]
使用将实施例5的岛成分由尼龙6变更为聚对苯二甲酸乙二醇酯(PET)的海岛复合纤维,除此之外,与实施例5同样地制作研磨垫。将该研磨垫的构成和研磨性能示于表4。
[实施例7]
制作与实施例5相同的由尼龙6极细纤维束和粘结剂纤维构成的单位面积重量320g/m2的无纺布。
接下来,代替干式工序中的1次浸渗,将聚氨酯树脂(100%模量80MPa)通过湿式工序对得到的无纺布实施1次浸渗,除此之外,与实施例5同样地进行切割、2次树脂浸渗、磨轮加工等而制成研磨垫。将该研磨垫的构成和研磨性能示于表4。
[实施例8]
制作与实施例6相同的由聚对苯二甲酸乙二醇酯极细纤维束和粘结剂纤维构成的单位面积重量320g/m2的无纺布。
接下来,在实施例5中,代替干式工序中的1次浸渗,将聚氨酯树脂(100%模量80MPa)通过湿式工序对得到的无纺布实施1次浸渗,除此之外,与实施例5同样地进行切割、2次树脂浸渗、磨轮加工等,制成研磨垫。将该研磨垫的构成和研磨性能一并示于表4。
[比较例1、2]
使用单纤维直径18.5μm、长度51mm的尼龙-6短纤维代替实施例5的海岛复合纤维,没有进行碱减量处理,除此之外,与实施例5同样地制作单位面积重量300g/m2的无纺布。
接下来与实施例5同样地进行干式1次树脂浸渗、切割、干式2次树脂浸渗、磨轮加工等,制成研磨垫,作为比较例1。
另一方面,与实施例7同样地进行湿式1次树脂浸渗、切割、干式2次树脂浸渗、磨轮加工等,制成研磨垫,作为比较例2。
将这些研磨垫的构成和研磨性能示于表4。
[比较例3、4]
使用单纤维直径18.5μm、长度51mm的聚对苯二甲酸乙二醇酯短纤维代替实施例5的海岛复合纤维,没有进行碱减量处理,除此之外,与实施例5同样地制作单位面积重量300g/m2的无纺布。
接下来与实施例5同样地进行干式1次树脂浸渗、切割、干式2次树脂浸渗、磨轮加工等,制成研磨垫,作为比较例3。
另一方面,与实施例7同样地进行湿式1次树脂浸渗、切割、干式2次树脂浸渗、磨轮加工等,制成研磨垫,作为比较例4。
将这些研磨垫的构成和研磨性能示于表4。
实施例5、7是使聚氨酯树脂浸渗到与浆料相比使用纤维为高ζ电位(负数侧)的、使用了尼龙纳米纤维的无纺布中而得的研磨垫。实施例6、8为使用聚酯纳米纤维代替尼龙纳米纤维的研磨垫。比较例1、2为使用普通尼龙纤维的研磨垫,比较例3、4为使用普通聚酯纤维的研磨垫。
在这些实施例的研磨垫中,通过使纳米纤维以束的形式存在,能够使纤维间空隙保持大量磨粒,作用效率提高,能够实现被加工物的优异的平坦性和高研磨速率。研磨垫物性为高硬度、低压缩模量且低表面粗糙度。
其中,实施例5、7的尼龙纳米纤维使用物的蓝宝石研磨性能特别优异。这些研磨垫通过使用具有高ζ电位(负数侧)的尼龙纳米纤维,能够防止磨粒粒子的凝聚,实现低表面粗糙度(擦伤少)。
产业上的可利用性
根据本发明,可提供寿命长且研磨速率高、能够实现被加工物的优异的平坦性的研磨垫及其制造方法,其工业价值极大。
Claims (12)
1.一种研磨垫,其特征在于,含有纤维直径为400~700nm的极细纤维、粘结剂纤维和高分子弹性体,空隙率为50%以上,且弯曲强度为5.0N/mm2以上。
2.根据权利要求1所述的研磨垫,其表面起绒。
3.根据权利要求1所述的研磨垫,其中,在所述极细纤维中,ζ电位为﹣20mV以下。
4.根据权利要求1所述的研磨垫,其中,所述极细纤维由聚酰胺或聚酯构成。
5.根据权利要求1所述的研磨垫,其中,所述粘结剂纤维为皮芯型复合纤维。
6.根据权利要求1所述的研磨垫,其中,所述极细纤维与粘结剂纤维的重量比即极细纤维/粘结剂纤维为50/50~97/3的范围内。
7.一种研磨垫的制造方法,其特征在于,从含有由海成分和岛直径为400~700nm的岛成分构成的海岛型复合纤维与粘结剂纤维的无纺布,除去所述海成分,赋予高分子弹性体,由此得到空隙率为50%以上,且弯曲强度为5.0N/mm2以上的研磨垫。
8.根据权利要求7所述的研磨垫的制造方法,其中,所述海岛型复合纤维与粘结剂纤维的单纤维纤度比即海岛型复合纤维:粘结剂纤维为1:0.49~1:0.70的范围内。
9.根据权利要求7所述的研磨垫的制造方法,其中,所述无纺布为针刺无纺布。
10.根据权利要求7所述的研磨垫的制造方法,其中,所述无纺布的单位面积重量为300~600g/m2的范围内。
11.根据权利要求7所述的研磨垫的制造方法,其中,在所述无纺布中,纵向或横向的拉伸强度为100N/cm以上。
12.根据权利要求7所述的研磨垫的制造方法,其中,进一步使表面起绒。
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JP6640376B2 (ja) | 2020-02-05 |
JPWO2018092630A1 (ja) | 2019-06-24 |
MY196278A (en) | 2023-03-24 |
US20190270177A1 (en) | 2019-09-05 |
TWI736706B (zh) | 2021-08-21 |
EP3542957A4 (en) | 2020-07-08 |
CN110023034A (zh) | 2019-07-16 |
EP3542957A1 (en) | 2019-09-25 |
EP3542957B1 (en) | 2021-04-28 |
TW201825233A (zh) | 2018-07-16 |
KR102230016B1 (ko) | 2021-03-19 |
KR20190059975A (ko) | 2019-05-31 |
WO2018092630A1 (ja) | 2018-05-24 |
US11577359B2 (en) | 2023-02-14 |
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