CN110011630B - 振动元件、振子、电子器件、电子设备以及移动体 - Google Patents

振动元件、振子、电子器件、电子设备以及移动体 Download PDF

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Publication number
CN110011630B
CN110011630B CN201910001026.0A CN201910001026A CN110011630B CN 110011630 B CN110011630 B CN 110011630B CN 201910001026 A CN201910001026 A CN 201910001026A CN 110011630 B CN110011630 B CN 110011630B
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conductive layer
electrode
substrate
vibration
vibrating element
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CN110011630A (zh
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藤原良孝
畑中和寿
内藤松太郎
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Seiko Epson Corp
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201910001026.0A 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备以及移动体 Active CN110011630B (zh)

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CN201910001026.0A CN110011630B (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备以及移动体

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JP2012128662A JP6175743B2 (ja) 2012-06-06 2012-06-06 振動素子の製造方法
JPJP2012-128662 2012-06-06
CN201910001026.0A CN110011630B (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备以及移动体
CN201310221542.7A CN103475328B (zh) 2012-06-06 2013-06-05 振动元件及其制造方法、振子、电子器件和设备、移动体

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CN201320322501.2U Expired - Lifetime CN203377847U (zh) 2012-06-06 2013-06-05 振动元件、振子、电子器件、电子设备、移动体

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CN202535316U (zh) 2011-03-09 2012-11-14 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
JP5708089B2 (ja) 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
JP6644457B2 (ja) * 2014-03-26 2020-02-12 Tdk株式会社 圧電デバイス
JP2015211362A (ja) * 2014-04-28 2015-11-24 京セラクリスタルデバイス株式会社 水晶デバイスおよび水晶デバイスの製造方法
JP6618675B2 (ja) 2014-07-30 2019-12-11 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
JP6390836B2 (ja) 2014-07-31 2018-09-19 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP6738588B2 (ja) * 2014-09-02 2020-08-12 セイコーエプソン株式会社 発振器、電子機器、および移動体
JP2016127467A (ja) * 2015-01-06 2016-07-11 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
JP2016140024A (ja) 2015-01-29 2016-08-04 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP2017192032A (ja) * 2016-04-13 2017-10-19 日本電波工業株式会社 水晶振動子
US10367510B2 (en) * 2016-05-13 2019-07-30 Nihon Dempa Kogyo Co., Ltd. Crystal oscillator and method for manufacturing crystal oscillator
JP2017208798A (ja) * 2016-05-13 2017-11-24 日本電波工業株式会社 水晶発振器及び水晶発振器の製造方法
JP2018164126A (ja) 2017-03-24 2018-10-18 セイコーエプソン株式会社 振動デバイス、発振器、ジャイロセンサー、電子機器および移動体
CN108392200B (zh) * 2017-12-29 2021-10-29 深圳市亮动科技开发有限公司 一种心电监测设备的电极组件及其心电监测设备
US11495540B2 (en) * 2019-10-22 2022-11-08 Tokyo Electron Limited Semiconductor apparatus having stacked devices and method of manufacture thereof
JP7311152B2 (ja) * 2020-03-18 2023-07-19 有限会社マクシス・ワン 水晶振動子の電極構造、水晶振動子、水晶発振器
CN115412051A (zh) * 2021-05-28 2022-11-29 日本电波工业株式会社 晶体振子及晶体振子中间物以及晶体振子的制造方法
WO2023048014A1 (ja) * 2021-09-24 2023-03-30 株式会社大真空 圧電振動デバイス
WO2023085238A1 (ja) * 2021-11-09 2023-05-19 株式会社大真空 サーミスタ付き水晶振動デバイス
CN118202572A (zh) * 2021-11-15 2024-06-14 京瓷株式会社 水晶元件以及水晶设备
FI131267B1 (fi) * 2022-06-14 2025-01-15 Teknologian Tutkimuskeskus Vtt Oy Akustinen aaltoresonaattori

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US10680158B2 (en) 2020-06-09
CN203377847U (zh) 2014-01-01
US20130328452A1 (en) 2013-12-12
US20200259068A1 (en) 2020-08-13
US10147867B2 (en) 2018-12-04
JP2013255052A (ja) 2013-12-19
JP6175743B2 (ja) 2017-08-09
US9450166B2 (en) 2016-09-20
CN110011630A (zh) 2019-07-12
CN103475328A (zh) 2013-12-25
CN103475328B (zh) 2019-01-18
US11495727B2 (en) 2022-11-08
US20190067549A1 (en) 2019-02-28
US20160268494A1 (en) 2016-09-15

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