JP6644457B2 - 圧電デバイス - Google Patents
圧電デバイス Download PDFInfo
- Publication number
- JP6644457B2 JP6644457B2 JP2014063890A JP2014063890A JP6644457B2 JP 6644457 B2 JP6644457 B2 JP 6644457B2 JP 2014063890 A JP2014063890 A JP 2014063890A JP 2014063890 A JP2014063890 A JP 2014063890A JP 6644457 B2 JP6644457 B2 JP 6644457B2
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- main surface
- piezoelectric
- conductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Further insulation means against electrical, physical or chemical damage, e.g. protective coatings
Description
Claims (1)
- 基部及び当該基部の一主面から突出して設けられた枠状の突出部を有すると共に、前記一主面及び前記突出部により収容部が形成されている収容部材と、前記収容部を塞ぐように前記突出部上に設けられた蓋と、を有するパッケージと、
前記収容部において前記基部の前記一主面上に設けられた圧電素子と、を備え、
前記基部自体が積層型NTCサーミスタであり、
前記基部は、
複数のサーミスタ層が積層されてなり、前記基部の前記一主面を構成するサーミスタ部と、
前記サーミスタ部内に前記サーミスタ層の積層方向において対向して配置された第1内部電極及び第2内部電極と、
前記第1内部電極に電気的に接続された第1外部電極、及び、前記第2内部電極に電気的に接続された第2外部電極と、
前記一主面上に設けられており、前記圧電素子の2つの電極が接続されている2つの圧電素子搭載パッドと、
一方の前記圧電素子搭載パッドに電気的に接続された第3外部電極、及び、他方の前記圧電素子搭載パッドに電気的に接続された第4外部電極と、を備え、
2つの前記圧電素子搭載パッドと、前記第1内部電極及び前記第2内部電極とが、共通する前記サーミスタ部に設けられている、圧電デバイス。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014063890A JP6644457B2 (ja) | 2014-03-26 | 2014-03-26 | 圧電デバイス |
US14/642,053 US9726552B2 (en) | 2014-03-26 | 2015-03-09 | Temperature compensated piezoelectric oscilator device package wherein the base of the package consists of a multilayer thermistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014063890A JP6644457B2 (ja) | 2014-03-26 | 2014-03-26 | 圧電デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015186226A JP2015186226A (ja) | 2015-10-22 |
JP6644457B2 true JP6644457B2 (ja) | 2020-02-12 |
Family
ID=54189894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014063890A Active JP6644457B2 (ja) | 2014-03-26 | 2014-03-26 | 圧電デバイス |
Country Status (2)
Country | Link |
---|---|
US (1) | US9726552B2 (ja) |
JP (1) | JP6644457B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10634566B2 (en) * | 2016-06-30 | 2020-04-28 | Intel Corporation | Piezoelectric package-integrated temperature sensing devices |
JP2020005092A (ja) * | 2018-06-27 | 2020-01-09 | 京セラ株式会社 | 水晶デバイス、水晶モジュールおよび装置 |
JP7327006B2 (ja) * | 2019-08-30 | 2023-08-16 | Tdk株式会社 | 振動デバイス |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4627533A (en) * | 1984-10-29 | 1986-12-09 | Hughes Aircraft Company | Ceramic package for compensated crystal oscillator |
JP4222147B2 (ja) * | 2002-10-23 | 2009-02-12 | セイコーエプソン株式会社 | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
JP3918794B2 (ja) * | 2002-12-10 | 2007-05-23 | セイコーエプソン株式会社 | 圧電発振器およびその製造方法並びに電子機器 |
US7098580B2 (en) * | 2004-01-29 | 2006-08-29 | Kyocera Corporation | Piezoelectric oscillator |
JP4299260B2 (ja) * | 2005-03-23 | 2009-07-22 | Tdk株式会社 | 積層型ntcサーミスタ |
JP5339681B2 (ja) * | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | 表面実装用の水晶振動子 |
DE102007044604A1 (de) * | 2007-09-19 | 2009-04-09 | Epcos Ag | Elektrisches Vielschichtbauelement |
TWI466437B (zh) * | 2010-03-29 | 2014-12-21 | Kyocera Kinseki Corp | Piezoelectric vibrator |
US8569937B1 (en) * | 2010-07-13 | 2013-10-29 | Hrl Laboratories, Llc | Piezoelectric resonator with capacitive sense and/or force rebalance electrodes to control an amplitude of vibration |
JP2012182567A (ja) | 2011-02-28 | 2012-09-20 | Kyocera Crystal Device Corp | 圧電デバイス |
JP5877962B2 (ja) * | 2011-05-31 | 2016-03-08 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5866973B2 (ja) * | 2011-10-28 | 2016-02-24 | セイコーエプソン株式会社 | 振動デバイスの製造方法 |
JP5943187B2 (ja) * | 2012-03-21 | 2016-06-29 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、および電子機器 |
JP6175743B2 (ja) * | 2012-06-06 | 2017-08-09 | セイコーエプソン株式会社 | 振動素子の製造方法 |
CN104885361B (zh) * | 2012-11-16 | 2017-06-30 | 株式会社大真空 | 压电振动器件 |
JP2014107778A (ja) * | 2012-11-29 | 2014-06-09 | Seiko Epson Corp | 振動デバイス、電子機器及び移動体 |
KR101532133B1 (ko) * | 2013-06-03 | 2015-06-26 | 삼성전기주식회사 | 압전 소자 패키지 및 그 제조 방법 |
KR101532134B1 (ko) * | 2013-06-03 | 2015-06-26 | 삼성전기주식회사 | 압전 소자 패키지 및 그 제조 방법 |
JP6183156B2 (ja) * | 2013-10-30 | 2017-08-23 | セイコーエプソン株式会社 | パッケージ、振動デバイス、発振器、電子機器及び移動体 |
US9287882B2 (en) * | 2013-11-07 | 2016-03-15 | Kyocera Crystal Device Corporation | Temperature compensated crystal oscillator |
JP2016010099A (ja) * | 2014-06-26 | 2016-01-18 | セイコーエプソン株式会社 | 複合電子部品、発振器、電子機器及び移動体 |
-
2014
- 2014-03-26 JP JP2014063890A patent/JP6644457B2/ja active Active
-
2015
- 2015-03-09 US US14/642,053 patent/US9726552B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9726552B2 (en) | 2017-08-08 |
US20150276504A1 (en) | 2015-10-01 |
JP2015186226A (ja) | 2015-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI466437B (zh) | Piezoelectric vibrator | |
JP5900582B1 (ja) | 圧電振動デバイス | |
JP5337791B2 (ja) | 圧電振動子 | |
JP5144732B2 (ja) | 圧電振動子 | |
JP5101651B2 (ja) | 圧電振動子 | |
JP2012142691A (ja) | 圧電デバイス | |
JP6644457B2 (ja) | 圧電デバイス | |
JP2014222812A (ja) | 発振デバイス | |
JP2012182567A (ja) | 圧電デバイス | |
JP5877962B2 (ja) | 圧電振動子 | |
JP5144731B2 (ja) | 圧電振動子 | |
JP5819053B2 (ja) | 圧電振動子 | |
JP2013106054A (ja) | 圧電デバイス | |
JP6331475B2 (ja) | 圧電デバイス | |
JP5123139B2 (ja) | 圧電デバイス | |
JP2019068304A (ja) | 圧電振動デバイス | |
JP5751800B2 (ja) | 圧電振動子 | |
JP2010130455A (ja) | 圧電発振器 | |
JP6366320B2 (ja) | 圧電デバイス及び圧電デバイスの製造方法 | |
JP2012099928A (ja) | 圧電デバイス | |
JP6971875B2 (ja) | 水晶素子および水晶デバイス | |
JP5465568B2 (ja) | 圧電発振器 | |
JP5052940B2 (ja) | 圧電発振器 | |
JP2015220586A (ja) | 圧電振動素子搭載用基板および圧電装置 | |
JP2013222790A (ja) | 電子部品収納用パッケージ、及び圧電デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170201 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180123 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180326 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180612 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180907 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180918 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20181109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190924 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200108 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6644457 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |