JP6331475B2 - 圧電デバイス - Google Patents
圧電デバイス Download PDFInfo
- Publication number
- JP6331475B2 JP6331475B2 JP2014039318A JP2014039318A JP6331475B2 JP 6331475 B2 JP6331475 B2 JP 6331475B2 JP 2014039318 A JP2014039318 A JP 2014039318A JP 2014039318 A JP2014039318 A JP 2014039318A JP 6331475 B2 JP6331475 B2 JP 6331475B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- frame
- main surface
- piezoelectric device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims (3)
- 互いに対向する第1主面及び第2主面を有する、セラミックス基板と、
前記第1主面上に設けられる圧電素子と、
互いに対向する第1面及び第2面を有する枠であって、前記第1面が前記第1主面に接すると共に前記圧電素子を囲むように設けられる前記枠と、
前記枠の前記第2面に形成されている金属電気めっき層と、
前記枠に囲まれた空間を塞ぐように前記金属電気めっき層上に設けられる金属蓋と、を備えており、
前記金属電気めっき層と前記金属蓋とは、互いに抵抗溶接され、
前記枠は、前記金属電気めっき層に接触すると共に、金属及び金属酸化物を含有するコンポジット部を有する、圧電デバイス。 - 前記枠の前記第2面は、研磨された面である、請求項1に記載の圧電デバイス。
- 前記枠は、前記コンポジット部からなる、請求項1又は2に記載の圧電デバイス。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014039318A JP6331475B2 (ja) | 2014-02-28 | 2014-02-28 | 圧電デバイス |
US14/596,696 US9762203B2 (en) | 2014-02-28 | 2015-01-14 | Piezoelectric device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014039318A JP6331475B2 (ja) | 2014-02-28 | 2014-02-28 | 圧電デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015164242A JP2015164242A (ja) | 2015-09-10 |
JP6331475B2 true JP6331475B2 (ja) | 2018-05-30 |
Family
ID=54007163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014039318A Active JP6331475B2 (ja) | 2014-02-28 | 2014-02-28 | 圧電デバイス |
Country Status (2)
Country | Link |
---|---|
US (1) | US9762203B2 (ja) |
JP (1) | JP6331475B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016127467A (ja) * | 2015-01-06 | 2016-07-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
US10718672B2 (en) * | 2017-01-20 | 2020-07-21 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric device package |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3374395B2 (ja) * | 1997-10-03 | 2003-02-04 | 株式会社大真空 | 電子部品用パッケージ |
JP3448865B2 (ja) * | 1998-12-17 | 2003-09-22 | 株式会社大真空 | 電子部品用パッケージおよび圧電振動デバイス |
JP3702117B2 (ja) * | 1999-01-29 | 2005-10-05 | 京セラ株式会社 | 電子部品装置 |
JP2001144201A (ja) | 1999-08-31 | 2001-05-25 | Kyocera Corp | 電子部品装置 |
JP2007095956A (ja) * | 2005-09-28 | 2007-04-12 | Kyocera Corp | 電子部品収納用パッケージ |
JP5024290B2 (ja) * | 2006-08-10 | 2012-09-12 | 株式会社大真空 | 圧電振動デバイス |
KR101758585B1 (ko) | 2012-03-14 | 2017-07-14 | 니혼도꾸슈도교 가부시키가이샤 | 세라믹기판 및 그 제조방법 |
-
2014
- 2014-02-28 JP JP2014039318A patent/JP6331475B2/ja active Active
-
2015
- 2015-01-14 US US14/596,696 patent/US9762203B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20150249199A1 (en) | 2015-09-03 |
JP2015164242A (ja) | 2015-09-10 |
US9762203B2 (en) | 2017-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5337791B2 (ja) | 圧電振動子 | |
JP5806096B2 (ja) | 圧電デバイス | |
JP5052966B2 (ja) | 圧電発振器 | |
JP5144732B2 (ja) | 圧電振動子 | |
JP2007274339A (ja) | 表面実装型圧電振動デバイス | |
JP6331475B2 (ja) | 圧電デバイス | |
JP5101201B2 (ja) | 圧電発振器 | |
JP6644457B2 (ja) | 圧電デバイス | |
JP5144731B2 (ja) | 圧電振動子 | |
JP5689702B2 (ja) | 圧電デバイス | |
JP5911349B2 (ja) | 水晶デバイス | |
JP5751800B2 (ja) | 圧電振動子 | |
JP5171148B2 (ja) | 圧電発振器 | |
JP2005236892A (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP2014049966A (ja) | 水晶デバイス | |
JP6828331B2 (ja) | 圧電駆動装置 | |
JP2010130455A (ja) | 圧電発振器 | |
JP5101192B2 (ja) | 圧電デバイス | |
JP2007150394A (ja) | 圧電デバイス | |
JP2014011664A (ja) | 水晶デバイス | |
JP5805471B2 (ja) | 圧電デバイス | |
JP2007142947A (ja) | 表面実装型圧電発振器 | |
JP5995352B2 (ja) | 水晶デバイス | |
JP2008085962A (ja) | 圧電発振器 | |
JP6629660B2 (ja) | セラミックパッケージおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160916 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170629 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170711 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170822 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171031 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180403 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180416 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6331475 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |