CN109390326A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
- Publication number
- CN109390326A CN109390326A CN201811248184.8A CN201811248184A CN109390326A CN 109390326 A CN109390326 A CN 109390326A CN 201811248184 A CN201811248184 A CN 201811248184A CN 109390326 A CN109390326 A CN 109390326A
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Classifications
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- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014-051235 | 2014-03-14 | ||
JP2014051235 | 2014-03-14 | ||
CN201410448445.6A CN104916624B (zh) | 2014-03-14 | 2014-09-04 | 半导体装置及其制造方法 |
Related Parent Applications (1)
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CN201410448445.6A Division CN104916624B (zh) | 2014-03-14 | 2014-09-04 | 半导体装置及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN109390326A true CN109390326A (zh) | 2019-02-26 |
CN109390326B CN109390326B (zh) | 2022-02-11 |
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ID=54085571
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CN201410448445.6A Active CN104916624B (zh) | 2014-03-14 | 2014-09-04 | 半导体装置及其制造方法 |
CN201811248184.8A Active CN109390326B (zh) | 2014-03-14 | 2014-09-04 | 半导体装置及其制造方法 |
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CN201410448445.6A Active CN104916624B (zh) | 2014-03-14 | 2014-09-04 | 半导体装置及其制造方法 |
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CN (2) | CN104916624B (zh) |
TW (1) | TWI616979B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11502057B2 (en) | 2020-02-17 | 2022-11-15 | Kioxia Corporation | Semiconductor device and manufacturing method thereof |
WO2023206649A1 (zh) * | 2022-04-27 | 2023-11-02 | 长鑫存储技术有限公司 | 一种半导体器件的制备方法及半导体器件 |
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CN104916624B (zh) | 2018-12-21 |
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CN104916624A (zh) | 2015-09-16 |
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