CN108507557B - 传感器装置 - Google Patents

传感器装置 Download PDF

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Publication number
CN108507557B
CN108507557B CN201810527812.XA CN201810527812A CN108507557B CN 108507557 B CN108507557 B CN 108507557B CN 201810527812 A CN201810527812 A CN 201810527812A CN 108507557 B CN108507557 B CN 108507557B
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CN
China
Prior art keywords
sensor element
sensor device
substrate
substrate body
base material
Prior art date
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Expired - Fee Related
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CN201810527812.XA
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English (en)
Chinese (zh)
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CN108507557A (zh
Inventor
椛泽秀年
渡边成人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Publication of CN108507557A publication Critical patent/CN108507557A/zh
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • G01C19/574Structural details or topology the devices having two sensing masses in anti-phase motion
    • G01C19/5747Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5656Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00Details of instruments
    • G01P1/02Housings
    • G01P1/023Housings for acceleration measuring devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
CN201810527812.XA 2012-07-03 2013-06-24 传感器装置 Expired - Fee Related CN108507557B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012149228A JP6016228B2 (ja) 2012-07-03 2012-07-03 センサデバイス
JP2012-149228 2012-07-03
CN201310253619.9A CN103528579B (zh) 2012-07-03 2013-06-24 传感器装置

Related Parent Applications (1)

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CN201310253619.9A Division CN103528579B (zh) 2012-07-03 2013-06-24 传感器装置

Publications (2)

Publication Number Publication Date
CN108507557A CN108507557A (zh) 2018-09-07
CN108507557B true CN108507557B (zh) 2022-01-14

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CN201310253619.9A Expired - Fee Related CN103528579B (zh) 2012-07-03 2013-06-24 传感器装置
CN201810527812.XA Expired - Fee Related CN108507557B (zh) 2012-07-03 2013-06-24 传感器装置

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CN201310253619.9A Expired - Fee Related CN103528579B (zh) 2012-07-03 2013-06-24 传感器装置

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US (1) US9310200B2 (enExample)
JP (1) JP6016228B2 (enExample)
CN (2) CN103528579B (enExample)

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JP2014050224A (ja) * 2012-08-31 2014-03-17 Seiko Epson Corp 発電装置、2次電池、電子機器、及び移動手段
JP6102646B2 (ja) 2013-01-23 2017-03-29 ソニー株式会社 入力装置、電子機器及びセンサシート
JP6119518B2 (ja) 2013-02-12 2017-04-26 ソニー株式会社 センサ装置、入力装置及び電子機器
US10055067B2 (en) 2013-03-18 2018-08-21 Sony Corporation Sensor device, input device, and electronic apparatus
US10615793B2 (en) 2013-04-04 2020-04-07 Sony Corporation Deformable input apparatus and electronic apparatus including key regions
CN103633036B (zh) * 2013-08-07 2017-03-08 中国科学院电子学研究所 基于高阻材料的电场传感器封装元件
JP6142745B2 (ja) 2013-09-10 2017-06-07 ソニー株式会社 センサ装置、入力装置及び電子機器
JP2015170770A (ja) * 2014-03-07 2015-09-28 イビデン株式会社 プリント配線板
JP2015185281A (ja) 2014-03-20 2015-10-22 ソニー株式会社 キーボードカバーおよび電子機器
JP2015190859A (ja) 2014-03-28 2015-11-02 ソニー株式会社 センサ装置、入力装置及び電子機器
KR20150140136A (ko) * 2014-06-05 2015-12-15 엘지전자 주식회사 와치 타입 이동 단말기
JP6252678B2 (ja) * 2014-07-04 2017-12-27 株式会社村田製作所 圧電センサおよび圧電素子
JP6319026B2 (ja) * 2014-09-29 2018-05-09 日亜化学工業株式会社 発光装置及びその製造方法
JP6597069B2 (ja) * 2015-09-02 2019-10-30 セイコーエプソン株式会社 センサーユニット、電子機器、および移動体
US10516943B2 (en) * 2016-05-04 2019-12-24 Infineon Technologies Ag Microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device
US10840430B2 (en) * 2016-06-30 2020-11-17 Intel Corporation Piezoelectric package-integrated sensing devices
JP2018112466A (ja) * 2017-01-11 2018-07-19 ソニーセミコンダクタソリューションズ株式会社 センサデバイス及び電子機器
EP3680211B1 (en) * 2019-01-10 2024-03-06 TE Connectivity Solutions GmbH Sensor unit and method of interconnecting a substrate and a carrier
WO2021140850A1 (ja) * 2020-01-10 2021-07-15 株式会社村田製作所 モジュール
CN112346065A (zh) * 2020-12-04 2021-02-09 深圳市多泰吉科技有限公司 超声波传感头及具有其的倒车雷达
JP7779093B2 (ja) * 2021-11-10 2025-12-03 セイコーエプソン株式会社 慣性計測装置
CN117439496B (zh) * 2023-12-20 2024-03-15 江苏亚力防爆电机有限公司 矿用防爆电机的运行减震控制方法及系统

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JP2012084766A (ja) * 2010-10-14 2012-04-26 Panasonic Corp モジュールの製造方法

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Publication number Publication date
US20140007682A1 (en) 2014-01-09
CN103528579B (zh) 2018-06-29
CN108507557A (zh) 2018-09-07
US9310200B2 (en) 2016-04-12
CN103528579A (zh) 2014-01-22
JP2014010131A (ja) 2014-01-20
JP6016228B2 (ja) 2016-10-26

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Granted publication date: 20220114