CN107466159B - 摄像模组的模塑电路板及其制造设备和制造方法 - Google Patents

摄像模组的模塑电路板及其制造设备和制造方法 Download PDF

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Publication number
CN107466159B
CN107466159B CN201610394707.4A CN201610394707A CN107466159B CN 107466159 B CN107466159 B CN 107466159B CN 201610394707 A CN201610394707 A CN 201610394707A CN 107466159 B CN107466159 B CN 107466159B
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China
Prior art keywords
molding
circuit board
base
mold
manufacturing apparatus
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CN201610394707.4A
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English (en)
Chinese (zh)
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CN107466159A (zh
Inventor
王明珠
赵波杰
田中武彦
黄桢
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201610394707.4A priority Critical patent/CN107466159B/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to PCT/CN2017/087316 priority patent/WO2017211267A1/zh
Priority to JP2018563523A priority patent/JP6806801B2/ja
Priority to KR1020217012124A priority patent/KR102388560B1/ko
Priority to EP17809706.9A priority patent/EP3468316A4/en
Priority to US16/307,926 priority patent/US11161291B2/en
Priority to TW106118749A priority patent/TWI692999B/zh
Priority to KR1020187037930A priority patent/KR102262937B1/ko
Publication of CN107466159A publication Critical patent/CN107466159A/zh
Priority to JP2020201519A priority patent/JP7132998B2/ja
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Publication of CN107466159B publication Critical patent/CN107466159B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76531—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76732—Mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201610394707.4A 2016-06-06 2016-06-06 摄像模组的模塑电路板及其制造设备和制造方法 Active CN107466159B (zh)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CN201610394707.4A CN107466159B (zh) 2016-06-06 2016-06-06 摄像模组的模塑电路板及其制造设备和制造方法
JP2018563523A JP6806801B2 (ja) 2016-06-06 2017-06-06 撮像モジュールのモールド回路基板とその製造設備及び製造方法
KR1020217012124A KR102388560B1 (ko) 2016-06-06 2017-06-06 촬영 모듈의 몰딩회로기판과 그 제조설비 및 제조방법
EP17809706.9A EP3468316A4 (en) 2016-06-06 2017-06-06 CAMERA MODULE MOLDED PRINTED CIRCUIT BOARD, MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD
PCT/CN2017/087316 WO2017211267A1 (zh) 2016-06-06 2017-06-06 摄像模组的模塑电路板及其制造设备和制造方法
US16/307,926 US11161291B2 (en) 2016-06-06 2017-06-06 Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
TW106118749A TWI692999B (zh) 2016-06-06 2017-06-06 攝像模組的模塑電路板及其製造設備和製造方法
KR1020187037930A KR102262937B1 (ko) 2016-06-06 2017-06-06 촬영 모듈의 몰딩회로기판과 그 제조설비 및 제조방법
JP2020201519A JP7132998B2 (ja) 2016-06-06 2020-12-04 撮像モジュールのモールド回路基板とその製造設備及び製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610394707.4A CN107466159B (zh) 2016-06-06 2016-06-06 摄像模组的模塑电路板及其制造设备和制造方法

Publications (2)

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CN107466159A CN107466159A (zh) 2017-12-12
CN107466159B true CN107466159B (zh) 2022-07-19

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Country Status (7)

Country Link
US (1) US11161291B2 (https=)
EP (1) EP3468316A4 (https=)
JP (2) JP6806801B2 (https=)
KR (2) KR102388560B1 (https=)
CN (1) CN107466159B (https=)
TW (1) TWI692999B (https=)
WO (1) WO2017211267A1 (https=)

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CN107466160B (zh) * 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 摄像模组的模塑电路板的制造设备及其制造方法
US10659664B2 (en) * 2016-08-01 2020-05-19 Ningbo Sunny Opotech Co., Ltd. Camera module and molded circuit board assembly and manufacturing method thereof
TWI734028B (zh) * 2017-09-28 2021-07-21 大陸商寧波舜宇光電信息有限公司 攝像模組、感光組件、感光組件拼板及其成型模具和製造方法
CN107888812A (zh) * 2017-11-27 2018-04-06 维沃移动通信有限公司 一种电子设备及电子设备的摄像模组
CN108289375A (zh) * 2018-01-15 2018-07-17 深圳华麟电路技术有限公司 高像素摄像头模组软硬结合板加工方法
CN108134898B (zh) * 2018-01-30 2020-04-10 维沃移动通信有限公司 一种摄像头模组、摄像头模组的组装方法及移动终端
US20210029281A1 (en) * 2018-04-17 2021-01-28 Ningbo Sunny Opotech Co., Ltd. Camera module with chamfer, photosensitive component and electronic device
US11758253B2 (en) 2018-04-17 2023-09-12 Ningbo Sunny Opotech Co., Ltd. Camera module having chamfer, photosensitive assembly, preparation method, and electronic device
WO2019242771A1 (zh) * 2018-06-22 2019-12-26 宁波舜宇光电信息有限公司 模塑感光组件和摄像模组及其制造方法以及电子设备
WO2020019940A1 (zh) * 2018-07-26 2020-01-30 宁波舜宇光电信息有限公司 感光组件、感光组件拼板、模塑组件拼板以及制造方法
CN110933258A (zh) * 2018-09-20 2020-03-27 宁波舜宇光电信息有限公司 光学镜头、摄像模组及其组装方法
CN111050032B (zh) * 2018-10-15 2021-08-24 三赢科技（深圳）有限公司 相机模组
CN111263507A (zh) * 2018-11-30 2020-06-09 宁波舜宇光电信息有限公司 线路板拼板及其制造方法和感光组件、摄像模组
CN109743845A (zh) * 2019-03-06 2019-05-10 宁波舜宇光电信息有限公司 模塑电路板及其制备方法、模塑电路板半成品
CN112020219B (zh) * 2019-05-30 2022-03-01 宁波舜宇光电信息有限公司 一种覆铜拼板以及摄像模组的制备方法
CN110519500A (zh) * 2019-09-17 2019-11-29 深圳传音控股股份有限公司 摄像模组、电子设备及图像获取方法
CN112954163B (zh) * 2021-02-05 2022-08-23 南昌欧菲光电技术有限公司 光传感模组、摄像模组及电子设备
CN114407403B (zh) * 2021-12-09 2024-04-09 陕西法士特齿轮有限责任公司 一种制作端面o型圈的装置及方法
TWI794101B (zh) * 2022-04-21 2023-02-21 大根光學工業股份有限公司 成像鏡頭模組與電子裝置
CN115056417B (zh) * 2022-05-09 2023-06-20 广州市力驰微电子科技有限公司 一种电源芯片生产用注塑成型设备及其操作方法
CN119676999A (zh) * 2023-09-20 2025-03-21 北京小米移动软件有限公司 一种膜片的制作方法、膜片、壳体及电子设备
US20250159319A1 (en) * 2023-11-14 2025-05-15 Meta Platforms Technologies, Llc Electro-magnetic interference shielding for camera module

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