CN107240496B - 电子部件 - Google Patents

电子部件 Download PDF

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Publication number
CN107240496B
CN107240496B CN201710319375.8A CN201710319375A CN107240496B CN 107240496 B CN107240496 B CN 107240496B CN 201710319375 A CN201710319375 A CN 201710319375A CN 107240496 B CN107240496 B CN 107240496B
Authority
CN
China
Prior art keywords
electrode
inserter
surface electrode
electronic component
ceramic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710319375.8A
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English (en)
Chinese (zh)
Other versions
CN107240496A (zh
Inventor
服部和生
山田忠辉
藤本力
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN107240496A publication Critical patent/CN107240496A/zh
Application granted granted Critical
Publication of CN107240496B publication Critical patent/CN107240496B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN201710319375.8A 2010-12-28 2011-12-27 电子部件 Active CN107240496B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010291413 2010-12-28
JP2010-291413 2010-12-28
JP2011-121174 2011-05-31
JP2011121174 2011-05-31
CN201180063327.8A CN103299382B (zh) 2010-12-28 2011-12-27 电子部件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180063327.8A Division CN103299382B (zh) 2010-12-28 2011-12-27 电子部件

Publications (2)

Publication Number Publication Date
CN107240496A CN107240496A (zh) 2017-10-10
CN107240496B true CN107240496B (zh) 2019-06-07

Family

ID=46383080

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180063327.8A Active CN103299382B (zh) 2010-12-28 2011-12-27 电子部件
CN201710319375.8A Active CN107240496B (zh) 2010-12-28 2011-12-27 电子部件

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201180063327.8A Active CN103299382B (zh) 2010-12-28 2011-12-27 电子部件

Country Status (4)

Country Link
JP (2) JP5376069B2 (ko)
KR (2) KR101485117B1 (ko)
CN (2) CN103299382B (ko)
WO (1) WO2012090986A1 (ko)

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JP5655818B2 (ja) * 2012-06-12 2015-01-21 株式会社村田製作所 チップ部品構造体
WO2013187186A1 (ja) 2012-06-14 2013-12-19 株式会社 村田製作所 電子部品及びその製造方法
JP5532087B2 (ja) * 2012-08-06 2014-06-25 株式会社村田製作所 実装構造
JP5888281B2 (ja) * 2012-08-10 2016-03-16 株式会社村田製作所 実装ランド構造体及び積層コンデンサの実装構造体
JP6014581B2 (ja) * 2013-02-18 2016-10-25 太陽誘電株式会社 インターポーザ付き積層セラミックコンデンサと、積層セラミックコンデンサ用インターポーザ
JP5725062B2 (ja) 2013-03-15 2015-05-27 株式会社村田製作所 電子部品、それに含まれる基板型の端子、および、電子部品の実装構造
JP5794256B2 (ja) * 2013-03-19 2015-10-14 株式会社村田製作所 電子部品および電子部品連
JP5803997B2 (ja) * 2013-07-23 2015-11-04 株式会社村田製作所 電子部品の製造方法
JP5803998B2 (ja) 2013-07-23 2015-11-04 株式会社村田製作所 電子部品の製造方法及び基板型の端子の製造方法
KR101525689B1 (ko) * 2013-11-05 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
KR101525696B1 (ko) 2013-11-14 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
KR101514565B1 (ko) 2013-11-14 2015-04-22 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
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KR20150089277A (ko) * 2014-01-27 2015-08-05 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP6011573B2 (ja) 2014-03-24 2016-10-19 株式会社村田製作所 電子部品
JP6024693B2 (ja) 2014-03-24 2016-11-16 株式会社村田製作所 電子部品
KR101963273B1 (ko) * 2014-09-18 2019-03-28 삼성전기주식회사 인터포저, 인터포저를 포함하는 전자 부품 및 인터포저를 포함하는 전자 부품의 실장 기판
JP2016072603A (ja) * 2014-09-26 2016-05-09 株式会社村田製作所 電子部品
US9997295B2 (en) * 2014-09-26 2018-06-12 Murata Manufacturing Co., Ltd. Electronic component
JP6379996B2 (ja) * 2014-10-24 2018-08-29 株式会社村田製作所 電子部品、回路モジュール及び回路基板
KR102139763B1 (ko) * 2015-01-08 2020-07-31 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
KR102214642B1 (ko) * 2015-01-20 2021-02-10 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP2017005221A (ja) * 2015-06-16 2017-01-05 株式会社村田製作所 複合電子部品
KR102004804B1 (ko) 2017-08-28 2019-07-29 삼성전기주식회사 복합 전자부품, 그 실장 기판
KR102463337B1 (ko) * 2017-09-20 2022-11-04 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102538906B1 (ko) 2017-09-27 2023-06-01 삼성전기주식회사 복합 전자부품 및 그 실장 기판
KR102516765B1 (ko) * 2017-09-27 2023-03-31 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102426211B1 (ko) 2017-10-02 2022-07-28 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102473414B1 (ko) 2017-10-12 2022-12-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
US10892212B2 (en) * 2017-11-09 2021-01-12 Stmicroelectronics, Inc. Flat no-lead package with surface mounted structure
CN108257878A (zh) * 2018-01-11 2018-07-06 郑州云海信息技术有限公司 一种增强qfn封装焊接效果的方法及qfn封装
KR102609148B1 (ko) * 2018-02-13 2023-12-05 삼성전기주식회사 전자 부품 및 그 실장 기판
KR102505433B1 (ko) 2018-04-20 2023-03-03 삼성전기주식회사 전자 부품
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
KR102538898B1 (ko) * 2018-06-08 2023-06-01 삼성전기주식회사 전자 부품
KR20190121179A (ko) 2018-09-13 2019-10-25 삼성전기주식회사 전자 부품
KR102032759B1 (ko) 2018-09-14 2019-10-17 삼성전기주식회사 전자 부품
KR102584973B1 (ko) 2018-09-28 2023-10-05 삼성전기주식회사 복합 전자부품
CN113303033B (zh) * 2019-01-28 2024-02-13 三菱电机株式会社 基板组件以及空气调和装置
KR102109639B1 (ko) * 2019-06-07 2020-05-12 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
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JP2021174837A (ja) * 2020-04-23 2021-11-01 株式会社村田製作所 積層セラミックコンデンサ
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Also Published As

Publication number Publication date
KR101476391B1 (ko) 2014-12-24
JP5376069B2 (ja) 2013-12-25
KR20140107622A (ko) 2014-09-04
JP2014042037A (ja) 2014-03-06
KR20130115314A (ko) 2013-10-21
JP5725112B2 (ja) 2015-05-27
CN107240496A (zh) 2017-10-10
JPWO2012090986A1 (ja) 2014-06-05
KR101485117B1 (ko) 2015-01-21
WO2012090986A1 (ja) 2012-07-05
CN103299382A (zh) 2013-09-11
CN103299382B (zh) 2017-05-24

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