CN1070403C - 半导体片研磨机的工件夹持器及其定位方法 - Google Patents

半导体片研磨机的工件夹持器及其定位方法 Download PDF

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Publication number
CN1070403C
CN1070403C CN94117575A CN94117575A CN1070403C CN 1070403 C CN1070403 C CN 1070403C CN 94117575 A CN94117575 A CN 94117575A CN 94117575 A CN94117575 A CN 94117575A CN 1070403 C CN1070403 C CN 1070403C
Authority
CN
China
Prior art keywords
workpiece holder
piezoelectric element
grinding
work holder
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94117575A
Other languages
English (en)
Chinese (zh)
Other versions
CN1108591A (zh
Inventor
安东·胡贝尔
罗伯特·魏斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of CN1108591A publication Critical patent/CN1108591A/zh
Application granted granted Critical
Publication of CN1070403C publication Critical patent/CN1070403C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10P50/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN94117575A 1993-10-21 1994-10-21 半导体片研磨机的工件夹持器及其定位方法 Expired - Fee Related CN1070403C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4335980A DE4335980C2 (de) 1993-10-21 1993-10-21 Verfahren zum Positionieren einer Werkstückhalterung
DEP4335980.9 1993-10-21

Publications (2)

Publication Number Publication Date
CN1108591A CN1108591A (zh) 1995-09-20
CN1070403C true CN1070403C (zh) 2001-09-05

Family

ID=6500715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94117575A Expired - Fee Related CN1070403C (zh) 1993-10-21 1994-10-21 半导体片研磨机的工件夹持器及其定位方法

Country Status (8)

Country Link
US (1) US5567199A (enExample)
JP (1) JP2896746B2 (enExample)
KR (1) KR0159916B1 (enExample)
CN (1) CN1070403C (enExample)
DE (1) DE4335980C2 (enExample)
IT (1) IT1280040B1 (enExample)
MY (1) MY110610A (enExample)
TW (1) TW245818B (enExample)

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US5951368A (en) * 1996-05-29 1999-09-14 Ebara Corporation Polishing apparatus
DE19627142C2 (de) * 1996-07-05 2003-04-24 Andreas Hilker Vorrichtung zur Oberflächenbearbeitung von Metall, Glas oder dergleichen
KR100218309B1 (ko) * 1996-07-09 1999-09-01 구본준 씨엠피장치의 반도체웨이퍼 레벨링 감지장치 및 방법
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
JPH1110498A (ja) * 1997-06-18 1999-01-19 Sumitomo Heavy Ind Ltd 固体アクチュエータを用いた面振れ修正機構を持つ加工装置
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
US6045431A (en) * 1997-12-23 2000-04-04 Speedfam Corporation Manufacture of thin-film magnetic heads
JP2000015557A (ja) * 1998-04-27 2000-01-18 Ebara Corp 研磨装置
JP2968784B1 (ja) * 1998-06-19 1999-11-02 日本電気株式会社 研磨方法およびそれに用いる装置
JP2000015570A (ja) * 1998-07-02 2000-01-18 Disco Abrasive Syst Ltd 研削装置
JP3515917B2 (ja) * 1998-12-01 2004-04-05 シャープ株式会社 半導体装置の製造方法
DE19859360C2 (de) * 1998-12-22 2003-07-17 Schwaebische Werkzeugmaschinen Werkzeugmaschine mit piezoelektrischer Positionskorrektureinrichtung
US6432823B1 (en) 1999-11-04 2002-08-13 International Business Machines Corporation Off-concentric polishing system design
US6383056B1 (en) 1999-12-02 2002-05-07 Yin Ming Wang Plane constructed shaft system used in precision polishing and polishing apparatuses
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
JP2002025961A (ja) * 2000-07-04 2002-01-25 Disco Abrasive Syst Ltd 半導体ウエーハの研削方法
US6991524B1 (en) * 2000-07-07 2006-01-31 Disc Go Technologies Inc. Method and apparatus for reconditioning digital discs
TW200301211A (en) * 2001-12-11 2003-07-01 Mitsuboshi Diamond Ind Co Ltd Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method
KR20020090195A (ko) * 2002-10-30 2002-11-30 도대홍 튜브형 마늘다데기 제조
DE10325977B4 (de) * 2003-06-07 2005-06-09 Daimlerchrysler Ag Flachschleifvorrichtung mit einer Spannvorrichtung sowie Verfahren zum Schleifbearbeiten eines Werkstücks in einer Flachschleifvorrichtung
CN100343018C (zh) * 2004-01-08 2007-10-17 财团法人工业技术研究院 晶片磨床构造
US6966817B2 (en) * 2004-02-11 2005-11-22 Industrial Technology Research Institute Wafer grinder
NL1036034A1 (nl) 2007-10-11 2009-04-15 Asml Netherlands Bv Imprint lithography.
JP4783404B2 (ja) * 2008-07-02 2011-09-28 光洋機械工業株式会社 ワーク装着装置
JP4783405B2 (ja) * 2008-07-02 2011-09-28 光洋機械工業株式会社 傾斜角調整装置及びワーク装着装置
JP5295204B2 (ja) * 2010-11-09 2013-09-18 中国電力株式会社 研磨装置
CN103029031A (zh) * 2011-09-30 2013-04-10 上海双明光学科技有限公司 一种晶圆基片加工方法
CN103193199B (zh) * 2013-03-27 2015-09-23 山东理工大学 一种用于低温超声阳极键合装置中的硅片夹持器
CN104227523A (zh) * 2013-06-19 2014-12-24 晶科能源有限公司 硅片打磨工艺及其设备
JP6147587B2 (ja) * 2013-06-27 2017-06-14 株式会社ディスコ 研削装置及び研削方法
JP6121284B2 (ja) * 2013-08-13 2017-04-26 株式会社ディスコ 研磨装置
JP6336772B2 (ja) * 2014-02-14 2018-06-06 株式会社ディスコ 研削研磨装置
JP6660743B2 (ja) * 2016-01-22 2020-03-11 株式会社東京精密 研削装置
JP6906312B2 (ja) * 2017-01-16 2021-07-21 株式会社ディスコ 研磨装置
CN109499984B (zh) * 2018-10-13 2022-03-18 广东嗨学云教育科技有限公司 一种集成电路通用制造装置
JP7417362B2 (ja) * 2019-04-05 2024-01-18 株式会社ディスコ 研削装置
JP2020196100A (ja) * 2019-06-04 2020-12-10 株式会社ディスコ 圧電アクチュエータで構成したチャックテーブル傾き調整機構
JP7391470B2 (ja) * 2019-12-20 2023-12-05 株式会社ディスコ ワークの研削方法
JP7563933B2 (ja) * 2020-10-07 2024-10-08 株式会社ディスコ 微調整装置、加工装置及び被加工物の加工方法
CN113023357B (zh) * 2021-04-14 2022-06-07 湖南三安半导体有限责任公司 黏贴装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872626A (en) * 1973-05-02 1975-03-25 Cone Blanchard Machine Co Grinding machine with tilting table
US4597228A (en) * 1983-12-19 1986-07-01 Citizen Watch Co., Ltd. Vacuum suction device
US5054244A (en) * 1989-04-19 1991-10-08 Kabushiki Kaisha Toshiba Polishing apparatus
US5117589A (en) * 1990-03-19 1992-06-02 Read-Rite Corporation Adjustable transfer tool for lapping magnetic head sliders

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184727A (ja) * 1982-04-23 1983-10-28 Disco Abrasive Sys Ltd シリコンウェ−ハの面を研削する方法
US4603867A (en) * 1984-04-02 1986-08-05 Motorola, Inc. Spinner chuck
DD226819A1 (de) * 1984-08-27 1985-09-04 Werkzeugmasch Okt Veb Messanordnung zur erfassung der ist-lage und der topographie eines rotierenden schleifkoerpers
JPS62124842A (ja) * 1985-11-27 1987-06-06 Hitachi Seiko Ltd テ−ブルの傾斜補正型工作機械
JPS62181862A (ja) * 1986-02-07 1987-08-10 Hitachi Seiko Ltd 平面研削装置
CA2012878C (en) * 1989-03-24 1995-09-12 Masanori Nishiguchi Apparatus for grinding semiconductor wafer
JP3077994B2 (ja) * 1990-05-21 2000-08-21 理化学研究所 電解ドレッシング研削装置
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
FR2677276B1 (fr) * 1991-06-06 1995-12-01 Commissariat Energie Atomique Machine de polissage a table porte-echantillon perfectionnee.
DE4136882A1 (de) * 1991-11-09 1993-05-13 Glyco Metall Werke Positioniervorrichtung fuer eine bearbeitungsmaschine fuer werkstuecke
US5320007A (en) * 1992-11-18 1994-06-14 Texas Instruments Incorporated Method for positioning and processing LPE films

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872626A (en) * 1973-05-02 1975-03-25 Cone Blanchard Machine Co Grinding machine with tilting table
US4597228A (en) * 1983-12-19 1986-07-01 Citizen Watch Co., Ltd. Vacuum suction device
US5054244A (en) * 1989-04-19 1991-10-08 Kabushiki Kaisha Toshiba Polishing apparatus
US5117589A (en) * 1990-03-19 1992-06-02 Read-Rite Corporation Adjustable transfer tool for lapping magnetic head sliders

Also Published As

Publication number Publication date
MY110610A (en) 1998-08-29
DE4335980C2 (de) 1998-09-10
ITRM940674A1 (it) 1996-04-18
ITRM940674A0 (it) 1994-10-18
CN1108591A (zh) 1995-09-20
DE4335980A1 (de) 1995-04-27
KR950012617A (ko) 1995-05-16
US5567199A (en) 1996-10-22
JP2896746B2 (ja) 1999-05-31
IT1280040B1 (it) 1997-12-29
TW245818B (enExample) 1995-04-21
JPH07122524A (ja) 1995-05-12
KR0159916B1 (ko) 1999-02-01

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Applicant after: Wacker Siltronic Gesellschaft Fuer, Halbleitermaterialien mbH

Applicant before: Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe mbH

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: WACKER-CHEMITRONIC GESELLSCHAFT FUER ELEKTRONIK-GRUNDSTOFFE MBH TO: WACKER SILTRNOIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN MBH

C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee