CN106756823A - Liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube - Google Patents
Liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube Download PDFInfo
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- CN106756823A CN106756823A CN201710053016.2A CN201710053016A CN106756823A CN 106756823 A CN106756823 A CN 106756823A CN 201710053016 A CN201710053016 A CN 201710053016A CN 106756823 A CN106756823 A CN 106756823A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 150000002500 ions Chemical class 0.000 title claims abstract description 35
- 150000001875 compounds Chemical class 0.000 title claims abstract description 32
- 238000009713 electroplating Methods 0.000 title claims abstract description 21
- 239000010408 film Substances 0.000 claims abstract description 72
- 239000002131 composite material Substances 0.000 claims abstract description 46
- 230000007547 defect Effects 0.000 claims abstract description 24
- 238000000151 deposition Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000000427 thin-film deposition Methods 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 238000001914 filtration Methods 0.000 claims abstract description 6
- 238000007733 ion plating Methods 0.000 claims description 30
- 239000010409 thin film Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 10
- 230000008676 import Effects 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 230000033228 biological regulation Effects 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 5
- 238000010891 electric arc Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000006641 stabilisation Effects 0.000 claims description 5
- 238000011105 stabilization Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 230000008030 elimination Effects 0.000 claims description 4
- 238000003379 elimination reaction Methods 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010963 304 stainless steel Substances 0.000 claims description 3
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims description 3
- 210000001367 artery Anatomy 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 3
- 239000003344 environmental pollutant Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 231100000719 pollutant Toxicity 0.000 claims description 3
- 210000003462 vein Anatomy 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 210000002381 plasma Anatomy 0.000 description 26
- 238000005516 engineering process Methods 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000000541 cathodic arc deposition Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 210000001519 tissue Anatomy 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
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- 238000011109 contamination Methods 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
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- 238000001704 evaporation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010921 in-depth analysis Methods 0.000 description 1
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- 238000005468 ion implantation Methods 0.000 description 1
- 230000037427 ion transport Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube, belong to technical field of material surface treatment, the present invention is to solve the problems, such as the loss in bulky grain and depositing ions pollute to inside pipe wall in multi-stage magnetic field filter cleaning and arc-plasma transmitting procedure.The inventive method includes:First, on the sample stage that workpiece to be coated is placed in vacuum chamber, line related is connected, opens external water cooling system;2nd, thin film deposition:Treat that the vacuum in vacuum chamber is less than 10‑4During Pa, it is passed through working gas and adjusts air pressure, open plated film power supply, attract the arc-plasma in exit using grid bias power supply simultaneously and carry out energy adjustment, bulky grain defect is effectively eliminated by the stop shielding of liner positive bias conical pipe and straight tube set composite itself and the filtering effect of positively biased piezoelectric field inhibitory action and multi-stage magnetic field and ensures the efficiency of transmission of arc-plasma, technological parameter needed for setting, carries out film preparation.
Description
Technical field
The present invention relates to liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube, belong to material
Technical field of surface.
Background technology
During arc ion plating prepares film, because arc spot current density is up to 2.5 ~ 5 × 1010A/m2, cause
Occurs the liquid metal of melting at the arc spot position of target material surface, in the presence of local plasma pressure in droplets
Splash out, is attached to film surface or inlays formation " bulky grain " in the film(Macroparticles)Defect(Boxman
R L, Goldsmith S. Macroparticle contamination in cathodic arc coatings:
generation, transport and control [J]. Surf Coat Tech, 1992, 52(1): 39-50.).
In arc-plasma, it is far longer than due to the movement velocity of electronics and big is reached in the movement velocity of ion, unit interval
The electron number on grain surface is more than number of ions, makes bulky grain that elecrtonegativity is presented.It is the thin of micron or sub-micron relative to thickness rank
Film, pollution of the size in 0.1-10 microns of bulky grain defect just as PM2.5 to air quality, quality and property to film
There can be serious harm.It is increasingly extensive with thin-film material and thin film technique application, the solution of bulky grain defect problem with
The no bottleneck further developed as arc ions electroplating method, seriously constrains its answering in thin-film material of new generation preparation
With.
At present, it is also easy to produce greatly in the simple metal using low melting point or multicomponent alloy material to solve arc ions electroplating method
Grain defect problem, the method for using Magnetic filter main at present filters out bulky grain, and such as Chinese patent is used for material surface modifying
Plasma immersion and ion implantation device(Publication number:CN1150180, publication date:On May 21st, 1997)It is middle to use 90 °
Magnetic filter is filtered to the bulky grain of pulsed cathode arc, American scholar Anders et al. (Anders S, Anders A,
Dickinson M R, MacGill R A, Brown I G. S-shaped magnetic macroparticle filter
for cathodic arc deposition [J]. IEEE Trans Plasma Sci, 1997, 25(4): 670-
674.) and the Zhang Yujuan etc. of He'nan University (such as Zhang Yujuan, Wu Zhiguo, Zhang Weiwei filtered cathode arc plasmas prepare TiAlN thin film
Influence China YouSe Acta Metallurgica Sinica 2004,14 (8) of the middle sedimentary condition to film texture:1264-1268.) in article
Middle " S " magnetic filter that made is filtered to the bulky grain of cathode arc, also American scholar Anders et al.(Anders
A, MacGill R A. Twist filter for the removal of macroparticles from cathodic
arc plasmas [J]. Surf Coat Tech, 2000, 133-134: 96-100.)The Twist filter's of proposition
Magnetic filter, although the efficiency of transmission that these methods have certain effect, plasma in terms of filtering and eliminating bulky grain is damaged
Lose seriously, substantially reduce ion current density.Based on that can filter on the basis of bulky grain can guarantee that efficiency again, Chinese patent is true
Empty cathode arc straight filter (publication number:CN1632905, publication date:On June 29th, 2005) the middle side for proposing straight tube filtering
Method, but which in turn reduces filter effect.In a word, related researcher is by contrasting various Magnetic filter methods(Anders A.
Approaches to rid cathodic arc plasmas of macro- and nanoparticles: a review
[J] Surf Coat Tech, 1999,120-121319-330. and Takikawa H, Tanoue H. Review of
cathodic arc deposition for preparing droplet-free thin films [J]. IEEE Trans
Plasma Sci, 2007, 35(4): 992-999.)It was found that arc ion plating plasma after magnetic filter by keeping
Efficiency of transmission and elimination bulky grain high is very difficult to take into account, and drastically influence application of the technology in high-quality thin-film deposition.
In addition using the electric field suppressing method of bias on matrix, when back bias voltage is applied on matrix, electric field will be to electronegative big
Grain produces repulsive interaction, and then reduces the generation of film surface bulky grain defect.German scholar Olbrich et al.(Olbrich
W, Fessmann J, Kampschulte G, Ebberink J. Improved control of TiN coating
properties using cathodic arc evaporation with a pulsed bias [J]. Surf Coat
Tech, 1991, 49(1-3):258-262. and Fessmann J, Olbrich W, Kampschulte G, Ebberink
J. Cathodic arc deposition of TiN and Zr(C, N) at low substrate temperature
using a pulsed bias voltage [J]. Mat Sci Eng A, 1991, 140: 830-837.)Using pulse
Bias to replace traditional Dc bias, form a kind of new physical gas phase deposition technology --- pulsed bias arc ion plating
Technology, not only greatly reduces the number of film surface bulky grain, also overcomes the substrate temperature mistake that Traditional DC bias causes
It is high, the problems such as stress in thin films is larger.Woods Guoqiang of Dalian University of Technology et al.(Woods Guoqiang pulsed bias arc ion platings
Process ba- sis research [D] Dalian University of Technology, 2008. and Huang Meidong, woods Guoqiang, Dong Chuan, Sun Chao hear immediately inclined
Press Influencing Mechanism [J] the Acta Metallurgica Sinicas to arc ion plating film surface appearance, 2003,39 (5): 510-515.)Pin
The mechanism for causing bulky grain defect to reduce to pulsed bias conducts in-depth analysis, by pulsed bias amplitude, frequency and arteries and veins
The adjustment of width and other processes parameter is rushed, the sheaths kinetic characteristic of arc-plasma can be improved, reduce film surface big
Grain defect counts, improve the quality of film, are widely used in actual production, but bulky grain can not be still completely eliminated and lack
Fall into.Domestic scholars(Wei Yongqiang, Zong Xiaoya, Jiang Zhiqiang, literary Zhenhua, Chen Liang thoroughbred horse multi-stage magnetic field straight tube Magnetic filters and pulse
The compound arc ions electroplating method of bias, publication number:CN103276362A, publication date:On September 4th, 2013)Propose many
The arc ions electroplating method that level magnetic field straight tube Magnetic filter is combined with pulsed bias, big is eliminated by multi-stage magnetic field filter
Grain defect simultaneously lifts the efficiency of transmission of plasma, but the pollution problem of inside pipe wall and the loss of inside pipe wall plasma do not have
It is well solved, later stage correlation scholar(Wei Yongqiang, Zong Xiaoya, Hou Junxing, Liu Yuan, Liu Xueshen, Jiang Zhiqiang,
Accord with the multi-stage magnetic field arc ions electroplating method of pallid light liner positive bias straight tubes, publication number:CN105925940A, publication date:
On September 7th, 2016)The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube is proposed to solve the pollution to inside pipe wall
Problem.Also scholar(The cathodic arc plasma source and its film of Zhang Tao, Hou Junda, Liu Zhiguo, Zhang Yicong Magnetic filters
Prepare [J] China Surface Engineering, 2002,02): 11-15+20-12.)The method for using for reference Bilek plates(Bilek M M M,
Yin Y, McKenzie D R, Milne W I A M W I. Ion transport mechanisms in a
filtered cathodic vacuum arc (FCVA) system [C]. Proceedings of the Discharges
and Electrical Insulation in Vacuum, 1996 Proceedings ISDEIV, XVIIth
International Symposium on, 1996: 962-966 vol.2), on 90 degree of bend pipes of bend pipe magnetic filter
Apply positive bias to improve the efficiency of transmission of plasma.
The content of the invention
The invention aims to be the simple metal or multicomponent alloy for solving conventional arc ion electroplating method using low melting point
Material and nonmetallic materials(Such as graphite)Bulky grain defect, flexure type Magnetic filter technology are also easy to produce as target cause electric arc etc.
The low problem of gas ions efficiency of transmission, with reference to multi-stage magnetic field filter method and conical pipe own form mechanical stop shielding and just
The compound action that biasing electric field attracts, while ensureing arc-plasma with efficiency of transmission higher by conical pipe and multistage magnetic
Filter, allow workpiece surface the situation for applying back bias voltage it is continuous, fine and close prepare high-quality thin-film, while realize it is right
Constituent content addition control, reduction use the production cost of alloys target, improve the deposition efficiency of film, reduce bulky grain in film
Defect is to film growth and the adverse effect of performance, it is proposed that liner positive bias conical pipe and the compound multi-stage magnetic field electric arc of straight tube
Ion electroplating method.
The inventive method institute use device includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field dress
Put 4, multi-stage magnetic field power supply 5, liner positive bias conical pipe and straight tube set composite 6, positively biased voltage source 7, sample stage 8, bias plasma
Source waveform oscillograph 9 and vacuum chamber 10;
The method is comprised the following steps:
On step one, the sample stage 8 that pending substrate work-piece is placed in vacuum chamber 10, liner positive bias conical pipe and straight tube are multiple
Attach together and put insulation between 6 and vacuum chamber 10 and multi-stage magnetic field device 4, workpiece and sample stage 8 connect the negative pole output of grid bias power supply 1
End, arc ion plating target source 3 is arranged on vacuum chamber 10, connects the cathode output end of arc power 2, multi-stage magnetic field device 4 it is at different levels
Magnetic field connects each output end of multi-stage magnetic field power supply 5, and both positive and negative polarity connection can be determined according to output magnetic direction, and liner is just
Bias conical pipe and straight tube set composite 6 connect the cathode output end of positively biased voltage source 7, open outside water-cooling circulating system;
Step 2, thin film deposition:Vacuum chamber 10 is vacuumized, treats that the vacuum in vacuum chamber 10 is less than 10-4During Pa, work is passed through
Make gas to 0.01Pa~10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and adjust the output of grid bias power supply 1
Bias amplitude, pulse frequency and pulse width, the peak voltage of the output pulse of grid bias power supply 1 is 0~1.2kV, pulse frequency
It is 0Hz~80kHz, pulse width 1 ~ 90%;
Arc power 2 is opened, the surface in arc ion plating target source 3 is cleaned by the spots moving of electric arc, what regulation needed
Technological parameter, the current value of the output of arc power 2 is 10 ~ 300A, and multi-stage magnetic field device 4 is adjusted by multi-stage magnetic field power supply 5, is kept
Arc-plasma is produced in the stabilization of arc ion plating target source 3 and carries out filtering elimination to bulky grain defect, makes arc plasma
Body reaches matrix surface with efficiency of transmission higher by multi-stage magnetic field device 4, carries out the fast deposition of film, arc ion plating
Target source 3 and multi-stage magnetic field device 4 avoid the temperature in the course of work from raising problem by water-cooling pattern;
Positively biased voltage source 7 is opened, direct current positive bias, adjustment output are kept to liner positive bias conical pipe and straight tube set composite 6
Voltage, makes liner positive bias conical pipe and straight tube set composite 6 attract bulky grain, and depositing ions are repelled, and subtracts
Loss of few plasma in transmitting procedure in pipe, improves the efficiency of transmission of plasma and the deposition velocity of film;Liner
Positive bias conical pipe and straight tube set composite 6 can coordinate multi-stage magnetic field device 4 to design various structures and import and export layout, each pipe
Between be connected by bolt and nut, be easy to disassemble assembling and cleaning pollutant;Liner positive bias conical pipe and straight tube are compound
Activity insulation connection between device 6 and multi-stage magnetic field device 4, liner positive bias conical pipe and straight tube set composite 6 can regard table
Face pollution level is dismantled cleaning and is installed in time, it is to avoid the inside pipe wall pollution of multi-stage magnetic field device 4 and difficult under linerless board status
In the problem of cleaning, the length of liner positive bias conical pipe and straight tube set composite 6HLength with multi-stage magnetic field device 4 is identical,
Internal diameter at liner positive bias conical pipe and the right side import of straight tube set composite 6D EnterIt is interior more than the external diameter in arc ion plating target source 3
Lining positive bias conical pipe and the internal diameter of the external diameter less than multi-stage magnetic field device 4 on the right side of straight tube set composite 6, liner positive bias taper
Internal diameter at pipe and the left side outlet of straight tube set composite 6D Go outSelected according to different targets and technological parameter, at import
Internal diameter change and the textural association of set composite with exit, it is possible to achieve the mechanical stop shielding to bulky grain, liner is just
The material of bias conical pipe and straight tube set composite 6 may be selected 304 stainless steel materials of nonmagnetic, resistance to cleaning, can be according to taper
The length and rigidity of pipe and straight tube set composite need to select suitable thickness, are processed according to actual design parameter;Positively biased
The voltage parameter of voltage source 7 is 0 ~+200V, is DC voltage, bulky grain defect can be produced in deposition process and continued
The attraction of stabilization, greatly reduces the probability that bulky grain reaches film surface by multi-stage magnetic field device 4.
The need for film preparation, adjusting related technological parameter carries out simple metal film, the change of different element ratios
It is prepared by compound ceramic membrane, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
Advantages of the present invention:A. liner positive bias conical pipe and straight tube set composite can be to big by applying positive bias
Particle is effectively attracted, and depositing ions are repelled, and reduces loss of the plasma in transmitting procedure in pipe, further
Improve the efficiency of transmission of arc-plasma and the deposition velocity of film;B. multi-stage magnetic field filter can be by the magnetic line of force
Ensure the high efficiency of transmission of arc-plasma, change the motion path of bulky grain defect to eliminate big in arc-plasma
Grain defect;C. liner positive bias conical pipe and straight tube set composite can realize mechanical stop screen effect by own form,
The motion path of bulky grain defect is limited to eliminate the bulky grain defect in arc-plasma;D. pulsed bias parameter is passed through
It is adjusted, including amplitude, pulse width and frequency are realized to the regulation of arc-plasma energy and the bulky grain to remaining
Defect is eliminated;E. the microstructure and properties of prepared film can be adjusted by pulsed bias parameter, using arteries and veins
Amplitude, pulse width and the frequency for rushing bias realize the pinning effect that energetic ion grows to film, improve the crystalline substance of film growth
Body tissue and stress state, improve bond strength;F. prepared film avoids bulky grain defect, and film crystal tissue is more
Plus it is fine and close, can further improve the mechanical property of film.
Step 3, can combine using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulse
Cathode arc carries out thin film deposition to prepare simple metal film, difference with the compound bias of Dc bias, pulsed bias or DC pulse
The compound ceramic film of element ratio, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
Brief description of the drawings
Fig. 1 is the liner positive bias conical pipe of multi-stage magnetic field arc ion plating of the present invention and a kind of dress of straight tube set composite
With sketch;Fig. 2 is 4 kinds of typical structure sketches of liner positive bias conical pipe and straight tube set composite.
Specific embodiment
Specific embodiment one:Present embodiment, present embodiment liner positive bias taper are illustrated with reference to Fig. 1 and 2
The multi-stage magnetic field arc ions electroplating method institute use device that pipe and straight tube are combined includes grid bias power supply 1, arc power 2, arc ions
Plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, liner positive bias conical pipe and straight tube set composite 6, positively biased piezoelectricity
Source 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber 10;
The method is comprised the following steps:
On step one, the sample stage 8 that pending substrate work-piece is placed in vacuum chamber 10, liner positive bias conical pipe and straight tube are multiple
Attach together and put insulation between 6 and vacuum chamber 10 and multi-stage magnetic field device 4, workpiece and sample stage 8 connect the negative pole output of grid bias power supply 1
End, arc ion plating target source 3 is arranged on vacuum chamber 10, connects the cathode output end of arc power 2, multi-stage magnetic field device 4 it is at different levels
Magnetic field connects each output end of multi-stage magnetic field power supply 5, and both positive and negative polarity connection can be determined according to output magnetic direction, and liner is just
Bias conical pipe and straight tube set composite 6 connect the cathode output end of positively biased voltage source 7, open outside water-cooling circulating system;
Step 2, thin film deposition:Vacuum chamber 10 is vacuumized, treats that the vacuum in vacuum chamber 10 is less than 10-4During Pa, work is passed through
Make gas to 0.01Pa~10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and adjust the output of grid bias power supply 1
Bias amplitude, pulse frequency and pulse width, the peak voltage of the output pulse of grid bias power supply 1 is 0~1.2kV, pulse frequency
It is 0Hz~80kHz, pulse width 1 ~ 90%;
Arc power 2 is opened, the surface in arc ion plating target source 3 is cleaned by the spots moving of electric arc, what regulation needed
Technological parameter, the current value of the output of arc power 2 is 10 ~ 300A, and multi-stage magnetic field device 4 is adjusted by multi-stage magnetic field power supply 5, is kept
Arc-plasma is produced in the stabilization of arc ion plating target source 3 and carries out filtering elimination to bulky grain defect, makes arc plasma
Body reaches matrix surface with efficiency of transmission higher by multi-stage magnetic field device 4, carries out the fast deposition of film, arc ion plating
Target source 3 and multi-stage magnetic field device 4 avoid the temperature in the course of work from raising problem by water-cooling pattern;
Positively biased voltage source 7 is opened, and liner positive bias conical pipe and straight tube set composite 6 keep direct current positive bias, adjustment output electricity
Pressure, makes liner positive bias conical pipe and straight tube set composite 6 attract bulky grain, and depositing ions are repelled, and reduces
Loss of the plasma in transmitting procedure in pipe, improves the efficiency of transmission of plasma and the deposition velocity of film;Liner is just
Bias conical pipe and straight tube set composite 6 can coordinate multi-stage magnetic field device 4 to design various structures and import and export layout, respectively manage it
Between be connected by bolt and nut, be easy to disassemble assembling and cleaning pollutant;Liner positive bias conical pipe and the compound dress of straight tube
To put 6 can realize quickly removing and installing, it is to avoid the inside pipe wall pollution cleaning of multi-stage magnetic field device 4 asks under linerless board status
Topic, the internal diameter at liner positive bias conical pipe and the right side import of straight tube set composite 6D EnterIt is outer more than arc ion plating target source 3
The internal diameter of the external diameter less than multi-stage magnetic field device 4 on footpath, liner positive bias conical pipe and the right side of straight tube set composite 6, liner positively biased
Internal diameter at pressure conical pipe and the left side outlet of straight tube set composite 6D Go outSelected according to different targets and technological parameter, passed through
The internal diameter ratio change at import and exit and the textural association of set composite, it is possible to achieve to the mechanical stop screen of bulky grain
Cover, the material of liner positive bias conical pipe and straight tube set composite 6 may be selected 304 stainless steel materials of nonmagnetic, resistance to cleaning, can
Length and rigidity according to conical pipe and straight tube set composite need to select suitable thickness, are according to the processing of actual design parameter
Can;The voltage parameter of positively biased voltage source 7 is 0 ~+200V, is DC voltage, and bulky grain defect can be produced in deposition process
The continual and steady attraction of life, greatly reduces probability of the bulky grain by multi-stage magnetic field device 4.
The output waveform of grid bias power supply 1 is direct current, pulse, DC pulse is compound or multiple-pulse is compound.
The output of arc power 2 direct current, pulse, DC pulse are compound or multiple-pulse is compound.
Arc ion plating target source 3 is using high-melting-point or the simple metal or multicomponent alloy material of low melting point, it is possible to use single
Target, multiple target or composition target, carry out simple metal film, the compound ceramic film of different element ratios, function film, polynary many
Layer, superlattices, the high-quality thin-film with nanometer multilayer or gradient-structure.
Working gas selects argon gas, or working gas from one or more in nitrogen, acetylene, methane, silane or oxygen
Mixed gas prepare simple metal film, the compound ceramic film of different element ratio, function film, multi-component multi-layer, super
Lattice, the film with nanometer multilayer or gradient-structure.
The proposition of liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube, can be in conical pipe
Bulky grain is attracted using the positive bias for applying with straight tube set composite, is prevented effectively from big produced by low melting material
Particle issues;Depositing ions are repelled simultaneously, reduces loss of the plasma in transmitting procedure in pipe, improve plasma
The efficiency of transmission of body and the deposition velocity of film;Liner positive bias conical pipe and straight tube set composite pass through textural association and outlet
The internal diameter at placeD Go outRegulation, it is possible to achieve the mechanical stop shielding to bulky grain defect, reduces bulky grain and reaches heavy by exit
The probability of product sample surfaces;Liner positive bias conical pipe and straight tube set composite can realize quickly removing and installing, it is to avoid nothing
The problem of the inside pipe wall pollution cleaning of multi-stage magnetic field device under liner plate state;Apply on workpiece back bias voltage parameter by adjusting,
Be conducive to improving the interval Potential Distributing of plasma between target base, fully attract compound plasma to workpiece motion s, realize
The fast deposition of film;Simultaneously also using the metallic plasma that the stable lasting, ionization level of generation of arc ion plating (aip) is high,
Be conducive to ionization level ion high in the chemosynthesis reaction of workpiece surface, prepare different element ratios compound ceramic film,
Function film, multi-component multi-layer, superlattices and the film with gradient-structure or simple metal film.
Specific embodiment two:Present embodiment is that the method also includes with the difference of implementation method one:
Step 3, can combine using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulsed cathode
Arc carries out thin film deposition to prepare simple metal film, different elements with the compound bias of Dc bias, pulsed bias or DC pulse
The compound ceramic film of ratio, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
Specific embodiment three:Present embodiment is with the difference of implementation method two, perform repeatedly step one to
Step 3, prepares the multilayer films with different stress, microstructure and element ratio, other and implementation method two
It is identical.
Specific embodiment four:Present embodiment is with the difference of implementation method one, perform repeatedly step one to
Step 3, prepares the multilayer films with different stress, microstructure and element ratio, other and implementation method two
It is identical.
2 sets or arc ion plating target source 3, multi-stage magnetic field device 4 and the liner positively biased of the above can be used in step 2
The liner positive bias conical pipe and the compound multi-stage magnetic field arc ion plating side of straight tube of pressure conical pipe and the combination of straight tube set composite 6
Method carries out the thin film deposition with various simple metal elements and multicomponent alloy material as target, then carries out step 3, then repeatedly
Step 2 and step 3 are performed, so repeatedly, the sandwich construction with different stress, microstructure and element ratio is prepared
Film.
Claims (7)
1. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe and straight tube are combined, it is characterised in that the method institute
Use device includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, interior
Lining positive bias conical pipe and straight tube set composite 6, positively biased voltage source 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber
10;
The method is comprised the following steps:
On step one, the sample stage 8 that pending substrate work-piece is placed in vacuum chamber 10, liner positive bias conical pipe and straight tube are multiple
Attach together and put insulation between 6 and vacuum chamber 10 and multi-stage magnetic field device 4, workpiece and sample stage 8 connect the negative pole output of grid bias power supply 1
End, arc ion plating target source 3 is arranged on vacuum chamber 10, connects the cathode output end of arc power 2, multi-stage magnetic field device 4 it is at different levels
Magnetic field connects each output end of multi-stage magnetic field power supply 5, and both positive and negative polarity connection can be determined according to output magnetic direction, and liner is just
Bias conical pipe and straight tube set composite 6 connect the cathode output end of positively biased voltage source 7, open outside water-cooling circulating system;
Step 2, thin film deposition:Vacuum chamber 10 is vacuumized, treats that the vacuum in vacuum chamber 10 is less than 10-4During Pa, work is passed through
Gas opens grid bias power supply 1 and grid bias power supply kymographion 9, and adjust the inclined of the output of grid bias power supply 1 to 0.01Pa~10Pa
Pressure amplitude value, pulse frequency and pulse width, the peak voltage of the output pulse of grid bias power supply 1 is 0~1.2kV, and pulse frequency is
0Hz~80kHz, pulse width 1 ~ 90%;
Arc power 2 is opened, the surface in arc ion plating target source 3 is cleaned by the spots moving of electric arc, what regulation needed
Technological parameter, the current value of the output of arc power 2 is 10 ~ 300A, and multi-stage magnetic field device 4 is adjusted by multi-stage magnetic field power supply 5, is kept
Arc-plasma is produced in the stabilization of arc ion plating target source 3 and carries out filtering elimination to bulky grain defect, makes arc plasma
Body reaches matrix surface with efficiency of transmission higher by multi-stage magnetic field device 4, carries out the fast deposition of film, arc ion plating
Target source 3 and multi-stage magnetic field device 4 avoid the temperature in the course of work from raising problem by water-cooling pattern;
Positively biased voltage source 7 is opened, direct current positive bias, adjustment output are kept to liner positive bias conical pipe and straight tube set composite 6
Voltage, makes liner positive bias conical pipe and straight tube set composite 6 attract bulky grain, and depositing ions are repelled, and subtracts
Loss of few plasma in transmitting procedure in pipe, improves the efficiency of transmission of plasma and the deposition velocity of film;Liner
Positive bias conical pipe and straight tube set composite 6 can coordinate multi-stage magnetic field device 4 to design various structures and import and export layout, each pipe
Between be connected by bolt and nut, be easy to disassemble assembling and cleaning pollutant;Liner positive bias conical pipe and straight tube are compound
Activity insulation connection between device 6 and multi-stage magnetic field device 4, liner positive bias conical pipe and straight tube set composite 6 can regard table
Face pollution level is dismantled cleaning and is installed in time, it is to avoid the inside pipe wall pollution of multi-stage magnetic field device 4 and difficult under linerless board status
In the problem of cleaning, the length of liner positive bias conical pipe and straight tube set composite 6HLength with multi-stage magnetic field device 4 is identical,
Internal diameter at liner positive bias conical pipe and the right side import of straight tube set composite 6D EnterIt is interior more than the external diameter in arc ion plating target source 3
Lining positive bias conical pipe and the internal diameter of the external diameter less than multi-stage magnetic field device 4 on the right side of straight tube set composite 6, liner positive bias taper
Internal diameter at pipe and the left side outlet of straight tube set composite 6D Go outSelected according to different targets and technological parameter, at import
Internal diameter change and the textural association of set composite with exit, it is possible to achieve the mechanical stop shielding to bulky grain, liner is just
The material of bias conical pipe and straight tube set composite 6 may be selected 304 stainless steel materials of nonmagnetic, resistance to cleaning, can be according to taper
The length and rigidity of pipe and straight tube set composite need to select suitable thickness, are processed according to actual design parameter;Positively biased
The voltage parameter of voltage source 7 is 0 ~+200V, is DC voltage, bulky grain defect can be produced in deposition process and continued
The attraction of stabilization, greatly reduces the probability that bulky grain reaches film surface by multi-stage magnetic field device 4.
2. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, the method institute use device also includes that grid bias power supply kymographion 9 is used to show the arteries and veins that grid bias power supply 1 sends
Voltage and current waveform is rushed, by adjusting the output waveform of grid bias power supply 1, effective attraction is carried out to plated film ion, carried out thin
The deposition and control deposition targets of film ratio in the film, realize the regulation of plasma energy.
3. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, grid bias power supply 1 is exported, pulse is pulse, DC pulse is compound or multiple-pulse is compound.
4. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, the method can singly cover or set combination prepares simple metal film, the compound ceramic of different element ratios more
Film, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
5. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, the method also includes:
Step 3, can combine using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulsed cathode
Arc carries out thin film deposition to prepare simple metal film, different elements with the compound bias of Dc bias, pulsed bias or DC pulse
The compound ceramic film of ratio, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
6. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, performing step one repeatedly to step 2, using 2 sets or cover the system to prepare simple metal film, different units more
The compound ceramic film of plain ratio, function film and the high-quality thin-film with nanometer multilayer or gradient-structure.
7. the multi-stage magnetic field arc ions electroplating method that liner positive bias conical pipe according to claim 1 and straight tube are combined,
Characterized in that, working gas selects argon gas, or working gas from a kind of or many in nitrogen, acetylene, methane, silane or oxygen
Kind mixed gas prepare simple metal film, the compound ceramic film of different element ratio, function film and with nanometer
The high-quality thin-film of multilayer or gradient-structure.
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