CN105925940A - Multi-stage magnetic field arc ion plating method for lining positive bias straight pipe - Google Patents
Multi-stage magnetic field arc ion plating method for lining positive bias straight pipe Download PDFInfo
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- CN105925940A CN105925940A CN201610407162.6A CN201610407162A CN105925940A CN 105925940 A CN105925940 A CN 105925940A CN 201610407162 A CN201610407162 A CN 201610407162A CN 105925940 A CN105925940 A CN 105925940A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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Abstract
The invention discloses a multi-stage magnetic field arc ion plating method for a lining positive bias straight pipe, and belongs to the technical field of material surface treatment. The problems that in a multi-stage magnetic field filtering device, pollution to the inner wall of a pipeline due to macroparticles needs to be removed, and losses are caused in the plasma transmitting process need to be solved. The method comprises the steps that firstly, a workpiece to be coated is arranged on a sample table in a vacuum chamber, and a related power source is powered on; and secondly, film deposition is conducted, when the vacuum degree in the vacuum chamber is smaller than 10-4Pa, work gas is guided in, the air pressure is adjusted, a coating power source is started, meanwhile, energy of plasmas is adjusted through a grid bias power supply, the macroparticle defect is further eliminated through a lining positive bias straight pipe device, the transmission efficiency of the arc plasmas is guaranteed through the lining positive bias straight pipe device, needed technology parameters are set, and film deposition is conducted.
Description
Technical field
The present invention relates to the multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube, belong to technical field of material surface treatment.
Background technology
During arc ion plating prepares thin film, owing to arc speckle electric current density is up to 2.5 ~ 5 × 1010A/m2There is melted liquid metal in the arc speckle position causing target material surface, under the effect of local plasma pressure, splash is out in droplets, it is attached to film surface or inlays formation " bulky grain " (Macroparticles) defect (Boxman R L, Goldsmith S. Macroparticle in the film
contamination in cathodic arc coatings: generation, transport and control [J].
Surf Coat Tech, 1992,52 (1): 39-50.).In arc-plasma, owing to the movement velocity of electronics is far longer than the movement velocity of ion, the electron number arriving large particle surface in the unit interval is more than number of ions, makes bulky grain present elecrtonegativity.Relative to the thin film that thickness rank is micron or submicron, size is in the bulky grain defect of 0.1-10 micron just as the PM2.5 pollution to air quality, and quality and performance to thin film have serious harm.Along with thin-film material and thin film technique apply increasingly extensive, whether the solution of bulky grain defect problem becomes the bottleneck that arc ions electroplating method develops further, seriously constrains its application in a new generation's thin-film material preparation.
At present, it is easily generated bulky grain defect problem at the simple metal or multicomponent alloy material using low melting point to solve arc ions electroplating method, the way currently mainly using Magnetic filter filters out bulky grain, if Chinese patent is for plasma immersion and ion implantation device (publication number: the CN1150180 of material surface modifying, publication date: on May 21st, 1997) in use 90 ° of magnetic filters the bulky grain of pulsed cathode arc is filtered, American scholar Anders et al. (Anders S, Anders A
Dickinson M R, MacGill R A, Brown I G. S-shaped magnetic macroparticle filter
For cathodic arc deposition [J]. IEEE Trans Plasma Sci, 1997,25 (4): 670-674.) and (Zhang Yujuan such as Zhang Yujuan of He'nan University, Wu Zhiguo, Zhang Weiwei etc. filtered cathode arc plasma prepares the sedimentary condition impact on film texture in TiAlN thin film. China YouSe Acta Metallurgica Sinica. 2004,14 (8): 1264-1268.) in article, made " S " magnetic filter the bulky grain of cathode arc is filtered, also has American scholar Anders et al. (Anders A, MacGill R A.
Twist filter for the removal of macroparticles from cathodic arc plasmas [J].
Surf Coat Tech, 2000,133-134:96-100.) Magnetic filter of the Twist filter proposed, although these methods have certain effect in terms of filtering and eliminating bulky grain, but the loss of the efficiency of transmission of plasma is serious, makes ion current density be substantially reduced.Based on filtering on the basis of bulky grain can guarantee that efficiency again, Chinese patent vacuum cathode arc straight tube filter (publication number: CN1632905, publication date: on June 29th, 2005) the middle method proposing straight tube filtration, but which in turn reduces filter effect.In a word, relevant research worker is by contrast various Magnetic filter methods (Anders A. Approaches to
rid cathodic arc plasmas of macro- and nanoparticles: a review [J]. Surf Coat
Tech, 1999,120-121319-330. and Takikawa H, Tanoue H. Review of cathodic arc deposition for preparing
Droplet-free thin films [J]. IEEE Trans Plasma Sci, 2007,35 (4): 992-999.) find that arc ion plating plasma, by keeping high efficiency of transmission and elimination bulky grain to be very difficult to take into account after magnetic filter, drastically influence the application in high-quality thin-film deposits of this technology.Additionally using the electric field suppressing method of bias on matrix, when applying back bias voltage on matrix, electric field will produce repulsive interaction to electronegative bulky grain, and then reduce the generation of film surface bulky grain defect.German scholar Olbrich et al. (Olbrich W, Fessmann J,
Kampschulte G, Ebberink J. Improved control of TiN coating properties using
cathodic arc evaporation with a pulsed bias [J]. Surf Coat Tech, 1991, 49(1-3):
258-262. and Fessmann J, Olbrich W,
Kampschulte G, Ebberink J. Cathodic arc deposition of TiN and Zr(C, N) at low
substrate temperature using a pulsed bias voltage [J]. Mat Sci Eng A, 1991,
140:830-837.) use pulsed bias to replace traditional Dc bias, define a kind of new physical gas phase deposition technology pulsed bias arc ion plating technology, not only greatly reduce the oarse-grained number of film surface, also overcome Traditional DC and bias the problems such as the substrate temperature caused is too high, stress in thin films is bigger.Woods Guoqiang of Dalian University of Technology et al. (woods Guoqiang. Process ba-sis research [D] of pulsed bias arc ion plating. Dalian University of Technology, 2008. and Huang Meidong, woods Guoqiang, Dong Chuan, Sun Chao, hear immediately. the Influencing Mechanism [J] of Bias On Morphologies of Films Prepared By Arc Ion Plating. Acta Metallurgica Sinica, 2003, 39 (5): 510-515.) mechanism causing bulky grain defect to reduce for pulsed bias conducts in-depth analysis, by to pulsed bias amplitude, the adjustment of the technological parameter such as frequency and pulse width, the sheaths kinetic characteristic of arc-plasma can be improved, reduce the bulky grain defect counts of film surface, improve the quality of thin film, actual production is widely used, but bulky grain defect still can not be completely eliminated.Domestic scholars (Wei Yongqiang, Zong Xiaoya, Jiang Zhiqiang, literary composition Zhenhua, Chen Liangji. the arc ions electroplating method that multi-stage magnetic field straight tube Magnetic filter is compound with pulsed bias, publication number: CN103276362A, publication date: on JIUYUE 4th, 2013) propose the arc ions electroplating method that multi-stage magnetic field straight tube Magnetic filter is compound with pulsed bias, eliminate bulky grain defect by multi-stage magnetic field defecator and promote the efficiency of transmission of plasma, but the loss of the pollution problem of inside pipe wall and inside pipe wall plasma is not well solved.Also have scholar (Zhang Tao, Hou Junda, Liu Zhiguo, Zhang Yicong. the cathodic arc plasma source of Magnetic filter and film preparation [J] thereof. China's Surface Engineering, 2002,02): 11-15+20-12.) use for reference method (the Bilek M M M of Bilek plate, Yin Y
McKenzie D R, Milne W I A M W I. Ion transport mechanisms in a filtered
cathodic vacuum arc (FCVA) system [C]. Proceedings of the Discharges and
Electrical Insulation in Vacuum, 1996 Proceedings ISDEIV, XVIIth International
Symposium on, 1996:962-966 vol.2), the bend pipe of 90 degree of bend pipe magnetic filters applies positive bias and improves the efficiency of transmission of plasma.
Summary of the invention
nullThe invention aims to the simple metal for solving conventional arc ion electroplating method employing low melting point or multicomponent alloy material and nonmetallic materials (such as graphite) are easily generated bulky grain defect as target、Flexure type Magnetic filter technology causes the problems such as arc-plasma efficiency of transmission is low，The bulky grain defect contained in arc-plasma is eliminated in conjunction with multi-stage magnetic field straight tube Magnetic filter method，Ensure that arc-plasma passes through multi-stage magnetic field defecator with higher efficiency of transmission simultaneously，Make surface of the work apply back bias voltage situation can be continuous、Fine and close prepares high-quality thin-film，Realize constituent content in thin film is added controlling simultaneously、Reduce the production cost using alloys target、Improve the deposition efficiency of thin film、Reduce bulky grain defect to thin film growth and the adverse effect of performance，Propose the multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube.
The used device of the inventive method includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6, positive bias power supply 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber 10；
The method comprises the following steps:
Step one, pending substrate work-piece is placed on the sample stage 8 in vacuum chamber 10, workpiece connects the outfan of grid bias power supply 1, the arc ion plating target source 3 being arranged on vacuum chamber 10 connects the outfan of arc power 2, the magnetic fields at different levels of multi-stage magnetic field device 4 connect each outfan of multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6 connects the outfan of positive bias power supply 7, insulate between liner positive bias hose straightening device 6 and vacuum chamber 10 and multi-stage magnetic field device 4；
Step 2, thin film deposition: by vacuum chamber 10 evacuation, treat that the vacuum in vacuum chamber 10 is less than 10-4During Pa, it is passed through working gas to 0.01Pa～10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and regulate the bias amplitude of grid bias power supply 1 output, pulse frequency and pulse width, it is 0～1.2kV that grid bias power supply 1 exports the peak voltage of pulse, and pulse frequency is 0Hz～80kHz, pulse width 1 ~ 90%；
Open arc power 2, by the spots moving of electric arc, the surface in arc ion plating target source 3 is carried out, the technological parameter that regulation needs, the current value of arc power 2 output is 10 ~ 300A, multi-stage magnetic field device 4 is regulated by multi-stage magnetic field power supply 5, keep arc-plasma in the stable generation in arc ion plating target source 3 and to carry out bulky grain defect filtering elimination, make arc-plasma arrive matrix surface with higher efficiency of transmission by multi-stage magnetic field device 4, carry out the fast deposition of thin film；
nullOpen positive bias power supply 7，Liner positive bias hose straightening device 6 is kept direct current positive bias，Adjust output voltage，Make liner positive bias hose straightening device 6 that bulky grain to be attracted，Depositing ions is repelled，Reduce plasma loss in pipe in transmitting procedure，Improve efficiency of transmission and the deposition velocity of thin film of plasma，Between liner positive bias hose straightening device 6 and multi-stage magnetic field device 4, movable insulation is connected，Liner positive bias hose straightening device 6 can be dismantled cleaning in time and install with apparent surface pollution level，Avoid the problem that the inside pipe wall of multi-stage magnetic field device 4 under linerless board status pollutes and is difficult to cleaning，The internal diameter of liner positive bias hose straightening device 6 is more than the external diameter in arc ion plating target source 3，The external diameter of liner positive bias hose straightening device 6 is less than the internal diameter of multi-stage magnetic field device 4，Material may select nonmagnetic、304 stainless steel materials of resistance to cleaning，The parameter of positive bias power supply 7 is 0 ~+200V，For DC voltage，In deposition process, bulky grain defect can be produced continual and steady attraction，Greatly reduce bulky grain and arrived the probability of film surface by multi-stage magnetic field device 4.
According to the needs of film preparation, adjust relevant technological parameter and carry out simple metal thin film, the different compound ceramic thin film of element ratio, function film and there is the high-quality thin-film of nanometer multilayer or gradient-structure prepare.
Advantages of the present invention: bulky grain can effectively be attracted by a. liner positive bias hose straightening device, depositing ions is repelled, reduce plasma loss in pipe in transmitting procedure, improve efficiency of transmission and the deposition velocity of thin film of arc-plasma further；B. multi-stage magnetic field defecator can ensure the high efficiency of transmission of arc-plasma by the magnetic line of force, and the motion path changing bulky grain defect eliminates the bulky grain defect in arc-plasma；The microstructure and properties of the most prepared thin film can be adjusted by pulsed bias parameter, the amplitude of pulsed bias, pulse width and frequency is utilized to realize the pinning effect that thin film is grown by energetic ion, improve texture and the stress state of thin film growth, improve bond strength；D. prepared thin film avoids bulky grain defect, and film crystal tissue is finer and close, can improve the mechanical property of thin film further.
Step 3, bias can be combined in conjunction with using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulsed cathode arc carry out thin film deposition with Dc bias, pulsed bias or DC pulse, prepare simple metal thin film, the different compound ceramic thin film of element ratio, function film and there is the high-quality thin-film of nanometer multilayer or gradient-structure.
Accompanying drawing explanation
Fig. 1 is the multi-stage magnetic field arc ions electroplating method sketch of liner positive bias straight tube of the present invention.
Detailed description of the invention
Detailed description of the invention one: present embodiment is described below in conjunction with Fig. 1, multi-stage magnetic field the used device of arc ions electroplating method of present embodiment liner positive bias straight tube includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6, positive bias power supply 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber 10；
The method comprises the following steps:
Step one, pending substrate work-piece is placed on the sample stage 8 in vacuum chamber 10, workpiece connects the outfan of grid bias power supply 1, the arc ion plating target source 3 being arranged on vacuum chamber 10 connects the outfan of arc power 2, the magnetic fields at different levels of multi-stage magnetic field device 4 connect each outfan of multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6 connects the outfan of positive bias power supply 7, insulate between liner positive bias hose straightening device 6 and vacuum chamber 10 and multi-stage magnetic field device 4；
Step 2, thin film deposition: by vacuum chamber 10 evacuation, treat that the vacuum in vacuum chamber 10 is less than 10-4During Pa, it is passed through working gas to 0.01Pa～10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and regulate the bias amplitude of grid bias power supply 1 output, pulse frequency and pulse width, it is 0～1.2kV that grid bias power supply 1 exports the peak voltage of pulse, and pulse frequency is 0Hz～80kHz, pulse width 1 ~ 90%；
Open arc power 2, by the spots moving of electric arc, the surface in arc ion plating target source 3 is carried out, the technological parameter that regulation needs, the current value of arc power 2 output is 10 ~ 300A, multi-stage magnetic field device 4 is regulated by multi-stage magnetic field power supply 5, keep arc-plasma in the stable generation in arc ion plating target source 3 and to carry out bulky grain defect filtering elimination, make arc-plasma arrive matrix surface with higher efficiency of transmission by multi-stage magnetic field device 4, carry out the fast deposition of thin film；
nullOpen positive bias power supply 7，Liner positive bias hose straightening device 6 is kept direct current positive bias，Adjust output voltage，Make liner positive bias hose straightening device 6 that bulky grain to be attracted，Depositing ions is repelled，Reduce plasma loss in pipe in transmitting procedure，Improve efficiency of transmission and the deposition velocity of thin film of plasma，Between liner positive bias hose straightening device 6 and multi-stage magnetic field device 4, movable insulation is connected，Liner positive bias hose straightening device 6 can be dismantled cleaning in time and install with apparent surface pollution level，Avoid the problem that the inside pipe wall of multi-stage magnetic field device 4 under linerless board status pollutes and is difficult to cleaning，The internal diameter of liner positive bias hose straightening device 6 is more than the external diameter in arc ion plating target source 3，The external diameter of liner positive bias hose straightening device 6 is less than the internal diameter of multi-stage magnetic field device 4，Material may select nonmagnetic、304 stainless steel materials of resistance to cleaning，The parameter of positive bias power supply 7 is 0 ~+200V，For DC voltage，In deposition process, bulky grain defect can be produced continual and steady attraction，Greatly reduce bulky grain and arrived the probability of film surface by multi-stage magnetic field device 4.
Grid bias power supply 1 output waveform is direct current, pulse, DC pulse is compound or multiple-pulse is combined.
Arc power 2 exports direct current, pulse, DC pulse is compound or multiple-pulse is combined.
Arc ion plating target source 3 uses high-melting-point or the simple metal of low melting point or multicomponent alloy material, single target, multiple target or composition target can be used, carry out simple metal thin film, the different compound ceramic thin film of element ratio, function film, multi-component multi-layer, superlattices, there is the high-quality thin-film of nanometer multilayer or gradient-structure.
Working gas selects argon, or working gas selects the mixed gas of one or more in nitrogen, acetylene, methane, silane or oxygen, prepare simple metal thin film, the different compound ceramic thin film of element ratio, function film, multi-component multi-layer, superlattices, there is the thin film of nanometer multilayer or gradient-structure.
The proposition of the multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube, can utilize the positive bias of liner plate to attract bulky grain in hose straightening device, be prevented effectively from bulky grain problem produced by low melting material；Depositing ions is repelled, reduces plasma loss in pipe in transmitting procedure, improve efficiency of transmission and the deposition velocity of thin film of plasma；Liner positive bias hose straightening device can realize quickly removing and installing, it is to avoid the problem that under linerless board status, the inside pipe wall of multi-stage magnetic field device pollutes cleaning；By adjusting applied back bias voltage parameter on workpiece, be conducive to improving the interval Potential Distributing of plasma between target base, fully attract compound plasma to workpiece motion s, it is achieved the fast deposition of thin film；Producing of arc ion plating (aip) is the most also utilized to stablize the metallic plasma lasting, ionization level is high, be conducive to high ionization level ion at the chemosynthesis reaction of surface of the work, prepare the different compound ceramic thin film of element ratio, function film, multi-component multi-layer, superlattices and there is thin film or the simple metal thin film of gradient-structure.
Detailed description of the invention two: present embodiment is with the difference of embodiment one, and the method also includes:
Step 3, bias can be combined in conjunction with using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulsed cathode arc carry out thin film deposition with Dc bias, pulsed bias or DC pulse, prepare simple metal thin film, the different compound ceramic thin film of element ratio, function film and there is the high-quality thin-film of nanometer multilayer or gradient-structure.
Detailed description of the invention three: present embodiment is with the difference of embodiment two, repeatedly performs step one and has the multilayer films of different stress, microstructure and element ratio to step 3, preparation, and other are identical with embodiment two.
Detailed description of the invention four: present embodiment is with the difference of embodiment one, repeatedly performs step one and has the multilayer films of different stress, microstructure and element ratio to step 3, preparation, and other are identical with embodiment two.
The multi-stage magnetic field arc ion plating apparatus that can use the liner positive bias straight tube of 2 sets or above arc ion plating target source 3, multi-stage magnetic field device 4 and the cooperation of liner positive bias hose straightening device 6 in step 2 carries out the thin film deposition as target with various simple metal elements and multicomponent alloy material, then step 3 is carried out, the most repeatedly perform step 2 and step 3, the most repeatedly, preparation has the multilayer films of different stress, microstructure and element ratio.
Claims (7)
1. the multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube, it is characterized in that, the used device of the method includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6, positive bias power supply 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber 10；
The method comprises the following steps:
Step one, pending substrate work-piece is placed on the sample stage 8 in vacuum chamber 10, workpiece connects the outfan of grid bias power supply 1, the arc ion plating target source 3 being arranged on vacuum chamber 10 connects the outfan of arc power 2, the magnetic fields at different levels of multi-stage magnetic field device 4 connect each outfan of multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6 connects the outfan of positive bias power supply 7, insulate between liner positive bias hose straightening device 6 and vacuum chamber 10 and multi-stage magnetic field device 4；
Step 2, thin film deposition: by vacuum chamber 10 evacuation, treat that the vacuum in vacuum chamber 10 is less than 10-4During Pa, it is passed through working gas to 0.01Pa～10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and regulate the bias amplitude of grid bias power supply 1 output, pulse frequency and pulse width, it is 0～1.2kV that grid bias power supply 1 exports the peak voltage of pulse, and pulse frequency is 0Hz～80kHz, pulse width 1 ~ 90%；
Open arc power 2, by the spots moving of electric arc, the surface in arc ion plating target source 3 is carried out, the technological parameter that regulation needs, the current value of arc power 2 output is 10 ~ 300A, multi-stage magnetic field device 4 is regulated by multi-stage magnetic field power supply 5, keep arc-plasma in the stable generation in arc ion plating target source 3 and to carry out bulky grain defect filtering elimination, make arc-plasma arrive matrix surface with higher efficiency of transmission by multi-stage magnetic field device 4, carry out the fast deposition of thin film；
nullOpen positive bias power supply 7，Liner positive bias hose straightening device 6 is kept direct current positive bias，Adjust output voltage，Make liner positive bias hose straightening device 6 that bulky grain to be attracted，Depositing ions is repelled，Reduce plasma loss in pipe in transmitting procedure，Improve efficiency of transmission and the deposition velocity of thin film of plasma，Between liner positive bias hose straightening device 6 and multi-stage magnetic field device 4, movable insulation is connected，Liner positive bias hose straightening device 6 can be dismantled cleaning in time and install with apparent surface pollution level，Avoid the problem that the inside pipe wall of multi-stage magnetic field device 4 under linerless board status pollutes and is difficult to cleaning，The internal diameter of liner positive bias hose straightening device 6 is more than the external diameter in arc ion plating target source 3，The external diameter of liner positive bias hose straightening device 6 is less than the internal diameter of multi-stage magnetic field device 4，Material may select nonmagnetic、304 stainless steel materials of resistance to cleaning，The parameter of positive bias power supply 7 is 0 ~+200V，For DC voltage，In deposition process, bulky grain defect can be produced continual and steady attraction，Greatly reduce bulky grain and arrived the probability of film surface by multi-stage magnetic field device 4.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterized in that, the used device of the method also includes pulse voltage and the current waveform that grid bias power supply kymographion 9 sends for showing grid bias power supply 1, by adjusting the output waveform of grid bias power supply 1, plated film ion is effectively attracted, carry out the deposition of thin film and control deposition targets ratio in the film, it is achieved the regulation of plasma energy.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterised in that grid bias power supply 1 export pulse be pulse, DC pulse is compound or multiple-pulse is combined.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterized in that, the method can singly be overlapped or overlap more combination and prepared simple metal thin film, the different compound ceramic thin film of element ratio, function film and have the high-quality thin-film of nanometer multilayer or gradient-structure.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterised in that the method also includes:
Step 3, bias can be combined in conjunction with using Traditional DC magnetron sputtering, pulsed magnetron sputtering, conventional arc ion plating and pulsed cathode arc carry out thin film deposition with Dc bias, pulsed bias or DC pulse, prepare simple metal thin film, the different compound ceramic thin film of element ratio, function film and there is the high-quality thin-film of nanometer multilayer or gradient-structure.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterized in that, execution step one is to step 2 repeatedly, prepares simple metal thin film, the different compound ceramic thin film of element ratio, function film and has the high-quality thin-film of nanometer multilayer or gradient-structure.
The multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube the most according to claim 1, it is characterized in that, working gas selects argon, or the mixed gas of one or more in working gas selection nitrogen, acetylene, methane, silane or oxygen, prepare simple metal thin film, the different compound ceramic thin film of element ratio, function film and there is the high-quality thin-film of nanometer multilayer or gradient-structure.
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| CN106637098A (en) * | 2017-01-22 | 2017-05-10 | 魏永强 | Multi-grade magnetic field electric arc ion plating method of lining positive-biased tapered pipe |
| CN106637097A (en) * | 2017-01-22 | 2017-05-10 | 魏永强 | Lining conical pipe and porous baffle composite multi-level magnetic field arc ion plating method |
| CN106637096A (en) * | 2017-01-22 | 2017-05-10 | 魏永强 | Lining positive bias porous baffle multi-level magnetic field arc ion plating method |
| CN106676482A (en) * | 2017-01-22 | 2017-05-17 | 魏永强 | Lining step tube and porous baffle composite type multi-level magnetic field arc ion plating method |
| CN106676483A (en) * | 2017-01-22 | 2017-05-17 | 魏永强 | Lining straight pipe and porous baffle compound type multistage magnetic field arc ion plating method |
| CN106756823A (en) * | 2017-01-22 | 2017-05-31 | 魏永强 | Liner positive bias conical pipe and the compound multi-stage magnetic field arc ions electroplating method of straight tube |
| CN106756824A (en) * | 2017-01-22 | 2017-05-31 | 魏永强 | The multi-stage magnetic field arc ions electroplating method of liner positive bias stairstepping pipe |
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