CN105917750B - 用于重定向经过电子组装件的气流的系统和方法 - Google Patents

用于重定向经过电子组装件的气流的系统和方法 Download PDF

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CN105917750B
CN105917750B CN201580003480.XA CN201580003480A CN105917750B CN 105917750 B CN105917750 B CN 105917750B CN 201580003480 A CN201580003480 A CN 201580003480A CN 105917750 B CN105917750 B CN 105917750B
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R.W.埃利斯
D.迪安
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Abstract

用于重定向气流的系统，包含多个彼此相邻布置的电子组装件。每个电子组装件包含基板，所述基板具有实质上平坦的第一表面和相反的实质上平坦的第二表面。电子器件被联接到所述第一表面和所述第二表面中的每一个。每个表面还联接有一个或多个凸片，其中每个凸片配置为重定向经过所述至少一个电子器件的气流。

Description

用于重定向经过电子组装件的气流的系统和方法
技术领域
本公开总体上涉及用于电子器件的冷却系统，更具体地，涉及用于重定向经过具有电子器件的电子组装件的气流的系统和方法。
背景技术
电子器件(例如处理器或存储器)在运行中产生热量。如果任其发展，该热量可能降低系统性能，甚至导致部分的或完全的系统故障。因此，许多现有技术尝试通过使用热沉(heat sink)、冷却风扇等来移除或耗散热量。
尽管这些技术对于冷却不接近其他热源的单个电子部件可能是有效的，但当涉及包含多个发热源的更复杂的系统(例如服务器机架和存储阵列等)时，这些技术存在不足。一些存储阵列(例如那些包含多个固态驱动器(SSD)的存储阵列)，在运行期间产生大量的热量。
用于这些系统的现有冷却系统典型地包含多个高速风扇。这些高速风扇是吵闹的、给系统增加大量的费用、增加这些系统的总能量消耗、并降低系统效率。此外，现有冷却系统通常不能缓解形成在系统内的局部热点，这进而缩短了系统内的单独部件的寿命。
鉴于这些和其他的问题，期望提供一种更有效地冷却电子部件的系统和方法，尤其是对于包含多个发热部件的更大的系统中的部件。
发明内容
根据一些实施例，提供一种系统，用于重定向经过一个或多个电子组装件中的气流。每个电子组装件包含具有实质上平坦的第一表面和相反的实质上平坦的第二表面的基板(例如印刷电路板)、至少一个电子器件以及联接到该电子组装件的至少一个第一凸片。该至少一个第一凸片配置为为重定向经过该至少一个电子器件的气流。该凸片可以具有任意合适的形状(例如L形、T形，或者I形)，并可以具有固定的角度或者相对于基板和气流可调整的角度。
根据一些实施例，该电子组装件还包含联接到第二表面的至少一个第二凸片，其中该至少一个第二凸片配置为重定向经过该电子组装件的气流。在一些实施例中，通过焊接或胶粘至基板的方式将凸片联接到基板的表面。在其他实施例中，凸片被联接到电子器件的表面。
凸片重定向气流，有时形成湍流和旋涡，以更好地分配冷却气流经过电子器件，以及更好地重定向被加热的气流离开电子器件。这些系统和方法更加有效地冷却电子器件，从而使形成在这样的系统内的局部热点最小化。这些系统更加安静、运行和维护花费更少、而且更加高效。
本说明书中描述的主题的一个或更多实施方式的细节在下面的附图和说明中陈述。主题的其他特征、方面和优点通过说明书、附图和权利要求而变得显而易见。
附图说明
图1是根据本发明的一些实施例的存储阵列系统的示意图。
图2A和2B分别是根据本发明的一些实施例的电子组装件的侧视图和主视图。
图2C是根据本发明的另一实施例的不同电子组装件的侧视图。
图3A-3D示出了本发明的各种不同实施例中使用的各种不同凸片的各个视图。
图4A示出了本发明的实施例中使用的另一凸片的各个视图。
图4B是当与图4A中所示的凸片结合使用时，图2A-2C中的电子组装件的一部分的俯视图。
图4C是可以与图4A-4B或图5A-5D中所示的实施例一起使用的推动销(push pin)的透视图。
图5A-5D示出了本发明其他实施例中使用的另一凸片。
在整个附图中，相似的附图标记指代相对应的部件。
具体实施方式
如上文所述，难以有效且高效地冷却大而复杂的电子器件(例如服务器机架或存储阵列)中的所有电子部件。图1示出了一个这样的系统：固态驱动器存储阵列系统102。固态驱动器(SSD)存储系统102包含机柜112，机柜112含有多个(例如，多行或多列)SSD存储阵列104(a)-104(n)。这些阵列104的每一个进而含有多个固态驱动器110，示出为在每个阵列104中彼此平行布置。每个固态驱动器110包含基板(例如印刷电路板)、多个固态存储器设备、控制器，和其他电路。
在一些实施例中，存储阵列系统102包含安装在机柜112中或以其他方式与机柜112流体联接的一个或多个风扇106、108。在一些实施例中，一些风扇(例如风扇108)抽吸冷却空气进入机柜112，并强制空气通过固态驱动器110。在一些实施例中，一些风扇(例如风扇106)使被加热的空气从机柜112排出。
尽管图1示出了存储阵列系统102，但本领域技术人员应该认识到，本文描述的实施例可以应用于任意需要冷却多个电子部件的系统(例如台式计算机、服务器，或者类似物)，并且当气流(自然发生的或者强制流通的空气)经过具有多个发热的部件的电子组装件时，效果尤其良好。
图2A是根据本发明的一些实施例的电子组装件200的侧视图。图2B示出了电子组装件200的侧视图。在一些实施例中，该电子组装件代表图1的固态驱动器110中的一个。电子组装件200配置为设置在气流(以开口箭头代表)中，从而空气流经该电子组装件。
电子组装件200包含基板210(例如印刷电路板)，基板210具有实质上平坦的第一表面201和相反的实质上平坦的第二表面203。电子组装件200还包含至少一个电子器件(例如存储装置204(a)-(h)、控制器202，和其他电路206(1)-(d))。在一些实施例中，第一侧面201和第二侧面203中的每一个包含多个电子器件。在一些实施例中，第一侧面201和第二侧面203中的每一个包含相同的电子器件。
在一些实施例中，电子器件被安装在基板210的侧面上，而在其他的实施例中，电子器件被集成到基板210中(例如在基板的相对的表面之间)。在一些实施例中，一个或多个散热装置(例如带有鳍片的(多个)热沉214)被热耦合到一个或多个电子器件。
在一些实施例中，电子组装件200包含连接器(例如边缘卡连接器212)，用于将该电子组装件电气地(和/或机械地)联接到更大的系统。
电子组装件200还包含一个或多个凸片208(a)-208(d)。在图2A和图2B所示的实施例中，凸片208(a)-208(d)被设置在基板210的前边缘的列中，即在基板的首先暴露于进入的气流的一侧。然而应该认识到，这些凸片可以被设置在如下文所描述的任意的便利的位置。
在一些实施例中，这些凸片直接安装在基板210的第一表面201和/或第二表面203上。在一些实施例中，凸片被胶粘至电子组装件200，而在其他实施例中，凸片被焊接至电子组装件200。在一些实施例中，凸片的基部被“镀锡”处理，以有助于焊接到专门设置在基板210上的凸片接收垫。下文关于图4和图5示出和描述了其他用于安装凸片的机构。
在一些实施例中，凸片208(a)-208(d)与基板一体形成，即基板和凸片形成为单个的部件。例如，基板和凸片可以注射模制为单个的部件。
在一些实施例中，凸片208(a)-208(d)由金属材料构成，而在其他实施例中，它们由ESD(静电放电)塑料构成。使用ESD塑料是因为经过凸片的气流可能产生静电，如果不适当地放电可能进而损坏电子部件。在一些实施例中，凸片被接地。在一些实施例中，凸片(例如金属片)从基板210传导走热量。在一些实施例中，凸片被热耦合到发热器件(例如经由迹线、通孔、导热胶、基板中或基板上的导热层，或类似物)。
如下面更详细描述的，每个凸片208(a)-208(d)设置为相对于气流成一定角度，从而重定向通过电子组装件的气流。在一些实施例中，凸片将气流混合以产生经过PCB的湍流气流。在一些实施例中，凸片将气流混合以在气流中产生旋涡。由凸片产生的气流提供经过电子组装件的均匀的气流，从而避免形成局部热点。
在一些实施例中，当凸片被联接到电子组装件200时，每个凸片的取向在拾取与放置时间(pick-and-place time)被决定。PCB上的每个旋涡凸片的角度被选择以改变电子组装件200的不同区域的气流。例如，凸片可以被定向以重定向经过部件的气流，或者凸片可以被定向以重定向气流进入彼此来产生湍流。
在一些实施例中，系统(例如图1的存储阵列系统)包含至少两个电子组装件，该两个电子组装件彼此相邻设置，从而气流可以在电子组装件之间通过。在这种配置中，两个电子组装件的凸片也可以将来自一个电子组装件的气流重定向至相邻的电子组装件，从而进一步增强湍流并增强两个组装件上的部件的冷却。
图2C是根据本发明的另一实施例的不同的电子组装件220的侧视图。在该实施例中，额外的凸片208(e)-(h)被设置在电子组装件200上的其他位置。在图2A-C的任一实施例中，根据发热部件的位置、电子组装件的冷却要求、现有的气流(无论自然的或强制对流的空气)、基板210上的可用空间、凸片的尺寸和类型、周围的电子组装件等，来选取凸片的位置。凸片相对于气流的角度(迎角)被用于控制或导向空气以不同的方向经过电子组装件。
虽然凸片208(a)-(h)可以具有任意合适的形状和尺寸来处理气流的速度和电子组装件的其他规格，下面的说明描述了合适的凸片设置的子集。在一些实施例中，凸片为2到8毫米高x 4-8毫米长x 2-6毫米宽，或者不超出产业委员会所提出和备案的应用的形状因数限制的任意其他配置。
图3A示出了L形凸片的斜视图300和侧视图302。L形凸片具有联接到凸起304的基部306。在一些实施例中，凸起304正交于基部306。在一些实施例中，该基部配置为如上文所述的联接到基板210(图2A-C)。凸起304配置为设置在气流中以重定向气流。在一些实施例中，L形凸片的边缘(例如边缘308)被倒角。
图3B示出了I形凸片的斜视图310和侧视图312。该I形凸片具有联接到腹板(web)320的基部凸缘318，腹板320进而联接到顶部凸缘316。在一些实施例中，腹板320正交于法兰318、316。在一些实施例中，基部凸缘如上文所述的配置为联接到基板210(图2A-C)。腹板320和顶部凸缘316配置为重定向气流。在一些实施例中，I形凸片的边缘(例如边缘322)被倒角。
图3C示出了改进的L形凸片的斜视图和侧视图。该改进的L形凸片具有联接到凸起334的基部336凸起。在一些实施例中，凸起334正交于基部336。在一些实施例中，基部如上文所述的配置为联接到基板210(图2A-C)。凸起334配置为设置在气流中以重定向气流。在一些实施例中，该改进的L形凸片的边缘(例如边缘338)被倒角。在一些实施例中，基部336具有减小的足印(footprint)，以减少基板上安装面积(在该安装面积处焊接到基板)，从而减少将凸片安装到基板所需的焊料的量。在一些实施例中，基部具有三角形面积，且在一些实施例中，三角形面积的顶点被截平，以进一步减少足印。
图3D示出了一倒T形凸片的斜视图340和侧视图342。该T形凸片具有联接到凸起346的基部344。在一些实施例中，凸起346正交于基部344。在一些实施例中，基部344如上文所述的配置为联接到基板210(图2A-C)。凸起344配置为重定向气流。在一些实施例中，该I形凸片的边缘(例如边缘348)被倒角。
上述涉及图3A-D的任一凸片可以被挤压或注射模制，且可能需要额外的机械加工。在一些实施例中，凸片延伸进入气流中的高度显著地高于周围部件。
图4A示出了用于本发明的实施例的另一凸片的第一斜视图402和第二斜视图403。该凸片具有与图3D的倒T形凸片相似的形状，但基部406上具有圆形的边缘，在凸起404上具有圆形和锥形的侧面，以及穿孔钉408，当穿孔钉408延伸离开基部406时略带锥度。在一些实施例中，该凸片具有翼形形状。穿孔钉408配置为插入电子组装件200或220上的相应的孔(例如基板210中形成的穿孔)。
图4B是当与图4A中所示的凸片结合使用时，图2A-2C的电子组装件200或220的一部分的俯视图。在一些实施例中，图4B是图2A-2C的电子组装件200或220的基板210的俯视图。该图的上部示出了第一实施例420，其中基板210包含形成在其中的孔424和若干尾部孔426、434、436。在一些实施例中，这些孔424、426、434、436形成为至少部分地通过基板210，而在其他实施例中，这些孔形成为从第一侧面201(图2A)到第二侧面203(图2A)完全穿过基板。在气流中，引导孔424设置在尾部孔426、434、436(设置在引导孔424的下风向，更接近凸片的尾部边缘)的上风向(更接近凸片的引导边缘)。
在使用中，图4A的凸片的其中一个钉408被设置在引导孔424内，而另一个钉408被设置在尾部孔426、434、436中的一个内。以这种方式，凸片对气流的迎角可以根据需要被调整。虚线428、430和432示出了当被设置在基板210上的三个位置之一时，图4A的凸片的基部406的轮廓。
图4B的下部示出了第二实施例422，其中基板210包含两组孔440，其每一个含有各自的引导孔和尾部孔，即引导孔未如第一实施例424的情况被重复使用。在使用中，凸片被设置在任一组孔440中。
可以通过将基部或钉胶粘就位、通过焊接、或通过任何其它合适的方式将凸片固定到位。此外，可以在电子组装件(或基板)中设置任意数量的孔，以将每个凸片设置为所需的迎角。根据所需的气流的特性(例如方向、速度、湍流、失速等)来选择所需的迎角。
在一些实施例中，钉408(图2A)被替换为图4C中所示的安装或固定推动销450。通过简单地将销450推动通过形成为通过基板的孔，这些销450允许凸片被固定在基板210(图2A-2C)上。
每个销450包含轴452和头部453，轴452具有第一直径，头部453具有比轴更大的直径。头部453包含被通道458分隔的分段454，且由弹性材料或弹力材料来制造，该弹性材料允许分段在被推动通过小于头部但大于轴的孔时能够弯曲入通道，但随后当离开孔的另一侧时可以弹性地回到其正常偏置的位置。在使用中，每个凸片的销450被推动通过基板中的孔，以将凸片锁定到基板。在其他实施例中，可以使用任意其他合适的固定销或锁定销。
图5A-5D示出了本发明的其他实施例中使用的另一凸片500。一旦安装在电子组装件上，该凸片500可以被安装者或使用者在任意时候重定向。凸片500包含两部分，即凸片部分502和基部部分504。在一些实施例中，凸片500由金属材料构成，而在其他实施例中由ESD塑料构成。此外，在一些实施例中，凸片500被胶粘或焊接到该电子组装件。在其他实施例中，如图5D所示，通过将基部部分504的推动销450(参考图4C所描述)压合通过基板210中形成的孔530将凸片500安装到基板210。这将凸片500附接至基板210。
回到图5A-5C，凸片部分502包含配置为设置在电子组装件(例如基板210)的表面上的基部506。凸片508实质上正交于基部506延伸。如图所示，推动销450从基部450的底部延伸。凸片508配置为以一定的迎角设置在气流中。基部506还包含若干小凸起(或棘爪)452。
基部部分504包含实质上平坦的基部520，基部520具有通过其形成的孔524。孔524的直径稍微大于推动销450的直径，因此推动销450可以被推动通过基部520中的孔524，以将凸片部分502固定到基部部分504。基部520还包含若干小凸起(或棘爪)452，其配置为与棘爪(或凸起)526配合，以防止凸片部分502被气流旋转，但仍允许使用者相对于基部部分504旋转凸片部分502，以调整凸片508的迎角。可替代的，凸起526仅是摩擦凸块，以帮助凸片在气流中保持正确的位置。
最终，如图5D所示，基部部分包含凸起(或棘爪)522，其配置为与形成在电子组装件(例如基板210)中的相对应的棘爪(或凸起)532相配合。这些棘爪在主安装孔的任一侧起引导孔的作用，以对齐基部部分，并在一旦彼此联接后，阻止基部部分相对于电子组装件(例如基板210)转动。角度标记也可以被模制或印刷在基部或基板上，以指示板级或机柜级构造的角度分配。
可调整的凸片402、403、500的主要优点之一是可以使用同样的零件来组装电路板，并可以在组装后设置气流的角度(迎角)。还可能根据系统的特定配置来调整每个凸片的角度。
应该理解的是，上述操作的特定顺序仅是示范性的，而非意在表示该描述的顺序是该操作可执行的唯一顺序。本领域普通技术人员将认识到重新排列本文描述的操作的多种方式。
为了解释目的，已参考特定的实施例描述了前述说明。然而，以上说明性的讨论无意穷举或将本发明限定为所公开的精确形式。鉴于上文的教导，许多修改和变化是可能的。所选择和描述的实施例是为了最佳地解释本发明的原理及其实际应用，从而使本领域技术人员最佳地利用本发明和具有各种修改的各种实施例，以适合于所设想的特定用途。

Claims (22)

1.一种用于重定向经过电子组装件的气流的系统，所述系统包含：
电子组装件，所述电子组装件包含：
基板，其中所述基板具有实质上平坦的第一表面和相反的实质上平坦的第二表面；
联接到所述基板的至少一个电子器件；以及
至少一个第一凸片和至少一个第二凸片，其中所述至少一个第一凸片联接到所述电子组装件的基板的平坦的第一表面，且所述至少一个第二凸片联接到所述电子组装件的基板的平坦的第二表面，从而当气流流经所述电子组装件时，所述至少一个第一凸片相对于所述气流具有一角度，以导向气流经过所述电子组装件和所述至少一个电子器件。
2.如权利要求1所述的系统，其中所述第一凸片和所述第二凸片被焊接到所述基板。
3.如权利要求2所述的系统，其中所述基板是印刷电路板。
4.如权利要求1所述的系统，其中所述第一凸片和所述第二凸片中的每一个包含至少一个凸起，其中每个所述凸起与所述基板中的孔相配合。
5.如权利要求4所述的系统，其中每个所述凸起是推动销，所述推动销一旦被插入通过所述基板中的其相应的孔，即偏置锁定就位。
6.如权利要求1所述的系统，其中所述第一凸片和所述第二凸片定向为导致湍流气流。
7.如权利要求1所述的系统，其中多个第一凸片以相对于彼此的两个或更多个不同的角度被附接到所述第一表面，以在不同的方向上导向所述气流经过所述电子组装件。
8.如权利要求1所述的系统，其中所述至少一个第一凸片设置为实质上垂直于所述第一表面，且所述至少一个第二凸片设置为实质上垂直于所述第二表面。
9.如权利要求1所述的系统，还包含多个设置为彼此相邻且平行的电子组装件。
10.如权利要求1所述的系统，其中所述至少一个电子器件包含多个集成电路存储器装置。
11.如权利要求1所述的系统，其中所述至少一个电子器件包括多个电子器件，所述多个电子器件被联接到所述基板的第一表面和第二表面中的每一个。
12.如权利要求1所述的系统，其中所述至少一个电子器件包括多个电子器件，所述多个电子器件被设置在所述第一表面和所述第二表面之间。
13.如权利要求1所述的系统，还包括气流的源。
14.如权利要求1所述的系统，其中所述第一凸片是L形、T形，或I形。
15.如权利要求1所述的系统，其中所述第一凸片的角度可调整。
16.如权利要求15所述的系统，其中，通过相对于所述基板旋转所述凸片并将所述凸片的销插入形成在所述基板中的相对应的孔中以调整所述角度。
17.如权利要求15所述的系统，其中所述凸片包含可旋转地联接到基部部分的凸片部分，其中所述基部部分被附接到所述基板，且通过相对于所述基部部分和所述基板旋转所述凸片部分以调整所述凸片部分的角度。
18.一种用于重定向经过基板的气流的系统：
基板，具有相反的第一侧面和第二侧面，且包含联接至所述第一侧面的至少第一电子器件和联接至所述第二侧面的至少第二电子器件；以及
多个凸片，附接到所述基板的第一侧面和第二侧面，其中当所述基板接收气流时，所述多个凸片重定向经过所述第一电子器件和所述第二电子器件的气流，所述多个凸片包括第一凸片，其直接位于所述气流的源和所述第一电子器件之间且相对于所述气流成角度，以引导经过所述基板的第一侧面和所述第一电子器件的气流。
19.如权利要求18所述的系统，其中所述多个凸片包括第二凸片，其直接设置在所述气流的源和所述第二电子器件之间，以引导经过所述第二电子器件的气流。
20.如权利要求19所述的系统，其中所述第一凸片相对于所述气流的入射的角度是可调整的。
21.如权利要求20所述的系统，其中通过相对于所述基板旋转所述至少一个第一凸片并将所述至少一个第一凸片的销插入形成在所述基板中的相对应的孔中以调整所述角度。
22.如权利要求20所述的系统，其中所述至少一个第一凸片包含可旋转地联接到基部部分的凸片部分，其中所述基部部分被附接到所述基板，且通过相对于所述基部部分和所述基板旋转所述凸片部分以调整所述凸片部分的角度。
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