CN201655782U - 表贴散热器 - Google Patents
表贴散热器 Download PDFInfo
- Publication number
- CN201655782U CN201655782U CN2010201156832U CN201020115683U CN201655782U CN 201655782 U CN201655782 U CN 201655782U CN 2010201156832 U CN2010201156832 U CN 2010201156832U CN 201020115683 U CN201020115683 U CN 201020115683U CN 201655782 U CN201655782 U CN 201655782U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- surface mount
- heat dissipation
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims 6
- 238000005452 bending Methods 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000005538 encapsulation Methods 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 description 51
- 238000001816 cooling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201156832U CN201655782U (zh) | 2010-02-08 | 2010-02-08 | 表贴散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201156832U CN201655782U (zh) | 2010-02-08 | 2010-02-08 | 表贴散热器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201655782U true CN201655782U (zh) | 2010-11-24 |
Family
ID=43121026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201156832U Expired - Lifetime CN201655782U (zh) | 2010-02-08 | 2010-02-08 | 表贴散热器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201655782U (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014204982A2 (en) * | 2013-06-19 | 2014-12-24 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US9158349B2 (en) | 2013-10-04 | 2015-10-13 | Sandisk Enterprise Ip Llc | System and method for heat dissipation |
US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
US9898056B2 (en) | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US12225694B2 (en) | 2021-09-16 | 2025-02-11 | Delta Electronics (Shanghai) Co., Ltd. | Surface-mounted heat sink and power module using same |
-
2010
- 2010-02-08 CN CN2010201156832U patent/CN201655782U/zh not_active Expired - Lifetime
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
WO2014204982A2 (en) * | 2013-06-19 | 2014-12-24 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
WO2014204982A3 (en) * | 2013-06-19 | 2015-02-26 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US9313874B2 (en) | 2013-06-19 | 2016-04-12 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9898056B2 (en) | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9158349B2 (en) | 2013-10-04 | 2015-10-13 | Sandisk Enterprise Ip Llc | System and method for heat dissipation |
US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9848512B2 (en) | 2014-02-27 | 2017-12-19 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
US12225694B2 (en) | 2021-09-16 | 2025-02-11 | Delta Electronics (Shanghai) Co., Ltd. | Surface-mounted heat sink and power module using same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YADA POWER SUPPLY PRODUCTS (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: AIMOSHENG NETWORK ENERGY SOURCE CO LTD Effective date: 20140904 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 518101 SHENZHEN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140904 Address after: 518101 Guangdong city of Shenzhen province Baoan District Xin'an road two North 68 Street office Honglang District Industrial Park plant Patentee after: Astec power supply (Shenzhen) Co., Ltd. Address before: 518057 Nanshan District science and Technology Industrial Park, Guangdong, Shenzhen Branch Road, No. Patentee before: Aimosheng Network Energy Source Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20101124 |
|
CX01 | Expiry of patent term |