CN105705336A - 以低轮廓封装体封装键合线的方法 - Google Patents

以低轮廓封装体封装键合线的方法 Download PDF

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CN105705336A
CN105705336A CN201380080529.2A CN201380080529A CN105705336A CN 105705336 A CN105705336 A CN 105705336A CN 201380080529 A CN201380080529 A CN 201380080529A CN 105705336 A CN105705336 A CN 105705336A
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packaging body
bonding line
frustum
shaped bodies
wafer
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CN105705336B (zh
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陈健华
M·W·库姆比
张竹青
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
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    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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Abstract

以低轮廓封装体封装键合线的方法包括：将封装体施加在键合线之上，该键合线在第一端连接至晶片并且在第二端连接至电路元件；和将所述封装体的形状截头，以形成截头形体。

Description

以低轮廓封装体封装键合线的方法
背景技术
线键合包括在线的任一端形成键合，通常一个端部附接到基板并且另一端部附接到电路板。键合可以是楔形键合，其中线利用力和/或超声波能量直接键合到电路板或基板。球键合，楔形键合的替换方式，包括形成导电球和将该球电连接到线的端部以及电连接到基板或电路板。在形成电连接之后，线及其连接部利用陶瓷、塑料或环氧树脂进行封装以防止实体损坏或腐蚀。
附图说明
附图示出了本文描述的原理的各种实例并且是说明书的一部分。所示出的实例仅仅是示例性的，不用来限制权利要求的范围。
图1是如下装置的实例的示图，该装置具有根据本文描述的原理覆盖键合线的低轮廓封装体。
图2是根据本文描述的原理制造具有低轮廓封装体的装置的各阶段的实例的示图。
图3是根据本文描述的原理具有覆盖键合线的低轮廓封装体的装置的实例的示图。
图4是用于根据本文描述的原理利用低轮廓封装体封装键合线的方法的实例的示图。
具体实施方式
热喷墨印刷机利用包含喷墨喷嘴的晶片(die)与印刷电路板之间的键合线。许多形式的热喷墨产品的晶片尺寸足够大使得封装体珠容易远离第一喷嘴放置以避免对印刷头的保养有任何大的影响。然而，为了使产品具有更紧密的空间，薄膜封装体工艺已被使用，该工艺以降低封装体高度的方式分配粘性封装体。虽然这种薄膜封装体工艺不减小总的封装体高度，但工艺较复杂、对粘合剂图案敏感、在印刷头保养期间易于剥离，并且往往在封装体薄膜下方藏着滞留的空气。
本文描述的原理包括如下装置，其允许封装体靠近印刷头的喷嘴，而无上述伴随薄膜封装体工艺的缺陷。该装置能够包括键合线，该键合线在其第一端连接至晶片和在其第二端连接至电路元件。封装体材料被设置在键合线之上，在此处封装体具有截头形体。当封装体材料被初始沉积时，封装体材料呈由封装体材料的表面张力以及其它固有特性确定的形状。为了以这种方式在封装体的基部沉积足够的封装体材料量，封装体材料的总高度将较高而足以干扰对印刷头的保养。例如，当擦拭印刷头的表面时，墨和碎屑会捕获在封装体材料上。保持封装体材料的高度较低通常会避免上述问题。为了保持封装体材料的总高度较低，诸如高度在一百微米以下，由封装体材料的表面张力形成的形状被截头。这种截头能够以如下方式进行，即通过利用冲压机压缩封装体材料、磨削掉封装体材料的顶部部分、允许封装体材料的一部分在与被封装的表面隔开预定间隙的引导件下方通过毛细作用被吸引、其它程序、或其组合。
在下面的说明中，出于解释的目的，提出了许多具体的细节，以便全面理解本系统和方法。然而，对于本领域技术人员明显的是，在没有这些具体细节的情况下可以实施本装置、系统和方法。说明书中提到的“实例”或类似用语是指所描述的具体特征、结构或特性被包括在至少一个实例中，而并非必然地包含在其它实例中。
图1是装置(100)的实例的示图，该装置具有根据本文描述的原理覆盖键合线(104)的低轮廓封装体(102)。在该实例中，化合物(106)支撑晶片(108)，该晶片具有形成于其中的墨流体路径(110)。晶片(108)覆盖有聚合物层(112)。键合线(104)在第一端(114)键合到晶片(108)并且在第二端(118)键合到印刷电路板(116)。封装体(102)覆盖键合线(104)。
化合物(106)可以由任何适当类型的材料制成。在一些实例中，化合物(106)是环氧模制化合物。可以针对适合支撑晶片(108)以及喷墨应用的特性来选择化合物(106)。
晶片(108)可以是半导体材料的块件。在一些实例中，功能性电路被制作在晶片(108)上。通常，集成电路通过平板印刷工艺，诸如照相平板印刷以大批方式制造在电子级硅的单一晶圆或其它半导体材料上。晶圆可以切割成多个片体，每一个含有电路的一个复制体。这些片体的每一个可以称为晶片。在图1的实例中，晶片(108)还包括用于喷墨喷嘴的开口。在一些实例中，开口被成形为形成喷嘴。在其它实例中，开口被成形为接纳喷嘴。
任何适当类型的半导体材料可以用来构成晶片(108)。例如，硅可以用作晶片材料。然而，在其它实例中，类似于银的金属也可以包含到晶片(108)中。
印刷电路板(116)可以包括与晶片(108)中的集成电路的一些部分通信的电路元件。这些电路元件和通信可以指示喷墨印刷头何时发射。键合线(104)将电路元件桥接在电绝缘化合物(106)上，从而允许要通信的信号从场外位置发射到印刷头。
键合线(104)可以以任何适当类型的键合技术键合至晶片(108)或印刷电路板(116)上。例如，键合可以采用楔形键合、球键合、其它类型的键合、或其组合来形成。线(104)还可以包括任何适当类型的形状、长度、或几何形状。例如，线(104)可以具有15微米至数百微米的直径。
此外，线(104)可以由任何适当类型的材料制成。例如，线(104)可以由金、铝、铜、镍、银、其它类型的材料、或其组合制成。此外，线(104)可以为单一材料或多种材料，诸如具有至少一种不同类型的材料的涂层的线。
铜可以用于尺寸范围至75微米的细线球键合。铜线具有在较小直径下使用的能力同时提供与金类似的性能，而不需要高的材料成本。上至250微米的铜线能够以正确的设置参数被成功地楔形键合。大直径的铜线能够代替铝线，在铝线中高电流承载能力被使用或其中具有复杂几何形状的问题。制造者使用的退火和程序工作增强了使用大直径铜线来楔形键合至硅而不损坏晶片的能力。
掺杂有控制量的铍和/或其它成分的金能够被用于球键合。该工艺使用热、压力和超声波能量使要键合的两种材料键合到一起。连接尺寸、键合强度和传导性参数通常决定最适合用于特定金线键合应用的线尺寸。
可以根据本文描述的原理使用任何适当类型的封装体(102)。例如，封装体(102)可以由陶瓷、塑料、环氧树脂、热固性聚合物、硅、聚氨基甲酸脂、其它类型的材料、或其组合制成。封装体(102)能够用来防止实体损坏、腐蚀、湿气污染、或其它不期望的情形影响键合线、印刷电路板(116)、晶片(108)的部分、其它电子元件、或其组合。
可以诸如利用针分配机构、喷射分配机构、喷洒涂布机构、粘合剂冲压机构、另一类型的机构、或其组合通过灌注液体树脂到期望区域直到该区域覆盖有液体树脂来将封装体材料施加至印刷机的期望区域。在缺少主动式成形机构的情况下，封装体材料将形成由封装体材料的表面张力、流变性、粘度和其它特性决定的形状。
在一些实例中，当液体树脂施加至期望区域时封装体材料被主动成形。例如，当液体树脂被施加时引导件可以在期望区域的一部分上方以预定间隙间隔开。引导件可以具有通过毛细作用使液体树脂被汲取在引导件的下侧的特性。因此，引导件将液体树脂引导到要封装的区域上。预定间隙限制封装体的轮廓的高度。在一些实例中，封装体的高度小于一百微米。在该实例中，预定间隙也小于一百微米。引导件的下侧能够迫使封装体材料具有高冒式轮廓。在该实例中，引导件下侧的几何形状产生了封装体材料形状的顶部的几何形状。因此，如果引导件的下侧具有平坦形状，则封装体的顶部表面也将是平坦的。
在其它实例中，液体树脂被允许基于液体树脂的表面张力和其它固有特性来形成其形状。在该实例中，液体树脂能够用冲压机或其它装置加以压缩。因此，封装体将形成反映冲压机下侧的几何形状的轮廓。在这些实例中，封装体将产生截头形体。
引导件和/或冲压机可以被加热，以降低封装体的粘度，允许封装体更自由地流动，和加速封装体材料的固化。当引导件或冲压机被移除时，封装体材料被允许冷却并且其粘度增大，从而形成固化形体。在使用冲压机的一些实例中，封装体可以在冲压机被施加之前已固化。在这些实例中，加热的冲压机可以提供足够的能量来软化封装体材料，以便在冲压机与封装体接触时封装体材料足以流动和/或在冲压机施加的压力下压缩。在冲压机移除之后，封装体材料冷却并因此再次固化。
在其它实例中，可以通过适当机构形成封装体的截头形体。例如，可以通过去除封装体的顶部部分来形成截头形体。该部分可以通过磨削、切片、破裂方式来去除，或以其它方式将顶部部分分解以去除。
可以根据本文描述的原理使用任何适当类型的截头形体。尽管上述实例特别地提到封装体材料的平坦表面，但截头形体也可以包括由形成截头形体的机构产生的特征。例如，截头形体可以包括朝向晶片(108)倾斜的平坦表面。因此，擦拭器、工具、保养晶片(108)的个人的双手等等能够触及晶片(108)而不受封装体晶片侧的封装体的高度的干扰。在该实例中，封装体的印刷电路板侧因此可以高于晶片侧。该实例仍允许触及晶片(108)，但是提供了更多的封装体覆盖印刷电路板(116)，这可以得益于附加的封装体。
图2是根据本文描述的原理制造具有低轮廓封装体的装置的各阶段的实例的示图。在该实例中，制造的第一阶段(200)包含在覆盖晶片(206)的聚合物覆盖层(204)中形成间隙(202)。这些间隙(202)形成在晶片(206)上的需要晶片(206)和键合线(208)电接触的位置。在该阶段期间，印刷电路板(210)上的该位置也被制备来接纳键合线(208)的端部。
在第二阶段(212)期间，线(208)被键合到晶片(206)和印刷电路板(210)。任何适当类型的键合可以用来将晶片(206)和印刷电路板(210)电连接至线(208)。例如，键合可以是楔形键合、球键合、另一类型的键合、或其组合。键合线(208)和晶片(206)之间的键合在形成于聚合物覆盖层(204)中的间隙(202)中进行。
在第三阶段(214)，液体树脂(216)被施加到键合线(208)上。当液体树脂(216)固化时，液体树脂(216)形成固化形体(218)作为封装体(220)。固化形体(218)基于液体树脂的表面张力、温度、流变性特性、粘度、其它固有特性、和其组合而形成。为了沿键合线(208)的长度(222)提供足够的封装体(220)，封装体的固化形体(218)的高度(224)足够高，以致封装体(220)可能干扰对印刷头的保养。例如，封装体(220)的高度(224)可能干扰擦拭动作或干扰允许工具触及晶片(206)。
在第四阶段(225)，封装体的截头形体(226)被形成。在该实例中，冲压机(228)在固化形体(218)上按压以形成截头形体(226)。冲压机(228)可以包括涂层(230)，该涂层防止封装体(220)与冲压机(228)粘合。涂层(230)可以是任何适当类型的涂层。例如，该涂层可以是塑料、聚对苯二甲酸乙二醇酯、聚四氟乙烯、另一类型的材料、或其组合。
此外，在冲压机(228)正在压缩封装体(220)时冲压机(228)可以被加热以降低封装体的粘度。因此，封装体(220)将具有截头形体(226)。
截头形体(226)可以具有保留固化形体(218)和截头部分(232)的一部分。在图2的实例中，固化形体(218)被保持接近封装体(220)的基部(234)，并且截头部分(232)是平坦的那部分。在该实例中，截头形体(226)具有高冒式轮廓。尽管已特别参考平坦表面描述了该实例，但在其它实例中，截头形体具有允许触及晶片(206)的带坡度的、倾斜的、弯曲的、或其它类型的表面。
在一些实例中，封装体(220)从其基部(诸如封装体(220)接触化合物(236)的位置)到截头部分(232)的截头高度(235)小于一百微米。在一些实例中，截头高度在二十五微米与一百微米之间。在该实例中，冲压机(228)被移至距化合物(236)适当距离内。冲压机(228)可以被瞬间移至截头高度(235)或冲压机(228)可以在预定时段被移至截头高度(235)以允许热从冲压机(228)传递至封装体(220)或允许封装体(220)利用冲压机(228)施加的增加的压力量流动。
图3是根据本文描述的原理具有覆盖键合线(304)的低轮廓封装体(302)的装置(300)的实例的示图。在该实例中，液体树脂(306)从施加器(308)被施加到期望封装体(302)的区域。引导件(310)被定位在邻近液体树脂(306)被施加的区域。引导件(310)足够靠近已施加的液体树脂(306)使得液体树脂(306)被吸引到引导件(310)的下侧(312)并且沿下侧(312)的长度通过毛细作用被吸引。
可以根据本文描述的原理使用任何适当类型的施加器(308)。例如，施加器(308)可以是针式施加器、下落式施加器、喷射式施加器、喷洒式施加器、另一类型的施加器、或其组合。
引导件(310)被定位成在装置(300)和引导件(310)的下侧(312)之间形成等于针对封装体的形状的期望截头高度的间隙(314)。由于的引导件(310)和液体树脂(306)的毛细特性，液体树脂(306)被汲取到间隙(314)中和填充间隙(314)。
可以根据本文描述的原理以任何适当的方式形成间隙(314)。例如，间隔件可以包含到引导件(310)的下侧(312)中以确保间隙(314)是正确的。该间隔件可以包括当液体树脂(306)被施加至期望区域时用于使液体树脂(306)环绕该间隔件通过的机构。在其它实例中，计算机实现的机构可以使用距离传感器来确定引导件(310)的下侧(312)和装置(300)的顶部表面之间的距离。该距离传感器可以使用声音的传输、光波的传输、机械式探针、另一机构、或其组合。在一些实例中，距离传感器被直接包含到引导件(310)或冲压机(228，图2)中。
当液体树脂填充引导件(310)下方的空间时，引导件(310)能够是不动的或能够沿键合线(304)的长度与施加器(308)一起移动。因此，间隙(314)沿键合线的长度逐步移动并且附加的液体树脂(306)填充新的空间。因此，液体树脂沿键合线(304)的长度固化。所获得的形状是截头的，这是因为引导件(310)导致该形状具有平坦顶部，在没有与引导件(310)主动相互作用的情况下将不会形成该平坦顶部。引导件(310)，类似于冲压机(228，图2)，可以具有防止液体树脂(306)附接到引导件(310)上的涂层(316)。
液体树脂(306)可以固化在适当位置，同时引导件(310)仍形成间隙(314)。在一些实例中，液体树脂(306)在引导件(310)去除之前被部分固化。当液体树脂(306)被允许用空气冷却时可以进行固化处理。在其它实例中，固化处理通过主动冷却液体树脂(306)成封装体而加速。
在一些实例中，封装体通过暴露于某些紫外光波长被固化在适当位置。光的这些波长可以通过引导件(310)、冲压机(228，图2)、另一类型的工具、或其组合被引导至封装体。
虽然已经参考通过冲压和使用引导件形成截头形体而描述了这些实例，但是可以使用用于形成截头形体的任何适当机构。例如，可以通过磨削、装叶片、切片，或除此之外使用另一类型的工具来成形截头而形成截头形体。
图4是用于根据本文描述的原理利用低轮廓封装体封装键合线的方法(400)的实例的示图。在该实例中，方法(400)包括施加(步骤402)封装体在键合线上，该键合线在第一端连接至晶片并且在第二端连接至电路元件以及将封装体的形状截头(步骤404)以形成截头形体。
在一些实例中，通过压缩机构形成截头形体。例如，冲压机能够用来使封装体的表面变平或缩短封装体的高度。在其它实例中，其它装置能够用来使顶部变平和降低封装体的高度。在一些实例中，经压缩的封装体材料可以具有比其它封装体材料高的密度，其它封装体材料被允许保持其通过封装体材料的表面张力和其它特性确定的形状。压缩可以提供从封装体去除气泡的实例。此外，压缩可以帮助在晶片、键合线、印刷电路板、或装置与封装体的其它表面区域之间形成较强的结合。因此，封装体可以较不易于分层。
在一些实例中，通过允许封装体在引导件下方利用毛细作用被吸引而同时沉积封装体和沿键合线的长度移动引导件，该形状被截头。在另外的其它实例中，截头形体通过磨削或以其它方式去除封装体的一部分来形成。
用来形成封装体材料的液体树脂的温度可以在封装处理期间受到控制。可以使用一种机构来使液体树脂具有足够高的温度，从而在施加工艺、压缩工艺、磨削工艺、或用于形成截头形体的其它工艺期间容易流动。同样，当液体树脂被形成期望的截头形体时，液体树脂可以被主动地冷却来使封装体保持期望形状。主动式冷却可以通过使用冷却冲压机或引导件的风扇，或将冷却封装体的其它机构来进行。
本文描述的原理的优点在于冲压、引导、装叶片、磨削、或以其它方式形成截头形体的工艺与通过薄膜沉积技术形成低轮廓封装体相比较相对便宜。此外，本文描述原理可以包括用于在液体树脂被施加时形成截头形体的单一工艺。在其它实例中，本文描述的原理可以包括多个工艺，诸如第一沉积封装体，允许封装体形成封装体基于其固有特性而固有的任何形状，和将该自然形状截头。
此外，本文描述的原理允许封装体靠近印刷头和/或喷嘴。该优点允许印刷机中的电子元件(或印刷机自身)制作得更小。因此，印刷机能够更便宜和更小型化。
虽然已经参考特定类型的装置描述了本文描述的原理，但是本文描述的原理能够适用于任何适当类型的装置。例如，本文描述的原理可以适用于印刷机、微电子元件、其它类型的装置、或其组合。
在前的说明仅仅被提出用以图解和描述已描述的原理的实例。该说明并不意欲是详尽的或将这些原理限制到任何已公开的明确形式。根据以上教导可以作出许多变型和修改。

Claims (15)

1.一种用低轮廓封装体封装键合线的装置，所述装置包括：
键合线，其在第一端连接至晶片并且在第二端连接至电路元件；和
封装体材料，其设置在所述键合线之上；
其中所述封装体具有截头形体。
2.根据权利要求1所述的装置，其中在所述封装体包括由所述封装体的表面张力确定的沉积形体时所述截头形体通过压缩所述封装体来形成。
3.根据权利要求1所述的装置，其中所述截头形体通过沿引导件的下侧利用毛细作用吸引所述封装体来形成。
4.根据权利要求1所述的装置，其中在所述封装体包括由所述封装体的表面张力确定的沉积形体时所述截头形体通过去除所述封装体的一部分来形成。
5.根据权利要求1所述的装置，其中所述晶片包括喷墨喷嘴。
6.根据权利要求1所述的装置，其中所述封装体的高度小于一百微米。
7.根据权利要求1所述的装置，其中所述键合线被包含到印刷头中。
8.根据权利要求1所述的装置，其中所述截头形体包括高冒式轮廓。
9.一种用于以低轮廓封装体封装键合线的方法，包括：
将封装体施加在键合线之上，该键合线在第一端连接至晶片并且在第二端连接至电路元件；和
将所述封装体的形状截头，以形成截头形体。
10.根据权利要求9所述的方法，其中将所述形状截头包括利用冲压机压缩所述封装体。
11.根据权利要求10所述的方法，其中利用冲压机压缩所述封装体包括主动地加热所述冲压机同时压缩所述封装体。
12.根据权利要求9所述的方法，其中将所述形状截头包括磨削掉所述封装体的一部分。
13.根据权利要求9所述的方法，其中将所述形状截头包括允许所述封装体在引导件下方利用毛细作用被吸引。
14.根据权利要求9所述的方法，其中将所述形状截头包括允许所述封装体在引导件下方利用毛细作用被吸引，与此同时沉积所述封装体和沿所述键合线的长度移动所述引导件。
15.一种印刷机，用于以低轮廓封装体封装键合线，所述印刷机包括：
键合线，所述键合线的第一端连接至包括喷墨喷嘴的晶片，所述键合线的第二端连接至电路元件；和
封装体材料，其设置在所述键合线之上；
其中所述封装体具有截头形体，所述截头形体具有高度小于一百微米的轮廓。
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