CN105659381A - 具有引线键合的多管芯堆叠的集成电路封装 - Google Patents

具有引线键合的多管芯堆叠的集成电路封装 Download PDF

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Publication number
CN105659381A
CN105659381A CN201480010681.8A CN201480010681A CN105659381A CN 105659381 A CN105659381 A CN 105659381A CN 201480010681 A CN201480010681 A CN 201480010681A CN 105659381 A CN105659381 A CN 105659381A
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China
Prior art keywords
tube core
encapsulated layer
level interconnection
die
route characteristics
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CN201480010681.8A
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English (en)
Inventor
T·迈耶
P·耶尔维能
R·帕藤
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Intel Corp
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Intel Corp
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Application filed by Intel Corp filed Critical Intel Corp
Priority to CN201810827595.6A priority Critical patent/CN108807200A/zh
Publication of CN105659381A publication Critical patent/CN105659381A/zh
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Abstract

本公开的实施例针对集成电路(IC)封装，包括至少部分内嵌于第一包封层中的第一管芯和至少部分内嵌于第二包封层的第二管芯。第一管芯可具有被置于第一包封层的第一侧边的多个第一管芯级互连结构。IC封装还可包括至少部分内嵌于第一包封层中，并被配置以在第一包封层的第一和第二侧边之间路由电气信号的多个电气路由特征。第二侧边可被置于第一侧边的对面。第二管芯可具有可与多个电气路由特征中的至少子集通过键合引线电气耦合的多个第二管芯级互连结构。

Description

具有引线键合的多管芯堆叠的集成电路封装
领域
本公开的实施例大致涉及集成电路领域，更具体而言，涉及具有引线键合的多管芯堆叠的集成电路封装。
背景
诸如处理器之类的管芯的输入/输出密度不断增加，而管芯的尺寸不断缩小。在多管芯封装中的管芯之间提供更短的互连距离，并且维持多管芯封装较小的形状因数，可以是可取的，但从技术中的这些进展来看是具有挑战性的。
本文给出的背景描述是为了大致展示本公开的情境。除非本文另有说明，在本节中描述的材料对于本申请中的权利要求而言并不是现有技术，且并不由于包含于本节中而被承认为是现有技术。
附图说明
通过以下结合附图的详细说明将很容易理解实施例。为了方便描述，相同的参考数字表示相同的结构元素。以示例的方式，而不是以受限于附图的图形的方式示出实施例。除非明确说明，否则这些附图并非按比例绘制。
图1示意性地示出了根据一些实施例的包括具有引线键合的多管芯堆叠的集成电路封装的示例集成电路(IC)组件的侧面剖视图。
图2是根据本公开一些实施例的集成电路封装制造过程示意性的流程图。
图3-4是根据本公开的一些实施例描绘了图2中描述的集成电路封装制造过程中具体步骤的指定操作的示意性剖面侧视图。
图5示意性地示出了根据本公开不同实施例的具有封装级互连结构的示例集成电路(IC)组件的剖面侧视图。
图6示意性地示出了根据本公开不同实施例的具有封装级互连结构和置于重分布层(RDL)上的第三管芯的示例集成电路(IC)组件的剖面侧视图。
图7示意性地示出了根据本公开不同实施例的具有额外的堆叠和引线键合的管芯的示例集成电路(IC)组件的剖面侧视图。
图8示意性地示出了根据本公开的一些实施例的一种包括集成电路封装的计算设备。
详细说明
本公开的实施例描述了具有引线键合的多管芯堆叠的集成电路(IC)封装配置。在以下的描述中，示意性实现方式中的各个方面采用本领域技术人员通常使用的术语进行描述，以向其他领域技术人员传达其工作的实质。然而，对于本领域的技术人员而言，本公开的实施例显然可以只用所述的某些方面进行实施。出于解释的目的，为了提供示意性实现方式的透彻理解，给出了具体的数字、材料和配置。然而，对于本领域的技术人员而言，本公开中的实施例显然无需具体细节亦可实施。在其他示例中，为了不模糊示意性实现方式，众所周知的特征被忽略或简化。
在以下的详细说明中，对于附图的引用构成详细说明的一部分，其中相同的数字始终表示相同的部分，且其中是以本公开的主题可被实施的示例实施例的方式示出。需要了解的是，在不背离本公开的范围的情况下，可运用其他实施例，且可做出结构性或逻辑性的改变。因此，以下详细说明不应被认为具有限制意义，并且实施例的范围由所附的权利要求及其等效项所界定。
对于本公开的目的，短语“A和/或B”是指(A)，(B)，或(A和B)。对于本公开的目的，短语“A，B，和/或C”是指(A)，(B)，(C)，(A和B)，(A和C)，(B和C)，或(A，B和C)。
描述可采用基于透视法的描述，如顶/底，内/外，上/下，等等。这些描述仅仅用来方便讨论，并不旨在将本文描述的实施例的应用限制在任何特定的方向。
描述可采用短语“在一实施例中，”或“在实施例中，”，其可分别涉及相同或不同的实施例中的一个或多个。此外，关于本公开中的实施例所采用的术语“包括(comprising)”、“包含(including)”、“具有(having)”等都是同义词。
术语“与……耦合(coupledwith)，”连同其衍生项可被用于本文。“耦合(coupled)”可有以下的一个或多个含义。“耦合(coupled)”可表示两个或多个元素直接的物理或电气接触。然而，“耦合(coupled)”也可表示两个或多个元素间接地彼此接触，但仍然彼此协作或相互作用，且还可表示一个或多个其他元素被耦合在或连接在被称为彼此耦合的元素之间。术语“直接耦合(directlycoupled)”可表示两个或多个元素直接接触。
在各种实施例中，短语“形成，沉积，或以其他方式置于第二特征之上的第一特征，”可表示第一特征形成，沉积，或置于第二特征之上，且第一特征的至少一部分可与第二特征的至少一部分直接接触(例如，直接的物理和/或电气接触)或间接接触(例如，有一个或多个在第一特征和第二特征之间的其他特征)。
如本文中所使用，术语“模块”可指以下项，可是以下项的部分，或可包括以下项：专用集成电路(ASIC)、电子电路、片上系统(SoC)、执行一个或多个软件或固件程序的处理器(共享的，专用的，或群组的)和/或存储器(共享的，专用的，或群组的)、组合逻辑电路、和/或其他提供所述功能的适合元件。
图1示意性地示出根据本公开的实施例的包括与电路板116电气和物理耦合的IC封装102的集成电路(IC)组件实例的侧面剖视图。在实施例中，IC封装102可包括一个或多个管芯(例如，第一管芯106)。第一管芯106可至少被部分嵌入于第一包封层104中。第一管芯106可包括可被置于第一包封层104的第一侧边的多个管芯级互连结构(例如，管芯级互连结构108)。
IC封装102还可包括至少部分被嵌入于第一包封层104中的多个电气路由特征(例如，电气路由特征110)。如可见，多个电气路由特征可被配置以在第一包封层104的第二侧边和被置于第二侧边对面的第一电介质层104的第一侧边之间路由电气信号。在一些实施例中，电气路由特征，如所述，可以是形成于电气绝缘材料(例如，电气绝缘材料118)中的过孔条。该电气绝缘材料可包括硅、陶瓷、聚合物，或其他任何适合的材料并可被填充或不填充(例如，采用二氧化硅填充物，或其他适合的填充物)。
IC封装102还可包括被置于第一包封层104的第二侧边上且至少部分被内嵌于第二包封层120中的第二管芯122。第二管芯122还可具有多个第二管芯级互连结构(例如，管芯级互连结构124)。多个第二管芯级互连结构可通过键合引线(例如，键合引线126)的方式与电气路由特征电气地耦合。
在一些实施例中，IC封装102可具有重分布层112。重分布层112可被配置以通过电气路由特征的方式将管芯106和管芯122与一个或多个封装级互连结构(例如，焊球114)电气地耦合。封装级互连结构可被配置以将IC封装102与电路板116电气及物理地耦合。IC封装102可根据各种适合的配置，包括弹性体配置或任何其他适合的配置，与电路板116耦合。虽然在此被描述为焊球114，封装级互连结构可包括焊柱，或其他合适的结构替代，或附加于可将IC封装102通过被置于电路板116中的一个或多个焊盘(例如，焊盘128)与电路板116电气耦合的焊球114。IC封装102可代表由半导体材料制成的分立的芯片，且在一些实施例中，其可以是以下项，包括以下项，或是以下项的部分：处理器，存储器，或ASIC。在一些实施例中，IC封装102可以是嵌入式晶片级球栅阵列(eWLB)封装。
电路板116可包括被配置以路由去往或来自IC封装102的电气信号的电气路由特征。电气路由特征可包括，例如，被置于电路板的一个或多个表面的路径和/或内部路由特征，例如，举例而言，沟槽、过孔或其他通过其路由电气信号的互连结构。
电路板116可以是由电气绝缘材料，如环氧树脂层压板，所构成的印刷电路板(PCB)。例如，电路板116可包括用环氧树脂预浸材料层压在一起的电绝缘层，该电绝缘层由多种材料构成，诸如，举例来说，聚四氟乙烯、例如阻燃剂4(FR-4)的酚醛棉纸材料、FR-1、棉纸及例如CEM-1或CEM-3的环氧材料、或玻璃织物材料。在其他实施例中，电路板116可由其他适合的材料构成。在一些实施例中，电路板116可以是主板(如图5中的主板802)。
图2是根据本公开各种实施例的示意性IC封装(例如，图1的IC封装102)的示意性集成电路(IC)封装制造过程200。根据一个示意性实施例，图3-4提供了指定操作的剖视图，解释了IC封装制造过程200中的步骤。因此，图2-4将被相互结合进行描述。为了帮助说明，图3和4中在操作间移动的箭头上引用了图2中进行的操作。另外，在图3和4中的每个操作中，并不是所有参考数字都会被描述，以努力使这些附图不被过分复杂化。
IC制造过程200可始于方框202，其中可将第一管芯302的有源侧与载体306耦合。这可通过使用被置于载体306上的胶带或粘合剂(例如，粘合剂308)来完成。如所示，管芯302的有源侧可具有被置于其中的多个管芯级互连结构(例如，管芯级互连结构304)。在一些实施例中，多个电气路由特征312a-312d，此后统称为电气路由特征312，也可与载体306耦合。在这些实施例中，多个电气路由特征，如所述，可以是过孔条，由形成于电气绝缘材料310a和310b的过孔构成。该电气绝缘材料科包括任何适合的材料，包括但不仅限于，硅、陶瓷、聚合物、玻璃等。电气路由特征，在一些实施例中，可具有置于电气路由特征312a-d的任一端处的多个键合焊盘314a-h。在一些实施例中，键合焊盘314a-d至少可具有置于其上可引线键合的表面处理层。该可引线键合的抛光表面可包括镍、金、或任何其他适合的材料或材料的组合。在另一些实施例中，电气路由特征可在形成第一包封层316之后，以下参考方框204进行讨论，作为独立的过程被形成。电气路由特征可包括任何导电材料(例如，铜)。
在方框204处，可沉积包封材料以形成第一包封层316。在一些实施例中，这样的包封材料可以是铸模复合物(例如，环氧树脂)。在这样的实施例中，第一包封层316可通过例如压模工艺形成。如所述，第一包封层316可包封至少第一管芯302和电气路由特征312的部分。
在一些实施例中，第一包封层316还可包封键合焊盘314a-d。在这些实施例中，在方框206处，可移除在键合焊盘314a-d上方形成的任何包封材料，而导致空隙318a-d。这可通过钻孔(例如，激光钻孔)、研磨、刻蚀等完成。在采用激光钻孔的实施例中，激光钻孔可降低或破坏被用于键合焊盘314a-d的可引线键合表面处理层。在这些实施例中，可在激光钻孔后应用该表面处理层(例如，镍、金，或任何其他适合的表面处理层)。例如，可通过化学镀应用该表面处理层。
在方框208处，可从第一包封层316分离载体306。在一些实施例中，可从此后所描述的过程中分开执行以上所讨论的过程。在这些实施例中，可通过提供类似于通过上述过程所产生的IC封装组件开始该过程。在这些实施例中，可将钝化层沉积于IC封装组件上以防止任何暴露的金属特征(例如键合焊盘314a-h和第一管芯302的多个管芯级互连)被氧化或污染。该钝化层，举例而言，可被层压、印刷、或旋涂。在该钝化层被应用的地方，对于以下所描述的过程，空隙可在钝化层(例如，通过光刻过程)中被形成。
在方框210处，可形成电介质层320。参照方框208，电介质层在一些实施例中，该电介质层可以是以上所讨论的钝化层。另外，重分布层(RDL)322可被形成于电介质层320上。RDL320可从管芯级互连(例如，管芯级互连304)和电气路由特征312提供信号外接。虽然在本文中被描述为单一的RDL，应当理解的是，可根据所得到的IC封装可能需要满足的应用和设计来形成额外的RDL及对应的电介质层。在方框212处，移至图4，阻焊层324可被形成或图案化。该阻焊层，例如，可通过光刻工艺被形成。
在方框214处，如可见，可将第二管芯326的背侧与第一包封层316的与RDL322相反的第二侧耦合。这可通过，例如，使用胶带或粘合剂(例如，粘合剂328)来完成。在实施例中，第二管芯326可具有多个管芯级互连330a-330d被置于其上。如本文中所使用的，管芯的背侧是不具有管芯级互连被置于其中的管芯的侧边。
在方框216处，第二管芯326的管芯级互连330a-330d可分别通过导线332a-332d与电气路由特征312被引线键合。电气路由特征312可在第二管芯326和RDL之间路由电气信号。导线332a-d可包括任何适合的材料，包括但不仅限于，铝、铜、银、金等，并且还可以是多层导线(例如，漆包线)。该引线键合可通过任何传统的引线键合工艺来形成。在一些实施例中，一个或多个额外的管芯可被堆叠于第二管芯326的顶上。在该实施例中，垫片可被置于每个管芯和前一管芯之间以允许消除导线(例如，导线322a-d)。以下，该实施例参照图7被进一步地详细讨论。在方框218处，可在第二管芯326和导线332a-d上方沉积额外的包封材料，以形成第二包封层334，以保护引线键合配置。图5-7描述了IC封装的各种实施例，其可从以上所描述的过程中被形成。
图5示意性地示出了根据本公开不同实施例的具有封装级互连结构的示例集成电路(IC)封装500的剖面侧视图。如所述，图5可作为其起始点，IC封装组件参照图2-4通过以上所述的过程进行生产。然而，在图5中，封装级互连(例如，焊球502)可被置于RDL上。虽然本文中被描述为焊球，但封装级互连结构可包括支柱，或作为焊球的替代或附加的其他适合的结构。这些封装级互连结构可被配置以将IC封装500与电路板(例如，图1的电路板116)电气地耦合。
图6示意性地示出了根据本公开不同实施例的具有封装级互连结构(例如，焊球606)和包含于其中的第三管芯602的示例集成电路(IC)封装600的剖面侧视图。如所述，图6可作为其起始点，参照图2-4通过以上所述的过程生产IC封装组件。然而，在图6中，封装级互连(例如，焊球606)被置于RDL上。另外第三管芯602与IC封装组件通过互连结构604耦合。虽然本文中被描述为焊球，封装级互连结构可包括支柱，或其他适合的结构替代，或附加于焊球。这些封装级互连可被配置以电气地耦合IC封装600和电路板(例如，图1的电路板116)。如可见，第三管芯602和互连结构604的组合厚度比单独的封装级互连结构的厚度更小。这可使得第三管芯602被置于与多个封装级互连结构相同的平面内。
图7示意性地示出了具有额外管芯702堆叠于管芯326顶上的示例集成电路(IC)封装700的剖面侧视图。如所述，IC封装700可包括第一管芯和至少部分被嵌入于第一包封层716中的多个电气路由特征(例如，电气路由特征712)。第一包封层716可以是，例如，铸模复合物。在一些实施例中，多个电气路由特征，如所述，可以是形成于电气绝缘材料710a和710b中的过孔条。该电气绝缘材料可包括任何适合的材料，包括但不仅限于，硅、陶瓷、聚合物等。电气路由特征，在一些实施例中，可具有被置于单独的电气路由特征的任一端处的多个键合焊盘(例如，焊盘714)。在一些实施例中，顶部键合焊盘(例如，焊盘714)可具有置于其上可引线键合的表面处理层。这样的可引线键合的抛光表面可包括镍、金、或任何其他适合的材料或材料的组合。电气路由特征可包括任何导电材料(例如，铜)。
IC封装700还可包括重分布层(RDL)722。RDL可被置于电介质层720上，并可从管芯级互连(例如，管芯级互连704)和多个电气路由特征(例如，电气路由特征712)提供信号外接。虽然在本文中被描述为单一的RDL，应当理解的是，可根据所得到的IC封装可能需要满足的应用和设计来形成额外的RDL及对应的电介质层。阻焊层724可被置于RDL上，并且多个封装级互连(例如，封装级互连744)可被置于阻焊层724的开口中。
IC封装700还可包括可与第一包封层716侧边耦合的第二管芯726。这可通过，例如，使用胶带或粘合剂(例如，粘合剂728)来完成。在实施例中，第二管芯726可具有多个管芯级互连(例如，管芯级互连730)被置于其上。第二管芯726的管芯级互连，如所示，可通过导线732a-732d，与电气路由特征的第一子集通过多个键合焊盘的对应子集引线键合。电气路由特征可在第二管芯726和RDL722之间路由电气信号。导线732a-d可包括任何适合的材料，包括但不仅限于，铝、铜、银、金等。该引线键合可通过任何传统的引线键合工艺来形成。在一些实施例中，一个或多个额外的管芯(例如，第三管芯736)可被堆叠于第二管芯726的顶上。在这些实施例中，垫片(例如，垫片740)可被置于相邻的管芯之间以允许从管芯下方引出导线(例如导线732a-d)。在实施例中，第三管芯726可具有多个管芯级互连(例如，管芯级互连742)被置于其上。第二管芯726的管芯级互连，如所示，可通过导线738a-738d，与电气路由特征的第二子集通过多个键合焊盘的对应第二子集引线键合。第二管芯726、第三管芯736和导线732a-d和738a-d都可被内嵌于第二包封层734中。在一些实施例中，第四管芯可与RDL722以和图6的管芯602相似的配置进行耦合。
本公开中的实施例可在使用任何适合的硬件和/或软件以完成所需配置的系统中实现。图8示意性地说明了包含本文所描述的，例如图1-8所描绘的IC封装的计算设备。计算设备800可容纳一个板，如主板802。主板802可包括数个元件，包括但不限于处理器804和至少一个通信芯片806。处理器804可物理及电气地耦合至主板802。在一些实现中，所述的至少一个通信芯片806也可物理及电气地耦合至主板802。在进一步的实现中，通信芯片806可以是处理器804的一部分。
根据其应用，计算设备800可包括其他元件，所述其他元件可以或可以不物理及电气地连接至主板802。这些其他元件可包括，但不限于，易失性存储器(如DRAM)、非易失性存储器(如ROM)、闪存、图形处理器、数字信号处理器、密码处理器、芯片组、天线、显示器、触摸屏显示器、触摸屏控制器、电池、音频编解码器、视频编解码器、功率放大器、全球定位系统(GPS)设备、指南针、盖革计数器、加速度计、陀螺仪、扬声器、摄像机以及大容量存储设备(如硬盘驱动器、光盘(CD)、数字多功能盘(DVD)等)。
通信芯片806可实现对于去往和来自计算设备800的数据传输的无线通信。术语“无线”及其衍生项可被用于描述可通过使用调制的电磁辐射经由非实体介质进行数据通信的电路、设备、系统、方法、技术、通信通道等。该术语并不表示相关设备不含有任何导线，尽管在一些实施例中，它们可能没有。通信芯片806可实现多种无线标准或协议中的任一种，包括但不限于诸种电气和电子工程师协会(IEEE)标准，其包括Wi-Fi(IEEE802.11系列)、IEEE802.16标准(如IEEE802.16-2005年修订版)、长期演进(LTE)项目以及任何修订、更新和/或修改(如先进LTE项目，超移动宽带(UMB)项目(又称“3GPP2”)等)。IEEE802.16兼容的BWA网络通常被称为WiMAX网络，即全球微波接入互通的缩写，这是一个通过了IEEE802.16标准一致性和互通性测试的产品认证标识。通信芯片806可依照全球移动通信系统(GSM)、通用分组无线业务(GPRS)、通用移动电信系统(UMTS)、高速分组接入(HSPA)、进化的HSPA(E-HSPA)或LTE网络进行操作。通信芯片806可依照GSM增强型数据演进(EDGE)、GSMEDGE无线接入网络(GERAN)、通用地面无线接入网络(UTRAN)、或演进型UTRAN(E-UTRAN)进行操作。通信芯片806可依照码分多址(CDMA)、时分多址(TDMA)、数字增强无绳电信(DECT)、演进数据最优化(EV-DO)，及其衍生项，以及其他任何标为3G、4G、5G等的无线协议进行操作。通信芯片806在其他实施例中可依照其他无线协议进行操作。
计算设备800可包括多个通信芯片806。例如，第一通信芯片806可专用于短距离无线通信，如Wi-Fi和蓝牙，而第二通信芯片806可专用于长距离无线通信，如GPS、EDGE、GPRS、CDMA、WiMAX、LTE、Ev-DO等。
计算设备800中的处理器804可以是包含在IC组件中的IC封装(如图1中的IC封装102)。例如，图1中的电路板116可以是主板802，而处理器804可以是本文中所述的IC封装102的管芯。处理器804和主板802可利用如本文中所描述的封装级互连耦合在一起。术语“处理器”可指任何设备或设备的一部分，其处理来自寄存器和/或存储器的电子数据以将该电子数据转换成其他可被储存在寄存器和/或存储器中的电子数据。
通信芯片806可以是包含在可包括封装基板的IC组件中的IC封装(如IC封装102)。在进一步的实现中，另一个包含于计算设备800中的元件(如存储器设备或其他集成电路设备)可以是包含在IC组件中的IC封装(如IC封装102)。
在不同的实现中，计算设备800可以是手提电脑、上网本、笔记本、超级本、智能手机、平板、个人数字助理(PDA)、超级移动PC、移动电话、台式电脑、服务器、打印机、扫描仪、监视器、机顶盒、娱乐控制单元、数码相机、便携式音乐播放器、或数字录像机。在进一步的实现中，计算设备800可以是任何其他处理数据的电子设备。
示例
根据不同的实施例，本公开描述了数个实例。示例1可包括集成电路(IC)封装，包括：第一管芯，所述第一管芯至少部分内嵌于第一包封层中，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构；多个电气路由特征，所述电气路由特征至少部分内嵌于所述第一包封层中，并被配置以在所述第一包封层的所述第一侧边和所述第一包封层的第二侧边之间路由电气信号，所述第二侧边设置在所述第一侧边的对面；以及第二管芯，所述第二管芯被置于所述第一包封层的所述第二侧边上，并且至少部分内嵌于第二包封层中，所述第二管芯具有多个第二管芯级互连结构，其中所述多个第二管芯级互连结构通过键合引线与所述多个电气路由特征的至少子集电气地耦合。
示例2可包括示例1的主题，还包括：被置于所述第一包封层的所述第一侧边上的一个或多个重分布层(RDL)，其中所述一个或多个RDL与所述第一管芯电气地耦合，并且其中所述一个或多个RDL通过所述多个电气路由特征与所述第二管芯电气地耦合。
示例3可包括示例2的主题，还包括被置于所述一个或多个RDL上的多个封装级互连结构。
示例4可包括示例2的主题，还包括第三管芯，所述第三管芯被置于所述一个或多个RDL上，并且具有与一个或多个RDL电气耦合的多个第三管芯级互连结构。
示例5可包括示例4的主题，还包括被置于所述一个或多个RDL上的多个封装级互连结构，其中所述第三管芯和所述多个第三管芯级互连结构的组合厚度小于所述多个封装级互连的所述单个封装级互连结构的厚度，以使在与所述多个封装级互连结构相同的平面上所述第三管芯的摆放成为可能。
示例6可包括示例1的主题，其中所述多个电气路由特征的所述子集是第一子集，所述IC封装还包括：第三管芯，所述第三管芯至少部分内嵌于所述第二包封层中，并且具有多个第三管芯级互连结构，通过键合引线，与所述多个电气路由特征的第二子集电气地耦合，其中所述第三管芯和所述第二管芯通过垫片被耦合在一起。
示例7可包括示例1-6中任一项的主题，其中所述多个电气路由特征包括过孔条。
示例8可包括示例1-6中任一项的主题，其中所述IC封装是嵌入式晶片级球栅阵列(eWLB)封装。
示例9可包括形成集成电路(IC)封装的方法包括：提供第一包封层，所述包封层具有第一管芯和至少部分内嵌于其中的多个电气路由特征，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构，其中所述电气路由特征将所述第一包封层的所述第一侧边与所述第一包封层的第二侧边电气地耦合，并且其中所述第一包封层的所述第一侧边设置在所述第一包封层的所述第二侧边对面；将第二管芯与所述第一包封层的第二侧边耦合，其中所述第二管芯包括多个第二管芯级互连结构；通过键合引线将多个第二管芯级互连结构与所述多个电气路由特征中的至少子集电气地耦合；以及在所述第二管芯和所述引线键合配置上方形成第二包封层以在所述第二包封层中封装所述第二管芯的至少部分和所述引线键合配置。
实例10可包括实例9中的主题，其中提供第一包封层包括：将所述第一管芯与载体耦合；将所述多个电气路由特征与所述载体耦合；以及将包封材料沉积于所述第一管芯和所述多个电气路由特征上方以形成所述第一包封层。
实例11可包括实例9中的主题，其中提供第一包封层包括：将所述第一管芯与载体耦合；将包封材料置于所述第一管芯上方以形成所述第一包封层；以及在所述包封材料中形成所述多个电气路由特征。
实例12可包括实例9中的主题，还包括：
在所述第一包封层的所述第一侧边上形成一个或多个重分布层(RDL)，其中所述一个或多个RDL与所述第一管芯电气地耦合，并且其中所述一个或多个RDL通过所述多个电气路由特征与所述第二管芯电气地耦合。
示例13可包括示例12的主题，还包括：在一个或多个RDL上形成多个封装级互连。
实例14可包括实例12中的主题，还包括：将第三管芯通过被置于所述第三管芯上的多个第三管芯级互连结构电气地耦合至一个或多个RDL。
示例15可包括示例14的主题，还包括在一个或多个RDL上形成多个封装级互连结构，其中所述第三管芯和所述多个第三管芯级互连结构的组合厚度小于所述多个封装级互连的所述单个封装级互连结构的厚度，以使在与所述多个封装级互连结构相同平面上所述第三管芯的摆放成为可能。
示例16可包括示例9的主题，其中所述多个电气路由特征的所述子集是第一子集，而所述键合引线是第一键合引线，所述IC封装还包括：将具有多个第三管芯级互连结构的第三管芯通过垫片物理地耦合至所述第二管芯的表面；以及将多个第三管芯级互连结构与多个电气路由特征的第二子集通过第二键合引线电气地耦合，其中第二包封层被形成以包封第三管芯和。
示例17可包括示例9-16中任一项的主题，其中所述多个电气路由特征包括过孔条。
示例18可包括示例9-16中任一项的主题，其中所述IC封装是嵌入式晶片级球栅阵列(eWLB)封装。
示例19可包括集成电路(IC)组件包括：IC封装包括：第一管芯，所述第一管芯至少部分内嵌于第一包封层中，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构；多个电气路由特征，所述电气路由特征至少部分内嵌于所述第一包封层中，并被配置以在所述第一包封层的所述第一侧边和所述第一包封层的第二侧边之间路由电气信号，所述第二侧边设置在所述第一侧边的对面；第二管芯，所述第二管芯被置于所述第一包封层的所述第二侧边上，并且至少部分内嵌于第二包封层中，所述第二管芯具有多个第二管芯级互连结构，其中所述多个第二管芯级互连结构通过键合引线与所述多个电气路由特征的至少子集电气地耦合；以及多个封装级互连，所述多个封装级互连被置于所述第一包封层的所述第一侧边上，并且通过所述多个电气路由特征，与所述多个第二管芯级互连结构，和所述多个第一管芯级互连结构电气地耦合；以及电路板，所述电路板具有被置于其中的多个电气路由特征和被置于其上的多个焊盘，其中所述多个焊盘与所述多个封装级互连结构电气地耦合。
实例20可包括示例19的主题，其中所述的IC封装包括处理器。
示例21可包括示例20的主题，还包括与电路板耦合的以下项中的一个或多个：天线、显示、触摸屏显示、触摸屏控制器、电池、音频调制解调器、视频调制解调器、功率放大器、全球定位系统(GPS)设备、指南针、盖格计数器、加速度计、陀螺仪、扬声器、或摄像头。
示例22可包括示例19-21中任一项的主题，其中所述IC组件是以下项的部分：手提电脑、上网本、笔记本、超级本、智能手机、平板、个人数字助理(PDA)、超级移动PC、移动电话、台式电脑、服务器、打印机、扫描仪、监视器、机顶盒、娱乐控制单元、数码相机、便携式音乐播放器、或数字录像机。
不同的实施例可包括上述实施例任意合适的组合，包括上述以结合的形式(和)描述的实施例中的替代(或)实施例，例如“和”可以是“和/或”。此外，一些实施例可包括一个或多个制品(例如，非暂时性计算机可读介质)，该制品具有存储于其上的指令，该指令当被执行时会引起任意上述实施例的动作。另外，一些实施例可包括具有用以执行上述实施例中各种不同操作的任意合适手段的装置或系统。
以上示例性实现的描述，包括摘要中的描述，并非旨在穷举或是要将本公开中的实施例限制于所公开的确切形式。尽管出于解说的目的在此描述了具体的实现方式和示例，相关领域技术人员会意识到，在本公开范围内的各种不同的等效修改都是可能的。
根据以上的详细说明可对本公开的实施例作出这些修改。在随附的权利要求中的术语不应被解读为将本公开中各种不同的实施例限制于说明书和权利要求中所公开的特定的实现方式。相反，应由随附的权利要求来确定范围，权利要求应根据权利要求解释的既成规则来解读。

Claims (22)

1.一种集成电路(IC)封装，包括：
第一管芯，所述第一管芯至少部分内嵌于第一包封层中，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构；
多个电气路由特征，所述多个电气路由特征至少部分内嵌于所述第一包封层中，并被配置以在所述第一包封层的所述第一侧边和所述第一包封层的第二侧边之间路由电气信号，所述第二侧边设置在所述第一侧边的对面；以及
第二管芯，所述第二管芯被置于所述第一包封层的所述第二侧边上，并且至少部分内嵌于第二包封层中，所述第二管芯具有多个第二管芯级互连结构，其中所述多个第二管芯级互连结构通过键合引线与所述多个电气路由特征的至少子集电气地耦合。
2.如权利要求1所述的IC封装，还包括：被置于所述第一包封层的所述第一侧边的一个或多个重分布层(RDL)，其中所述一个或多个RDL与所述第一管芯电气地耦合，并且其中所述一个或多个RDL通过所述多个电气路由特征与所述第二管芯电气地耦合。
3.如权利要求2所述的IC封装，还包括被置于所述一个或多个RDL上的多个封装级互连结构。
4.如权利要求2所述的IC封装，还包括第三管芯，所述第三管芯被置于所述一个或多个RDL上，并且具有与所述一个或多个RDL电气耦合的多个第三管芯级互连结构。
5.如权利要求4所述的IC封装，还包括被置于所述一个或多个RDL上的多个封装级互连结构，其中所述第三管芯和所述多个第三管芯级互连结构的组合厚度小于所述多个封装级互连的所述单个封装级互连结构的厚度，以使所述第三管芯在与所述多个封装级互连结构相同的平面上的摆放成为可能。
6.如权利要求1所述的IC封装，其特征在于，所述多个电气路由特征的所述子集是第一子集，所述IC封装还包括：
第三管芯，所述第三管芯至少部分内嵌于所述第二包封层中，并且具有多个第三管芯级互连结构，所述多个第三管芯级互连结构通过键合引线与所述多个电气路由特征的第二子集电气地耦合，其中所述第三管芯和所述第二管芯通过垫片被耦合在一起。
7.如权利要求1-6中任一项所述的IC封装，其特征在于，所述多个电气路由特征包括过孔条。
8.如权利要求1-6中任一项所述的IC封装，其特征在于，所述IC封装是嵌入式晶片级球栅阵列(eWLB)封装。
9.一种形成集成电路(IC)封装的方法，包括：
提供第一包封层，所述第一包封层具有第一管芯和至少部分内嵌于其中的多个电气路由特征，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构，其中所述电气路由特征将所述第一包封层的所述第一侧边与所述第一包封层的第二侧边电气地耦合，并且其中所述第一包封层的所述第一侧边设置于所述第一包封层的所述第二侧边的对面；
将第二管芯与所述第一包封层的第二侧边耦合，其中所述第二管芯包括多个第二管芯级互连结构；
将所述多个第二管芯级互连结构与所述多个电气路由特征中的至少子集通过键合引线电气地耦合；以及
在所述第二管芯和所述引线键合配置上方形成第二包封层以在所述第二包封层中封装所述第二管芯的至少部分和所述引线键合配置。
10.如权利要求9所述的方法，其特征在于，提供所述第一包封层包括：
将所述第一管芯与载体耦合；
将所述多个电气路由特征与所述载体耦合；以及
将包封材料置于所述第一管芯和所述多个电气路由特征上方以形成所述第一包封层。
11.如权利要求9所述的方法，其特征在于，提供所述第一包封层包括：
将所述第一管芯与载体耦合；
将包封材料置于所述第一管芯上方以形成所述第一包封层；以及
在所述包封材料中形成所述多个电气路由特征。
12.如权利要求9所述的方法，还包括：
在所述第一包封层的所述第一侧边上形成一个或多个重分布层(RDL)，其中所述一个或多个RDL与所述第一管芯电气地耦合，并且其中所述一个或多个RDL通过所述多个电气路由特征与所述第二管芯电气地耦合。
13.如权利要求12所述的方法，还包括：
在所述一个或多个RDL上形成多个封装级互连。
14.如权利要求12所述的方法，还包括：
将第三管芯通过被置于所述第三管芯上的多个第三管芯级互连结构电气地耦合至一个或多个RDL。
15.如权利要求14所述的方法，还包括在所述一个或多个RDL上形成多个封装级互连结构，其中所述第三管芯和所述多个第三管芯级互连结构的组合厚度小于所述多个封装级互连的所述单个封装级互连结构的厚度，以使所述第三管芯在与所述多个封装级互连结构相同的平面上的摆放成为可能。
16.如权利要求9所述的方法，其特征在于，所述多个电气路由特征的所述子集是第一子集，而所述键合引线是第一键合引线，所述IC封装还包括：
将具有多个第三管芯级互连结构的第三管芯通过垫片物理地耦合至所述第二管芯的表面；以及
通过第二键合引线将所述多个第三管芯级互连结构与所述多个电气路由特征的第二子集电气地耦合，其中所述第二包封层被形成以包封所述第三管芯和。
17.如权利要求9-16中任一项所述的方法，其特征在于，所述多个电气路由特征包括过孔条。
18.如权利要求9-16中任一项所述的方法，其特征在于，所述IC封装是嵌入式晶片级球栅阵列(eWLB)封装。
19.一种集成电路(IC)组件包括：
IC封装，包括：
第一管芯，所述第一管芯至少部分内嵌于第一包封层中，所述第一管芯具有被置于所述第一包封层的第一侧边的多个第一管芯级互连结构；
多个电气路由特征，所述电气路由特征至少部分内嵌于所述第一包封层中，并被配置以在所述第一包封层的所述第一侧边和所述第一包封层的第二侧边之间路由电气信号，所述第二侧边设置在所述第一侧边的对面；
第二管芯，所述第二管芯被置于所述第一包封层的所述第二侧边上，并且至少部分内嵌于第二包封层中，所述第二管芯具有多个第二管芯级互连结构，其中所述多个第二管芯级互连结构通过键合引线与所述多个电气路由特征的至少子集电气地耦合；以及
多个封装级互连，所述多个封装级互连被置于所述第一包封层的所述第一侧边上，并且通过所述多个电气路由特征与所述多个第二管芯级互连结构和所述多个第一管芯级互连结构电气地耦合；以及
电路板，所述电路板具有被置于其中的多个电气路由特征和被置于其上的多个焊盘，其中所述多个焊盘与所述多个封装级互连结构电气地耦合。
20.如权利要求19所述的IC组件，其特征在于，所述IC封装包括处理器。
21.如权利要求20所述的IC组件，还包括与电路板耦合的以下项中的一个或多个：天线、显示、触摸屏显示、触摸屏控制器、电池、音频调制解调器、视频调制解调器、功率放大器、全球定位系统(GPS)设备、指南针、盖格计数器、加速度计、陀螺仪、扬声器、或摄像头。
22.如权利要求19-21中任一项所述的IC组件，其特征在于，所述IC组件是以下项的部分：手提电脑、上网本、笔记本、超级本、智能手机、平板、个人数字助理(PDA)、超级移动PC、移动电话、台式电脑、服务器、打印机、扫描仪、监视器、机顶盒、娱乐控制单元、数码相机、便携式音乐播放器、或数字录像机。
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