CN105263301A - 一种液冷散热系统及其液体散热排 - Google Patents
一种液冷散热系统及其液体散热排 Download PDFInfo
- Publication number
- CN105263301A CN105263301A CN201510769643.7A CN201510769643A CN105263301A CN 105263301 A CN105263301 A CN 105263301A CN 201510769643 A CN201510769643 A CN 201510769643A CN 105263301 A CN105263301 A CN 105263301A
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- Prior art keywords
- cooling
- liquid
- water pipe
- cooling water
- chamber
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05375—Assemblies of conduits connected to common headers, e.g. core type radiators with particular pattern of flow, e.g. change of flow direction
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
- H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/028—Cores with empty spaces or with additional elements integrated into the cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
Description
Claims (10)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510769643.7A CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
| US15/541,706 US10609841B2 (en) | 2015-11-12 | 2017-01-11 | Liquid cooling radiation system and liquid radiator thereof |
| PCT/CN2017/070823 WO2017088840A1 (zh) | 2015-11-12 | 2017-01-11 | 一种液冷散热系统及其液体散热排 |
| JP2018521585A JP2018533846A (ja) | 2015-11-12 | 2017-01-11 | 液冷却放熱システム及びその液体放熱列 |
| US16/789,892 US20200185306A1 (en) | 2015-11-12 | 2020-02-13 | Liquid cooling system |
| US17/602,167 US12158307B2 (en) | 2015-11-12 | 2020-11-23 | Internal circulation water cooling heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510769643.7A CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105263301A true CN105263301A (zh) | 2016-01-20 |
| CN105263301B CN105263301B (zh) | 2017-12-19 |
Family
ID=55102754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510769643.7A Active CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10609841B2 (zh) |
| JP (1) | JP2018533846A (zh) |
| CN (1) | CN105263301B (zh) |
| WO (1) | WO2017088840A1 (zh) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455420A (zh) * | 2016-09-11 | 2017-02-22 | 奇鋐科技股份有限公司 | 水冷排单元及其水冷模组 |
| WO2017088840A1 (zh) * | 2015-11-12 | 2017-06-01 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
| CN106852096A (zh) * | 2017-04-20 | 2017-06-13 | 石家庄东远散热技术有限公司 | 一种水冷散热装置 |
| CN107084376A (zh) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | 一种液冷风冷组合散热系统 |
| CN107148194A (zh) * | 2016-03-01 | 2017-09-08 | 双鸿科技股份有限公司 | 水冷散热装置 |
| CN108088301A (zh) * | 2017-12-25 | 2018-05-29 | 江西鑫田车业有限公司 | 一种通用型散热器 |
| CN108323113A (zh) * | 2018-02-12 | 2018-07-24 | 东莞昂湃实业有限公司 | 一种双向施压的液冷散热结构 |
| CN108681192A (zh) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | 可应用于dmd芯片散热的液冷型散热器 |
| CN108845654A (zh) * | 2018-09-15 | 2018-11-20 | 东莞市领胜泵业科技有限公司 | 一种水冷散热器 |
| CN109164931A (zh) * | 2018-07-26 | 2019-01-08 | 合肥金新允电子技术有限公司 | 一种elo工业触摸显示器的散热装置 |
| CN110337227A (zh) * | 2019-08-13 | 2019-10-15 | 深圳市研派科技有限公司 | 液冷散热装置 |
| WO2019227531A1 (zh) * | 2018-06-01 | 2019-12-05 | 深圳市研派科技有限公司 | 一种无管液冷散热系统 |
| WO2020098092A1 (zh) * | 2018-11-12 | 2020-05-22 | 青岛天乾科技有限公司 | 一种电子产品一体化水冷散热器及其应用的方法 |
| CN111984086A (zh) * | 2020-09-14 | 2020-11-24 | 青海师范大学 | 一种计算机水冷散热装置 |
| CN112930098A (zh) * | 2021-01-27 | 2021-06-08 | 东莞汉旭五金塑胶科技有限公司 | 一体式液冷散热器 |
| CN112969331A (zh) * | 2021-02-24 | 2021-06-15 | 李柯兴 | 一种电子工程用抗干扰设备 |
| CN113973470A (zh) * | 2020-07-24 | 2022-01-25 | 讯凯国际股份有限公司 | 水冷散热装置与水冷系统 |
| CN114449854A (zh) * | 2022-01-20 | 2022-05-06 | 东莞市星酷散热科技有限公司 | 一种集成式液冷散热装置 |
| CN115190751A (zh) * | 2022-08-04 | 2022-10-14 | 广东电网有限责任公司 | 用于ftu箱的降温装置 |
| CN115533309A (zh) * | 2021-06-28 | 2022-12-30 | 上海壹晨机械设备有限公司 | 一种用于薄板焊接的手持激光焊接一体机 |
| CN115568172A (zh) * | 2022-09-23 | 2023-01-03 | 东莞立讯技术有限公司 | 浸没式机柜及其散热系统 |
| CN115629658A (zh) * | 2022-09-16 | 2023-01-20 | 东莞永腾电子制品有限公司 | 一种水冷型芯片散热器 |
| CN117100489A (zh) * | 2023-10-24 | 2023-11-24 | 成都科瑞普医疗器械有限公司 | 一种用于应急的伤处冷敷装置 |
| CN117135874A (zh) * | 2022-05-27 | 2023-11-28 | 尼得科株式会社 | 冷却单元 |
| US12158307B2 (en) | 2015-11-12 | 2024-12-03 | Shenzhen APALTEK Co., Ltd. | Internal circulation water cooling heat dissipation device |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104754924B (zh) * | 2015-03-31 | 2016-02-03 | 广东申菱环境系统股份有限公司 | 液冷装置和辅助散热装置结合的服务器散热系统 |
| TWD191875S (zh) * | 2017-11-10 | 2018-07-21 | 雙鴻科技股份有限公司 | 水冷散熱裝置 |
| CN108287602B (zh) * | 2018-01-29 | 2021-04-30 | 温州职业技术学院 | 一种计算机电源散热装置 |
| US10694640B2 (en) | 2018-01-30 | 2020-06-23 | Quanta Computer Inc. | Server water cooling modules prevent water leakage device |
| JP7031373B2 (ja) * | 2018-03-01 | 2022-03-08 | セイコーエプソン株式会社 | プロジェクター |
| JP7238401B2 (ja) * | 2018-03-30 | 2023-03-14 | 日本電産株式会社 | 冷却装置 |
| JP2019179832A (ja) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | 冷却装置 |
| US10768677B2 (en) * | 2018-04-13 | 2020-09-08 | Cooler Master Technology Inc. | Heat dissipating device having colored lighting and persistence effect |
| US10681841B2 (en) * | 2018-08-08 | 2020-06-09 | Evga Corporation | Water-cooling heat dissipation device suitable for computer |
| CN109944806B (zh) * | 2019-04-23 | 2024-08-13 | 迎新科技(中国)有限公司 | 并联双泵导液装置及其液冷散热系统 |
| US10852788B2 (en) * | 2018-12-12 | 2020-12-01 | George Anthony Edwards | Computer component cooling device and method |
| CN109491471A (zh) * | 2018-12-28 | 2019-03-19 | 浙江晟昱散热器制造有限公司 | 一种石墨烯涂层散热器 |
| CN111623648A (zh) * | 2019-02-28 | 2020-09-04 | 浙江吉利汽车研究院有限公司 | 散热装置、散热系统及汽车 |
| CN109817106B (zh) * | 2019-03-19 | 2024-05-14 | 京东方科技集团股份有限公司 | 显示装置 |
| TWI725590B (zh) * | 2019-10-25 | 2021-04-21 | 雙鴻科技股份有限公司 | 水冷頭 |
| CN110750149A (zh) * | 2019-11-20 | 2020-02-04 | 北京市鑫全盛科技有限公司 | 双层散热的水冷散热器的水冷头 |
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| CN112444050A (zh) * | 2020-11-30 | 2021-03-05 | 东莞汉旭五金塑胶科技有限公司 | 内置有水泵的整体腔式水冷排 |
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| CN112506319B (zh) * | 2020-12-07 | 2023-02-24 | 华为技术有限公司 | 液冷系统及电子设备 |
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| CN112995814B (zh) * | 2021-02-06 | 2022-02-08 | 金华职业技术学院 | 一种新媒体传播用播音装置 |
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Also Published As
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| JP2018533846A (ja) | 2018-11-15 |
| WO2017088840A1 (zh) | 2017-06-01 |
| US10609841B2 (en) | 2020-03-31 |
| US20170367217A1 (en) | 2017-12-21 |
| CN105263301B (zh) | 2017-12-19 |
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