WO2023232064A1 - 一种水冷式散热装置 - Google Patents

一种水冷式散热装置 Download PDF

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Publication number
WO2023232064A1
WO2023232064A1 PCT/CN2023/097363 CN2023097363W WO2023232064A1 WO 2023232064 A1 WO2023232064 A1 WO 2023232064A1 CN 2023097363 W CN2023097363 W CN 2023097363W WO 2023232064 A1 WO2023232064 A1 WO 2023232064A1
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WO
WIPO (PCT)
Prior art keywords
water
base body
base
pump
cooled heat
Prior art date
Application number
PCT/CN2023/097363
Other languages
English (en)
French (fr)
Inventor
肖启能
Original Assignee
深圳昂湃技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳昂湃技术有限公司 filed Critical 深圳昂湃技术有限公司
Publication of WO2023232064A1 publication Critical patent/WO2023232064A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/005—Other auxiliary members within casings, e.g. internal filling means or sealing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

  • the utility model relates to the technology of a heat dissipation device, in particular to a water-cooled heat dissipation device.
  • One purpose of this utility model is to provide a water-cooled heat dissipation device, which is connected through a water drawing hole and a water storage chamber, so that the pump has a sufficient supply of water, thereby extending the service life of the heat dissipation device.
  • the present utility model provides a water-cooled heat dissipation device, which includes a water cooler, a pump assembly, a water inlet pipe and a drainage pipe.
  • the water cooler includes a base and a heat absorber connected to the base. structure, the heat-absorbing structure is provided with a heat exchange chamber inside, the base is provided with a water delivery channel connected to the heat exchange chamber, and a water storage chamber is provided in the water delivery channel;
  • the pump assembly includes a base body and A pump is fixed on the base body.
  • the base body is flatly attached to the top of the base body and has a pump receiving groove and a water drawing hole connected to the pump receiving groove.
  • the pump has an impeller, and the impeller is accommodated in the container.
  • the water drawing hole is configured corresponding to the water storage chamber and connected with each other; the water inlet pipe is connected to the base body and The water conveying channel is connected; the drainage pipe is connected with the base body and connected with the pump tank.
  • a water-cooled heat dissipation device which is characterized by: a water cooler, including a base body and a heat-absorbing structure connected to the base body, and a heat-exchange cavity is provided inside the heat-absorbing structure chamber, the base body is provided with a water delivery channel connected to the heat exchange chamber, and a water storage chamber is provided in the water delivery channel;
  • a pump component includes a base body and a pump fixed on the base body, the base body It is flatly attached to the top of the base and has a pump tank and a water drawing hole connected to the pump tank.
  • the pump has an impeller, and the impeller is accommodated in the pump tank.
  • the water drawing hole corresponds to the pump tank.
  • the water storage chamber is configured and communicated with each other; a water inlet pipe is connected to the base body and communicates with the water delivery channel; and a drainage pipe is connected to the base body and communicates with the pump tank.
  • a water storage chamber is provided around the water drawing hole of the base body, and the water storage chamber is interconnected with the water drawing hole and the water storage chamber.
  • a first sealing member is further included, the pump includes a pedestal, the pedestal is fixed corresponding to the base body, and the first sealing member is clamped between the pedestal and the base body.
  • a second sealing member is further included, the base body includes an upper housing base, and the second sealing member is clamped between the upper housing base and the base body.
  • a third sealing member is further included, and the third sealing member is clamped between the base body and the base body.
  • a lamp panel which is fixed above the pump and electrically connected to the pump.
  • the base body includes an upper housing base and a lower housing base assembled corresponding to the upper housing base, and the water delivery channel is provided inside the upper housing base and the lower housing base.
  • the water delivery channel includes a water inlet channel
  • the water inlet channel includes a water inlet hole provided on the upper housing base, communicates with the water inlet hole, and is formed between the upper housing base and the lower housing base.
  • the water delivery channel further includes a water outlet channel, and the water outlet channel includes a device
  • a plurality of outlet grooves on the lower housing base are respectively connected to each of the outlet grooves and formed between the upper housing base and the lower housing base.
  • a first water outlet channel is respectively connected to each of the first water outlet channels and is provided on the upper housing base.
  • a water outlet in the shell base is provided.
  • the water storage chamber is interconnected with each of the water outlets and is located in the middle of the upper shell base.
  • Figure 1 is a combined diagram of the water-cooled heat dissipation device of the present invention applied to a heat dissipation system.
  • Figure 2 is an exploded view of the water cooler of the present utility model.
  • Figure 3 is an exploded view of the pump assembly, water inlet pipe and drainage pipe of the present invention.
  • Figure 4 is an exploded view of the water cooler and pump assembly of the present invention.
  • Figure 5 is an exploded view of the water cooler and pump assembly of the present invention from another direction.
  • Figure 6 is an exploded view of the cover and fixing bracket of the present utility model.
  • Figure 7 is an assembled perspective view of the cold heat dissipation device of the present invention.
  • Figure 8 is an assembled cross-sectional view of the cold heat dissipation device of the present invention.
  • Fig. 9 is a cross-sectional view taken along line 9-9 of Fig. 8 .
  • Fig. 10 is a cross-sectional view taken along line 10-10 of Fig. 8 .
  • Fig. 11 is a sectional view taken along line 11-11 of Fig. 8 .
  • Fig. 12 is a cross-sectional view taken along line 12-12 of Fig. 8 .
  • the present utility model provides a water-cooled heat dissipation device, which is applied to a heat dissipation system 9.
  • the heat dissipation system 9 mainly includes a water-cooling heat dissipation device 1, a water-cooling radiator 7 and two water pipes. 8. Both ends of each water pipe 8 are connected to the water-cooling heat sink 1 and the water-cooling radiator 7 respectively.
  • the water-cooled heat dissipation device 1 of the present invention mainly includes a water cooler 10, a pump assembly 20, a water inlet pipe 30 and a drainage pipe 40.
  • the water cooler 10 mainly includes a base 11 and a heat-absorbing structure 15.
  • the base 11 is roughly in the shape of a rectangular body and mainly includes an upper shell 111 and a lower shell 115 assembled corresponding to the upper shell 111.
  • the upper shell A water delivery channel 12 is provided inside the seat 111 and the lower shell seat 115.
  • the water delivery channel 12 mainly includes a water inlet channel 121 and a water outlet channel 125.
  • the water inlet channel 121 mainly includes a water inlet hole 122 provided on the upper shell base 111, connected with the water inlet hole 122 and formed on the upper shell base 111 and There is a first water inlet channel 123 between the lower shell seats 115 and a second water inlet channel 124 connected with the first water inlet channel 123 and formed in the middle of the lower shell seat 115 .
  • the water outlet channel 125 mainly includes two water outlets 126 located on the sides of the lower shell seat 115, a first water outlet channel 127 that is connected to each outlet channel 126 and formed between the upper shell seat 111 and the lower shell seat 115.
  • a water outlet hole 128 is connected to each first water outlet channel 127 and is provided in the upper shell base 111 .
  • the water delivery channel 12 of the upper shell base 111 also includes a water storage chamber 13.
  • the water storage chamber 13 is interconnected with the aforementioned water outlet hole 128 and is located in the middle of the upper shell base 111.
  • the heat-absorbing structure 15 is connected below the base 11 and mainly includes a heat-conducting plate 151 and a plurality of heat-dissipating fins 152.
  • the heat-conducting plate 151 can be made of materials with good thermal conductivity such as copper, aluminum or alloys thereof.
  • a heat exchange chamber 153 is provided, and the heat dissipation fins 152 are arranged at intervals in the heat exchange chamber 153; the aforementioned second water inlet channel 124 and each outlet groove 126 are respectively connected to the heat exchange chamber 153.
  • the pump assembly 20 mainly includes a base body 21 and a pump 25.
  • the base body 21 is generally in a rectangular shape, which is flatly attached to the above-mentioned base 11 and has a pump receiving tank 211. and connectivity capacity There is a water drawing hole 212 in the pump tank 211.
  • the pump 25 mainly includes an impeller 251, a rotor 252, a stator 253 and a bearing 254.
  • the bearing 254 is fixed corresponding to the aforementioned base 21, and the rotor 252 is fixed on the impeller 251. above and jointly arranged in the space surrounded by the bearing 254 and the base 21 (see Figure 8).
  • the stator 253 is sleeved on the bearing 254 (as shown in FIG.
  • the stator 253 is located inside the rotor 252 , and it mainly includes circuit boards, silicon steel sheets, windings and other components.
  • a water storage chamber 213 (shown in FIG. 5 ) is provided around the water drawing hole 212 of the base 21 .
  • the water storage chamber 213 is interconnected with the water drawing hole 212 and the water storage chamber 13 . To provide water replenishment.
  • it also includes a first seal 26 (shown in Figure 3), a second seal 27 and a third seal 28 (shown in Figures 4 and 5), wherein the first seal
  • the member 26 is clamped between the holder 254 and the base 21 (shown in Figure 8); the second sealing member 27 is clamped between the upper housing 111 and the base 21 (shown in Figure 8); The third sealing member 28 is clamped between the seat body 11 and the base body 21 (see Figure 5).
  • the water inlet pipe 30 mainly includes a water inlet joint 31 and a water inlet hole 32 (shown in FIG. 9 ) connected to the water inlet joint 31 .
  • the water inlet joint 31 is fixed on the side of the base 21 , and the water inlet hole 32 is connected to the aforementioned water inlet channel 121 .
  • the drainage pipe 40 mainly includes a drainage joint 41 and a drainage hole 42 (as shown in Figure 9) connected to the drainage joint 41.
  • the drainage joint 41 is fixed on the side of the base 21, and the drainage hole 42 is connected to the water outlet of the aforementioned water outlet channel 125. Hole 128.
  • the water-cooled heat sink 1 further includes a light panel 50, which is fixed above the aforementioned pump 25 and is electrically connected to the pump 25.
  • the light panel 50 It mainly includes a circuit board and a plurality of light-emitting elements. Each light-emitting element is arranged above the circuit board to display the operation and other related mechanisms of the water-cooled heat sink 1 through the on and off or flashing of each light-emitting element.
  • the water-cooling heat dissipation device 1 further includes a cover 60 and a fixing bracket 65 .
  • the cover 60 is assembled to cover the base 10 , and may be made of light-transmitting material.
  • the fixing bracket 65 is assembled corresponding to the base body 10 and formed below the cover body 60 .
  • the working fluid such as water enters from the water inlet joint 31 and flows through the water inlet hole 122 of the water inlet channel 121, the first water inlet channel 123 and the second water inlet channel 124 in sequence.
  • the joint 41 is used for transportation, and the water pipe 8 is used to cool down the working fluid with high heat through the water-cooling radiator 7 so as to continue the next cycle operation.

Abstract

一种水冷式散热装置(1)，包括水冷器(10)、泵浦组件(20)、入水管道(30)及排水管道(40)，水冷器(10)包括座体(11)及连接座体(11)的吸热结构(15)，吸热结构(15)设有热交换腔室(153)，座体(11)设有连通热交换腔室(153)的输水流道(12)，在输水流道(12)设有储水室(13)；泵浦组件(20)包括基体(21)及固定在基体(21)的泵浦(25)，基体(21)平贴在座体(11)上方且具有容泵槽(211)及连通容泵槽(211)的汲水孔(212)，泵浦(25)具有叶轮(251)，叶轮(251)容置在容泵槽(211)内，汲水孔(212)则对应储水室(13)配置并且相互连通；入水管道(30)与基体(21)连接并且连通输水流道(12)；排水管道(40)与基体(21)连接并且连通容泵槽(211)。借此，能够延长水冷式散热装置(1)的使用寿命。

Description

一种水冷式散热装置 技术领域
本实用新型是有关一种散热装置的技术，尤指一种水冷式散热装置。
背景技术
随着电子产品内的处理器等元件的运算速度不断的提升，其所产生的热量也越来越高，导致一般的空冷式散热装置已无法达到现阶段的散热需求，势必需要利用具有水等工作液体进行循环冷却功效的水冷式散热装置，才能有效地对前述的电子发热元件进行散热。
现有的水冷式散热装置，虽然解决了前述空冷式散热装置的问题，但却存在着下述的问题点，由于水冷式散热装置的体积庞大因而限制其使用范围和场域，业界虽有提出相关的解决方案，却仍然存在着水量补给不足和使用寿命不长等待改善的空间。
实用新型内容
本实用新型之一目的，在于提供一种水冷式散热装置，其通过汲水孔和储水室连通设置，使得泵浦具备有足够的补给水量，进而延长散热装置的使用寿命。
为了达成上述之目的，本实用新型提供一种水冷式散热装置，包括一水冷器、一泵浦组件、一入水管道及一排水管道，该水冷器包括一座体及连接该座体的一吸热结构，该吸热结构内部设有一热交换腔室，该座体设有连通该热交换腔室的一输水流道，在该输水流道设有一储水室；该泵浦组件包括一基体及固定在该基体的一泵浦，该基体平贴在该座体上方且具有一容泵槽及连通该容泵槽的一汲水孔，该泵浦具有一叶轮，该叶轮容置在该容泵槽内，该汲水孔则对应该储水室配置并且相互连通；该入水管道与该基体连接并且 连通该输水流道；该排水管道与该基体连接并且连通该容泵槽。
本实用新型提供的技术方案如下：一种水冷式散热装置，其特征是，包括：一水冷器，包括一座体及连接该座体的一吸热结构，该吸热结构内部设有一热交换腔室，该座体设有连通该热交换腔室的一输水流道，在该输水流道设有一储水室；一泵浦组件，包括一基体及固定在该基体的一泵浦，该基体平贴在该座体上方且具有一容泵槽及连通该容泵槽的一汲水孔，该泵浦具有一叶轮，该叶轮容置在该容泵槽内，该汲水孔则对应该储水室配置并且相互连通；一入水管道，与该基体连接并且连通该输水流道；以及一排水管道，与该基体连接并且连通该容泵槽。
进一步优选地，其中在该基体的该汲水孔外周围设有一蓄水室，该蓄水室与该汲水孔和该储水室相互连通。
进一步优选地，其中还包括一第一密封件，该泵浦包括一承座，该承座对应于该基体固定，该第一密封件被夹掣在该承座和该基体之间。
进一步优选地，其中还包括一第二密封件，该座体包括一上壳座，该第二密封件被夹掣在该上壳座和该基体之间。
进一步优选地，其中还包括一第三密封件，该第三密封件被夹掣在该座体和该基体之间。
进一步优选地，其还包括一灯板，该灯板固定在该泵浦上方并且与该泵浦电性连接。
进一步优选地，其中该座体包括一上壳座和对应该上壳座组接的一下壳座，该输水流道设于该上壳座和该下壳座内部。
进一步优选地，其中该输水流道包括一入水流道，该入水流道包括设于该上壳座的一进水孔、连通该进水孔并形成在该上壳座和该下壳座之间的一第一入水通道及连通该第一入水通道并形成在该下壳座的一第二入水通道。
进一步优选地，其中该输水流道还包括一出水流道，该出水流道包括设 于该下壳座的复数出水槽、分别连通各该出水槽并形成在该上壳座和该下壳座之间的一第一出水通道及分别连通各该第一出水通道并设于该上壳座的一出水孔。
进一步优选地，其中该储水室与各该出水孔相互连通并设于该上壳座的中间部位。
附图说明
下面将以明确易懂的方式，结合附图说明优选实施方式，对一种水冷式散热装置的上述特性、技术特征、优点及其实现方式予以进一步说明。
图1是本实用新型水冷式散热装置应用于散热系统组合图。
图2是本实用新型的水冷器分解图。
图3是本实用新型的泵浦组件、入水管道和排水管道分解图。
图4是本实用新型的水冷器和泵浦组件分解图。
图5是本实用新型的水冷器和泵浦组件另一方向分解图。
图6是本实用新型的罩盖和固定架分解出示意图。
图7是本实用新型的冷式散热装置组合透视图。
图8是本实用新型的冷式散热装置组合剖视图。
图9是图8的9-9剖视图。
图10是图8的10-10剖视图。
图11是图8的11-11剖视图。
图12是图8的12-12剖视图。
附图标号说明：
1:水冷式散热装置，10:水冷器，11:座体，111:上壳座，115:下壳座，
12:输水流道，121:入水流道，122:进水孔，123:第一入水通道，124:第二入 水通道，125:出水流道，126:出水槽，127:第一出水通道，128:出水孔，13:储水室，15:吸热结构，151:导热板，152:散热鳍片，153:热交换腔室，20:泵浦组件，21:基体，211:容泵槽，212:汲水孔，213:蓄水室，25:泵浦，251:叶轮，252:转子，253:定子，254:承座，26:第一密封件，27:第二密封件，28:第三密封件，30:入水管道，31:入水接头，32:入水孔，40:排水管道，41:排水接头，42:排水孔，50:灯板，60:盖体，65:固定架，7:水冷排，8:输水管，9:散热系统。
具体实施方式
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、技术之类的具体细节，以便透彻理解本申请实施例。然而，本领域的技术人员应当清楚，在没有这些具体细节的其他实施例中也可以实现本申请。在其他情况中，省略对众所周知的系统、装置、电路以及方法的详细说明，以免不必要的细节妨碍本申请的描述。
应当理解，当在本说明书和所附权利要求书中使用时，术语“包括”指示所述描述特征、整体、步骤、操作、元素和/或组件的存在，但并不排除一个或多个其他特征、整体、步骤、操作、元素、组件和/或集合的存在或添加。
为使图面简洁，各图中只示意性地表示出了与本实用新型相关的部分，它们并不代表其作为产品的实际结构。另外，以使图面简洁便于理解，在有些图中具有相同结构或功能的部件，仅示意性地绘示了其中的一个，或仅标出了其中的一个。在本文中，“一个”不仅表示“仅此一个”，也可以表示“多于一个”的情形。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
有关本实用新型的详细说明及技术内容，配合图式说明如下，然而所附图式仅提供参考与说明用，并非用来限制本实用新型。
请先参阅图1所示，本实用新型提供一种水冷式散热装置，其是应用在一散热系统9上，散热系统9主要包括一水冷式散热装置1、一水冷排7及两个输水管8，各输水管8的两端分别连通水冷式散热装置1和水冷排7。
请续阅图2至图5所示，本实用新型之水冷式散热装置1主要包括一水冷器10、一泵浦组件20、一入水管道30及一排水管道40。
水冷器10主要包括一座体11及一吸热结构15，座体11大致呈一矩形体，其主要包括一上壳座111和对应于上壳座111组接的一下壳座115，在上壳座111和下壳座115内部设有一输水流道12。
输水流道12主要包括一入水流道121和一出水流道125，入水流道121主要包括设于上壳座111的一进水孔122、连通进水孔122并形成在上壳座111和下壳座115之间的一第一入水通道123及连通第一入水通道123并形成在下壳座115中间部位的一第二入水通道124。
出水流道125主要包括设于下壳座115侧边部位的两个出水槽126、分别连通各出水槽126并形成在上壳座111和下壳座115之间的一第一出水通道127及分别连通各第一出水通道127并设于上壳座111的一出水孔128。
上壳座111的输水流道12还包括一储水室13，储水室13是与前述出水孔128相互连通并设于上壳座111的中间部位。
吸热结构15是连接在座体11下方，且其主要包括一导热板151及复数散热鳍片152，导热板151可为铜、铝或其合金等导热性良好的材料所制成，在其内侧设有一热交换腔室153，各散热鳍片152是间隔排列的布设在热交换腔室153内；前述第二入水通道124和各出水槽126是分别连通热交换腔室153。
请一并参阅图8所示，泵浦组件20主要包括一基体21及一泵浦25，基体21大致呈一矩形状，其是平贴在前述座体11上方且其具有一容泵槽211及连通容 泵槽211的一汲水孔212，泵浦25主要包括一叶轮251、一转子252、一定子253及一承座254，承座254是对应于前述基体21固定，转子252是固定在叶轮251的上方并共同设置在承座254和基体21所围设的空间中(见于图8所示)。定子253则是对应转子252位置套设在承座254(见于图8所示)，定子253是位于转子252的内侧，且其主要包括电路板、矽钢片及绕线组等元件所组成。在泵浦25对应于基体21组接后，叶轮251是容置在前述容泵槽211内，汲水孔212则是对应于前述储水室13配置并且相互连通。
在一实施例中，在基体21的汲水孔212外周围还设有一蓄水室213(见于图5所示)，此蓄水室213是与汲水孔212和储水室13相互连通，借以提供水的补充。
在一实施例中，还包括一第一密封件26(见于图3所示)、一第二密封件27和一第三密封件28(见于图4和图5所示)，其中第一密封件26是被夹掣在承座254和基体21之间(见于图8所示)；第二密封件27是被夹掣在上壳座111和基体21之间(见于图8所示)；第三密封件28是被夹掣在座体11和基体21之间(见于图5所示)。
入水管道30主要包括一入水接头31及连通入水接头31的一入水孔32(见于图9所示)，入水接头31是固定在基体21侧边，入水孔32则连通前述入水流道121。
排水管道40主要包括一排水接头41及连通排水接头41的一排水孔42(见于图9所示)，排水接头41是固定在基体21侧边，排水孔42则连通前述出水流道125的出水孔128。
请续阅图6至图7所示，在一实施例中，水冷式散热装置1还包括一灯板50，其是固定在前述泵浦25上方并且与泵浦25电性连接，灯板50主要包括电路板和复数发光元件，各发光元件布设在电路板上方，借以通过各发光元件的明灭或闪烁来显示此水冷式散热装置1的运作等相关机制。
在一实施例中，水冷式散热装置1还包括一盖体60和一固定架65，盖体60是对应座体10罩盖组接，其可为透光材料所制成的元件。固定架65则对应座体10组接并形成在盖体60的下方位置。
请续阅图7至图12所示，使用时，利用水等工作流体从入水接头31进入，依序流经入水流道121的进水孔122、第一入水通道123和第二入水通道124后，再进入吸热结构15的热交换腔室153内，以与各散热鳍片152进行热交换，并将各散热鳍片152的热量带离；继而，依序从出水流道125的各出水槽126、第一出水通道127和出水孔128后，再依序流经储水室13、汲水孔212和容泵槽211后，通过泵浦25的叶轮251朝着排水孔42和排水接头41方向输送，并利用前述输水管8，将带有高热量的工作流体借由前述水冷排7予以降温冷却，借以续行下一次的循环运作。
以上所述仅是本实用新型的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本实用新型原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本实用新型的保护范围。

Claims (10)

  1. 一种水冷式散热装置，其特征是，包括：
    一水冷器，包括一座体及连接该座体的一吸热结构，该吸热结构内部设有一热交换腔室，该座体设有连通该热交换腔室的一输水流道，在该输水流道设有一储水室；
    一泵浦组件，包括一基体及固定在该基体的一泵浦，该基体平贴在该座体上方且具有一容泵槽及连通该容泵槽的一汲水孔，该泵浦具有一叶轮，该叶轮容置在该容泵槽内，该汲水孔则对应该储水室配置并且相互连通；
    一入水管道，与该基体连接并且连通该输水流道；以及
    一排水管道，与该基体连接并且连通该容泵槽。
  2. 如权利要求1所述的水冷式散热装置，其特征是，其中在该基体的该汲水孔外周围设有一蓄水室，该蓄水室与该汲水孔和该储水室相互连通。
  3. 如权利要求2所述的水冷式散热装置，其特征是，其中还包括一第一密封件，该泵浦包括一承座，该承座对应于该基体固定，该第一密封件被夹掣在该承座和该基体之间。
  4. 如权利要求3所述的水冷式散热装置，其特征是，其中还包括一第二密封件，该座体包括一上壳座，该第二密封件被夹掣在该上壳座和该基体之间。
  5. 如权利要求3所述的水冷式散热装置，其特征是，其中还包括一第三密封件，该第三密封件被夹掣在该座体和该基体之间。
  6. 如权利要求1所述的水冷式散热装置，其特征是，其还包括一灯板，该灯板固定在该泵浦上方并且与该泵浦电性连接。
  7. 如权利要求1所述的水冷式散热装置，其特征是，其中该座体包括一上壳座和对应该上壳座组接的一下壳座，该输水流道设于该上壳座和该下壳座内部。
  8. 如权利要求7所述的水冷式散热装置，其特征是，其中该输水流道包括一 入水流道，该入水流道包括设于该上壳座的一进水孔、连通该进水孔并形成在该上壳座和该下壳座之间的一第一入水通道及连通该第一入水通道并形成在该下壳座的一第二入水通道。
  9. 如权利要求8所述的水冷式散热装置，其特征是，其中该输水流道还包括一出水流道，该出水流道包括设于该下壳座的复数出水槽、分别连通各该出水槽并形成在该上壳座和该下壳座之间的一第一出水通道及分别连通各该第一出水通道并设于该上壳座的一出水孔。
  10. 如权利要求9所述的水冷式散热装置，其特征是，其中该储水室与各该出水孔相互连通并设于该上壳座的中间部位。
PCT/CN2023/097363 2022-06-02 2023-05-31 一种水冷式散热装置 WO2023232064A1 (zh)

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