CN105189792B - 热轧铜板 - Google Patents

热轧铜板 Download PDF

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Publication number
CN105189792B
CN105189792B CN201480020010.XA CN201480020010A CN105189792B CN 105189792 B CN105189792 B CN 105189792B CN 201480020010 A CN201480020010 A CN 201480020010A CN 105189792 B CN105189792 B CN 105189792B
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CN
China
Prior art keywords
hot
mass
grain boundary
rolling
hot rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480020010.XA
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English (en)
Chinese (zh)
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CN105189792A (zh
Inventor
牧诚
牧一诚
森广行
荒井公
饭田典久
竹田隆弘
下出水茂
及川伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
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Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN105189792A publication Critical patent/CN105189792A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Metal Rolling (AREA)
CN201480020010.XA 2013-04-08 2014-04-08 热轧铜板 Active CN105189792B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013080844A JP5752736B2 (ja) 2013-04-08 2013-04-08 スパッタリング用ターゲット
JP2013-080844 2013-04-08
PCT/JP2014/060151 WO2014168132A1 (ja) 2013-04-08 2014-04-08 熱延銅板

Publications (2)

Publication Number Publication Date
CN105189792A CN105189792A (zh) 2015-12-23
CN105189792B true CN105189792B (zh) 2017-06-09

Family

ID=51689539

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480020010.XA Active CN105189792B (zh) 2013-04-08 2014-04-08 热轧铜板

Country Status (6)

Country Link
US (1) US9938606B2 (cg-RX-API-DMAC7.html)
JP (1) JP5752736B2 (cg-RX-API-DMAC7.html)
KR (1) KR102214290B1 (cg-RX-API-DMAC7.html)
CN (1) CN105189792B (cg-RX-API-DMAC7.html)
TW (1) TWI518197B (cg-RX-API-DMAC7.html)
WO (1) WO2014168132A1 (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6056876B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導安定化材
JP6056877B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
US10889889B2 (en) 2015-08-24 2021-01-12 Mitsubishi Materials Corporation High purity copper sputtering target material
JP6299802B2 (ja) * 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP6299803B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
JP6668899B2 (ja) * 2016-04-06 2020-03-18 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
TWI663274B (zh) * 2017-03-30 2019-06-21 日商Ｊｘ金屬股份有限公司 Sputtering target and manufacturing method thereof
JP7121883B2 (ja) * 2018-04-09 2022-08-19 三菱マテリアル株式会社 スパッタリングターゲット材
US10670393B1 (en) * 2018-11-30 2020-06-02 Applied Materials, Inc. Construction of three-dimensional profiles of high aspect ratio structures using top down imaging
WO2020122112A1 (ja) * 2018-12-13 2020-06-18 三菱マテリアル株式会社 純銅板
JP7131376B2 (ja) * 2018-12-27 2022-09-06 三菱マテリアル株式会社 スパッタリングターゲット用銅素材
KR20210111671A (ko) 2019-01-07 2021-09-13 미츠비시 마테리알 가부시키가이샤 스퍼터링 타깃재
TWI727586B (zh) * 2019-02-28 2021-05-11 日商Ｊｘ金屬股份有限公司 銅電極材料
JP6973680B2 (ja) * 2019-09-27 2021-12-01 三菱マテリアル株式会社 純銅板
CN110578126B (zh) * 2019-10-18 2021-12-28 洛阳高新四丰电子材料有限公司 一种多规格高纯铜靶材的制备方法
EP4116451A4 (en) * 2020-03-06 2024-03-27 Mitsubishi Materials Corporation PURE COPPER PLATE
CN118742659B (zh) * 2022-07-29 2025-06-13 三菱综合材料株式会社 纯铜材、绝缘基板及电子器件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102652182A (zh) * 2009-12-22 2012-08-29 三菱伸铜株式会社 纯铜板的制造方法及纯铜板
CN102712986A (zh) * 2010-02-09 2012-10-03 三菱伸铜株式会社 纯铜板的制造方法及纯铜板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
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JP2614885B2 (ja) * 1988-02-10 1997-05-28 株式会社フジクラ 真空蒸着用銅基材
JP3403918B2 (ja) 1997-06-02 2003-05-06 株式会社ジャパンエナジー 高純度銅スパッタリングタ−ゲットおよび薄膜
JP3975414B2 (ja) 1997-11-28 2007-09-12 日立金属株式会社 スパッタリング用銅ターゲットおよびその製造方法
CN1181224C (zh) 2001-06-01 2004-12-22 中国科学院金属研究所 一种高强度高导电性纳米晶体铜材料的制备方法
CA2674403C (en) * 2007-12-18 2012-06-05 Integran Technologies Inc. Method for preparing polycrystalline structures having improved mechanical and physical properties
KR101058765B1 (ko) * 2008-09-30 2011-08-24 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 고순도 구리 및 전해에 의한 고순도 구리의 제조 방법
KR101290856B1 (ko) * 2008-09-30 2013-07-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 고순도 구리 또는 고순도 구리 합금 스퍼터링 타겟 및 동 스퍼터링 타겟의 제조 방법
JP4790782B2 (ja) 2008-11-04 2011-10-12 Ｊｘ日鉱日石金属株式会社 銅合金スパッタリングターゲット及び半導体素子配線
JP4869398B2 (ja) * 2009-12-22 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP4869415B2 (ja) * 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP5464352B2 (ja) * 2010-03-05 2014-04-09 三菱マテリアル株式会社 均一かつ微細結晶組織を有する高純度銅加工材の製造方法
JP5376168B2 (ja) * 2010-03-30 2013-12-25 三菱マテリアル株式会社 電気銅めっき用高純度銅アノード、その製造方法および電気銅めっき方法
JP5685869B2 (ja) * 2010-09-14 2015-03-18 三菱マテリアル株式会社 太陽電池パネルのインターコネクター用銅圧延箔及びその製造方法
JP6027823B2 (ja) * 2012-09-07 2016-11-16 三菱マテリアル株式会社 熱延銅板、及び、熱延銅板の形状調整方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102652182A (zh) * 2009-12-22 2012-08-29 三菱伸铜株式会社 纯铜板的制造方法及纯铜板
CN102712986A (zh) * 2010-02-09 2012-10-03 三菱伸铜株式会社 纯铜板的制造方法及纯铜板

Also Published As

Publication number Publication date
TWI518197B (zh) 2016-01-21
KR102214290B1 (ko) 2021-02-08
US9938606B2 (en) 2018-04-10
JP5752736B2 (ja) 2015-07-22
KR20150140658A (ko) 2015-12-16
CN105189792A (zh) 2015-12-23
US20160047017A1 (en) 2016-02-18
WO2014168132A1 (ja) 2014-10-16
TW201510254A (zh) 2015-03-16
JP2014201814A (ja) 2014-10-27

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