CN105034522A - 迭层结构 - Google Patents
迭层结构 Download PDFInfo
- Publication number
- CN105034522A CN105034522A CN201510345295.0A CN201510345295A CN105034522A CN 105034522 A CN105034522 A CN 105034522A CN 201510345295 A CN201510345295 A CN 201510345295A CN 105034522 A CN105034522 A CN 105034522A
- Authority
- CN
- China
- Prior art keywords
- protective layer
- layered structure
- photo
- sensitive resin
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011241 protective layer Substances 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims abstract description 19
- 229920006267 polyester film Polymers 0.000 claims abstract description 10
- 230000003746 surface roughness Effects 0.000 claims abstract description 8
- 230000005611 electricity Effects 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 229920005596 polymer binder Polymers 0.000 claims description 4
- 239000002491 polymer binding agent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- -1 polyethylene Polymers 0.000 description 20
- 239000010408 film Substances 0.000 description 19
- 229920000642 polymer Polymers 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 239000011148 porous material Substances 0.000 description 10
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000009881 electrostatic interaction Effects 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- NXQNMWHBACKBIG-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCC(O)(O)O Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCC(O)(O)O NXQNMWHBACKBIG-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 229940107698 malachite green Drugs 0.000 description 2
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical class CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- BERDFCXCZYWTFY-UHFFFAOYSA-N C(C=C)(=O)OC.C(CS)(=O)OC(COC(CS)=O)CC(C)(C)C Chemical compound C(C=C)(=O)OC.C(CS)(=O)OC(COC(CS)=O)CC(C)(C)C BERDFCXCZYWTFY-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical class COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005937 allylation reaction Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical class CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- PYHXGXCGESYPCW-UHFFFAOYSA-N diphenylacetic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)C1=CC=CC=C1 PYHXGXCGESYPCW-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- OJUGVDODNPJEEC-UHFFFAOYSA-N phenylglyoxal Chemical class O=CC(=O)C1=CC=CC=C1 OJUGVDODNPJEEC-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 1
- JEVGKYBUANQAKG-UHFFFAOYSA-N victoria blue R Chemical compound [Cl-].C12=CC=CC=C2C(=[NH+]CC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JEVGKYBUANQAKG-UHFFFAOYSA-N 0.000 description 1
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone powder Natural products C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
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- B32—LAYERED PRODUCTS
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Abstract
本发明是关于一种用作干膜光阻的迭层结构,其包含支撑层、感光性树脂层及保护层,其中该保护层为具有介于1500nm至2500nm之间的最大表面粗糙度及介于1×108Ω/□至1×1012Ω/□的片电阻的聚酯膜。本发明的迭层结构尤其适用于感光性组件、印刷电路板或导线架的线路制作。
Description
技术领域
本发明是关于一种用作干膜光阻(dryfilmresist)的迭层结构,尤其是适合用于感光性组件、印刷电路板或导线架的线路制程。
背景技术
干膜光阻为广泛用于印刷电路板制程中的感光性材料膜。习知干膜光阻主要包含支撑层(supportfilm)、感光性树脂层(即光阻层photoresistlayer)及保护层(protectionfilm),其中支撑层是作为支撑感光性树脂层的基材,保护层则是用于保护感光性树脂层,避免其于制程中遭受损伤。一般使用具有优异的机械及光学性质、耐热性、尺寸稳定性等特性的聚酯膜作为支撑层,例如聚对苯二甲酸乙二酯(polyethyleneterephthalate)。保护层则可使用聚乙烯、聚丙烯或聚酯等材料。
使用干膜光阻的方法包括在将干膜光阻施加于印刷电路板之前,先剥除保护层,将曝露出来的感光性树脂层与电路板表面(通常为铜板)贴合,此时支撑层位于感光性树脂层上方。之后,经由曝光及显影,将所欲产生的电路转移至感光性树脂层上。
先前技术已知干膜光阻中的各层的性质会显著地影响光阻质量及后续印刷电路板的电路性质。
中华民国第TW531679号专利案发现习知的聚乙烯保护层虽具有柔软性、耐药性及良好的剥离性,但聚乙烯在聚合时会产生高分子量的凝胶,该凝胶会使聚合后的聚乙烯膜含有微细突起物(即鱼眼(fisheye)),使得在剥离保护层,并将感光性树脂层与电路板贴合时,空气将混入电路板与感光性树脂层贴合处,产生气孔(airhole),导致后续电路板不良,如短路现象等情形发生。为避免产生鱼眼现象,TW531679使用具有下列特征的聚对苯二甲酸乙二酯膜作为保护层:5.0nm≦SRa≦25nm,100nm≦Spv≦250nm及500个≦尖端密度≦10000个,其中SRa为表面粗糙度,Spv为尖端至谷底的高度差,尖端密度为单位面积4点(各为2μm×2μm)内具有高度1nm以上的突起数。根据该案的揭露内容,当SRa、Spv及尖端密度值增大时,会产生粗大粒子,增加感光性树脂层与保护层间黏着力,导致保护层在剥离时产生破裂现象。反之,当SRa、Spv及尖端密度值降低时,保护层的摩擦系数骤升,造成薄膜制程中的抓痕及静电问题。
CN180600B指出因保护层的剥离而产生强烈的静电作用,将造成异物黏附,更可能对感光性树脂有机溶剂涂料产生火花放电现象,导致干膜光阻着火。
鉴于上述先前技术的问题,本发明提供一种干膜光阻迭层结构,其包含具有良好的剥离性的保护层,可减少静电作用及因干膜制程所产生的后续电路板不良现象。
发明内容
如前所述,先前技术的干膜光阻因各层的性质影响,造成剥离性不佳、抗静电性不佳等缺点,显著影响光阻质量及后续印刷电路板的电路性质。本发明之一目的在于提供一种迭层结构,其包含支撑层、感光性树脂层及保护层,其中该保护层是具有满足下列条件的表面特性的聚酯膜:
1500nm≦最大表面粗糙度≦2500nm;
1×108Ω/□≦片电阻值≦1×1012Ω/□。(Ω/□代表欧姆/单位面积)。
本案发明人经研究发现,保护层的最大表面粗糙度和片电阻值对其剥离性和抗静电作用有关键性的影响。申言之,仅在特定保护层性质或条件下(如最大表面粗糙度和片电阻值),方能使保护层于剥离时容易被撕除,减缓撕除保护层时所产生的静电作用,及避免在剥除时,膜面卷收,产生滑脱现象,及表面出现细纹,感光性树脂层上发生污染状况或气孔残留的现象。特定言之,若保护层的最大表面粗糙度低于1500nm,则易产生滑脱现象,表面易出现细纹;反之,若其最大表面粗糙度大于2500nm,则易产生鱼眼现象。当保护层具有1500nm≦最大表面粗糙度≦2500nm及1×108Ω/□≦片电阻值≦1×1012Ω/□时,其具有优良的剥离性,亦即,其于剥离时容易撕除且不残留感光性树脂组合物。
本发明的迭层结构尤其适用于感光性组件、印刷电路板或导线架的线路制作。
附图说明
图1为本发明所述迭层结构的剖面图。
图中,10为迭层结构、1为支撑层、2为保护层、3为感光性树脂层、d1为支撑层的厚度、d2为保护层的厚度、d3为感光性树脂层的厚度。
具体实施方式
本发明的迭层结构所包含的保护层,是为聚酯膜,其具有以3D干涉仪测得的介于1500nm至2500nm之间,较佳介于约1700nm至2300nm之间,更佳介于约2000nm至2300nm之间的最大表面粗糙度,及以Agilent表面阻抗测定仪43398检测得的介于1×108Ω/□至1×1012Ω/□,较佳介于1×109Ω/□至1×1011Ω/□之间的片电阻。根据本发明的具体实施例,用于作为保护层的聚酯膜系为聚对苯二甲酸乙二酯膜。本发明的保护层具有优良的防静电特性。此外,该保护层具有介于约1至100微米(μm)之间的厚度,较佳介于约10至40μm之间的厚度。根据本发明的具体实施例,该保护层较佳为经表面前处理的聚酯膜,例如,在该保护层的表面上,先形成由有机聚硅氧烷、氟化聚烯烃、聚氟乙烯、聚乙烯醇等的聚合物所构成的下涂层。
本发明的迭层结构所包含的支撑层,为包含聚对苯二甲酸乙二酯的聚酯膜,其具有介于10μm至100μm之间的厚度。
本发明的迭层结构所包含的感光性树脂层,可包含高分子黏合剂、含双键的光可聚合化合物及光起始剂。添加含双键的光可聚合化合物及光起始剂可使感光性树脂组合物在紫外线照射下进行自由基链聚合反应。本发明的感光性树脂组合物可视情况包含其他添加物,例如染料(如孔雀石绿、结晶紫或维多利亚蓝)、安定剂(如三苯基磷)、助剂(如羧基苯并三唑)、成色剂或填料及其组合。
可用于本发明的含双键的光可聚合化合物包括,但不限于1,4-丁二醇二(甲基)丙烯酸酯(1,4-butanedioldi(meth)acrylate)、1,6-己二醇二(甲基)丙烯酸酯(1,6-hexanedioldi(meth)acrylate)、新戊基乙二醇二(甲基)丙烯酸酯(neopentylglycoldi(meth)acrylate)、聚乙二醇二(甲基)丙烯酸酯(polyethyleneglycoldi(meth)acrylate)、新戊基乙二醇二(甲基)丙烯酸酯己二酸酯(neopentylglycoldipatedi(meth)acrylate)、新戊基乙二醇二甲基丙烯酸羟基特戊酸酯(neopentylglycoldi(meth)acrylatehydroxypivalate)、二(甲基)丙烯酸二环戊二烯酯(dicyclopentdienyldi(meth)acrylate)、己内酯改质的二(甲基)丙烯酸二环戊二烯酯(caprolactonemodifieddicyclopentdienyldi(meth)acrylate)、烯丙基化的二(甲基)丙烯酸环己酯(allylatedcyclohexyldi(meth)acrylate)、二(甲基)丙烯酸异氰尿酸酯(isocyanuratedi(meth)acrylate)、三羟甲基丙烷三(甲基)丙烯酸酯(trimethylolpropanetri(meth)acrylate)、二戊赤藓醇三(甲基)丙烯酸酯(dipentaerythrioltri(meth)acrylate)、戊赤藓醇三(甲基)丙烯酸酯、三甲基三(甲基)丙烯酸甲酯、三(丙烯氧乙基)异氰酸尿酯(tris(acryloxyethyl)isocyanurate)、二戊赤藓醇五(甲基)丙烯酸酯、二戊赤藓醇六(甲基)酸酯、乙氧基改质的三甲醇丙烷三丙烯酸酯、脂肪族胺基甲酸酯寡聚体及其混合物所构成的群组。
可用于本发明的光起始剂,包括但不限于二苯乙醇酮(benzoin)、二苯乙醇酮烷基醚(benzoinalkylether)、二苯乙二醛(benzyl)、缩酮(ketals)、苯乙酮化合物(acetophenones)、二苯甲酮(benzophenone)、4,4-二甲基-胺基-二苯甲酮(4,4-dimethtl-amino-benzophenone)、硫化氧杂蒽酮化合物(thioxanthones)、马福林-丙酮化合物(morpholono-propanone)、n-苯基甘胺酸、咪唑二聚体等。
添加高分子黏合剂的目的是为了使干膜组成具有成膜性。可用于本发明的黏合剂包括丙烯酸系高分子、苯乙烯系高分子、聚胺基甲酸乙酯、聚碳酸酯、聚酯、环氧乙烯等有机高分子。
根据本发明,该感光性树脂层具有介于5μm至300μm之间的厚度。
如图1所示,本发明的迭层结构10依序为支撑层1、感光性树脂层3及保护层2。本发明的迭层结构作为干式薄膜光阻使用时,须先撕除保护层,透过热压滚轮将曝露出来的感光性树脂层贴合于基材上,再撕除位于感光性树脂层上方的支撑层。之后,经由曝光及显影,将所欲产生的图案转移至感光性树脂层上,并藉由蚀刻或者电镀处理,将感光性树脂层移除后,即可得到配有电路图案的基材。
以下将具体地描述根据本发明的部分具体实施态样;惟,在不背离本发明的精神下,本发明尚可以多种不同形式的态样来实践,不应将本发明保护范围解释为限于说明书所陈述者。此外,除非文中有另外说明,于本说明书中(尤其是在后述专利申请范围中),所使用的“一”、“该”及类似用语应理解为包含单数及复数形式。另,为明确起见,图式中可能夸示各组件及区域的尺寸,而未按照实际比例绘示。本文中所使用术语“约”意指包含如由一般熟习此项技术者所测定的特定值的可接受误差,其部分地视如何量测或测定该值而定。
实施例
感光性树脂组合物溶液的制备
感光性树脂组合物1是藉由混合(a)高分子黏合剂,例如60重量份的丙烯酸树脂(100%固体,配方是由以下组合物所构成:224克甲基丙烯酸,288克甲基丙烯酸甲酯,104克丙烯酸丁酯,120克苯乙烯,64克甲基丙烯酸丁酯,8克2,2'-偶氮双异丁腈、(b)含双键的光可聚合化合物,例如20重量份的乙氧基改质的三甲醇丙烷三丙烯酸酯(PHOTOMER4155,Cognis)及15.6重量份的脂肪族胺基甲酸酯寡聚体、(c)光起始剂,例如0.1重量份的n-苯基甘胺酸(NPG,Hampford)及3.6重量份的咪唑二聚体(BCIM,黑金)及(d)溶剂,例如20重量份的丁酮所制得,如下表一所示。该感光性树脂组合物可另外包含孔雀石绿作为染料(e)。
表一
下表二比较以经表面前处理且具有低片电阻值的商用聚酯膜作为保护层,及以商用聚酯膜或聚乙烯膜作为保护层的性质。
表二
S100H16:三菱化学制PETfilm(经表面前处理、低片电阻)
T100H16:三菱化学制PETfilm(经表面前处理)
R310:三菱化学制PETfilm
GF-102:TamapolyPEfilm
将支撑层剪切成宽度为40cm和长度为25cm的大小,将表1的感光性树脂组合物1的溶液均匀地涂布于厚为16μm的支撑层上,利用80至100℃的热风对流式干燥机干燥2至10分钟,即于支撑层上形成了感光性树脂层,厚度为40μm,并以冷压滚轮将表二所列的保护层黏着至感光型树脂上。
表面性质评估
将上述的样品裁剪为宽度为30cm且长度为20cm的大小,在50℃及92%相对湿度(RH)的环境下静置24小时,以肉眼观察保护层与迭层结构的滑脱状况,并以手动方式将保护层自迭层结构剥离,观察保护层撕除后的感光性树脂层表面性质,例如感光性树脂组合物残留量、表面污染状况及气孔数,评估样品性质的优劣:
滑脱性:以肉眼观察保护层与迭层结构间的滑脱状况
O:膜面卷收后,没有滑脱,表面没有细纹
△:膜面卷收后,没有滑脱,表面一部份出现细纹
x:膜面卷收后,发生滑脱,表面出现细纹
剥离性:观察保护层撕除后,保护层上是否有残留感光性树脂组合物
O:保护层上无残留感光性树脂组合物
△:以肉眼观察保护层,该保护层上残留占保护层面积小于5%的感光性树脂组合物
x:以肉眼观察保护层,该保护层上残留占保护层面积大于5%的感光性树脂组合物
污染状况:以100倍光学显微镜观察感光性树脂层表面污染状况
O:观察无污染状况
x:观察有污染状况
气孔数(airhole):以100倍光学显微镜下观察感光性树脂层表面,并计数气孔个数
O:气孔个数<20个/m2
△:20个/m2<气孔个数<300个/m2
x:气孔个数>300个/m2
上述结果示于表三。
综合比较表二的实施例与比较例保护层的性质及表三所示的表面性质评估结果可知,实施例1的保护层具有介于6×109Ω/□至7×1010Ω/□间的片电阻值及介于1800nm至2200nm间的最大粗糙度,即其满足本发明保护层的以下特性:1500nm≦最大表面粗糙度≦2500nm及1×108Ω/□≦片电阻值≦1×1012Ω/□,所以将该保护层自感光性树脂层表面上撕除时保护层上没有残留感光性树脂组合物,膜面卷收后,未产生滑脱现象,表面未出现细纹,感光性树脂层上并未观察污染状况或大量气孔残留的现象。相较之下,比较例1的保护层虽具有与实施例1保护层相同范围的最大粗糙度,即介于1800nm至2200nm间的最大粗糙度,但是其片电阻值是介于2×1014Ω/□~1×1015Ω/□,即不满足本发明保护层的1×108Ω/□≦片电阻值≦1×1012Ω/□的要求,由表面性质评估结果可知,比较例1的保护层虽在膜面卷收后,未产生滑脱现象及未于表面出现细纹,但保护层自感光性树脂层表面上撕除时,仍在该保护层上观察到残留5%感光性树脂组合物、感光性树脂层上有污染状况或感光性树脂层表面有大于300个/m2的气孔个数等不良现象。另一方面,比较例2的保护层具有50nm~100nm的最大粗糙度,远低于本发明保护层的最大粗糙度,膜面卷收后,产生滑脱现象,表面出现细纹,且因片电阻值介于2×1014Ω/□~1×1015Ω/□,所以在剥除时,在该保护层上肉眼观察到残留占大于保护层面积5%感光性树脂组合物,且感光性树脂层上有显著污染状况等不良现象。而比较例3的保护层具有介于2500nm至2600nm间的最大粗糙度,因此在剥离保护层后,将感光性树脂层与电路板贴合时,空气易混入电路板与感光性树脂层贴合处,产生气孔。
由上述说明可知,本发明的迭层结构具有满足1500nm≦最大表面粗糙度≦2500nm及1×108Ω/□≦片电阻值≦1×1012Ω/□的条件的保护层,在剥离时较易撕除,使保护层上没有残留感光性树脂组合物,剥离时所产生的剥离带电电压较低,也可减缓保护层撕除时的静电作用,膜面卷收后,未产生滑脱现象,表面未出现细纹,感光性树脂层上未发生污染状况及未有大量气孔残留的现象,此等优异性质可避免后续使用于电路板上时,因干膜制程所产生的不良现象。
Claims (8)
1.一种迭层结构,其特征在于,其包含支撑层、感光性树脂层及保护层,其中该保护层是具有满足下列条件的表面特性的聚酯膜:
1500nm≦最大表面粗糙度≦2500nm;
1×108Ω/□≦片电阻值≦1×1012Ω/□。
2.如权利要求1所述的迭层结构,其特征在于,其中该保护层的厚度是介于约1至100μm。
3.如权利要求1所述的迭层结构,其特征在于,其中该感光性树脂层包含:
(a)高分子黏合剂;
(b)含双键的光可聚合化合物;及
(c)光起始剂。
4.如权利要求1所述的迭层结构,其特征在于,其中该保护层的最大表面粗糙度是介于约1700nm至2300nm之间。
5.如权利要求1所述的迭层结构,其特征在于,其中该保护层的最大粗糙度是介于约2000nm至2300nm之间。
6.如权利要求1所述的迭层结构,其特征在于,其中该保护层的片电阻值是介于1×109Ω/□至1×1011Ω/□之间。
7.如权利要求1所述的迭层结构,其特征在于,其中该保护层具有防静电特性。
8.一种如权利要求1所述的迭层结构的用途,其是用于感光性组件、印刷电路板或导线架的线路制作。
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