CN104900562A - 半导体制造装置及半导体制造方法 - Google Patents
半导体制造装置及半导体制造方法 Download PDFInfo
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- CN104900562A CN104900562A CN201410409333.XA CN201410409333A CN104900562A CN 104900562 A CN104900562 A CN 104900562A CN 201410409333 A CN201410409333 A CN 201410409333A CN 104900562 A CN104900562 A CN 104900562A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/08—Detecting presence of flaws or irregularities
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
- H01L2224/75985—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Acoustics & Sound (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014045032A JP6211955B2 (ja) | 2014-03-07 | 2014-03-07 | 半導体製造装置及び半導体製造方法 |
JP2014-045032 | 2014-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104900562A true CN104900562A (zh) | 2015-09-09 |
CN104900562B CN104900562B (zh) | 2018-02-06 |
Family
ID=54018124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410409333.XA Active CN104900562B (zh) | 2014-03-07 | 2014-08-19 | 半导体制造装置及半导体制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9240388B2 (zh) |
JP (1) | JP6211955B2 (zh) |
CN (1) | CN104900562B (zh) |
TW (1) | TWI596684B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105945481A (zh) * | 2016-06-08 | 2016-09-21 | 广东科杰机械自动化有限公司 | 一种半导体的自动生产方法 |
CN108364880A (zh) * | 2017-01-26 | 2018-08-03 | 捷进科技有限公司 | 半导体制造装置及半导体器件的制造方法 |
CN111952235A (zh) * | 2019-05-17 | 2020-11-17 | 三菱电机株式会社 | 半导体制造装置及半导体装置的制造方法 |
TWI808515B (zh) * | 2020-11-04 | 2023-07-11 | 韓商细美事有限公司 | 用於在焊接設備中傳送晶粒的裝置以及方法、焊接設備 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
JP2017212255A (ja) | 2016-05-23 | 2017-11-30 | 株式会社ジェイデバイス | 半導体製造装置及び製造方法 |
Citations (7)
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JP2003247986A (ja) * | 2002-02-27 | 2003-09-05 | Sharp Corp | 破損検出システムおよび破損検出方法 |
JP2006041282A (ja) * | 2004-07-28 | 2006-02-09 | Kyocera Corp | シリコンウェハのクラック検出方法 |
JP2008016465A (ja) * | 2006-07-03 | 2008-01-24 | Murata Mfg Co Ltd | 小型部品取出装置 |
JP2009246285A (ja) * | 2008-03-31 | 2009-10-22 | Hitachi High-Tech Instruments Co Ltd | 部品実装装置 |
JP2011007750A (ja) * | 2009-06-29 | 2011-01-13 | Kyocera Corp | ウエハのクラックの検出方法及びその検出装置 |
CN102956522A (zh) * | 2011-08-16 | 2013-03-06 | 东京毅力科创株式会社 | 膜破裂检测装置和成膜装置 |
CN102956519A (zh) * | 2011-08-23 | 2013-03-06 | 李昆达 | 检测太阳能电池板的音波检测装置及方法 |
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JPS58105039A (ja) * | 1981-12-18 | 1983-06-22 | Toshiba Corp | 加工変質層の検出方法 |
JP3241050B2 (ja) | 1990-12-04 | 2001-12-25 | 株式会社東芝 | 半導体の外観検査装置 |
DE69632116T2 (de) * | 1995-05-12 | 2004-08-19 | Seiko Epson Corp. | Gerät zur diagnostizierung des zustandes vom lebenden organismus und steuereinheit |
CN2365669Y (zh) * | 1999-02-01 | 2000-02-23 | 北京安通铁路工务技术开发公司 | 车轴超声波探伤用组合探头 |
JP2001071261A (ja) * | 1999-07-05 | 2001-03-21 | Semiconductor Leading Edge Technologies Inc | 超平坦化・高精度制御研磨装置および超平坦化・高精度制御研磨方法 |
JP4827490B2 (ja) | 2004-10-27 | 2011-11-30 | パナソニック株式会社 | 半導体装置の製造システム |
JP4624813B2 (ja) * | 2005-01-21 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP4830772B2 (ja) * | 2006-10-11 | 2011-12-07 | ヤマハ株式会社 | 半導体チップの検査方法 |
JP4973062B2 (ja) | 2006-08-14 | 2012-07-11 | ヤマハ株式会社 | 半導体チップの検査方法及びウェハのクラック検査装置 |
KR20080015363A (ko) | 2006-08-14 | 2008-02-19 | 야마하 가부시키가이샤 | 웨이퍼 및 반도체 소자의 검사 방법 및 장치 |
JP2008096319A (ja) | 2006-10-13 | 2008-04-24 | Mega Trade:Kk | 外観検査装置 |
JP5276347B2 (ja) * | 2007-07-03 | 2013-08-28 | 国立大学法人 新潟大学 | シリコンウェーハ中に存在する原子空孔の定量評価装置、その方法、シリコンウェーハの製造方法、及び薄膜振動子 |
WO2009016906A1 (ja) * | 2007-07-30 | 2009-02-05 | Murata Manufacturing Co., Ltd. | 弾性波装置及びその製造方法 |
JP2009243913A (ja) | 2008-03-28 | 2009-10-22 | Taiheiyo Cement Corp | 音波検査装置 |
JP4906897B2 (ja) | 2009-01-22 | 2012-03-28 | 三菱電機株式会社 | クラック検知支援装置、及び、クラック検知支援方法 |
JP2011017626A (ja) * | 2009-07-09 | 2011-01-27 | Sony Corp | 力学量検知部材及び力学量検知装置 |
WO2011062279A1 (ja) * | 2009-11-20 | 2011-05-26 | 独立行政法人産業技術総合研究所 | 欠陥を検査する方法、欠陥の検査を行ったウエハまたはそのウエハを用いて製造された半導体素子、ウエハまたは半導体素子の品質管理方法及び欠陥検査装置 |
JP5931772B2 (ja) | 2013-02-13 | 2016-06-08 | 株式会社東芝 | 半導体製造装置 |
-
2014
- 2014-03-07 JP JP2014045032A patent/JP6211955B2/ja active Active
- 2014-08-19 CN CN201410409333.XA patent/CN104900562B/zh active Active
- 2014-08-22 TW TW103129077A patent/TWI596684B/zh active
- 2014-09-03 US US14/475,726 patent/US9240388B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003247986A (ja) * | 2002-02-27 | 2003-09-05 | Sharp Corp | 破損検出システムおよび破損検出方法 |
JP2006041282A (ja) * | 2004-07-28 | 2006-02-09 | Kyocera Corp | シリコンウェハのクラック検出方法 |
JP2008016465A (ja) * | 2006-07-03 | 2008-01-24 | Murata Mfg Co Ltd | 小型部品取出装置 |
JP2009246285A (ja) * | 2008-03-31 | 2009-10-22 | Hitachi High-Tech Instruments Co Ltd | 部品実装装置 |
JP2011007750A (ja) * | 2009-06-29 | 2011-01-13 | Kyocera Corp | ウエハのクラックの検出方法及びその検出装置 |
CN102956522A (zh) * | 2011-08-16 | 2013-03-06 | 东京毅力科创株式会社 | 膜破裂检测装置和成膜装置 |
CN102956519A (zh) * | 2011-08-23 | 2013-03-06 | 李昆达 | 检测太阳能电池板的音波检测装置及方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105945481A (zh) * | 2016-06-08 | 2016-09-21 | 广东科杰机械自动化有限公司 | 一种半导体的自动生产方法 |
CN108364880A (zh) * | 2017-01-26 | 2018-08-03 | 捷进科技有限公司 | 半导体制造装置及半导体器件的制造方法 |
CN108364880B (zh) * | 2017-01-26 | 2022-03-29 | 捷进科技有限公司 | 半导体制造装置及半导体器件的制造方法 |
CN111952235A (zh) * | 2019-05-17 | 2020-11-17 | 三菱电机株式会社 | 半导体制造装置及半导体装置的制造方法 |
TWI808515B (zh) * | 2020-11-04 | 2023-07-11 | 韓商细美事有限公司 | 用於在焊接設備中傳送晶粒的裝置以及方法、焊接設備 |
Also Published As
Publication number | Publication date |
---|---|
TW201535554A (zh) | 2015-09-16 |
US9240388B2 (en) | 2016-01-19 |
US20150255421A1 (en) | 2015-09-10 |
JP6211955B2 (ja) | 2017-10-11 |
JP2015170746A (ja) | 2015-09-28 |
TWI596684B (zh) | 2017-08-21 |
CN104900562B (zh) | 2018-02-06 |
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