CN104754861A - 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜 - Google Patents

电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜 Download PDF

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Publication number
CN104754861A
CN104754861A CN201410828123.4A CN201410828123A CN104754861A CN 104754861 A CN104754861 A CN 104754861A CN 201410828123 A CN201410828123 A CN 201410828123A CN 104754861 A CN104754861 A CN 104754861A
Authority
CN
China
Prior art keywords
shielding film
electromagnetic shielding
metal pattern
release film
manufacture method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410828123.4A
Other languages
English (en)
Chinese (zh)
Inventor
郑光春
赵南富
金道铉
陈锡泌
许裕盛
宋中根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
Original Assignee
InkTec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by InkTec Co Ltd filed Critical InkTec Co Ltd
Priority to CN201910445962.0A priority Critical patent/CN110177450A/zh
Publication of CN104754861A publication Critical patent/CN104754861A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
CN201410828123.4A 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜 Pending CN104754861A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910445962.0A CN110177450A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0164330 2013-12-26
KR1020130164330A KR20150075912A (ko) 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201910445962.0A Division CN110177450A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜

Publications (1)

Publication Number Publication Date
CN104754861A true CN104754861A (zh) 2015-07-01

Family

ID=53536703

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201410828123.4A Pending CN104754861A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜
CN201910445962.0A Pending CN110177450A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜

Family Applications After (1)

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CN201910445962.0A Pending CN110177450A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜

Country Status (3)

Country Link
JP (3) JP2015126230A (https=)
KR (1) KR20150075912A (https=)
CN (2) CN104754861A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107511302A (zh) * 2017-08-16 2017-12-26 苏州城邦达力材料科技有限公司 屏蔽膜的加工系统及方法
CN107921751A (zh) * 2015-08-11 2018-04-17 柯尼卡美能达株式会社 功能性片材
CN110291608A (zh) * 2017-03-06 2019-09-27 阿莫绿色技术有限公司 一种功率继电器组件
CN111050466A (zh) * 2019-12-31 2020-04-21 安捷利（番禺）电子实业有限公司 插入损耗低且剥离强度大的pcb及其制作方法
CN111246719A (zh) * 2020-02-26 2020-06-05 东莞市华卓电子科技有限公司 一种5g电磁膜的生产方法
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板

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KR20150075912A (ko) * 2013-12-26 2015-07-06 주식회사 잉크테크 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름
KR20180066508A (ko) * 2016-12-09 2018-06-19 공주대학교 산학협력단 전자파 차폐용 블록필름
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process
KR102236577B1 (ko) * 2019-02-20 2021-04-06 주식회사 코모텍 인라인형 멀티 코팅장치
KR102212079B1 (ko) 2019-03-22 2021-02-04 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전자 어셈블리, 이를 포함하는 전자 장치 및 전자 어셈블리를 제작하는 방법
JP6690773B1 (ja) * 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
CN113133291A (zh) * 2019-12-31 2021-07-16 广州宏庆电子有限公司 一种电磁屏蔽覆盖膜及其制备方法
DE102020128367B4 (de) 2020-10-28 2025-10-30 Te Connectivity Germany Gmbh Anordnung mit einem aus mindestens drei aufeinanderliegenden Blechlagen zusammengefügten Blechstapel, elektrischer Kontakt umfassend diese Anordnung und Verfahren zum Durchsetzfügen eines Blechstapels
CN112831290B (zh) * 2020-12-25 2022-12-06 领胜城科技（江苏）有限公司 一种可挠电磁屏蔽胶带的制备方法
KR102572146B1 (ko) * 2021-08-03 2023-08-30 주식회사 볼트크리에이션 전자파 차폐 시트 및 그 제조방법
CN120769434A (zh) * 2025-06-13 2025-10-10 广州源康精密电子股份有限公司 一种rfpc及其制作方法

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US20090126984A1 (en) * 2007-05-09 2009-05-21 Fujifilm Corporation Electromagnetic shielding film and optical filter
KR101046200B1 (ko) * 2010-06-23 2011-07-05 에스디플렉스(주) 전자파 차폐필름의 제조방법 및 이에 의해 제조된 전자파 차폐필름
CN203015375U (zh) * 2012-12-20 2013-06-19 深圳科诺桥科技有限公司 印刷电路板及高填充性电磁屏蔽膜
KR20130115431A (ko) * 2012-04-12 2013-10-22 한화엘앤씨 주식회사 전자기파 차폐 필름 제조방법

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KR20150075912A (ko) * 2013-12-26 2015-07-06 주식회사 잉크테크 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
CN101080162A (zh) * 2006-05-24 2007-11-28 冠品化学股份有限公司 具有电磁屏蔽功能的软质基材
US20090126984A1 (en) * 2007-05-09 2009-05-21 Fujifilm Corporation Electromagnetic shielding film and optical filter
KR101046200B1 (ko) * 2010-06-23 2011-07-05 에스디플렉스(주) 전자파 차폐필름의 제조방법 및 이에 의해 제조된 전자파 차폐필름
KR20130115431A (ko) * 2012-04-12 2013-10-22 한화엘앤씨 주식회사 전자기파 차폐 필름 제조방법
CN203015375U (zh) * 2012-12-20 2013-06-19 深圳科诺桥科技有限公司 印刷电路板及高填充性电磁屏蔽膜

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107921751A (zh) * 2015-08-11 2018-04-17 柯尼卡美能达株式会社 功能性片材
CN110291608A (zh) * 2017-03-06 2019-09-27 阿莫绿色技术有限公司 一种功率继电器组件
CN110291608B (zh) * 2017-03-06 2021-10-15 阿莫绿色技术有限公司 一种功率继电器组件
CN107511302A (zh) * 2017-08-16 2017-12-26 苏州城邦达力材料科技有限公司 屏蔽膜的加工系统及方法
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
CN111050466A (zh) * 2019-12-31 2020-04-21 安捷利（番禺）电子实业有限公司 插入损耗低且剥离强度大的pcb及其制作方法
CN111246719A (zh) * 2020-02-26 2020-06-05 东莞市华卓电子科技有限公司 一种5g电磁膜的生产方法

Also Published As

Publication number Publication date
KR20150075912A (ko) 2015-07-06
CN110177450A (zh) 2019-08-27
JP2015126230A (ja) 2015-07-06
JP2017143275A (ja) 2017-08-17
JP2021002664A (ja) 2021-01-07

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Application publication date: 20150701