JP2015126230A - 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｕｒｉｎｇｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍａｎｄｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍｍａｎｕｆａｃｔｕｒｅｄｔｈｅｒｅｏｆ - Google Patents

電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｕｒｉｎｇｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍａｎｄｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍｍａｎｕｆａｃｔｕｒｅｄｔｈｅｒｅｏｆ Download PDF

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Publication number
JP2015126230A
JP2015126230A JP2014265459A JP2014265459A JP2015126230A JP 2015126230 A JP2015126230 A JP 2015126230A JP 2014265459 A JP2014265459 A JP 2014265459A JP 2014265459 A JP2014265459 A JP 2014265459A JP 2015126230 A JP2015126230 A JP 2015126230A
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JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
shielding film
metal pattern
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014265459A
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English (en)
Japanese (ja)
Inventor
クヮン−チョン チュン，
Kwang-Choon Chung
クヮン−チョン チュン，
ナン−ブ チョ，
Nam-Boo Cho
ナン−ブ チョ，
ド−ヒュン キム，
Do-Hyun Kim
ド−ヒュン キム，
ソク−ピル チン，
Seok Pil Jin
ソク−ピル チン，
ユ ソン フ，
You Sungl Huh
ユ ソン フ，
ジュン−グン ソン，
Jung-Geun Song
ジュン−グン ソン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
InkTec Co Ltd
Original Assignee
InkTec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by InkTec Co Ltd filed Critical InkTec Co Ltd
Publication of JP2015126230A publication Critical patent/JP2015126230A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2014265459A 2013-12-26 2014-12-26 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｕｒｉｎｇｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍａｎｄｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍｍａｎｕｆａｃｔｕｒｅｄｔｈｅｒｅｏｆ Pending JP2015126230A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0164330 2013-12-26
KR1020130164330A KR20150075912A (ko) 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Related Child Applications (1)

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JP2017038742A Division JP2017143275A (ja) 2013-12-26 2017-03-01 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム

Publications (1)

Publication Number Publication Date
JP2015126230A true JP2015126230A (ja) 2015-07-06

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Family Applications (3)

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JP2014265459A Pending JP2015126230A (ja) 2013-12-26 2014-12-26 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｕｒｉｎｇｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍａｎｄｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍｍａｎｕｆａｃｔｕｒｅｄｔｈｅｒｅｏｆ
JP2017038742A Pending JP2017143275A (ja) 2013-12-26 2017-03-01 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム
JP2020144609A Pending JP2021002664A (ja) 2013-12-26 2020-08-28 電磁波遮蔽フィルムの製造方法

Family Applications After (2)

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JP2017038742A Pending JP2017143275A (ja) 2013-12-26 2017-03-01 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム
JP2020144609A Pending JP2021002664A (ja) 2013-12-26 2020-08-28 電磁波遮蔽フィルムの製造方法

Country Status (3)

Country Link
JP (3) JP2015126230A (https=)
KR (1) KR20150075912A (https=)
CN (2) CN104754861A (https=)

Cited By (6)

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WO2017026211A1 (ja) * 2015-08-11 2017-02-16 コニカミノルタ株式会社 機能性シート
JP2017143275A (ja) * 2013-12-26 2017-08-17 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム
KR20180066508A (ko) * 2016-12-09 2018-06-19 공주대학교 산학협력단 전자파 차폐용 블록필름
WO2020194109A1 (en) * 2019-03-22 2020-10-01 3M Innovative Properties Company Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly
CN112831290A (zh) * 2020-12-25 2021-05-25 领胜城科技（江苏）有限公司 一种可挠电磁屏蔽胶带的制备方法
CN120769434A (zh) * 2025-06-13 2025-10-10 广州源康精密电子股份有限公司 一种rfpc及其制作方法

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KR102119594B1 (ko) * 2017-03-06 2020-06-05 주식회사 아모그린텍 파워 릴레이 어셈블리
CN107511302A (zh) * 2017-08-16 2017-12-26 苏州城邦达力材料科技有限公司 屏蔽膜的加工系统及方法
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process
KR102236577B1 (ko) * 2019-02-20 2021-04-06 주식회사 코모텍 인라인형 멀티 코팅장치
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
JP6690773B1 (ja) * 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
CN111050466A (zh) * 2019-12-31 2020-04-21 安捷利（番禺）电子实业有限公司 插入损耗低且剥离强度大的pcb及其制作方法
CN113133291A (zh) * 2019-12-31 2021-07-16 广州宏庆电子有限公司 一种电磁屏蔽覆盖膜及其制备方法
CN111246719A (zh) * 2020-02-26 2020-06-05 东莞市华卓电子科技有限公司 一种5g电磁膜的生产方法
DE102020128367B4 (de) 2020-10-28 2025-10-30 Te Connectivity Germany Gmbh Anordnung mit einem aus mindestens drei aufeinanderliegenden Blechlagen zusammengefügten Blechstapel, elektrischer Kontakt umfassend diese Anordnung und Verfahren zum Durchsetzfügen eines Blechstapels
KR102572146B1 (ko) * 2021-08-03 2023-08-30 주식회사 볼트크리에이션 전자파 차폐 시트 및 그 제조방법

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JP2009289840A (ja) * 2008-05-28 2009-12-10 Toyo Ink Mfg Co Ltd 電磁波シールド性接着フィルム
JP2013168643A (ja) * 2012-01-17 2013-08-29 Toyo Ink Sc Holdings Co Ltd 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法
JP2013538439A (ja) * 2010-06-23 2013-10-10 インクテック カンパニー リミテッド 電磁波シールドフィルムの製造方法及びこれにより製造された電磁波シールドフィルム

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JPH05235495A (ja) * 1992-02-21 1993-09-10 Sumitomo Electric Ind Ltd シールド付フレキシブルプリント配線板
JP2009289840A (ja) * 2008-05-28 2009-12-10 Toyo Ink Mfg Co Ltd 電磁波シールド性接着フィルム
JP2013538439A (ja) * 2010-06-23 2013-10-10 インクテック カンパニー リミテッド 電磁波シールドフィルムの製造方法及びこれにより製造された電磁波シールドフィルム
JP2013168643A (ja) * 2012-01-17 2013-08-29 Toyo Ink Sc Holdings Co Ltd 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法

Cited By (13)

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JP2021002664A (ja) * 2013-12-26 2021-01-07 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． 電磁波遮蔽フィルムの製造方法
JP2017143275A (ja) * 2013-12-26 2017-08-17 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム
JPWO2017026211A1 (ja) * 2015-08-11 2018-06-07 コニカミノルタ株式会社 機能性シート
WO2017026211A1 (ja) * 2015-08-11 2017-02-16 コニカミノルタ株式会社 機能性シート
KR20180066508A (ko) * 2016-12-09 2018-06-19 공주대학교 산학협력단 전자파 차폐용 블록필름
US10985111B2 (en) 2019-03-22 2021-04-20 3M Innovative Properties Company Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly
WO2020194109A1 (en) * 2019-03-22 2020-10-01 3M Innovative Properties Company Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly
JP2022526888A (ja) * 2019-03-22 2022-05-27 スリーエム イノベイティブ プロパティズ カンパニー 電子アセンブリ、電子アセンブリを含む電子装置、及び電子アセンブリの製造方法
US11355453B2 (en) 2019-03-22 2022-06-07 3M Innovative Properties Company Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly
US12068258B2 (en) 2019-03-22 2024-08-20 3M Innovative Properties Company Method for fabricating electronic assembly including a magnetic field shielding film
CN112831290A (zh) * 2020-12-25 2021-05-25 领胜城科技（江苏）有限公司 一种可挠电磁屏蔽胶带的制备方法
CN112831290B (zh) * 2020-12-25 2022-12-06 领胜城科技（江苏）有限公司 一种可挠电磁屏蔽胶带的制备方法
CN120769434A (zh) * 2025-06-13 2025-10-10 广州源康精密电子股份有限公司 一种rfpc及其制作方法

Also Published As

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KR20150075912A (ko) 2015-07-06
CN110177450A (zh) 2019-08-27
JP2017143275A (ja) 2017-08-17
JP2021002664A (ja) 2021-01-07
CN104754861A (zh) 2015-07-01

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