KR20150075912A - 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 - Google Patents

전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 Download PDF

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Publication number
KR20150075912A
KR20150075912A KR1020130164330A KR20130164330A KR20150075912A KR 20150075912 A KR20150075912 A KR 20150075912A KR 1020130164330 A KR1020130164330 A KR 1020130164330A KR 20130164330 A KR20130164330 A KR 20130164330A KR 20150075912 A KR20150075912 A KR 20150075912A
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KR
South Korea
Prior art keywords
metal pattern
release film
conductive adhesive
shielding film
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130164330A
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English (en)
Korean (ko)
Inventor
정광춘
조남부
김도현
진석필
허유성
송중근
Original Assignee
주식회사 잉크테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Priority to KR1020130164330A priority Critical patent/KR20150075912A/ko
Priority to CN201410828123.4A priority patent/CN104754861A/zh
Priority to CN201910445962.0A priority patent/CN110177450A/zh
Priority to JP2014265459A priority patent/JP2015126230A/ja
Publication of KR20150075912A publication Critical patent/KR20150075912A/ko
Priority to JP2017038742A priority patent/JP2017143275A/ja
Priority to JP2020144609A priority patent/JP2021002664A/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
KR1020130164330A 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 Ceased KR20150075912A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020130164330A KR20150075912A (ko) 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름
CN201410828123.4A CN104754861A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜
CN201910445962.0A CN110177450A (zh) 2013-12-26 2014-12-25 电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜
JP2014265459A JP2015126230A (ja) 2013-12-26 2014-12-26 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムｍｅｔｈｏｄｆｏｒｍａｎｕｆａｃｔｕｒｉｎｇｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍａｎｄｅｌｅｃｔｒｏｍａｇｎｅｔｉｃｉｎｔｅｒｆｅｒｅｎｃｅｓｈｉｅｌｄｉｎｇｆｉｌｍｍａｎｕｆａｃｔｕｒｅｄｔｈｅｒｅｏｆ
JP2017038742A JP2017143275A (ja) 2013-12-26 2017-03-01 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム
JP2020144609A JP2021002664A (ja) 2013-12-26 2020-08-28 電磁波遮蔽フィルムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130164330A KR20150075912A (ko) 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020170001886A Division KR20170006301A (ko) 2017-01-05 2017-01-05 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Publications (1)

Publication Number Publication Date
KR20150075912A true KR20150075912A (ko) 2015-07-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130164330A Ceased KR20150075912A (ko) 2013-12-26 2013-12-26 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Country Status (3)

Country Link
JP (3) JP2015126230A (https=)
KR (1) KR20150075912A (https=)
CN (2) CN104754861A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020171945A1 (en) * 2019-02-18 2020-08-27 Jabil Inc. Adhesive circuit patterning process
CN114472729A (zh) * 2020-10-28 2022-05-13 泰连德国有限公司 具有由至少三个叠置的金属板层接合的金属板叠层的组件
WO2023014017A1 (ko) * 2021-08-03 2023-02-09 주식회사 볼트크리에이션 전자파 차폐 시트 및 그 제조방법

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KR20150075912A (ko) * 2013-12-26 2015-07-06 주식회사 잉크테크 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름
JP6812972B2 (ja) * 2015-08-11 2021-01-13 コニカミノルタ株式会社 機能性シート
KR20180066508A (ko) * 2016-12-09 2018-06-19 공주대학교 산학협력단 전자파 차폐용 블록필름
KR102119594B1 (ko) * 2017-03-06 2020-06-05 주식회사 아모그린텍 파워 릴레이 어셈블리
CN107511302A (zh) * 2017-08-16 2017-12-26 苏州城邦达力材料科技有限公司 屏蔽膜的加工系统及方法
KR102236577B1 (ko) * 2019-02-20 2021-04-06 주식회사 코모텍 인라인형 멀티 코팅장치
KR102212079B1 (ko) 2019-03-22 2021-02-04 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전자 어셈블리, 이를 포함하는 전자 장치 및 전자 어셈블리를 제작하는 방법
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
JP6690773B1 (ja) * 2019-12-18 2020-04-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
CN111050466A (zh) * 2019-12-31 2020-04-21 安捷利（番禺）电子实业有限公司 插入损耗低且剥离强度大的pcb及其制作方法
CN113133291A (zh) * 2019-12-31 2021-07-16 广州宏庆电子有限公司 一种电磁屏蔽覆盖膜及其制备方法
CN111246719A (zh) * 2020-02-26 2020-06-05 东莞市华卓电子科技有限公司 一种5g电磁膜的生产方法
CN112831290B (zh) * 2020-12-25 2022-12-06 领胜城科技（江苏）有限公司 一种可挠电磁屏蔽胶带的制备方法
CN120769434A (zh) * 2025-06-13 2025-10-10 广州源康精密电子股份有限公司 一种rfpc及其制作方法

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KR101361533B1 (ko) * 2012-04-12 2014-02-13 한화엘앤씨 주식회사 전자기파 차폐 필름 제조방법
CN203015375U (zh) * 2012-12-20 2013-06-19 深圳科诺桥科技有限公司 印刷电路板及高填充性电磁屏蔽膜
KR20150075912A (ko) * 2013-12-26 2015-07-06 주식회사 잉크테크 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020171945A1 (en) * 2019-02-18 2020-08-27 Jabil Inc. Adhesive circuit patterning process
US12490387B2 (en) 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process
CN114472729A (zh) * 2020-10-28 2022-05-13 泰连德国有限公司 具有由至少三个叠置的金属板层接合的金属板叠层的组件
US12030103B2 (en) 2020-10-28 2024-07-09 Te Connectivity Germany Gmbh Assembly with a stack of sheet metal joined from at least three superimposed layers of sheet metal
WO2023014017A1 (ko) * 2021-08-03 2023-02-09 주식회사 볼트크리에이션 전자파 차폐 시트 및 그 제조방법
KR20230020207A (ko) * 2021-08-03 2023-02-10 주식회사 볼트크리에이션 전자파 차폐 시트 및 그 제조방법

Also Published As

Publication number Publication date
CN110177450A (zh) 2019-08-27
JP2015126230A (ja) 2015-07-06
JP2017143275A (ja) 2017-08-17
JP2021002664A (ja) 2021-01-07
CN104754861A (zh) 2015-07-01

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