JP2017143275A - 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム - Google Patents
電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム Download PDFInfo
- Publication number
- JP2017143275A JP2017143275A JP2017038742A JP2017038742A JP2017143275A JP 2017143275 A JP2017143275 A JP 2017143275A JP 2017038742 A JP2017038742 A JP 2017038742A JP 2017038742 A JP2017038742 A JP 2017038742A JP 2017143275 A JP2017143275 A JP 2017143275A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- wave shielding
- shielding film
- metal pattern
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 86
- 239000002184 metal Substances 0.000 claims abstract description 86
- 239000010410 layer Substances 0.000 claims abstract description 84
- 239000012790 adhesive layer Substances 0.000 claims abstract description 34
- 238000007639 printing Methods 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract 4
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- -1 phosphorus compound Chemical class 0.000 claims description 29
- 239000000945 filler Substances 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 12
- 238000007645 offset printing Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000003063 flame retardant Substances 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical group [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical group OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical group OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000001099 ammonium carbonate Substances 0.000 claims description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical group [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 4
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-N carbonic acid monoamide Natural products NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 125000000524 functional group Chemical class 0.000 claims description 4
- 238000007646 gravure printing Methods 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 238000010022 rotary screen printing Methods 0.000 claims description 4
- 229940100890 silver compound Drugs 0.000 claims description 4
- 150000003379 silver compounds Chemical class 0.000 claims description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical group O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical group [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical group [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 239000000920 calcium hydroxide Substances 0.000 claims description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- IBAHLNWTOIHLKE-UHFFFAOYSA-N cyano cyanate Chemical group N#COC#N IBAHLNWTOIHLKE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical group 0.000 claims description 3
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Chemical group SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000010452 phosphate Chemical group 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical group [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 229920000642 polymer Chemical class 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Chemical group 0.000 claims description 3
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 claims description 3
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 claims description 3
- 229940007718 zinc hydroxide Drugs 0.000 claims description 3
- 229910021511 zinc hydroxide Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000012798 spherical particle Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 96
- 230000008569 process Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000010944 silver (metal) Substances 0.000 description 8
- 230000009975 flexible effect Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- BVCZEBOGSOYJJT-UHFFFAOYSA-N ammonium carbamate Chemical compound [NH4+].NC([O-])=O BVCZEBOGSOYJJT-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- UDXBSNUCGGXUNH-UHFFFAOYSA-N 2-cyanoethylazanium;2-cyanoethyl carbonate Chemical compound [NH3+]CCC#N.[O-]C(=O)OCCC#N UDXBSNUCGGXUNH-UHFFFAOYSA-N 0.000 description 1
- XEXHIBLRARSXCL-UHFFFAOYSA-N 2-cyanoethylazanium;hydrogen carbonate Chemical compound OC([O-])=O.[NH3+]CCC#N XEXHIBLRARSXCL-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- OZDFMZUKOBBNHM-UHFFFAOYSA-N 2-ethylhexyl carbamate Chemical compound CCCCC(CC)COC(N)=O OZDFMZUKOBBNHM-UHFFFAOYSA-N 0.000 description 1
- WRJRTLNJQQNHLC-UHFFFAOYSA-N 2-ethylhexylazanium;2-ethylhexyl carbonate Chemical compound CCCCC(CC)C[NH3+].CCCCC(CC)COC([O-])=O WRJRTLNJQQNHLC-UHFFFAOYSA-N 0.000 description 1
- LFTWYPLGYKQPMV-UHFFFAOYSA-N 2-ethylhexylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CCCCC(CC)C[NH3+] LFTWYPLGYKQPMV-UHFFFAOYSA-N 0.000 description 1
- NNHMJLWANZZIRG-UHFFFAOYSA-N 2-methoxyethanamine 2-methoxyethyl carbamate Chemical compound COCCN.COCCOC(N)=O NNHMJLWANZZIRG-UHFFFAOYSA-N 0.000 description 1
- HTBCQGGKQJBADY-UHFFFAOYSA-N 2-methoxyethylazanium;2-methoxyethyl carbonate Chemical compound COCC[NH3+].COCCOC([O-])=O HTBCQGGKQJBADY-UHFFFAOYSA-N 0.000 description 1
- IUPKRHGZXTZBKD-UHFFFAOYSA-N 2-methylpropan-1-amine 2-methylpropyl carbamate Chemical compound CC(C)CN.CC(C)COC(N)=O IUPKRHGZXTZBKD-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- PMPXTVNEQKJCMX-UHFFFAOYSA-N 3-aminopropanenitrile 2-cyanoethyl carbamate Chemical compound NCCC#N.NC(=O)OCCC#N PMPXTVNEQKJCMX-UHFFFAOYSA-N 0.000 description 1
- IGDXYWDETCLQJX-UHFFFAOYSA-N 3-triethoxysilylpropan-1-amine 3-triethoxysilylpropyl carbamate Chemical compound CCO[Si](OCC)(OCC)CCCN.CCO[Si](OCC)(OCC)CCCOC(N)=O IGDXYWDETCLQJX-UHFFFAOYSA-N 0.000 description 1
- SKRSRJOKBARNAS-UHFFFAOYSA-N 3-triethoxysilylpropylazanium;3-triethoxysilylpropyl carbonate Chemical compound CCO[Si](OCC)(OCC)CCC[NH3+].CCO[Si](OCC)(OCC)CCCOC([O-])=O SKRSRJOKBARNAS-UHFFFAOYSA-N 0.000 description 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- UFGRWTLTISXGJP-UHFFFAOYSA-N C(OCC(C)C)([O-])=O.[NH4+] Chemical compound C(OCC(C)C)([O-])=O.[NH4+] UFGRWTLTISXGJP-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- HWVVYUPLWARZKN-UHFFFAOYSA-N N-butylbutan-1-amine dibutyl carbonate Chemical compound CCCCNCCCC.CCCCOC(=O)OCCCC HWVVYUPLWARZKN-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KOOADCGQJDGAGA-UHFFFAOYSA-N [amino(dimethyl)silyl]methane Chemical class C[Si](C)(C)N KOOADCGQJDGAGA-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- ZSIQJIWKELUFRJ-UHFFFAOYSA-N azepane Chemical compound C1CCCNCC1 ZSIQJIWKELUFRJ-UHFFFAOYSA-N 0.000 description 1
- GHFDYTIELHTMGV-UHFFFAOYSA-N benzyl carbamate;phenylmethanamine Chemical compound NCC1=CC=CC=C1.NC(=O)OCC1=CC=CC=C1 GHFDYTIELHTMGV-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- QJLWYBRKZCYIEK-UHFFFAOYSA-N benzylazanium;benzyl carbonate Chemical compound [NH3+]CC1=CC=CC=C1.[O-]C(=O)OCC1=CC=CC=C1 QJLWYBRKZCYIEK-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- DDWQBJYWGXHLCN-UHFFFAOYSA-N butan-1-amine;butylcarbamic acid Chemical compound CCCC[NH3+].CCCCNC([O-])=O DDWQBJYWGXHLCN-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical group CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SCJNFWUKTOYSRT-UHFFFAOYSA-N butylazanium;butyl carbonate Chemical compound CCCC[NH3+].CCCCOC([O-])=O SCJNFWUKTOYSRT-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 125000004802 cyanophenyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FNPQBMYFLGSBBI-UHFFFAOYSA-N decyl(methyl)azanium;n-decyl-n-methylcarbamate Chemical compound CCCCCCCCCC[NH2+]C.CCCCCCCCCCN(C)C([O-])=O FNPQBMYFLGSBBI-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JKZDDFARANSOQU-UHFFFAOYSA-N diazanium;morpholine;carbonate Chemical compound [NH4+].[NH4+].[O-]C([O-])=O.C1COCCN1.C1COCCN1 JKZDDFARANSOQU-UHFFFAOYSA-N 0.000 description 1
- LXSFGVACVWCFRS-UHFFFAOYSA-N dibutylazanium;n,n-dibutylcarbamate Chemical compound CCCC[NH2+]CCCC.CCCCN(C([O-])=O)CCCC LXSFGVACVWCFRS-UHFFFAOYSA-N 0.000 description 1
- HSFZJWNDRZGOKZ-UHFFFAOYSA-N dioctadecyl carbonate N-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC.CCCCCCCCCCCCCCCCCCOC(=O)OCCCCCCCCCCCCCCCCCC HSFZJWNDRZGOKZ-UHFFFAOYSA-N 0.000 description 1
- WVDBSYPGKQYWSS-UHFFFAOYSA-N dioctadecylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CCCCCCCCCCCCCCCCCC[NH2+]CCCCCCCCCCCCCCCCCC WVDBSYPGKQYWSS-UHFFFAOYSA-N 0.000 description 1
- AYGOKHJRGBNMGQ-UHFFFAOYSA-N dioctadecylazanium;n,n-dioctadecylcarbamate Chemical compound CCCCCCCCCCCCCCCCCC[NH2+]CCCCCCCCCCCCCCCCCC.CCCCCCCCCCCCCCCCCCN(C([O-])=O)CCCCCCCCCCCCCCCCCC AYGOKHJRGBNMGQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WAAUVORLARCBAF-UHFFFAOYSA-N ethylazanium;ethyl carbonate Chemical compound CC[NH3+].CCOC([O-])=O WAAUVORLARCBAF-UHFFFAOYSA-N 0.000 description 1
- GPUHGQYNYJIMDZ-UHFFFAOYSA-N ethylazanium;n-ethylcarbamate Chemical compound CC[NH3+].CCNC([O-])=O GPUHGQYNYJIMDZ-UHFFFAOYSA-N 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- RGEULEMUWRTZMP-UHFFFAOYSA-N hydrogen carbonate;2-methoxyethylazanium Chemical compound OC([O-])=O.COCC[NH3+] RGEULEMUWRTZMP-UHFFFAOYSA-N 0.000 description 1
- YCADFRFBAHDVOS-UHFFFAOYSA-N hydrogen carbonate;propan-2-ylazanium Chemical compound CC(C)[NH3+].OC([O-])=O YCADFRFBAHDVOS-UHFFFAOYSA-N 0.000 description 1
- NZYYSSZGIPELSX-UHFFFAOYSA-N hydrogen carbonate;pyridin-1-ium Chemical compound OC(O)=O.C1=CC=NC=C1 NZYYSSZGIPELSX-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- NPHYYTMURMCAQE-UHFFFAOYSA-N morpholin-4-ium;n-morpholin-4-ylcarbamate Chemical compound C1COCC[NH2+]1.[O-]C(=O)NN1CCOCC1 NPHYYTMURMCAQE-UHFFFAOYSA-N 0.000 description 1
- IKVDMBQGHZVMRN-UHFFFAOYSA-N n-methyldecan-1-amine Chemical compound CCCCCCCCCCNC IKVDMBQGHZVMRN-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BTDGNUHTDOIMKX-UHFFFAOYSA-N octadecan-1-amine octadecyl carbamate Chemical compound CCCCCCCCCCCCCCCCCCN.CCCCCCCCCCCCCCCCCCOC(N)=O BTDGNUHTDOIMKX-UHFFFAOYSA-N 0.000 description 1
- XKFXSYSPQZRVOY-UHFFFAOYSA-N octadecylazanium;octadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCCC[NH3+].CCCCCCCCCCCCCCCCCCOC([O-])=O XKFXSYSPQZRVOY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- AHIHJODVQGBOND-UHFFFAOYSA-M propan-2-yl carbonate Chemical compound CC(C)OC([O-])=O AHIHJODVQGBOND-UHFFFAOYSA-M 0.000 description 1
- MPXHWRXXJUKENG-UHFFFAOYSA-N propan-2-ylazanium;n-propan-2-ylcarbamate Chemical compound CC(C)[NH3+].CC(C)NC([O-])=O MPXHWRXXJUKENG-UHFFFAOYSA-N 0.000 description 1
- TZRORHHMAGATLL-UHFFFAOYSA-N propan-2-ylazanium;propan-2-yl carbonate Chemical compound CC(C)[NH3+].CC(C)OC([O-])=O TZRORHHMAGATLL-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- XKXIQBVKMABYQJ-UHFFFAOYSA-M tert-butyl carbonate Chemical compound CC(C)(C)OC([O-])=O XKXIQBVKMABYQJ-UHFFFAOYSA-M 0.000 description 1
- YSEKXGQQTHQQMK-UHFFFAOYSA-N tert-butylazanium;hydrogen carbonate Chemical compound OC([O-])=O.CC(C)(C)[NH3+] YSEKXGQQTHQQMK-UHFFFAOYSA-N 0.000 description 1
- XBXCNNQPRYLIDE-UHFFFAOYSA-N tert-butylcarbamic acid Chemical compound CC(C)(C)NC(O)=O XBXCNNQPRYLIDE-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- ZFNFNJYRZOQPJF-UHFFFAOYSA-N trimethoxy(sulfanyl)silane Chemical compound CO[Si](S)(OC)OC ZFNFNJYRZOQPJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Xは、酸素、硫黄、ハロゲン、シアノ、シアネート、カーボネート、硝酸(nitrate)、亜硝酸塩(nitrite)、硫酸(Sulfate)、ホスフェート(phosphate)、チオシアネート、塩素酸塩(chlorate)、過塩素酸塩(perchlorate)、テトラフルオロホウ酸塩(tetrafluoroborate)、アセチルアセトネート(acetylacetonate)、カルボキシレート及びそれらの誘導体から選択される置換基であり、nは、1〜4の整数であり、R1〜R6は、互いに独立的に水素、C1〜C30の脂肪族か脂環族アルキル基、アリール基またはアラルキル(aralkyl)基、官能基が置換されたアルキル及びアリール基、そしてヘテロ環化合物と高分子化合物及びその誘導体から選択される置換基であり、ただし、R1〜R6がすべて水素の場合は除く)
Xは、酸素、硫黄、ハロゲン、シアノ、シアネート、カーボネート、硝酸(nitrate)、亜硝酸塩(nitrite)、硫酸(Sulfate)、ホスフェート(phosphate)、チオシアネート、塩素酸塩(chlorate)、過塩素酸塩(perchlorate)、テトラフルオロホウ酸塩(tetrafluoroborate)、アセチルアセトネート(acetylacetonate)、カルボキシレート及びそれらの誘導体から選択される置換基であり、nは、1〜4の整数であり、R1〜R6は、互いに独立的に水素、C1〜C30の脂肪族か脂環族アルキル基、アリール基またはアラルキル(aralkyl)基、官能基が置換されたアルキル及びアリール基、そしてヘテロ環化合物と高分子化合物及びその誘導体から選択される置換基であり、ただし、R1〜R6がすべて水素の場合は除く)
ト、ベンジルアンモニウムベンジルカルバメート、トリエトキシシリルプロピルアンモニウムトリエトキシシリルプロピルカルバメート、エチルアンモニウムエチルカーボネート、イソプロピルアンモニウムイソプロピルカーボネート、イソプロピルアンモニウムバイカーボネート、n−ブチルアンモニウムn−ブチルカーボネート、イソブチルアンモニウムイソブチルカーボネート、t−ブチルアンモニウムt−ブチルカーボネート、t−ブチルアンモニウムバイカーボネート、2−エチルヘキシルアンモニウム2−エチルヘキシルカーボネート、2−エチルヘキシルアンモニウムバイカーボネート、2−メトキシエチルアンモニウム2−メトキシエチルカーボネート、2−メトキシエチルアンモニウムバイカーボネート、2−シアノエチルアンモニウム2−シアノエチルカーボネート、2−シアノエチルアンモニウムバイカーボネート、オクタデシルアンモニウムオクタデシルカーボネート、ジブチルアンモニウムジブチルカーボネート、ジオクタデシルアンモニウムジオクタデシルカーボネート、ジオクタデシルアンモニウムバイカーボネート、メチルデシルアンモニウムメチルデシルカーボネート、ヘキサメチレンイミンアンモニウムヘキサメチレンイミンカーボネート、モルホリンアンモニウムモルホリンカーボネート、ベンジルアンモニウムベンジルカーボネート、トリエトキシシリルプロピルアンモニウムトリエトキシシリルプロピルカーボネート、ピリジニウムバイカーボネート、トリエチレンジアミニウムイソプロピルカーボネート、トリエチレンジアミニウムバイカーボネート及びその誘導体から選択される1種または2種以上の混合物であることができる。
11:第1離型フィルム
12:第2離型フィルム
20:絶縁層
30:金属パターン
40:導電性接着剤層
Claims (16)
- 第1離型フィルム上に絶縁層を形成する絶縁層形成段階と、
前記絶縁層上に金属パターンを印刷する金属パターン形成段階と、
第2離型フィルム上に導電性接着剤層を形成する導電性接着剤層形成段階、及び
前記金属パターンと前記導電性接着剤層が当接するように前記第1離型フィルム及び第2離型フィルムを合紙して電磁波遮蔽フィルムを形成する離型フィルム合紙段階を含む電磁波遮蔽フィルムの製造方法。 - 前記絶縁層形成段階は、
熱可塑性樹脂及び熱硬化性樹脂のうちの少なくとも1つの樹脂と難燃性フィラー及び耐摩耗性フィラーのうちの少なくとも1つのフィラーを含む絶縁性樹脂組成物をコーティングする段階、及び
コーティングされた前記絶縁性樹脂組成物が半硬化状態となるように乾燥する段階を含む請求項1に記載の電磁波遮蔽フィルムの製造方法。 - 前記難燃性フィラーは、水酸化アルミニウム、リン化合物、水酸化亜鉛または水酸化カルシウムのうちの少なくとも1つである請求項2に記載の電磁波遮蔽フィルムの製造方法。
- 前記耐摩耗性フィラーは、水酸化チタン、シリカ、酸化ジルコニウムまたは酸化亜鉛のうちの少なくとも1つである請求項2に記載の電磁波遮蔽フィルムの製造方法。
- 前記金属パターンは、第1方向に沿って形成される第1ライン及び第1方向と交差する方向である第2方向に沿って形成される第2ラインを含む請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 前記金属パターンは、複数の単位図形が相互に連結された形態であり、前記単位図形は、円、楕円または多角形である請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 前記金属パターンは、線幅が100〜500μmであり、厚さが0.05〜2.0μmである請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 前記金属パターンは、銀(Ag)インク組成物を用いて印刷することによって形成され、
前記銀インク組成物は、下記化学式1で表される1つ以上の銀化合物と、下記化学式2〜化学式4で表される化合物のうちの少なくとも1つのアンモニウムカルバメート系化合物またはアンモニウムカーボネート系化合物を反応させて得られる銀錯体化合物を含有する請求項1に記載の電磁波遮蔽フィルムの製造方法。
Xは、酸素、硫黄、ハロゲン、シアノ、シアネート、カーボネート、硝酸(nitrate)、亜硝酸塩(nitrite)、硫酸(Sulfate)、ホスフェート(phosphate)、チオシアネート、塩素酸塩(chlorate)、過塩素酸塩(perchlorate)、テトラフルオロホウ酸塩(tetrafluoroborate)、アセチルアセトネート(acetylacetonate)、カルボキシレート及びそれらの誘導体から選択される置換基であり、nは、1〜4の整数であり、R1〜R6は、互いに独立的に水素、C1〜C30の脂肪族か脂環族アルキル基、アリール基またはアラルキル(aralkyl)基、官能基が置換されたアルキル及びアリール基、そしてヘテロ環化合物と高分子化合物及びその誘導体から選択される置換基であり、ただし、R1〜R6がすべて水素の場合は除く) - 前記金属パターンは、ダイレクトグラビア印刷法、フレキソ印刷法、オフセット印刷法、グラビアオフセット印刷法、リバースオフセット印刷法、ディスペンシング、スクリーン印刷法、ロータリースクリーン印刷法またはインクジェット印刷法により前記絶縁層上に印刷される請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 前記導電性接着剤層は、銀球状粒子または銀フレーク状のうちの少なくとも1つの導電性フィラーを含む請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 前記導電性接着剤層形成段階は、
導電性接着組成物を前記第2離型フィルム上にコーティングする段階、及び
コーティングされた前記導電性接着組成物が半硬化状態となるように乾燥する段階を含む請求項1に記載の電磁波遮蔽フィルムの製造方法。 - 前記第2離型フィルムの粘着力は、前記第1離型フィルムの粘着力に対して1.05〜1.5である請求項1に記載の電磁波遮蔽フィルムの製造方法。
- 請求項1〜12のいずれかに記載の方法によって製造された電磁波遮蔽フィルム。
- 絶縁性樹脂を含む絶縁層、
前記絶縁層上に形成され、金属インク組成物を含む金属パターン、及び
前記金属パターン上に形成され、導電性接着組成物を含む電磁波遮蔽フィルム。 - 前記電磁波遮蔽フィルムの少なくとも一面に離型フィルムをさらに含む請求項14に記載の電磁波遮蔽フィルム。
- 前記金属パターンは、線幅は100〜500μmであり、厚さは0.05〜2.0μmである請求項14に記載の電磁波遮蔽フィルム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130164330A KR20150075912A (ko) | 2013-12-26 | 2013-12-26 | 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 |
KR10-2013-0164330 | 2013-12-26 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014265459A Division JP2015126230A (ja) | 2013-12-26 | 2014-12-26 | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムmethodformanufacturingelectromagneticinterferenceshieldingfilmandelectromagneticinterferenceshieldingfilmmanufacturedthereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020144609A Division JP2021002664A (ja) | 2013-12-26 | 2020-08-28 | 電磁波遮蔽フィルムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017143275A true JP2017143275A (ja) | 2017-08-17 |
JP2017143275A5 JP2017143275A5 (ja) | 2018-02-15 |
Family
ID=53536703
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014265459A Pending JP2015126230A (ja) | 2013-12-26 | 2014-12-26 | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムmethodformanufacturingelectromagneticinterferenceshieldingfilmandelectromagneticinterferenceshieldingfilmmanufacturedthereof |
JP2017038742A Pending JP2017143275A (ja) | 2013-12-26 | 2017-03-01 | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム |
JP2020144609A Pending JP2021002664A (ja) | 2013-12-26 | 2020-08-28 | 電磁波遮蔽フィルムの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014265459A Pending JP2015126230A (ja) | 2013-12-26 | 2014-12-26 | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムmethodformanufacturingelectromagneticinterferenceshieldingfilmandelectromagneticinterferenceshieldingfilmmanufacturedthereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020144609A Pending JP2021002664A (ja) | 2013-12-26 | 2020-08-28 | 電磁波遮蔽フィルムの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (3) | JP2015126230A (ja) |
KR (1) | KR20150075912A (ja) |
CN (2) | CN104754861A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200101807A (ko) * | 2019-02-20 | 2020-08-28 | 주식회사 코모텍 | 인라인형 멀티 코팅장치 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150075912A (ko) * | 2013-12-26 | 2015-07-06 | 주식회사 잉크테크 | 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 |
WO2017026211A1 (ja) * | 2015-08-11 | 2017-02-16 | コニカミノルタ株式会社 | 機能性シート |
KR20180066508A (ko) * | 2016-12-09 | 2018-06-19 | 공주대학교 산학협력단 | 전자파 차폐용 블록필름 |
KR102119594B1 (ko) * | 2017-03-06 | 2020-06-05 | 주식회사 아모그린텍 | 파워 릴레이 어셈블리 |
CN107511302A (zh) * | 2017-08-16 | 2017-12-26 | 苏州城邦达力材料科技有限公司 | 屏蔽膜的加工系统及方法 |
US20200267844A1 (en) * | 2019-02-18 | 2020-08-20 | Jabil Inc. | Adhesive Circuit Patterning Process |
KR102212079B1 (ko) * | 2019-03-22 | 2021-02-04 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전자 어셈블리, 이를 포함하는 전자 장치 및 전자 어셈블리를 제작하는 방법 |
CN112210321A (zh) * | 2019-07-12 | 2021-01-12 | 臻鼎科技股份有限公司 | 导电粘着剂以及使用其的电磁波屏蔽膜和电路板 |
JP6690773B1 (ja) * | 2019-12-18 | 2020-04-28 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
CN111050466A (zh) * | 2019-12-31 | 2020-04-21 | 安捷利(番禺)电子实业有限公司 | 插入损耗低且剥离强度大的pcb及其制作方法 |
CN111246719A (zh) * | 2020-02-26 | 2020-06-05 | 东莞市华卓电子科技有限公司 | 一种5g电磁膜的生产方法 |
DE102020128367A1 (de) * | 2020-10-28 | 2022-04-28 | Te Connectivity Germany Gmbh | Anordnung mit einem aus mindestens drei aufeinanderliegenden Blechlagen zusammengefügten Blechstapel |
CN112831290B (zh) * | 2020-12-25 | 2022-12-06 | 领胜城科技(江苏)有限公司 | 一种可挠电磁屏蔽胶带的制备方法 |
KR102572146B1 (ko) * | 2021-08-03 | 2023-08-30 | 주식회사 볼트크리에이션 | 전자파 차폐 시트 및 그 제조방법 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62124896U (ja) * | 1986-01-28 | 1987-08-08 | ||
JPS62145399U (ja) * | 1986-03-06 | 1987-09-12 | ||
JPH05235495A (ja) * | 1992-02-21 | 1993-09-10 | Sumitomo Electric Ind Ltd | シールド付フレキシブルプリント配線板 |
JPH06152178A (ja) * | 1992-11-13 | 1994-05-31 | Kansai Paint Co Ltd | 電波反射防止体および電波反射防止方法 |
JP2000036685A (ja) * | 1998-05-15 | 2000-02-02 | Nippon Paint Co Ltd | 電磁波吸収材 |
JP2009126115A (ja) * | 2007-11-27 | 2009-06-11 | Furukawa Electric Co Ltd:The | 積層板及びこれを用いた製品 |
JP2009289840A (ja) * | 2008-05-28 | 2009-12-10 | Toyo Ink Mfg Co Ltd | 電磁波シールド性接着フィルム |
JP2011171522A (ja) * | 2010-02-19 | 2011-09-01 | Toyo Ink Sc Holdings Co Ltd | 硬化性電磁波シールド性接着性フィルムおよびその製造方法 |
JP2013168643A (ja) * | 2012-01-17 | 2013-08-29 | Toyo Ink Sc Holdings Co Ltd | 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法 |
JP2013538439A (ja) * | 2010-06-23 | 2013-10-10 | インクテック カンパニー リミテッド | 電磁波シールドフィルムの製造方法及びこれにより製造された電磁波シールドフィルム |
JP2015126230A (ja) * | 2013-12-26 | 2015-07-06 | インクテック カンパニー, リミテッドInktec Co., Ltd. | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムmethodformanufacturingelectromagneticinterferenceshieldingfilmandelectromagneticinterferenceshieldingfilmmanufacturedthereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070275237A1 (en) * | 2006-05-24 | 2007-11-29 | Syh-Tau Yeh | Electromagnetic shielding tape |
US8426749B2 (en) * | 2007-05-09 | 2013-04-23 | Fujifilm Corporation | Electromagnetic shielding film and optical filter |
KR101361533B1 (ko) * | 2012-04-12 | 2014-02-13 | 한화엘앤씨 주식회사 | 전자기파 차폐 필름 제조방법 |
CN203015375U (zh) * | 2012-12-20 | 2013-06-19 | 深圳科诺桥科技有限公司 | 印刷电路板及高填充性电磁屏蔽膜 |
-
2013
- 2013-12-26 KR KR1020130164330A patent/KR20150075912A/ko active Application Filing
-
2014
- 2014-12-25 CN CN201410828123.4A patent/CN104754861A/zh active Pending
- 2014-12-25 CN CN201910445962.0A patent/CN110177450A/zh active Pending
- 2014-12-26 JP JP2014265459A patent/JP2015126230A/ja active Pending
-
2017
- 2017-03-01 JP JP2017038742A patent/JP2017143275A/ja active Pending
-
2020
- 2020-08-28 JP JP2020144609A patent/JP2021002664A/ja active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62124896U (ja) * | 1986-01-28 | 1987-08-08 | ||
JPS62145399U (ja) * | 1986-03-06 | 1987-09-12 | ||
JPH05235495A (ja) * | 1992-02-21 | 1993-09-10 | Sumitomo Electric Ind Ltd | シールド付フレキシブルプリント配線板 |
JPH06152178A (ja) * | 1992-11-13 | 1994-05-31 | Kansai Paint Co Ltd | 電波反射防止体および電波反射防止方法 |
JP2000036685A (ja) * | 1998-05-15 | 2000-02-02 | Nippon Paint Co Ltd | 電磁波吸収材 |
JP2009126115A (ja) * | 2007-11-27 | 2009-06-11 | Furukawa Electric Co Ltd:The | 積層板及びこれを用いた製品 |
JP2009289840A (ja) * | 2008-05-28 | 2009-12-10 | Toyo Ink Mfg Co Ltd | 電磁波シールド性接着フィルム |
JP2011171522A (ja) * | 2010-02-19 | 2011-09-01 | Toyo Ink Sc Holdings Co Ltd | 硬化性電磁波シールド性接着性フィルムおよびその製造方法 |
JP2013538439A (ja) * | 2010-06-23 | 2013-10-10 | インクテック カンパニー リミテッド | 電磁波シールドフィルムの製造方法及びこれにより製造された電磁波シールドフィルム |
JP2013168643A (ja) * | 2012-01-17 | 2013-08-29 | Toyo Ink Sc Holdings Co Ltd | 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法 |
JP2015126230A (ja) * | 2013-12-26 | 2015-07-06 | インクテック カンパニー, リミテッドInktec Co., Ltd. | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルムmethodformanufacturingelectromagneticinterferenceshieldingfilmandelectromagneticinterferenceshieldingfilmmanufacturedthereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200101807A (ko) * | 2019-02-20 | 2020-08-28 | 주식회사 코모텍 | 인라인형 멀티 코팅장치 |
KR102236577B1 (ko) * | 2019-02-20 | 2021-04-06 | 주식회사 코모텍 | 인라인형 멀티 코팅장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20150075912A (ko) | 2015-07-06 |
JP2021002664A (ja) | 2021-01-07 |
JP2015126230A (ja) | 2015-07-06 |
CN110177450A (zh) | 2019-08-27 |
CN104754861A (zh) | 2015-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017143275A (ja) | 電磁波遮蔽フィルムの製造方法及びこれから製造された電磁波遮蔽フィルム | |
TWI514957B (zh) | 製造電磁干擾屏蔽膜之方法 | |
CN204168593U (zh) | 电磁波屏蔽薄膜、使用其的印刷电路板、及压延铜箔 | |
CN103609207B (zh) | 电磁波干扰抑制体 | |
JP6970025B2 (ja) | 電磁波シールドフィルム | |
TWI699787B (zh) | 導電性黏著劑組成物 | |
TW201601915A (zh) | 電磁波干擾遮蔽薄膜 | |
CN107743357A (zh) | 用于电子产品的吸波片 | |
JP6949724B2 (ja) | 電磁波シールドフィルム及びその製造方法 | |
JP6511550B1 (ja) | 電磁波シールドフィルム | |
CN102140316A (zh) | 导电胶膜及其制备方法 | |
JP2015073105A (ja) | 電磁波シールド性フィルム、及び配線板 | |
WO2016088826A1 (ja) | 複合型電磁波抑制体 | |
JP2013026324A (ja) | 複合磁性体 | |
KR20190126266A (ko) | 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 | |
CN1174814C (zh) | 电缆的抗腐蚀镀层和包带 | |
KR20170006301A (ko) | 전자파 차폐필름의 제조방법 및 이로부터 제조된 전자파 차폐필름 | |
KR101411978B1 (ko) | 금속화 고분자필름에 착색층이 형성된 전자파 차폐용 접착테이프의 제조방법 및 그에 의한 접착테이프 | |
TW202028398A (zh) | 電磁屏蔽膜及其製作方法 | |
JP2009125974A (ja) | 難燃性積層シート | |
CN114762470A (zh) | 电磁波屏蔽膜 | |
CN109890187A (zh) | Fpc电磁屏蔽膜及其制作方法 | |
TWI842957B (zh) | 電磁波屏蔽膜 | |
CN115004875A (zh) | 电磁波屏蔽膜 | |
CN114731777A (zh) | 电磁波屏蔽膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171226 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171226 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190312 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190612 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190827 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20191126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200227 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200428 |