CN105491786A - 适用于高频信号的电磁屏蔽膜及其制造工艺 - Google Patents
适用于高频信号的电磁屏蔽膜及其制造工艺 Download PDFInfo
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Abstract
本发明公开了一种适用于高频信号的电磁屏蔽膜及其制造工艺,该电磁屏蔽膜包括:金属层、涂布于金属层一面的耐高温绝缘层以及涂布于金属层另一面的单向导电胶黏剂层,耐高温绝缘层上贴合有载体薄膜层。有益之处在于:本发明的适用于高频信号的电磁屏蔽膜带有金属层,屏蔽性能好,单向导电胶黏剂层具有优异的导通性能,耐高温绝缘层具有良好的绝缘性和耐弯折性,能够耐340℃*30sec温度,同时能满足柔性线路板行业的柔软性要求;而且,本发明的制造工艺容易实现,通过常规的FPC加工工艺(如涂布、贴合等)即可实现,方便工业推广应用。
Description
技术领域
本发明涉及一种适用于高频信号的电磁屏蔽膜及其制造工艺,具有高电磁波屏蔽的特点。
背景技术
印刷线路板是电子产品中不可或缺的材料,目前被广泛应用于计算机及其外围设备、通讯产品以及消费性电子产品中,随着消费性电子产品需求持续增长,对于印刷电路板的要求也是与日俱增。在柔性印刷线路板行业,随着智能手机、Ipad等电子设备的更新换代,对电磁屏蔽的要求也越来越高。在柔性线路板的加工过程中,线路上就会大量地使用电磁屏蔽膜材料。
随着柔性线路板基材的发展,高频线路逐步出现,并越来越受到重视和发展,高频线路的出现对电磁屏蔽又提出了更高的要求,比如USB3.0等,传输速度是USB2.0的10倍以上,快速,信息量大,信号清晰稳定是未来的主题。因此,适用于高频信号的电磁屏蔽膜成为未来的导向,而该领域的技术空白有待填补。
发明内容
为解决现有技术的不足,本发明的目的在于提供一种适用于高频信号的电磁屏蔽膜及其制造工艺。
为了实现上述目标,本发明采用如下的技术方案:
适用于高频信号的电磁屏蔽膜,其特征在于,包括:金属层、涂布于金属层一面的耐高温绝缘层以及涂布于金属层另一面的单向导电胶黏剂层,所述耐高温绝缘层上贴合有载体薄膜层,该电磁屏蔽膜为“四层结构”。
进一步地,前述单向导电胶黏剂层上还设有一层离型保护层,从而形成了“五层结构”的电磁屏蔽膜。
优选地,前述金属层为金属箔,所述金属箔由银、铜、铝、镍中的一种或几种的混合物制成,厚度为2-12μm。
更优选地,前述耐高温绝缘层为聚酰亚胺,厚度为3-50μm。
再优选地,前述单向导电胶黏剂层由胶黏剂主体和分布于胶黏剂主体中的导电粉组成,导电粉的材料为银粉、银包铜粉、铜粉和镍粉中的一种或几种的混合物,胶黏剂主体为改性环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂中的一种或几种的混合物,单向导电胶黏剂层的厚度为3-15μm,导电粉的粒径为1-15μm。
进一步优选地,前述载体薄膜层为高分子聚合物薄膜层,选自PET、PEN、PI、PBT、PPS薄膜中的一种或几种的改性薄膜,厚度为25-200μm。而且,载体薄膜层表面带有与耐高温绝缘层粘接的微粘胶,能够和耐高温绝缘层良好粘连,不容易脱层。
再优选地,前述离型保护层为PET离型膜、PP离型膜、PBT离型膜及离型纸中的一种,在离型保护层上涂布有硅油或非硅油离型剂,离型保护膜层的厚度为12-200μm,赋予该单向导电胶黏剂层能够轻松剥离的特性。
此外,本发明还公开了前述的“四层结构”的电磁屏蔽膜的制造工艺,步骤如下:
A1、在金属层的一面涂布耐高温绝缘层,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层厚度为2-12μm,耐高温绝缘层的涂布厚度为3-50μm;
A2、利用烘箱对卷状带耐高温绝缘层的金属层进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层牢固地粘附在金属层表面;
A3、在金属层的另一面上涂布单向导电胶黏剂层,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
A4、在耐高温绝缘层上贴合载体薄膜层,使载体薄膜层上的微粘胶面与耐高温绝缘层紧密贴合;
A5、收卷。
前述的“五层结构”电磁屏蔽膜的制造工艺,步骤如下:
B1、在金属层的一面涂布耐高温绝缘层,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层厚度为2-12μm,耐高温绝缘层的涂布厚度为3-50μm;
B2、利用烘箱对卷状带耐高温绝缘层的金属层进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层牢固地粘附在金属层表面;
B3、在金属层的另一面上涂布单向导电胶黏剂层,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
B4、在单向导电胶黏剂层上热贴合一层离型保护层;
B5、在耐高温绝缘层上贴合载体薄膜层,使载体薄膜层上的微粘胶面与耐高温绝缘层面紧密贴合;
B6、收卷。
本发明的有益之处在于:本发明的适用于高频信号的电磁屏蔽膜带有金属层,屏蔽性能好,单向导电胶黏剂层具有优异的导通性能,耐高温绝缘层具有良好的绝缘性和耐弯折性,能够耐340℃*30sec温度,同时能满足柔性线路板行业的柔软性要求;而且,本发明的制造工艺容易实现,通过常规的FPC加工工艺(如涂布、贴合等)即可实现,方便工业推广应用。
附图说明
图1是本发明的“四层结构”电磁屏蔽膜的结构示意图;
图2是本发明的“五层解雇”电磁屏蔽膜的结构示意图。
图中附图标记的含义:1、载体薄膜层,2、耐高温绝缘层,3、金属层,4、单向导电胶黏剂层,5、离型保护层。
具体实施方式
以下结合附图和具体实施例对本发明作具体的介绍。
参见图1,本发明的四层结构的适用于高频信号的电磁屏蔽膜包括:金属层3、涂布于金属层3一面的耐高温绝缘层2以及涂布于金属层3另一面的单向导电胶黏剂层4,耐高温绝缘层2上贴合有载体薄膜层1。参见图2,“五层结构”的电磁屏蔽膜,即是在单向导电胶黏剂层4上还设有一层离型保护层5。
金属层3为金属箔,由银、铜、铝、镍中的一种或几种的混合物制成,厚度为2-12μm。耐高温绝缘层2具有柔软和绝缘的特性,具体材料为聚酰亚胺(如热塑性聚酰亚胺,TPI),厚度为3-50μm。单向导电胶黏剂层4由胶黏剂主体和分布于胶黏剂主体中的导电粉组成,导电粉的材料为银粉、银包铜粉、铜粉和镍粉中的一种或几种的混合物,胶黏剂主体为改性环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂中的一种或几种的混合物,单向导电胶黏剂层4的厚度为3-15μm,导电粉的粒径为1-15μm。载体薄膜层1对耐高温绝缘层2起到承载作用,一般为高分子聚合物薄膜层,具体可选自PET、PEN、PI、PBT、PPS薄膜中的一种或几种的改性薄膜,厚度为25-200μm;而且,载体薄膜层1表面带有与耐高温绝缘层2粘接的微粘胶,能够和耐高温绝缘层2良好粘连,不容易脱层。
图2中的离型保护层5为PET离型膜、PP离型膜、PBT离型膜及离型纸中的一种,在离型保护层5上涂布有硅油或非硅油离型剂,离型保护膜层的厚度为12-200μm,赋予该单向导电胶黏剂层4能够轻松剥离的特性。
本发明的四层结构和五层结构的电磁屏蔽膜均具有良好的柔韧性,厚度超薄,耐热性能满足焊锡液浸泡达到340℃*30秒,不分层起泡,并且具有良好的导通性能,导通电阻在100毫欧姆以下,电磁屏蔽效果良好,能够达到70db以上,很好地满足了电子产品行业的需求。
为了更好地应用本发明,下面对本发明的“四层结构”的电磁屏蔽膜的制造工艺进行介绍,步骤如下:
A1、在金属层3的一面涂布耐高温绝缘层2,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层3厚度为2-12μm,耐高温绝缘层2的涂布厚度为3-50μm;
A2、利用烘箱对卷状带耐高温绝缘层2的金属层3进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层2牢固地粘附在金属层3表面;
A3、在金属层3的另一面上涂布单向导电胶黏剂层4,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
A4、在耐高温绝缘层2上贴合载体薄膜层1,使载体薄膜层1上的微粘胶面与耐高温绝缘层2紧密贴合;
A5、收卷。
“五层结构”的电磁屏蔽膜的制造工艺与上类似,步骤如下:
B1、在金属层3的一面涂布耐高温绝缘层2,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层3厚度为2-12μm,耐高温绝缘层2的涂布厚度为3-50μm;
B2、利用烘箱对卷状带耐高温绝缘层2的金属层3进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层2牢固地粘附在金属层3表面;
B3、在金属层3的另一面上涂布单向导电胶黏剂层4,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
B4、在单向导电胶黏剂层4上热贴合一层离型保护层5;
B5、在耐高温绝缘层2上贴合载体薄膜层1,使载体薄膜层1上的微粘胶面与耐高温绝缘层2面紧密贴合;
B6、收卷。
由上可见,本发明的制造工艺容易实现,所用到的涂布、烘干固化、烘箱固化等工序均是现有技术中业已成熟的常用技术,不作赘述,采用这些常规的成熟技术,使得本发明的制造工艺简单易实现而且能够有效控制成本,便于在工业上推广应用。
以上显示和描述了本发明的基本原理、主要特征和优点。本行业的技术人员应该了解,上述实施例不以任何形式限制本发明,凡采用等同替换或等效变换的方式所获得的技术方案,均落在本发明的保护范围内。
Claims (10)
1.适用于高频信号的电磁屏蔽膜,其特征在于,包括:金属层、涂布于金属层一面的耐高温绝缘层以及涂布于金属层另一面的单向导电胶黏剂层,所述耐高温绝缘层上贴合有载体薄膜层。
2.根据权利要求1所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述单向导电胶黏剂层上还设有一层离型保护层。
3.根据权利要求1所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述金属层为金属箔,所述金属箔由银、铜、铝、镍中的一种或几种的混合物制成,厚度为2-12μm。
4.根据权利要求1所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述耐高温绝缘层为聚酰亚胺,厚度为3-50μm。
5.根据权利要求1所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述单向导电胶黏剂层由胶黏剂主体和分布于胶黏剂主体中的导电粉组成,导电粉的材料为银粉、银包铜粉、铜粉和镍粉中的一种或几种的混合物,胶黏剂主体为改性环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂中的一种或几种的混合物,单向导电胶黏剂层的厚度为3-15μm,导电粉的粒径为1-15μm。
6.根据权利要求1所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述载体薄膜层为高分子聚合物薄膜层,选自PET、PEN、PI、PBT、PPS薄膜中的一种或几种的改性薄膜,厚度为25-200μm。
7.根据权利要求6所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述载体薄膜层表面带有与耐高温绝缘层粘接的微粘胶。
8.根据权利要求2所述的适用于高频信号的电磁屏蔽膜,其特征在于,所述离型保护层为PET离型膜、PP离型膜、PBT离型膜及离型纸中的一种,在离型保护层上涂布有硅油或非硅油离型剂,离型保护膜层的厚度为12-200μm。
9.如权利要求1所述的适用于高频信号的电磁屏蔽膜的制造工艺,其特征在于,步骤如下:
A1、在金属层的一面涂布耐高温绝缘层,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层厚度为2-12μm,耐高温绝缘层的涂布厚度为3-50μm;
A2、利用烘箱对卷状带耐高温绝缘层的金属层进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层牢固地粘附在金属层表面;
A3、在金属层的另一面上涂布单向导电胶黏剂层,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
A4、在耐高温绝缘层上贴合载体薄膜层,使载体薄膜层上的微粘胶面与耐高温绝缘层紧密贴合;
A5、收卷。
10.如权利要求2所述的适用于高频信号的电磁屏蔽膜的制造工艺,其特征在于,步骤如下:
B1、在金属层的一面涂布耐高温绝缘层,经烘箱干燥使绝缘层溶剂脱除并收卷,金属层厚度为2-12μm,耐高温绝缘层的涂布厚度为3-50μm;
B2、利用烘箱对卷状带耐高温绝缘层的金属层进行加热固化,烘箱内通氮气保护或抽真空,使耐高温绝缘层牢固地粘附在金属层表面;
B3、在金属层的另一面上涂布单向导电胶黏剂层,厚度为3-15μm,并入烘箱干燥,烘箱温度为60-120℃,线速度为5-30m/min;
B4、在单向导电胶黏剂层上热贴合一层离型保护层;
B5、在耐高温绝缘层上贴合载体薄膜层,使载体薄膜层上的微粘胶面与耐高温绝缘层面紧密贴合;
B6、收卷。
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