CN104754861A - Method for manufacturing electromagnetic shielding film and the electromagnetic shielding film manufactured thereof - Google Patents
Method for manufacturing electromagnetic shielding film and the electromagnetic shielding film manufactured thereof Download PDFInfo
- Publication number
- CN104754861A CN104754861A CN201410828123.4A CN201410828123A CN104754861A CN 104754861 A CN104754861 A CN 104754861A CN 201410828123 A CN201410828123 A CN 201410828123A CN 104754861 A CN104754861 A CN 104754861A
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- Prior art keywords
- electromagnetic shielding
- shielding film
- metal pattern
- manufacture method
- release film
- Prior art date
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WAAUVORLARCBAF-UHFFFAOYSA-N ethylazanium;ethyl carbonate Chemical compound CC[NH3+].CCOC([O-])=O WAAUVORLARCBAF-UHFFFAOYSA-N 0.000 description 1
- GPUHGQYNYJIMDZ-UHFFFAOYSA-N ethylazanium;n-ethylcarbamate Chemical compound CC[NH3+].CCNC([O-])=O GPUHGQYNYJIMDZ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-O isopropylaminium Chemical compound CC(C)[NH3+] JJWLVOIRVHMVIS-UHFFFAOYSA-O 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- NPHYYTMURMCAQE-UHFFFAOYSA-N morpholin-4-ium;n-morpholin-4-ylcarbamate Chemical compound C1COCC[NH2+]1.[O-]C(=O)NN1CCOCC1 NPHYYTMURMCAQE-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- YDKYIMZMZFEENX-UHFFFAOYSA-N octadecyl hydrogen carbonate Chemical compound CCCCCCCCCCCCCCCCCCOC(O)=O YDKYIMZMZFEENX-UHFFFAOYSA-N 0.000 description 1
- WBFJLQYCLUOFRY-UHFFFAOYSA-N octadecylazanium;n-octadecylcarbamate Chemical compound CCCCCCCCCCCCCCCCCC[NH3+].CCCCCCCCCCCCCCCCCCNC([O-])=O WBFJLQYCLUOFRY-UHFFFAOYSA-N 0.000 description 1
- XKFXSYSPQZRVOY-UHFFFAOYSA-N octadecylazanium;octadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCCC[NH3+].CCCCCCCCCCCCCCCCCCOC([O-])=O XKFXSYSPQZRVOY-UHFFFAOYSA-N 0.000 description 1
- BXXLBMBLLVIOKO-UHFFFAOYSA-N octadecylcarbamic acid Chemical compound CCCCCCCCCCCCCCCCCCNC(O)=O BXXLBMBLLVIOKO-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- MPXHWRXXJUKENG-UHFFFAOYSA-N propan-2-ylazanium;n-propan-2-ylcarbamate Chemical compound CC(C)[NH3+].CC(C)NC([O-])=O MPXHWRXXJUKENG-UHFFFAOYSA-N 0.000 description 1
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical compound CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- XBXCNNQPRYLIDE-UHFFFAOYSA-N tert-butylcarbamic acid Chemical compound CC(C)(C)NC(O)=O XBXCNNQPRYLIDE-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- NESLVXDUKMNMOG-UHFFFAOYSA-N triethoxy-(propyltetrasulfanyl)silane Chemical compound CCCSSSS[Si](OCC)(OCC)OCC NESLVXDUKMNMOG-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a method of manufacturing an electromagnetic shielding film and the electromagnetic shielding film manufactured thereof. The electromagnetic shielding film is manufactured by the method including following steps: an insulating layer forming step, namely a step of forming an insulating layer on a first release liner; a metal pattern forming step, namely a step of printing a metal pattern on the insulating layer; a conductive adhesive layer forming step, namely a step of forming a conductive adhesive layer on a second release liner; and a release liner connecting step, namely a step of connecting the first and second release liners, so that the metal pattern and the conductive adhesive layer are connected to each other, thus forming the electromagnetic shielding film. By the method, adhesive force among layers of the electromagnetic shielding film is enhanced, so that durability is excellent and the efficiency of manufacturing steps can be increased.
Description
Technical field
The manufacture method that the present invention relates to a kind of electromagnetic shielding film and the electromagnetic shielding film manufactured by the method, relating to one in more detail can at printed circuit board (Printed Circuit Board, or flexible printed circuit board (FlexiblePrinted Circuit Board PCB), etc. FPCB) circuit board uses, thus covers the electromagnetic electromagnetic shielding film that electronic equipment produces.
Background technology
Recently, the electronic equipment of PC, mobile phone and digital equipment etc. presents miniaturized and light-weighted trend, at full speed the popularizing of this electronic equipment, be connected in work unit or family and also cause electromagnetic flood, thus along with the development of electronic industry, the threat of electromagnetic interference (Electromagnetic interference, EMI) is more and more higher.
This electromagnetic interference shows as the diversified forms such as the burnout failure from the misoperation of electronic equipment to factory, and along with delivering electromagnetic wave successively and to play human body the result of study of negative effect, the worry of health and paying close attention to also is improved gradually, in the case, be that the supervision strengthening of electromagnetic interference and countermeasure are prepared painstakingly centered by developed country.Therefore, the core realm for electronic technology industry is appeared to the electromagnetic wave shielding technology of various electronics, electric equipment products in one's mind.
Electromagnetic wave shielding technology is roughly divided into two kinds of methods: namely, to shield around electromagnetic occurring source to protect the method for external equipment: with storage equipment in shielding material, with the method for the electromagnetic occurring source proterctive equipment from the external world.Wherein, when considering the operability of operation, reliability and high performance etc., form of film is the most favourable.
Electromagnetic shielding film is in the past made up of insulating barrier, metal film layer and resin of binding property.As everyone knows, electromagnetic wave does not enter in metal, and conductively-closed.When electro-magnetic wave contacts electric conductor, part is absorbed or is passed through, but major part is reflected on the surface at electric conductor.This is because when electro-magnetic wave contacts conductor, produce vortex flow by inductance in conductor, and this vortex flow reflection electromagnetic wave.
Usually, metal level is formed by the method for deposition (deposition) or printing (sputtering), due to the character of firm (rigid) of metal level, bendability declines the electromagnetic shielding film formed by this method, and therefore the durability of electromagnetic shielding film may have problems.
In addition, when the method by depositing or print forms metal level, metal in uneven thickness and variant between adhesive force, the decline of the shielding that therefore may generate electromagnetic waves, is making the problem being difficult to adhesive film in operation as circuit boards such as PCB or FPCB.
Therefore, be necessary to develop and a kind ofly improve the bonding force of each interlayer forming film when manufacturing electromagnetic shielding film and there is the electromagnetic shielding film of flexible nature.
No. 10-2008-0114606th, (patent documentation 1) KR published patent
No. 10-2008-0015447th, (patent documentation 2) KR published patent
No. 10-2007-0110369th, (patent documentation 3) KR published patent.
Summary of the invention
Therefore, the present invention proposes to solve problem as above, its objective is the manufacture method that a kind of electromagnetic shielding film is provided, the manufacture method of this electromagnetic shielding film improves the adhesive force between the insulating barrier of screened film, metal level and conductive adhesive oxidant layer, thus excellent in te pins of durability, even and if long-time use also can not be stripped.
In addition, the object of this invention is to provide a kind of manufacture method of electromagnetic shielding film, even if the manufacture method metal level of this electromagnetic shielding film has firm character, also can improve the bendability of electromagnetic shielding film, thus the flexibility of electromagnetic shielding film is excellent.
In order to reach described object, the manufacture method of the electromagnetic shielding film of one embodiment of the invention, can comprise the following steps: the forming step of insulating barrier, and the first release film forms insulating barrier; The forming step of metal pattern, type metal pattern on described insulating barrier; The forming step of conductive adhesive oxidant layer, the second release film is formed conductive adhesive oxidant layer; And the engagement step of release film, engage described first release film and described second release film, thus described metal pattern and described conductive adhesive oxidant layer are adjoined one another, form electromagnetic shielding film thus.
The forming step of described insulating barrier can comprise the following steps: coating insulating resin composition, and described insulating resin composition is included at least one resin in thermoplastic resin and thermosetting resin and at least one filler in flame retardant filler and resistance to wear filler; And carry out drying, become semi-cured state to make the described insulating resin composition of coating.
Described flame retardant filler can be at least one filler in aluminium hydroxide, phosphorus compound, zinc hydroxide or calcium hydroxide.
Described resistance to wear filler can be at least one filler in titanium hydroxide, silicon dioxide, zirconia or zinc oxide.
Described metal pattern can comprise the First Line formed along first direction and the second line formed along second direction, and described second direction is the direction intersected with first direction.
The shape of described metal pattern can be the interconnective shape of multiple units figure, and described unit figure can be circle, ellipse or polygon.
The live width of described metal pattern can be 100 ~ 500 μm, and thickness can be 0.05 ~ 2.0 μm.
Described metal pattern can utilize silver (Ag) ink composition print and formed, described silver-colored ink composition can contain silver complex, and described silver complex carries out reacting by making more than one the silver compound represented by following chemical formula 1 with at least one aminoquinoxaline compounds in the compound represented by following chemical formula 2 ~ 4 or carbonate based compounds and obtains.
[chemical formula 1]
Ag
nX
[chemical formula 2]
[chemical formula 3]
[chemical formula 4]
(in described chemical formula, X is selected from the substituting group in oxygen, sulphur, halogen, cyano group, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, rhodanate, chlorate, perchlorate, tetrafluoroborate, acetylacetonate, carboxylate and derivative thereof, n is the integer of 1 ~ 4, R
1~ R
6for being selected from the substituting group in hydrogen, the aliphat of C1 ~ C30 or alicyclic alkyl group, aryl or aralkyl (aralkyl), the alkyl that instead of functional group and aryl, heterocyclic compound and macromolecular compound and derivative thereof independently of each other, wherein, R
1~ R
6except the situation being hydrogen.)
Described metal pattern carries out printing by the method for direct intaglio printing, flexographic printing, hectographic printing, intaglio offset, oppositely offset printing, some glue, silk screen printing, rotary screen printing or ink jet printing and forms on described insulating barrier.
Described conductive adhesive oxidant layer can comprise at least one electroconductive stuffing in spherical silver particles or sheet silver.
The forming step of described conductive adhesive oxidant layer can comprise the following steps: applying conductive binding compositions on described second release film; And carry out drying, become semi-cured state to make the described conductive adhesive composition of coating.
The bonding force of described second release film can be 1.05 ~ 1.5 with the ratio of the bonding force of described first release film.
The electromagnetic shielding film of one embodiment of the invention manufactures by said method.
The electromagnetic shielding film of another embodiment of the present invention can comprise: insulating barrier, comprises insulative resin; Metal pattern, is formed on described insulating barrier, comprises metallic ink composition; And conductive adhesive oxidant layer, be formed on described metal pattern, comprise conductive adhesive composition.
At least one side of described electromagnetic shielding film can comprise release film further.
The live width of described metal pattern can be 100 ~ 500 μm, and thickness can be 0.05 ~ 2.0 μm.
By the manufacture method of electromagnetic shielding film of the present invention, the conductivity ink composition based on metal can be utilized to print for pattern form, thus also can be easy to realize metal level on the insulating barrier of semi-cured state.
In addition, as metal level, form the pattern of regulation and do not form film, thus adhesive force and the bendability of each layer can be improved, therefore also there is flexibility while excellent in te pins of durability, and by the formation of metal pattern, the use amount of great number metal can be reduced, so economy is good.
In addition, by regulating the shape of metal pattern, excellent shield effectiveness can be played.
In addition, each release film is formed insulating barrier and metal pattern and conductive adhesive oxidant layer laggard row respectively engage, thus compared with forming the operation in the past of insulating barrier, metal pattern and conductive adhesive oxidant layer successively, can activity time be shortened, and process efficiency can be improved and produce yield.
In addition, when type metal pattern, compared with the method for deposition in the past or sputtering, print speed printing speed is faster, and therefore productivity is excellent.Effect of the present invention is not limited in effect mentioned above, and for the effect that other are not mentioned, those skilled in the art should be able to be understood clearly by the record of claims.
Accompanying drawing explanation
Fig. 1 is the precedence diagram of the manufacture method of the electromagnetic shielding film representing one embodiment of the invention successively.
Fig. 2 is the process flow chart of the process flow of the manufacture method of the electromagnetic shielding film schematically representing one embodiment of the invention.
Fig. 3 is the exploded perspective view of the electromagnetic shielding film of one embodiment of the invention.
Fig. 4 is the cutaway view of the electromagnetic shielding film of one embodiment of the invention.
Fig. 5 is the cutaway view of the electromagnetic shielding film manufactured by the manufacture method of the electromagnetic shielding film of one embodiment of the invention.
Embodiment
By referring to accompanying drawing and specific embodiment described later, advantages and features of the invention and the method for reaching these advantages and feature should be able to be expressly understood.But the present invention is not limited to following public embodiment, can be realized by various different form.Embodiments of the invention are just for intactly openly the present invention, and in order to intactly inform that category of the present invention provides to those skilled in the art, the present invention should define by the scope of claim.In specification in the whole text, identical Reference numeral represents identical structural element.
If do not have other definition, the implication that all terms (comprising technical term and scientific terminology) used in this manual can be understood jointly with those skilled in the art uses.In addition, the term defined in normally used dictionary, when not having clear and definite special definition, is not explained ideally or exceedingly.
Conveniently and clearly illustrate, in figure, the thickness of each structural element or size are exaggerated, omitted or are schematically shown.And the size of each structural element and area not intactly reflect actual size and area.
In addition, mentioned in the process that example structure is described angle and direction for be denoted as benchmark in scheming.In the description for forming in the explanation of structure of embodiment, when not mentioning datum mark and the position relationship of angle clearly, with reference to relevant drawings.
Below, be described with reference to the manufacture method of accompanying drawing to the electromagnetic shielding film of one embodiment of the invention.
With reference to Fig. 1, the electromagnetic shielding film of one embodiment of the invention manufactures by the method comprised the following steps: the forming step S10 of insulating barrier, the forming step S20 of metal pattern, the forming step S30 of conductive adhesive oxidant layer and the engagement step S40 of release film.
The forming step S10 of insulating barrier is the step forming insulating barrier on the first release film.
In this manual, term " the 1st " and " the 2nd " use for distinguishing release film.
Described first release film can use unglazed release film, as long as common release film is unglazed, then can be applicable to the present invention in many ways, so uses unglazed release film, then can provide the extinction effect of insulating barrier.
As an example of described first release film, the unglazed release film of non-silicon class and non-silicon class tarnish (matt) release film can be enumerated, not easily peel off between this film and insulating barrier, and when being coated with insulation layer composition at an upper portion thereof, tarnish (matt) effect of insulating barrier is provided, thus can extinction effect be provided, and can reduce to greatest extent because of the caused heating that rubs, therefore bendability is excellent.
In addition, on the insulating layer in order to form metal level as routine silver coating (Ag) ink composition time, tarnish (Matt) effect of insulating barrier can contribute to improving stripping (Peel) value between insulator-metal.
When using non-silicon class tarnish (matt) release film, in order to eliminate the contraction problem being coated with at an upper portion thereof and producing after layer of cloth, and in order to improve FPCB operability, described release film preferably has the thickness of 35 ~ 90 μm.
Bonding force between first release film and insulating barrier can be more than 180gf/in, is preferably more than 200gf/in, is more preferably more than 200gf/in and lower than 250gf/in.
When lower than described bonding force, easilier than the second release film being attached to conductive adhesive oxidant layer to peel off, therefore cannot carry out interim bonding operation, described interim bonding operation is be engaged in printed circuit board temporarily and allow to the operation of carrying out loading and unloading; When higher than described bonding force, the problem not easily removing release film after being attached to printed circuit board by hot pressing can be produced.
Described insulating barrier can be made up of insulating resin composition, and described insulating resin composition can comprise at least one filler at least one resin in thermoplastic resin and thermosetting resin and flame retardant filler and resistance to wear filler.
Insulative resin can use more than one resins be selected from thermoplastic resin and thermosetting resin.Preferably can use heat-resistance polyester resin or polyurethane resin, now can improve the adhesive force between metal pattern, and excellent bendability can be provided.In addition, when using the epoxy resin of excellent heat resistance, the advantage that the advantage of the reflow excellence of pb-free solder can be provided and not easily tear when FPCB process operation.In addition, also heat-resistance polyester resin can be used together with polyurethane resin.
Described flame retardant filler can be at least one filler in aluminium hydroxide, phosphorus compound, calcium hydroxide or zinc hydroxide, and described resistance to wear filler can be at least one filler in titanium hydroxide, silicon dioxide, zirconia or zinc oxide.
Relative to insulating resin composition 100 % by weight, preferably add the described flame retardant filler of 2 ~ 20 % by weight and described resistance to wear filler.
Described insulating resin composition can add additive further, can use the function enhancement mode additive of known routine in the technical field of the invention.As concrete example, the tackifier etc. such as organic modified silicas wetting agent, nonionic leveling agent, phosphate compounds, amino trimethyl silane polymercaptan (amino trimethylsilane polythiol), coupling agent can be used, but be not limited to this.
The forming step of described insulating barrier can comprise the following steps: to be coated with insulating resin composition; And carry out drying, become semi-cured state to make the described insulating resin composition of coating.
Described insulating resin composition is coated with by methods such as comma (comma) coating, intaglio plate coating, slot coated and the coatings of nick version, in the present invention as an example, is coated with by micro-gravure coating process.
By the insulating barrier of semi-cured state is made in the insulating resin composition be coated with drying in 120 DEG C for five minutes.
Wherein, if make semi-cured state (B-Stage) instead of solid state (C-Stage), then can produce sufficient flowing (flow) when adding thermo-compressed to play resiliency, thus can make it to flow into and fill the part with step in FPCB, and improve the engaging force with FPCB.
Described insulating barrier can have the thickness of 3 ~ 20 μm, preferably can be 5 ~ 15 μm.When thinner than described thickness, resin flows (resin flow) property of insulating barrier is lower, may tear because of the circuit step of printed circuit board; When thicker than described thickness, the flexibility of insulating barrier declines, and round and smooth bendability may be caused to decline.
The forming step (S20) of metal pattern is the operation of type metal pattern on the middle insulating barrier formed of the forming step (S10) of insulating barrier.
Described metal pattern can use conductivity ink composition to print, and preferably uses silver (Ag) ink composition.
Silver (Ag) has lower resistance, and presents the high attenuation rate of about 60dB, therefore very effective as electromagnetic shielding material.
Described silver-colored ink composition can comprise silver complex, and described silver complex is undertaken reacting by least one aminoquinoxaline compounds in the compound that makes more than one the silver compound that represented by following chemical formula 1 and represented by following chemical formula 2 ~ 4 or carbonate based compounds and obtained.
[chemical formula 1]
Ag
nX
[chemical formula 2]
[chemical formula 3]
. [chemical formula 4]
(in described chemical formula, X is selected from the substituting group in oxygen, sulphur, halogen, cyano group, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, rhodanate, chlorate, perchlorate, tetrafluoroborate, acetylacetonate, carboxylate and derivative thereof, n is the integer of 1 ~ 4, R
1~ R
6independently of each other for being selected from the substituting group in hydrogen, C1 ~ C30 aliphat or alicyclic alkyl group, aryl or aralkyl (aralkyl), the alkyl that instead of functional group and aryl, heterocyclic compound and macromolecular compound and derivative thereof, but get rid of R
1~ R
6be the situation of hydrogen.)
R
1~ R
6concrete example can be selected from hydrogen, methyl, ethyl, propyl group, isopropyl, butyl, isobutyl group, amyl group, hexyl, ethylhexyl, heptyl, octyl group, iso-octyl, nonyl, decyl, dodecyl, cetyl, octadecyl, docosyl (docodecyl), cyclopropyl, cyclopenta, cyclohexyl, pi-allyl, hydroxyl, methoxyl group, ethoxy, methoxyethyl, 2-hydroxypropyl, methoxycarbonyl propyl, cyanoethyl, ethyoxyl, butoxy, own oxygen base, methoxyethoxyethyl, methoxyethoxyethoxyethyl, hexamethylene imine, morpholine, piperidines, piperazine, ethylenediamine, propane diamine, hexamethylene diamine, triethylenediamine, pyrroles, imidazoles, pyridine, carboxymethyl, trimethoxy-silylpropyl, triethoxysilylpropyltetrasulfide, phenyl, anisyl, benzonitrile base, phenoxy group, tolyl, benzyl and derivative thereof, as in the macromolecular compound such as polyallylamine or polymine and derivative thereof, and be not particularly limited.The concrete example of compound can be selected from aminoquinoxaline (ammoniumcarbamate), ammonium carbonate (ammonium carbonate), ammonium bicarbonate (ammonium bicarbonate), ethyl carbamic acid ethyl ammonium, isopropylamino formic acid isopropyl ammonium, n-butylamino formic acid normal-butyl ammonium, isobutylamino carboxvlic acid isobutyl ammonium, tert-butylamino formic acid tert-butyl group ammonium, 2-ethylhexylamino formic acid 2-ethylhexyl ammonium, octadecylamino formic acid octadecyl ammonium, 2-methoxyethyl carbamic acid 2-methoxyethyl ammonium, 2-cyanoethyl carbamic acid 2-cyanoethyl ammonium, dibutylamino formic acid dibutyl ammonium, two (octadecyl) carbamic acid two (octadecyl) ammonium, triethoxysilylpropylammonium methyldecyl ammonium, hexamethylene imine aminocarbamic acid hexamethylene imine base ammonium, morpholinium morpholinecarbamate salt, ethylhexylamino pyridine carboxylic acid salt, isopropyl diamino acid three second two ammonium (Triethylene diammonium isopropylbicarbamate), benzylcarbamate hexadecyldimethyl benzyl ammonium, triethoxysilylpropyltetrasulfide carbamic acid triethoxysilylpropyltetrasulfide ammonium, ethyl carbonate ethyl ammonium, isopropyl isobutyl carbonate propyl ammonium, heavy carbonic isopropyl ammonium, n normal-butyl ammonium, isobutyl group isobutyl carbonate butyl ammonium, tert-butyl group carbonic acid tert-butyl group ammonium, heavy carbonic tert-butyl group ammonium, 2-ethylhexyl carbonate 2-ethylhexyl ammonium, heavy carbonic 2-ethylhexyl ammonium, 2-methoxy ethyl carbonic acid 2-methoxy ethyl ammonium, heavy carbonic 2-methoxyethyl ammonium, 2-cyanoethyl carbonic acid 2-cyanoethyl ammonium, heavy carbonic 2-cyanoethyl ammonium, octadecyl carbonic acid octadecyl ammonium, dibutyl carbonic acid dibutyl ammonium, two (octadecyl) carbonic acid two (octadecyl) ammonium, heavy carbonic two (octadecyl) ammonium, methyldecyl methyl decyl ammonium, hexamethylene imine carbonic acid hexamethylene imine base ammonium, morpholine carbonic acid morpholinyl ammonium, benzyl carbonic acid hexadecyldimethyl benzyl ammonium, triethoxysilylpropyltetrasulfide carbonic acid triethoxysilylpropyltetrasulfide ammonium, heavy carbonic pyridiniujm, isopropyl carbon triethylenetetraminehexaacetic acid two ammonium, a kind of material in heavy carbonic three second two ammonium and derivative thereof or the mixture of two or more material.
Under nitrogen atmosphere, make the aminoquinoxaline or ammonium carbonate derivative and composition thereof of more than the silver compound of more than at least one shown in described chemical formula 1 and at least one shown in described chemical formula 2 ~ 4 under normal pressure or pressurized state and directly react under solvent-free state, or using solvent to react.When using solvent, water can be used; As the alcohols of methyl alcohol, ethanol, isopropyl alcohol or butanols; As the glycols of ethylene glycol or glycerine; As the acetate esters of ethyl acetate, butyl acetate or carbitol acetate; As the ethers of diethyl ether, oxolane or dioxane; As the ketone of methyl ethyl ketone or acetone; As the hydro carbons of hexane or heptane; As the aromatic series of benzene or toluene; And as the halogenated solvent of chloroform, carrene or carbon tetrachloride or the mixed solvent etc. of these solvents.
Described metal pattern can comprise the First Line formed along first direction and the second line formed along second direction, and described second direction is the direction intersected with first direction.
By forming multiple First Line and the second line to realize lattice, and preferably can be honeycomb (honeycomb) shape, quadrangle form and diamond shape.
In addition, described metal pattern is the interconnective shape of multiple units figure, and described unit figure can be circle, ellipse or polygon.
Described metal pattern can have the live width of 100 ~ 500 μm, preferably can be 200 ~ 300 μm.When the live width of described metal pattern is greater than 500 μm, the raising effect of electromagnetic shielding effect is small, and when being less than 100 μm, due to the firm character of metal level, the bending durability of screened film and the adhesive force of interlayer can decline.
Described metal pattern can have the thickness of 0.05 ~ 2.0 μm, preferably can be 0.15 ~ 1.0 μm.When the scope of described metal pattern is thinner than described scope, electromagnetic wave shielding performance may be reduced, when the thickness of metal pattern is thick, although can shielding properties be improved, can bendability be reduced due to the decline of the flexibility of metal level.
In addition, the aperture opening ratio of described metal pattern can be 15 ~ 50% of printing live width, preferably can be 25 ~ 40%.
Described metal pattern, by direct intaglio printing, flexographic printing, hectographic printing, intaglio offset, oppositely offset printing, some glue, silk screen printing, rotary screen printing or ink jet printing method, prints conductivity ink composition on the insulating layer and is formed.
After the described metal pattern of formation, about 10 seconds ~ about 20 points can be placed burn till at the temperature of 0 ~ 200 DEG C.After formation metal pattern, through burning till step, thus conductivity ink composition can be converted to metal.
So, with by deposit or while sputtering method forms metal level, also need the conventional art possessing the double-layer structure insulating barriers such as Anchor (anchor) layer for improving adhesive force different, the mode black by the silver (Ag) that printing electromagnetic wave shielding efficiency is high forms screen, even if thus adopt single insulating barrier, also can produce the product of resistance to wear, adhesive force and bendability excellence.This is described as follows in more detail, namely to deposit or in sputtering mode in the mode of formation metal level in the past, owing to there is lower stripping (Peel) value with insulating barrier, there is insulating barrier and metal level when FPCB (flexible PCB) is bending and peel off the problem of (Delamination), and there is the problem that bendability declines because of metallic, also there is metal level and split and damaged danger.Therefore, for having step, the FPCB operation that namely PCB layout thickness is larger or require the product of bendability, above-mentioned metal level generation type in the past has certain limitation.
Unlike this, in the present invention, when the insulating barrier of semi-cured state prints the conductivity ink composition of complex form, conductivity ink composition permeates in insulating barrier and produces physics fixed effect, and metal and carboxyl (-COOH), amino (-NH
2) or the resin functional group of hydroxyl (-OH) etc. react, thus improve by chemical reaction and peel off (Peel) value.
In addition, form the structure as multilayer in the present invention by the syndeton of fine silver (Ag) particle, when bending, crackle (Crack) transfer phenomena of metal level is significantly slack-off, thus can keep excellent shielding properties.Wherein, the metal level that the present invention is formed is not by the single metal level deposited or sputtering mode is formed.
And, for metal level, do not adopt the form of film being coated with whole insulating barrier, but form pattern, therefore the part not forming metal pattern directly contacts with the material of the identical type of conductive adhesive oxidant layer with formation insulating barrier, thus can improve adhesive force further.
The forming step S30 of conductive adhesive oxidant layer is the operation forming conductive adhesive oxidant layer on the second release film.
Second release film is the release film arranged independent of the first release film, and described second release film can be the PET film being coated with silicon mould release.
The scope of the bonding force of the second release film can be 200 ~ 300gf/in, when bonding force is lower than 200gf/in, is easily stripped in interim joining process, thus can brings pollution; When more than 300gf/in, be first stripped than the first release film, be therefore difficult to realize on FPCB.
The forming step S30 of described conductive adhesive oxidant layer comprises: the step of applying conductive binding compositions on described second release film; And carry out drying, with the step making the described conductive adhesive composition of coating become semi-cured state.
Conductive adhesive composition can comprise electroconductive stuffing, preferably, silver (Ag) powder of the spherical or sheet (flake) of conductivity and flexibility excellence can be used alone or as a mixture.
Described conductive adhesive composition, except electroconductive stuffing, can be included in the additives such as at least one resin, solvent and thermal curing agents in thermoplastic resin and thermosetting resin, anti-flammability phosphorus compound or metal adhesion reinforcing agent further.
Aluminium class coupling agent, titanium class coupling agent and mercaptan compound can be used as described metal adhesion reinforcing agent.As the concrete example of described metal adhesion reinforcing agent, the organically-modified silanes tackifier such as trimethoxy propyl silane, vinyltriethoxysilane, sulfydryl trimethoxy silane and mercaptan compound, the chelate etc. such as alkyl compound containing sulfuryl can be used, but be not limited to this.
Described conductivity knitting layer by comma (comma) coating, or is formed by slit coater applying conductive binding compositions.
In the forming step S30 of described conductive adhesive oxidant layer, the drying of conductive adhesive composition can perform 10 seconds ~ 20 minutes at the temperature of 60 ~ 200 DEG C.
The flexibility of the conductive adhesive oxidant layer of semi-cured state is excellent, therefore when being applicable on the high product of step, the conductive adhesive oxidant layer of softening (softened) by heating can fill step, and stably can be connected with the earthed circuit of FPCB, thus effectively prevent produced electromagnetic wave noise from outwards radiating.
It is the thickness of 3 ~ 20 μm that described conductive adhesive oxidant layer can be coated with.When thinner than described thickness, cannot fill step, film can tear; When thicker than described thickness, have the problem that bendability declines.
The engagement step S40 of release film is the operation the first release film and the second release film engaged.
When joint first release film and the second release film, the first release film can be made to connect with the conductive adhesive oxidant layer of metal pattern and the second release film, thus stacked with the order of insulating barrier, metal pattern and conductive adhesive oxidant layer.
The bonding force of described second release film can be 1.05 ~ 1.5 with the ratio of described first release film bonding force, when the bonding force that release film has an above-mentioned scope than time, easily carry out bonding process and the operation on FPCB substrate.
Specifically, the second release film can be put into take-off device, and applying conductive adhesive phase, the first release film being printed with metal level is put into another take-off device, and at junction surface with the temperature of about 80 DEG C, approximately 5kg/cm
2pressure engage with the second release film exported from drying machine after batch.
The electromagnetic shielding film of one embodiment of the invention can be manufactured by said method.
The electromagnetic shielding film manufactured by said method is formed with metal level, and this metal level has certain pattern, but not form of film.Thus, improve the adhesive force between each layer, improve bendability, therefore excellent in te pins of durability and soft.
Below, with reference to Fig. 2 and Fig. 3, the manufacture method of electromagnetic shielding film is described.
First, prepare release film 10, as this release film 10, prepare the first release film 11 and the second release film 12 respectively.
On the first release film 11, coating comprises the insulating resin composition of insulative resin, to form insulating barrier 20.Insulating resin composition can by 10 ~ 80 % by weight insulative resin, 2 ~ 20 % by weight be selected from least one filler in flame retardant filler or resistance to wear filler, 5 ~ 80 % by weight the additive of solvent and 0.5 ~ 10 % by weight form.
Use conductivity ink composition, described insulating barrier 20 forms metal pattern 30 in a grid formation.The printing of conductivity ink composition can be carried out for time semi-cured state (Bstage) at insulating barrier 20, compared with when making form of film, there is good adhesive force, and when adding thermo-compressed on FPCB, the position with step can be filled, therefore can also improve the engaging force with substrate.
The metal pattern of grid configuration prints by direct intaglio printing (Direct gravure printing), flexographic printing (Flexoprinting), rotary screen printing (rotary screen printing), intaglio offset (gravure offset printing) or reverse offset printing (Reverse offset printing) etc., but is not limited to mesh case form.
Applying conductive binding compositions on the second release film 12, to form conductive adhesive oxidant layer 40.
Conductive adhesive composition can by 10 ~ 60 % by weight resin, the electroconductive stuffing of 10 ~ 30 % by weight, solvent and 1 ~ 7 % by weight of 29 ~ 60 % by weight other additives form.Described electroconductive stuffing can use silver (Ag) powder of conductivity and flexibility excellence.
When forming conductive adhesive oxidant layer 40, after applying conductive binding compositions, drying is semi-cured state, can be easy to carry out the joint between release film under semi-cured state.In addition, conductive adhesive composition stably can be connected with the earthed circuit of FPCB, thus the electromagnetic wave noise that shielding produces effectively outwards radiates.
Next, with metal pattern 30 and conductive adhesive oxidant layer 40 in opposite directions and the mode connected engages release film 11,12 to complete electromagnetic shielding film.
Fig. 4 and Fig. 5 is the cutaway view of the electromagnetic shielding film of one embodiment of the invention, and Fig. 4 represents the form that insulating barrier 20, metal pattern 30 and conductive adhesive oxidant layer 40 are stacked, and Fig. 5 represents the form being attached with release film 11,12 on two sides.
Described electromagnetic shielding film is respond well to circuit shielding electromagnetic waves, its bendability and flexibility excellence.
Interest field of the present invention is not limited to above-described embodiment, can be realized in the scope of appending claims by the embodiment of various ways.In the scope not departing from claims the present invention for required protection spirit, all flexible various scope of those skilled in the art also belongs in the scope described in claims of the present invention.
Description of reference numerals
10: release film
11: the first release films
12: the second release films
20: insulating barrier
30: metal pattern
40: conductive adhesive oxidant layer.
Claims (16)
1. a manufacture method for electromagnetic shielding film, comprises the following steps:
The forming step of insulating barrier, the first release film forms insulating barrier;
The forming step of metal pattern, type metal pattern on described insulating barrier;
The forming step of conductive adhesive oxidant layer, the second release film is formed conductive adhesive oxidant layer; And
The engagement step of release film, engages described first release film and described second release film, thus described metal pattern and described conductive adhesive oxidant layer are adjoined one another, and forms electromagnetic shielding film thus.
2. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
The forming step of insulating barrier comprises the following steps:
Coating insulating resin composition, described insulating resin composition is included at least one resin in thermoplastic resin and thermosetting resin and at least one filler in flame retardant filler and resistance to wear filler; And
Carry out drying, become semi-cured state to make the described insulating resin composition of coating.
3. the manufacture method of electromagnetic shielding film according to claim 2, wherein,
Described flame retardant filler is at least one filler in aluminium hydroxide, phosphorus compound, zinc hydroxide or calcium hydroxide.
4. the manufacture method of electromagnetic shielding film according to claim 2, wherein,
Described resistance to wear filler is at least one filler in titanium hydroxide, silicon dioxide, zirconia or zinc oxide.
5. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
Described metal pattern comprises the First Line formed along first direction and the second line formed along second direction, and described second direction is the direction intersected with first direction.
6. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
The shape of described metal pattern is the interconnective shape of multiple units figure, and described unit figure is circular, oval or polygon.
7. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
The live width of described metal pattern is 100 ~ 500 μm, and thickness is 0.05 ~ 2.0 μm.
8. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
Described metal pattern for utilizing silver-colored ink composition to print and being formed,
Described silver-colored ink composition contains silver complex, described silver complex carries out reacting by making more than one the silver compound represented by following chemical formula 1 with at least one aminoquinoxaline compounds in the compound represented by following chemical formula 2 ~ chemical formula 4 or carbonate based compounds and obtains
[chemical formula 1]
Ag
nX
[chemical formula 2]
[chemical formula 3]
[chemical formula 4]
In described chemical formula, X is selected from the substituting group in oxygen, sulphur, halogen, cyano group, cyanate, carbonate, nitrate, nitrite, sulfate, phosphate, rhodanate, chlorate, perchlorate, tetrafluoroborate, acetylacetonate, carboxylate and derivative thereof, n is the integer of 1 ~ 4, R
1~ R
6for being selected from the substituting group in hydrogen, the aliphat of C1 ~ C30 or alicyclic alkyl group, aryl or aralkyl, the alkyl that instead of functional group and aryl, heterocyclic compound and macromolecular compound and derivative thereof independently of each other, wherein, R
1~ R
6except the situation being hydrogen.
9. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
Described metal pattern carries out printing by the method for direct intaglio printing, flexographic printing, hectographic printing, intaglio offset, oppositely offset printing, some glue, silk screen printing, rotary screen printing or ink jet printing and forms on described insulating barrier.
10. the manufacture method of electromagnetic shielding film according to claim 1, wherein,
Described conductive adhesive oxidant layer comprises at least one electroconductive stuffing in spherical silver particles or sheet silver.
The manufacture method of 11. electromagnetic shielding films according to claim 1, wherein,
The forming step of described conductive adhesive oxidant layer comprises the following steps:
Applying conductive binding compositions on described second release film; And
Carry out drying, become semi-cured state to make the described conductive adhesive composition of coating.
The manufacture method of 12. electromagnetic shielding films according to claim 1, wherein,
The bonding force of described second release film is 1.05 ~ 1.5 with the ratio of the bonding force of described first release film.
13. 1 kinds of electromagnetic shielding films, are manufactured by the method described in any one in claim 1 ~ 12.
14. 1 kinds of electromagnetic shielding films, comprising:
Insulating barrier, comprises insulative resin;
Metal pattern, is formed on described insulating barrier, comprises metallic ink composition; And
Conductive adhesive oxidant layer, is formed on described metal pattern, comprises conductive adhesive composition.
The manufacture method of 15. electromagnetic shielding films according to claim 14, wherein,
At least one side of described electromagnetic shielding film comprises release film further.
The manufacture method of 16. electromagnetic shielding films according to claim 14, wherein,
The live width of described metal pattern is 100 ~ 500 μm, and thickness is 0.05 ~ 2.0 μm.
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| KR20130115431A (en) * | 2012-04-12 | 2013-10-22 | 한화엘앤씨 주식회사 | Electromagnetic wave shield film and printed circuited board attached said film and the manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2021002664A (en) | 2021-01-07 |
| JP2015126230A (en) | 2015-07-06 |
| JP2017143275A (en) | 2017-08-17 |
| CN110177450A (en) | 2019-08-27 |
| KR20150075912A (en) | 2015-07-06 |
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