CN110876256A - Electromagnetic wave shielding film, method for manufacturing same, and method for manufacturing shielded printed wiring board - Google Patents
Electromagnetic wave shielding film, method for manufacturing same, and method for manufacturing shielded printed wiring board Download PDFInfo
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- CN110876256A CN110876256A CN201910785812.4A CN201910785812A CN110876256A CN 110876256 A CN110876256 A CN 110876256A CN 201910785812 A CN201910785812 A CN 201910785812A CN 110876256 A CN110876256 A CN 110876256A
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- electromagnetic wave
- film
- transfer film
- wave shielding
- shielding film
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Abstract
The invention provides an electromagnetic wave shielding film with a transfer film, which can prevent a gap from being generated between an adhesive layer of the electromagnetic wave shielding film and the surface of a printed circuit board when the electromagnetic wave shielding film is manufactured. The present invention is an electromagnetic wave shielding film with a transfer film, comprising a transfer film and an electromagnetic wave shielding film laminated on the transfer film, characterized in that: the electromagnetic wave shielding film comprises a protective layer contacting with the transfer film, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer, wherein the Young's modulus of elasticity of the transfer film is 2.9-5.0 GPa.
Description
Technical Field
The present invention relates to an electromagnetic wave shielding film with a transfer film, a method for manufacturing the electromagnetic wave shielding film with the transfer film, and a method for manufacturing a shielded printed wiring board.
Background
In electronic devices such as mobile phones, video cameras, and notebook-size personal computers, which are rapidly becoming smaller and higher in functionality, flexible printed wiring boards are often used to incorporate circuits into complicated mechanisms. Further, due to its excellent flexibility, a movable portion such as a print head and a control portion are connected to each other. In these electronic devices, electromagnetic wave shielding measures are essential, and flexible printed wiring boards (hereinafter, also referred to as "shielding printed wiring boards") that have been provided with electromagnetic wave shielding measures are also used in flexible printed wiring boards used in devices.
For example, patent document 1 discloses a method for manufacturing a shielded printed wiring board in which an electromagnetic wave shielding film is coated on a base film including a printed circuit.
Among the methods for manufacturing a shielded printed wiring board described in patent document 1, there is disclosed a method for manufacturing a shielded printed wiring board, comprising: when an electromagnetic wave shielding film is coated, a shielding layer and a conductive adhesive layer (adhesive layer) are provided on one surface of a cover film (protective layer), a peelable adhesive film (transfer film) having adhesiveness is bonded to the other surface to form a reinforcing shielding film (electromagnetic wave shielding film with a transfer film), the reinforcing shielding film is placed on a base film so that the conductive adhesive layer abuts against the base film, and the base film is heated and pressed to bond the reinforcing shielding film and the conductive adhesive layer, and then the adhesive film is peeled.
[ Prior art documents ]
[ patent document ]
[ patent document 1 ] Japanese patent laid-open (Japanese patent application laid-open) No. 2000-269632.
Disclosure of Invention
[ problem to be solved by the invention ]
As described above, the electromagnetic wave shielding film is attached to the printed wiring board via the adhesive layer of the electromagnetic wave shielding film.
The surface of the printed wiring board that is in contact with the adhesive layer is generally not flat but has a height difference.
Since the adhesive layer has plasticity, the difference in level of the surface of the printed wiring board can be filled to some extent, but the adhesive layer may not be completely filled and a gap may be formed.
Such gaps are the cause of various problems.
As an example of the above problem, a case where a ground circuit of a printed wiring board and an external ground are connected via an electromagnetic wave shielding film will be described below.
The printed wiring board has a base film as a basic structure, a printed circuit including a ground circuit formed on the base film, and a cover layer covering the printed circuit.
In order to electrically connect the ground circuit to an external ground, a hole may be formed in the cover layer above the ground circuit to expose the ground circuit. The hole exposing the ground circuit becomes a step on the surface of the printed wiring board.
As described above, the electromagnetic wave shielding film is attached to the printed wiring board via the adhesive layer of the electromagnetic wave shielding film. In this case, in order to electrically connect the ground circuit to an external ground, an adhesive layer having conductivity is used as the adhesive layer of the electromagnetic wave shielding film.
When the electromagnetic wave shielding film is attached to the printed wiring board, the adhesive layer of the electromagnetic wave shielding film deforms or flows to fill the hole (i.e., the difference in height between the surfaces of the printed wiring board) where the ground circuit is exposed.
However, if the diameter of the hole through which the ground circuit is exposed is too small, the adhesive layer of the electromagnetic wave shielding film may not sufficiently fill the hole through which the ground circuit is exposed, and the ground circuit and the adhesive layer of the electromagnetic wave shielding film may not sufficiently contact each other. In this case, a problem arises in that the connection resistance increases.
The present invention has been made in view of the above problems, and an object of the present invention is to provide an electromagnetic wave shielding film with a transfer film, which can prevent a gap from being generated between an adhesive layer of the electromagnetic wave shielding film and a surface of a printed wiring board when manufacturing a shielded printed wiring board.
[ MEANS FOR SOLVING THE PROBLEMS ] A method for producing a semiconductor device
That is, an electromagnetic wave shielding film with a transfer film according to the present invention is an electromagnetic wave shielding film with a transfer film including a transfer film and an electromagnetic wave shielding film laminated on the transfer film, and is characterized in that: the electromagnetic wave shielding film comprises a protective layer in contact with the transfer film, a shielding layer laminated on the protective layer and an adhesive layer laminated on the shielding layer, wherein the Young elastic modulus of the transfer film is 2.9-5.0 GPa.
In the electromagnetic wave shielding film with a transfer film of the present invention, the young's modulus of elasticity of the transfer film is more preferably 2.9 to 3.6 GPa.
When the electromagnetic wave shielding film with the transfer film is used for manufacturing a shielding printed circuit board, the adhesive layer of the electromagnetic wave shielding film with the transfer film is abutted against the surface of the printed circuit board and is pressed and connected.
In this case, when the young's modulus of elasticity of the transfer film is 2.9 to 5.0GPa, the transfer film is sufficiently hard, and thus the pressure of pressure bonding is difficult to disperse.
Therefore, even if there is a level difference on the surface of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be reliably pressed, and the level difference can be reliably filled in the adhesive layer.
In the electromagnetic wave-shielding film with a transfer film of the present invention, the adhesive layer may have conductivity.
In general, a ground circuit is also provided in the printed circuit of the printed wiring board. When the adhesive layer of the electromagnetic wave shielding film with the transfer film of the present invention has conductivity, the electromagnetic wave shielding film is disposed on the printed wiring board and the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, thereby achieving electrical connection therebetween. In addition, the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave-shielding film and the external ground.
When the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, the cover layer located above the ground circuit forms a hole (i.e., a step on the surface of the printed wiring board) for exposing the ground circuit.
When the electromagnetic wave shielding film with the transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be reliably brought into contact with each other, and therefore, the increase in the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be prevented.
In the electromagnetic wave-shielding film with a transfer film of the present invention, the shielding layer may be made of a metal layer.
In addition, in the electromagnetic wave-shielding film with a transfer film of the present invention, the shielding layer may be made of a conductive resin.
As described above, in the electromagnetic wave shielding film with a transfer film of the present invention, the material of the shielding layer is not particularly limited as long as it can shield electromagnetic waves.
Another electromagnetic wave-shielding film with a transfer film according to the present invention is an electromagnetic wave-shielding film with a transfer film comprising a transfer film and an electromagnetic wave-shielding film laminated on the transfer film, characterized in that: the electromagnetic wave shielding film comprises a protective layer contacting with the transfer film and an adhesive layer with conductivity laminated on the protective layer, wherein the Young elastic modulus of the transfer film is 2.9-5.0 GPa.
In the electromagnetic wave shielding film with a transfer film of the present invention, the young's modulus of elasticity of the transfer film is more preferably 2.9 to 3.6 Gpa.
In the electromagnetic wave shielding film with the transfer film, the Young modulus of the transfer film is 2.9-5.0 GPa. I.e. the transfer film is sufficiently hard. Therefore, when the electromagnetic wave shielding film is pressed against the printed wiring board, the pressure is difficult to disperse.
Therefore, even when there is a level difference on the surface of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be reliably pressed, and the level difference can be reliably filled in the adhesive layer.
In the electromagnetic wave shielding film with the transfer film, the adhesive layer with conductivity has two functions of electromagnetic wave shielding function and jointing function with the printed circuit board.
When the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole (i.e., a step on the surface of the printed wiring board) for exposing the ground circuit is formed in the cover layer located above the ground circuit.
When the electromagnetic wave shielding film with the transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be reliably brought into contact with each other, and therefore, the increase in the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be prevented.
The method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention is characterized by comprising the steps of: a transfer film preparation step of preparing a transfer film having a Young's modulus of 2.9 to 5.0GPa, and an electromagnetic wave shielding film formation step of forming an electromagnetic wave shielding film by laminating a protective layer, a shielding layer, and an adhesive layer in this order on the transfer film.
In the method for producing an electromagnetic wave shielding film with a transfer film of the present invention, the young's modulus of elasticity of the transfer film is more preferably 2.9 to 3.6 GPa.
Another method for manufacturing an electromagnetic wave shielding film with a transfer film according to the present invention includes the steps of: a transfer film preparation step of preparing a transfer film having a Young's modulus of 2.9 to 5.0GPa, and an electromagnetic wave shielding film formation step of forming an electromagnetic wave shielding film by sequentially laminating a protective layer and an adhesive layer made of a conductive resin and having an electromagnetic wave shielding function on the transfer film.
In the method for producing an electromagnetic wave shielding film with a transfer film of the present invention, the young's modulus of elasticity of the transfer film is more preferably 2.9 to 3.6 GPa.
The electromagnetic wave-shielding film with a transfer film of the present invention can be manufactured by the method.
The method for manufacturing a shielded printed wiring board according to the present invention is characterized by comprising the steps of:
a printed wiring board preparation step of preparing a printed wiring board including a base film, a printed circuit including a ground circuit formed on the base film, and a cover layer covering the printed circuit;
an electromagnetic wave shielding film preparation step of preparing the electromagnetic wave shielding film with a transfer film of the present invention;
a press-bonding step of disposing the adhesive layer of the electromagnetic wave shielding film with the transfer film in contact with the cover layer of the printed wiring board and press-bonding the electromagnetic wave shielding film with the transfer film to the printed wiring board;
a peeling step of peeling the transfer film from the electromagnetic wave shielding film with the transfer film;
wherein the surface of the cover layer in contact with the adhesive layer has a step.
As described above, in the electromagnetic wave shielding film with a transfer film of the present invention, the young's modulus of elasticity of the transfer film is 2.9 to 5.0GPa and is sufficiently hard.
Therefore, even if there is a level difference on the surface of the cover layer of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be reliably pressed, and the level difference can be reliably filled in the adhesive layer.
In the method for manufacturing a shielded printed wiring board according to the present invention, it is preferable that the step is a hole through which the ground circuit is exposed, and the adhesive layer has conductivity.
As described above, in the method for manufacturing a shielded printed wiring board according to the present invention, the adhesive layer can reliably fill the level difference.
In particular, when the height difference is a hole through which the ground circuit is exposed and the adhesive layer has conductivity, the adhesive layer can be reliably brought into contact with the ground circuit.
Therefore, the increase in connection resistance can be suppressed.
Drawings
Fig. 1 is a schematic cross-sectional view of an example of an electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention;
fig. 2 is a schematic process diagram illustrating an example of a printed wiring board preparation step of the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention;
fig. 3 is a schematic process diagram showing an example of an electromagnetic wave shielding film preparation process with a transfer film in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention;
fig. 4 is a schematic process diagram illustrating an example of a crimping step in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention;
fig. 5 is a schematic process diagram illustrating an example of a peeling step in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention;
fig. 6 is a schematic cross-sectional view of an example of the electromagnetic wave shielding film with a transfer film according to embodiment 2 of the present invention;
FIG. 7 (a) and (b) are process diagrams schematically illustrating a method for manufacturing an evaluation substrate according to example 1;
FIG. 8 is a schematic view showing a method for measuring the connection resistance of the evaluation substrate according to example 1-1 in the connection resistance test.
Detailed Description
The electromagnetic wave-shielding film with a transfer film of the present invention will be specifically described below. However, the present invention is not limited to the following embodiments, and can be applied with appropriate modifications within a scope not changing the gist of the present invention.
(embodiment 1)
An electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention will be described in detail with reference to the drawings.
Fig. 1 is a schematic cross-sectional view of an example of an electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention.
As shown in fig. 1, the electromagnetic wave-shielding film with transfer film 10 includes a transfer film 20 and an electromagnetic wave-shielding film 30 laminated on the transfer film 20.
The electromagnetic wave shielding film 30 includes a protective layer 31 in contact with the transfer film 20, a shielding layer 32 laminated on the protective layer 31, and an adhesive layer 33 laminated on the shielding layer 32.
The young's modulus of elasticity of the transfer film 20 is 2.9 GPa or more.
The upper limit of the young's modulus of elasticity of the transfer film 20 is preferably 5.0GPa, more preferably 4.5 GPa, and still more preferably 3.6 GPa.
When the young's modulus of elasticity of the transfer film exceeds 5.0GPa, the electromagnetic wave shielding film with the transfer film tends to be less likely to follow the height difference when it is attached to the printed wiring board.
The electromagnetic wave-shielding film 10 with the transfer film is attached to a printed wiring board for manufacturing a shielded printed wiring board.
When a shielded printed wiring board is manufactured using the electromagnetic wave shielding film 10 with a transfer film, the adhesive layer 33 of the electromagnetic wave shielding film 10 with a transfer film is brought into contact with the surface of the printed wiring board and pressure-bonded thereto.
At this time, if the young's modulus of elasticity of the transfer film 20 is 2.9 GPa or more, the pressure of pressure bonding is difficult to disperse because the transfer film 20 is sufficiently hard.
Therefore, even if there is a level difference on the surface of the printed wiring board, the adhesive layer 33 of the electromagnetic wave shielding film 30 can be reliably pressed, and the level difference can be reliably filled in the adhesive layer 33.
Next, the structure of each layer forming the electromagnetic wave-shielding film with transfer film 10 will be explained.
(transfer film)
The material of the transfer film is not particularly limited as long as it satisfies the young's modulus of elasticity of 2.9 to 5.0GPa of the transfer film, and examples thereof include polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, unplasticized polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutylene, plasticized polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane, ethylene-vinyl acetate copolymer, plastic sheets such as polyvinyl acetate, etc., paper such as cellophane, offset paper, kraft paper, coated paper, etc., various nonwoven fabrics, synthetic paper, metal layers, and composite films obtained by combining these materials.
In addition, the transfer film may be a thermosetting resin or a thermoplastic resin, preferably a thermoplastic resin. If the electromagnetic shielding film is a thermoplastic resin, the electromagnetic shielding film with the transfer film can easily follow the height difference of the printed wiring board.
The transfer film may be a film having a release treatment applied to one or both surfaces thereof, and examples of the release treatment include a method in which a release agent is applied to one or both surfaces of the film, or a method in which a matte treatment is performed physically.
When the transfer film is made of a plastic sheet, inorganic particles such as titanium oxide and silica, organic particles having a core-shell structure, and the like may be contained in order to adjust the young's modulus.
The thickness of the transfer film is preferably 10 to 150 μm, more preferably 20 to 100 μm, and further preferably 40 to 60 μm.
If the thickness of the transfer film is less than 10 μm, the transfer film is broken when the shielded printed wiring board is manufactured, and the transfer film is difficult to peel off from the electromagnetic wave shielding film.
If the thickness of the transfer film exceeds 150 μm, the handling becomes poor.
An adhesive layer for transfer film may be provided between the transfer film and the protective layer. In this case, the transfer film is in a state of being bonded to the adhesive layer for transfer film. The transfer film needs to be easily peeled from the electromagnetic wave shielding film when the electromagnetic wave shielding film is used, and the adhesive layer for the transfer film is preferably left on the transfer film side when the transfer film is peeled.
(protective layer)
The protective layer is not particularly limited as long as it has insulating properties and can protect the adhesive layer and the shielding layer, and is preferably composed of, for example, a thermoplastic resin composition, a thermosetting resin composition, an active energy ray-curable composition, or the like.
The thermoplastic resin composition is not particularly limited, and examples thereof include styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, and acrylic resin compositions.
The thermosetting resin composition is not particularly limited, and examples thereof include at least 1 resin composition selected from the group consisting of epoxy resin compositions, polyurethane resin compositions, polyurethaneurea (polyurethaneurea) resin compositions, styrene resin compositions, phenol resin compositions, melamine resin compositions, acrylic resin compositions, and alkyd resin compositions.
The active energy ray-curable composition is not particularly limited, and examples thereof include polymerizable compounds having at least 2 (meth) acryloyloxy groups in the molecule.
The protective layer may be made of 1 kind of single material or 2 or more kinds of materials.
The protective layer may contain a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity improver, an anti-blocking agent, and the like, as required.
The thickness of the protective layer is not particularly limited, and can be appropriately set as needed, but is preferably 1 to 15 μm, and more preferably 3 to 10 μm.
When the thickness of the protective layer is less than 1 μm, it is too thin to sufficiently protect the adhesive layer and the shielding layer.
If the thickness of the protective layer exceeds 15 μm, the electromagnetic wave shielding film is too thick, and therefore the electromagnetic wave shielding film is difficult to bend, and the protective layer itself is easily broken. Therefore, it is difficult to apply the present invention to a member requiring bending resistance.
An adhesion promoting coating may also be formed between the protective layer and the barrier layer.
Examples of the material of the anchor coat layer include urethane resin, acrylic resin, core-shell type composite resin having a urethane resin as a shell and an acrylic resin as a core, epoxy resin, imide resin, amide resin, melamine resin, phenol resin, urea-formaldehyde resin, blocked isocyanate obtained by reacting a blocking agent such as phenol with polyisocyanate, polyvinyl alcohol, and polyvinyl pyrrolidone.
(Shielding layer)
In the electromagnetic wave-shielding film with a transfer film 10 in fig. 1, the shielding layer 32 may be made of a metal layer or may be made of a conductive resin.
In the electromagnetic wave shielding film with a transfer film 10, the material of the shielding layer is not particularly limited as long as it can shield electromagnetic waves.
When the shielding layer is made of a metal layer, the metal layer may include a layer made of gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, or the like, and preferably includes a copper layer.
Copper is a suitable material for the shield layer from the viewpoint of conductivity and economy.
The shielding layer may further comprise a layer made of an alloy of the above metals.
Further, the shield layer may be formed of a metal foil or a metal film formed by sputtering, electroless plating, electroplating, or the like.
When the shield layer is made of a conductive resin, the shield layer may be made of conductive particles and a resin.
The conductive particles are not particularly limited, and may be metal fine particles, carbon nanotubes, carbon fibers, metal fibers, or the like.
When the conductive particles are metal particles, the metal particles are not particularly limited, and may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by plating copper powder with silver, polymer particles coated with metal, glass beads, or the like.
Among these, copper powder or silver-coated copper powder, which is available at low cost, is preferable from the viewpoint of economy.
The average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 to 15.0. mu.m. When the average particle diameter of the conductive particles is 0.5 μm or more, the conductivity of the conductive resin is good. When the average particle diameter of the conductive particles is 15.0 μm or less, the conductive resin can be made thin.
The shape of the conductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, dendritic, rod-like, fibrous, and the like.
The amount of the conductive particles is not particularly limited, but is preferably 15 to 80% by mass, more preferably 15 to 60% by mass.
The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions, and thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, polyurethane resin compositions, melamine resin compositions, and alkyd resin compositions.
(adhesive layer)
The adhesive layer may be made of a thermosetting resin or a thermoplastic resin.
Examples of the thermosetting resin include phenol resins, epoxy resins, polyurethane resins, melamine resins, polyamide resins, alkyd resins, and the like.
Examples of the thermoplastic resin include styrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, imide resins, and acrylic resins.
The epoxy resin is more preferably an amide-modified epoxy resin.
The above resin is suitable as the resin constituting the adhesive layer.
The thickness of the adhesive layer is not particularly limited, but is preferably 1 to 50 μm, more preferably 3 to 30 μm.
When the thickness of the adhesive layer is less than 1 μm, the amount of resin constituting the adhesive layer is small, and thus it is difficult to obtain sufficient bonding performance. And is easily broken.
When the thickness of the adhesive layer exceeds 50 μm, the whole adhesive layer becomes thick and the flexibility is liable to be lost.
The adhesive layer may also be electrically conductive.
In general, a ground circuit is also provided in the printed circuit of the printed wiring board. When the adhesive layer of the electromagnetic wave shielding film with the transfer film of the present invention has conductivity, the electromagnetic wave shielding film is disposed on the printed wiring board and the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit to electrically connect the adhesive layer and the ground circuit. In addition, the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave-shielding film and the external ground.
When the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, the cover layer located above the ground circuit forms a hole (i.e., a step on the surface of the printed wiring board) for exposing the ground circuit.
When the electromagnetic wave shielding film with the transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be reliably brought into contact with each other, and therefore, the increase in the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be prevented.
When the adhesive layer has conductivity, the adhesive layer may be made of conductive particles and resin.
The conductive particles are not particularly limited, and may be metal fine particles, carbon nanotubes, carbon fibers, metal fibers, or the like.
When the conductive particles are metal particles, the metal particles are not particularly limited, and may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by plating copper powder with silver, polymer particles coated with metal, glass beads, or the like.
Among these, copper powder or silver-coated copper powder, which is available at low cost, is preferable from the viewpoint of economy.
The average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 to 15.0. mu.m. When the average particle diameter of the conductive particles is 0.5 μm or more, the conductivity of the conductive adhesive layer is good. When the average particle diameter of the conductive particles is 15.0 μm or less, the conductive adhesive layer can be made thin.
The shape of the conductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, dendritic, rod-like, fibrous, and the like.
The amount of the conductive particles is not particularly limited, but is preferably 15 to 80% by mass, more preferably 15 to 60% by mass.
The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions, and thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, polyurethane resin compositions, melamine resin compositions, and alkyd resin compositions.
When the adhesive layer has conductivity, the adhesive layer preferably has anisotropic conductivity.
When the adhesive layer has anisotropic conductivity, the transmission characteristics of a high-frequency signal transmitted through a printed circuit of a printed wiring board are improved as compared with the case of having isotropic conductivity.
Next, a method for manufacturing an electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention will be described.
The method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention includes (1) a transfer film preparation step and (2) an electromagnetic wave shielding film formation step.
(1) Transfer film preparation process
In this step, a transfer film having a Young's modulus of elasticity of 2.9 to 5.0GPa is prepared.
The material and the like of the transfer film have already been described, and the description is omitted here.
(2) Electromagnetic wave shielding film formation step
Next, a protective layer, a shielding layer, and an adhesive layer are sequentially stacked on the transfer film to form an electromagnetic wave shielding film.
The method of laminating these layers can be the same as the conventional method of manufacturing an electromagnetic wave shielding film.
For example, an electromagnetic wave shielding film with a transfer film can be manufactured by forming a protective layer and a shielding layer on the transfer film, forming an adhesive layer on another release film, and bonding them.
The materials of the protective layer, the shield layer, and the adhesive layer, etc. have already been described, and the description thereof is omitted.
Through the above steps, the electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention can be manufactured.
Next, a method for manufacturing a shielded printed wiring board using an electromagnetic wave shielding film with a transfer film according to embodiment 1 of the present invention will be described.
A method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention includes (1) a printed wiring board preparation step, (2) an electromagnetic wave shielding film with a transfer film preparation step, (3) a pressure bonding step, and (4) a peeling step.
Each step is described in detail below with reference to the drawings.
Fig. 2 is a schematic process diagram of an example of a printed wiring board preparation step of the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention.
Fig. 3 is a schematic process diagram of an example of a preparation process of an electromagnetic wave shielding film with a transfer film in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention.
Fig. 4 is a schematic process diagram illustrating an example of the pressure bonding step in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention.
Fig. 5 is a schematic process diagram illustrating an example of a peeling step in the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention.
(1) Printed wiring board preparation process
First, as shown in fig. 2, a printed wiring board 50 including a base film 51, a printed circuit 52 including a ground circuit 52a formed on the base film 51, and a cover layer 53 covering the printed circuit 52 is prepared.
In the printed wiring board 50, a hole 54 is formed in the cover layer 53 to expose the ground circuit 52a, and the hole 54 has a step.
The base film 51, the printed circuit 52, and the cover layer 53 may be the same as those used in conventional printed wiring boards.
(2) Electromagnetic wave shielding film preparation process with transfer film
Next, as shown in fig. 3, the electromagnetic wave-shielding film 10 with a transfer film according to embodiment 1 of the present invention is prepared.
The electromagnetic wave shielding film with a transfer film 10 is made of a transfer film 20 and an electromagnetic wave shielding film 30 laminated on the transfer film 20.
The electromagnetic wave shielding film 30 includes a protective layer 31 in contact with the transfer film 20, a shielding layer 32 laminated on the protective layer 31, and an adhesive layer 33 laminated on the shielding layer 32.
The adhesive layer 33 has conductivity.
(3) Pressure welding process
Next, as shown in fig. 4, the adhesive layer 33 of the electromagnetic wave-shielding film with transfer film 10 is arranged to contact the cover layer 53 of the printed wiring board 50, and the electromagnetic wave-shielding film with transfer film 10 is pressure-bonded to the printed wiring board 50.
At this time, the adhesive layer 33 has flexibility, and thus fills the hole 54.
Since the young's modulus of elasticity of the transfer film 20 is 2.9 to 5.0GPa, the pressure is hard to be dispersed when the electromagnetic wave shielding film 30 is pressure-bonded to the printed wiring board 50.
Therefore, the adhesive layer 33 of the electromagnetic wave shielding film 30 can be reliably pressed, and the adhesive layer 33 can reliably fill the hole 54.
Therefore, the adhesive layer 33 and the ground circuit 52a are surely in contact.
Since the adhesive layer 33 has conductivity, the ground circuit 52a and the adhesive layer 33 can be electrically connected.
As described above, since the adhesive layer 33 and the ground circuit 52a are reliably in contact with each other, the connection resistance is low.
In addition, after the shielded printed wiring board is manufactured, the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave shielding film and the external ground.
The conditions for pressure bonding in this step are not particularly limited, and for example, the following conditions are preferable: pressure: 1.0-5.0 MPa, temperature: 140-190 ℃ and time: 15-90 minutes.
(4) Peeling step
Next, as shown in fig. 5, the transfer film 20 is peeled from the electromagnetic wave-shielding film with transfer film 10.
The peeling method is not particularly limited, and a conventional method can be employed.
The shield printed wiring board 60 can be manufactured through the above processes.
In the method for manufacturing a shielded printed wiring board according to embodiment 1 of the present invention, the hole 54 is formed as a step in the cover layer 53, but in the method for manufacturing a shielded printed wiring board according to the present invention, a simple step portion may be formed in the cover layer. In this case, the adhesive layer of the electromagnetic wave shielding film with the transfer film may not have conductivity.
(embodiment 2)
Next, an electromagnetic wave-shielding film with a transfer film according to embodiment 2 of the present invention will be described in detail with reference to the drawings.
Fig. 6 is a schematic cross-sectional view of an example of the electromagnetic wave shielding film with a transfer film according to embodiment 2 of the present invention.
As shown in fig. 6, the electromagnetic wave shielding film with transfer film 110 is made of a transfer film 120, and an electromagnetic wave shielding film 130 laminated on the transfer film 120.
The electromagnetic wave shielding film 130 includes a protective layer 131 in contact with the transfer film 120, and an adhesive layer 133 having conductivity laminated on the protective layer 131.
The young's modulus of elasticity of the transfer film 120 is 2.9 GPa or more.
The upper limit of the Young's modulus of the transfer film 120 is preferably 5.0GPa, more preferably 4.5 GPa, and still more preferably 3.6 GPa.
When the young's modulus of elasticity of the transfer film exceeds 5.0GPa, the following ability to the difference in height is likely to be lowered when the electromagnetic wave shielding film with the transfer film is attached to the printed wiring board.
The electromagnetic wave-shielding film with transfer film 110 is used for attachment to a printed wiring board to manufacture a shielded printed wiring board.
When the electromagnetic wave shielding film with transfer film 110 is used to manufacture a shielded printed wiring board, the adhesive layer 133 of the electromagnetic wave shielding film with transfer film 110 is brought into contact with the surface of the printed wiring board and pressure-bonded thereto.
At this time, if the young's modulus of elasticity of the transfer film 120 is 2.9 GPa or more, the pressure of pressure bonding is difficult to disperse because the transfer film 120 is sufficiently hard.
Therefore, even if there is a level difference on the surface of the printed wiring board, the adhesive layer 133 of the electromagnetic wave shielding film 130 can be reliably pressed, and the level difference can be reliably filled in the adhesive layer 133.
In the electromagnetic wave shielding film with transfer film 110, the adhesive layer 133 has conductivity and also has an electromagnetic wave shielding function.
That is, in the electromagnetic wave shielding film with transfer film 110, the adhesive layer 133 has both an electromagnetic wave shielding function and a function of bonding to a printed wiring board.
In general, a ground circuit is also provided in the printed circuit of the printed wiring board. Since the adhesive layer of the electromagnetic wave shielding film with the transfer film has conductivity, the electromagnetic wave shielding film can be electrically connected to the ground circuit by disposing the electromagnetic wave shielding film on the printed wiring board and bringing the adhesive layer of the electromagnetic wave shielding film into contact with the ground circuit. In addition, the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave-shielding film and the external ground.
When the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole (i.e., a step on the surface of the printed wiring board) for exposing the ground circuit is formed in the cover layer located above the ground circuit.
When the electromagnetic wave shielding film with the transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be reliably brought into contact with each other, and therefore, the increase in the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit can be prevented.
The adhesive layer 133 may be made of conductive particles and resin.
The conductive particles are not particularly limited, and may be metal fine particles, carbon nanotubes, carbon fibers, metal fibers, or the like.
When the conductive particles are metal particles, the metal particles are not particularly limited, and may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder formed by plating copper powder with silver, polymer particles coated with metal, glass beads, or the like.
Among these, copper powder or silver-coated copper powder, which is available at low cost, is preferable from the viewpoint of economy.
The average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 to 15.0. mu.m. When the average particle diameter of the conductive particles is 0.5 μm or more, the conductivity of the conductive adhesive layer is good. When the average particle diameter of the conductive particles is 15.0 μm or less, the conductive adhesive layer can be made thin.
The shape of the conductive particles is not particularly limited, and can be appropriately selected from spherical, flat, scaly, dendritic, rod-like, fibrous, and the like.
The amount of the conductive particles is not particularly limited, but is preferably 15 to 80% by mass, more preferably 15 to 60% by mass.
The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions, thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, polyurethane resin compositions, melamine resin compositions, and alkyd resin compositions, and the like.
The preferable materials of the transfer film 120 and the protective layer 131 of the electromagnetic wave-shielding film with transfer film 110 are the same as those of the transfer film 20 and the protective layer 31 of the electromagnetic wave-shielding film with transfer film 10, and thus the description thereof is omitted here.
Next, a method for manufacturing an electromagnetic wave shielding film with a transfer film according to embodiment 2 of the present invention will be described.
The method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention includes (1) a transfer film preparation step and (2) an electromagnetic wave shielding film forming step.
(1) Transfer film preparation process
In this step, a transfer film having a Young's modulus of elasticity of 2.9 to 5.0GPa is prepared. The material and the like of the transfer film have already been described, and thus the description is omitted here.
(2) Electromagnetic wave shielding film formation step
Next, a protective layer and an adhesive layer are sequentially laminated on the transfer film to form an electromagnetic wave shielding film.
The method of laminating the electromagnetic shielding films can be the same as the conventional method of manufacturing an electromagnetic shielding film.
Since the materials and the like have already been described, the description thereof is omitted here.
[ examples ] A method for producing a compound
The following are examples to explain the present invention more specifically, but the present invention is not limited to these examples.
Examples 1-1 to 1-3 and comparative example 1-1
(1) Transfer film preparation process
Transfer films (examples 1-1 to 1-3) made of polyethylene terephthalate films having a thickness of 50 μm and a Young's modulus shown in Table 1 and transfer films (comparative example 1-1) made of polymethylpentene having a thickness of 50 μm were prepared. The Young's modulus was measured at 25 ℃ in accordance with JIS K7113-.
(2) Electromagnetic wave shielding film formation step
And coating a release agent on the surface of the transfer film, and heating and drying to form a release agent layer. An epoxy resin was prepared as a composition for a protective layer, and the epoxy resin was applied to the surface of the release agent layer using a wire bar, and heated and dried to form a protective layer having a thickness of 5 μm.
Next, a shield layer made of silver was formed to a thickness of 0.1 μm on the surface of the protective layer by vacuum evaporation.
Next, dendritic silver-coated copper powder having an average particle size of 5 μm as a conductive filler was added to the epoxy resin to 15 mass%, thereby preparing a composition for an adhesive layer. Subsequently, the composition for an adhesive layer was applied to a shield layer with a wire bar, and then dried at 100 ℃ for 3 minutes to form an adhesive layer having anisotropic conductivity and a thickness of 15 μm.
The electromagnetic wave shielding films with transfer films according to examples 1-1 to 1-3 and comparative example 1-1 were produced through the above steps.
Examples 2-1 to 2-3 and comparative example 2-1
(1) Transfer film preparation process
Transfer films (examples 2-1 to 2-3) made of polyethylene terephthalate films having a thickness of 50 μm and a Young's modulus shown in Table 2 and transfer films (comparative example 2-1) made of polymethylpentene having a thickness of 50 μm were prepared. The Young's modulus was measured at 25 ℃ in accordance with JIS K7113-.
(2) Electromagnetic wave shielding film formation step
And coating a release agent on the surface of the transfer film. An epoxy resin as a composition for a protective layer was prepared, and the epoxy resin was applied to the surface of a transfer film coated with a release agent using a wire bar, and heated and dried to form a protective layer having a thickness of 5 μm.
Next, an adhesive layer composition was prepared by adding 60 mass% of dendritic silver-coated copper powder having an average particle size of 5 μm as a conductive filler to an epoxy resin.
Subsequently, the composition for an adhesive layer was applied onto a protective layer with a wire bar, and then dried at 100 ℃ for 3 minutes to form an adhesive layer having isotropic conductivity and a thickness of 15 μm.
The electromagnetic wave shielding films with the transfer films according to examples 2-1 to 2-3 and comparative example 2-1 were produced through the above-described steps.
In the electromagnetic wave shielding films with transfer films according to examples 2-1 to 2-3 and comparative example 2-1, the adhesive layer having conductivity has both an electromagnetic wave shielding function and a function of bonding to a printed wiring board.
(preparation of substrate for evaluation)
Fig. 7 (a) and (b) are schematic process diagrams of the method for producing an evaluation substrate according to example 1.
First, as shown in fig. 7 (a), 2 printed circuits 252 made of copper foil having a gold plating layer provided on a part of the surface thereof were formed on a base film 251 made of polyimide, and a cover layer 253 (thickness 37.5 μm) made of polyimide film having a hole 254 (diameter 0.5 mm) for exposing the printed circuits was formed thereon, thereby producing a printed wiring board 250 used as a substrate for evaluation.
In printed wiring board 250, printed circuit 252 simulates a ground circuit.
Next, as shown in fig. 7 (b), the electromagnetic wave-shielding film 210 with a transfer film according to example 1-1 is disposed on the printed wiring board 250 such that the adhesive layer 233 of the electromagnetic wave-shielding film 210 with a transfer film is in contact with the cover layer 253 of the printed wiring board 250.
Next, using a press at temperature: 170 ℃ for 3 minutes, pressure: heating and pressurizing under the condition of 3.0MPa, and pressing the electromagnetic wave shielding film with the transfer film to the printed circuit board.
Next, the evaluation substrate according to example 1 was obtained by peeling the transfer film 220.
In fig. 7 (b), reference numeral 230 denotes an electromagnetic wave shielding film, reference numeral 231 denotes a protective layer, and reference numeral 232 denotes a shielding layer.
In addition to the electromagnetic wave shielding films with transfer films according to examples 1-2, 1-3, and 2-1 to 2-3, and comparative examples 1-1 and 2-1, the evaluation substrates according to examples 1-2, 1-3, and 2-1 to 2-3, and comparative examples 1-1 and 2-1 were obtained in the same manner as the evaluation substrate according to example 1.
(connection resistance test)
FIG. 8 is a schematic view of a method for measuring the connection resistance of the evaluation substrate according to example 1-1 in the connection resistance test.
In the evaluation substrate according to example 1-1, as shown in fig. 8, the resistance values between 2 printed circuits 252 were measured using a resistance meter 270, and the connection resistance between the printed circuits of the evaluation substrate and the adhesive layer of the electromagnetic wave shielding film with a transfer film was evaluated.
In addition, the connection resistance of the printed circuit of the evaluation substrate and the adhesive layer of the electromagnetic wave shielding film with a transfer film in the evaluation substrates according to examples 1-2, 1-3 and 2-1 to 2-3 and comparative examples 1-1 and 2-1 was evaluated in the same manner. The results are shown in tables 1 and 2.
The cases of examples 1-1 to 1-3 and comparative example 1-1 in which the connection resistance was less than 3000 m.OMEGA.and examples 2-1 to 2-3 and comparative example 2-1 in which the connection resistance was less than 250 m.OMEGA.were evaluated as excellent in conductivity.
[ TABLE 1 ]
[ TABLE 2 ]
As shown in tables 1 and 2, it is understood that the electromagnetic wave shielding films with the transfer films of examples 1-1 to 1-3 and examples 2-1 to 2-3 have low connection resistance.
That is, examples 1-1 to 1-3 and examples 2-1 to 2-3 show that the adhesive layer of the electromagnetic wave shielding film with the transfer film and the printed circuit of the evaluation substrate are reliably in contact with each other
[ NUMBER DEFINITION ]
10. 110, 210 electromagnetic wave shielding film with transfer film
20. 120, 220 transfer film
30. 130, 230 electromagnetic wave shielding film
31. 131, 231 protective layer
32. 232 shielding layer
33. 133, 233 adhesive layer
50. 250 printed wiring board
51. 251 base film
52. 252 printed circuit
52a ground circuit
53. 253 coating layer
54. 254 hole
60 shielding printed circuit board
270 resistance meter
Claims (13)
1. An electromagnetic wave shielding film with a transfer film, which is an electromagnetic wave shielding film with a transfer film comprising a transfer film and an electromagnetic wave shielding film laminated on the transfer film, characterized in that:
the electromagnetic wave shielding film comprises a protective layer contacting with the transfer film, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer,
the Young's modulus of elasticity of the transfer film is 2.9-5.0 GPa.
2. The electromagnetic wave-shielding film with a transfer film of claim 1,
the Young's modulus of elasticity of the transfer film is 2.9-3.6 GPa.
3. The electromagnetic wave-shielding film with a transfer film of claim 1, wherein:
the adhesive layer is electrically conductive.
4. The electromagnetic wave-shielding film with a transfer film of any one of claims 1 to 3, wherein:
the shielding layer is made of a metal layer.
5. The electromagnetic wave-shielding film with a transfer film of any one of claims 1 to 3, wherein:
the shield layer is made of a conductive resin.
6. An electromagnetic wave shielding film with a transfer film, which is an electromagnetic wave shielding film with a transfer film comprising a transfer film and an electromagnetic wave shielding film laminated on the transfer film, characterized in that:
the electromagnetic wave shielding film includes a protective layer in contact with the transfer film and an adhesive layer having conductivity laminated on the protective layer,
the Young's modulus of elasticity of the transfer film is 2.9-5.0 GPa.
7. The electromagnetic wave-shielding film with a transfer film of claim 6,
the Young's modulus of elasticity of the transfer film is 2.9-3.6 GPa.
8. A method for manufacturing an electromagnetic wave shielding film with a transfer film, comprising the steps of:
a transfer film preparation step of preparing a transfer film having a Young's modulus of elasticity of 2.9 to 5.0GPa,
and an electromagnetic wave shielding film forming step of forming an electromagnetic wave shielding film by laminating a protective layer, a shielding layer, and an adhesive layer in this order on the transfer film.
9. The method for manufacturing an electromagnetic wave-shielding film with a transfer film of claim 8, wherein,
the Young's modulus of elasticity of the transfer film is 2.9-3.6 GPa.
10. A method for manufacturing an electromagnetic wave shielding film with a transfer film, comprising the steps of:
a transfer film preparation step of preparing a transfer film having a Young's modulus of elasticity of 2.9 to 5.0GPa,
and an electromagnetic wave shielding film forming step of forming an electromagnetic wave shielding film by sequentially laminating a protective layer and an adhesive layer made of a conductive resin and having an electromagnetic wave shielding function on the transfer film.
11. The method for manufacturing an electromagnetic wave-shielding film with a transfer film of claim 10, wherein,
the Young's modulus of elasticity of the transfer film is 2.9-3.6 GPa.
12. A method for manufacturing a shielded printed wiring board, comprising the steps of:
a printed wiring board preparation step of preparing a printed wiring board including a base film, a printed circuit including a ground circuit formed on the base film, and a cover layer covering the printed circuit;
an electromagnetic wave shielding film with transfer film preparation step of preparing the electromagnetic wave shielding film with transfer film according to any one of claims 1 to 7;
a press-bonding step of disposing the adhesive layer of the electromagnetic wave shielding film with the transfer film in contact with the cover layer of the printed wiring board and press-bonding the electromagnetic wave shielding film with the transfer film to the printed wiring board;
a peeling step of peeling the transfer film from the electromagnetic wave shielding film with the transfer film;
wherein the surface of the cover layer in contact with the adhesive layer has a step.
13. The manufacturing method of a shielded printed wiring board according to claim 12, characterized in that:
the step is a hole exposing the ground circuit,
the adhesive layer is electrically conductive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-160342 | 2018-08-29 | ||
| JP2018160342A JP7256618B2 (en) | 2018-08-29 | 2018-08-29 | Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shield printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110876256A true CN110876256A (en) | 2020-03-10 |
Family
ID=69668619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910785812.4A Pending CN110876256A (en) | 2018-08-29 | 2019-08-23 | Electromagnetic wave shielding film, method for manufacturing same, and method for manufacturing shielded printed wiring board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7256618B2 (en) |
| KR (1) | KR102558230B1 (en) |
| CN (1) | CN110876256A (en) |
| TW (1) | TW202009283A (en) |
Cited By (1)
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| CN113539549A (en) * | 2021-07-15 | 2021-10-22 | 江西古川胶带有限公司 | Thermosetting conductive adhesive film and preparation method and application thereof |
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|---|---|---|---|---|
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
| KR102558151B1 (en) * | 2021-06-15 | 2023-07-21 | (주)와이솔 | Flexible printed circuit board with emi shielding sheet and method of fabricating thereof |
| TW202335576A (en) * | 2021-12-06 | 2023-09-01 | 日商拓自達電線股份有限公司 | Transfer film and electromagnetic wave shield film provided with transfer film |
| KR102591392B1 (en) * | 2022-11-16 | 2023-10-19 | (주)와이솔 | Flexible printed circuit board with emi shielding sheet and method of fabricating thereof |
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Also Published As
| Publication number | Publication date |
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| KR102558230B1 (en) | 2023-07-20 |
| JP7256618B2 (en) | 2023-04-12 |
| JP2020035858A (en) | 2020-03-05 |
| KR20200026065A (en) | 2020-03-10 |
| TW202009283A (en) | 2020-03-01 |
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