CN104797420A - Multilayer film and shielded printed wiring board - Google Patents

Multilayer film and shielded printed wiring board Download PDF

Info

Publication number
CN104797420A
CN104797420A CN201380060143.5A CN201380060143A CN104797420A CN 104797420 A CN104797420 A CN 104797420A CN 201380060143 A CN201380060143 A CN 201380060143A CN 104797420 A CN104797420 A CN 104797420A
Authority
CN
China
Prior art keywords
layer
film
resin bed
transfer film
transferred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201380060143.5A
Other languages
Chinese (zh)
Other versions
CN104797420B (en
Inventor
篠原启彰
芳野真次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN104797420A publication Critical patent/CN104797420A/en
Application granted granted Critical
Publication of CN104797420B publication Critical patent/CN104797420B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Provided is a multilayer film which has good embeddability and processability and is capable of adequately controlling the adhesive power of a transfer film with respect to a transfer-receiving layer. This multilayer film comprises: a transfer film (6) which comprises an inner resin layer (62) and outer resin layers (63) that are respectively laminated on one surface and the other surface of the inner resin layer (62), and in which a recessed and projected pattern (61) is formed on the outer surface of at least one of the outer resin layers (63); and a transfer-receiving layer (7) which is removably laminated on the outer surface of the transfer film (6), on said outer surface the recessed and projected pattern (61) being formed, and which is provided with a transferred pattern (71) that is formed by means of the recessed and projected pattern (61). The inner resin layer (62) is formed of a polyethylene terephthalate, and the outer resin layers (63) are formed of a polybutylene terephthalate.

Description

Stacked film and shielding printed wiring board
Technical field
The present invention relates to stacked film, in more detail, relate to stacked film and the shielding printed wiring board of the shielding electromagnetic waves film of shielded electronic equipment etc.
Background technology
Portable equipment and PC etc. will use shielding printed wiring board in the past.This shielding printed wiring board is to suppress noise or to shield for the purpose of the electromagnetic wave externally launched and be provided with screened film on the circuit substrate of flexible distributing board etc.
Usually, above-mentioned shielding printed wiring board manufactures in the following manner.First, for the stacked film forming cover layer (being transferred layer) on the one side of mould release membrance (transfer film) across parting agent layer coating resin, form screened film at cover layer side coating screen layer.By bonding screened film and hot pressing forms shielding printed wiring board on printed wiring board, this printed wiring board has the substrate parts of earthy wiring pattern and signal wiring pattern and to be layered on substrate parts and to expose the dielectric film of a part of earthy wiring pattern.Screened film has conductive adhesive oxidant layer at the binding face of itself and printed wiring board, and during hot pressing, conductive adhesive oxidant layer is embedded in the exposed portion of earthy wiring pattern of dielectric film.Thus, earthy wiring pattern is electrically connected with screen layer, and electromagnetic wave shielding function is able to further raising.
The mould release membrance purposes used in above-mentioned manufacturing process is different, such as patent document 1,2.
In patent document 1, disclose the mould release membrance used in the pre-preg stamping procedure when manufacturing copper-clad laminated board, this mould release membrance is provided with parting agent layer at the single or double of Polyester foam films.In patent document 2, disclose a kind of mould release membrance used in the stamping procedure of circuit substrate, described mould release membrance has embossing and its embossed surfaces roughness (Rz: ten mean roughness) is more than 5 μm less than 20 μm before stamping procedure, and after stamping procedure, be more than 2 μm less than 8 μm.
Prior art document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2002-1726 publication
Patent document 2: Japanese Unexamined Patent Publication 2008-246882 publication
Summary of the invention
Invent technical problem to be solved
But the mould release membrance of patent document 1,2 uses as padded coaming in the stamping procedure of circuit substrate, therefore, possibly enough bonding forces cannot be obtained because mould release membrance is too high relative to the rippability being transferred layer.In addition, usually, mould release membrance is formed by one deck resin, in some conditions, mould release membrance reduces for the product having shape-following-up properties of the cover layer that will fit, therefore, when the part that in printed wiring board, earthy wiring pattern exposes from dielectric film is comparatively narrow and small, conductive adhesive oxidant layer may be caused cannot to obtain sufficient embeddability.
For solving the problem, the object of the present invention is to provide and can obtain good embeddability and machinability and the stacked film that suitably can control transfer film is transferred layer bonding force.Technical scheme needed for technical solution problem
Stacked film of the present invention, it is characterized in that, comprising: transfer film to there is inner side resin bed and respectively at the one side of described inner side resin bed and the stacked outside resin bed of another side, further, relief pattern is formed with at the outer surface of at least one of described outside resin bed; And be transferred layer, strippingly be layered in the outer surface of described transfer film relief pattern, and be there is the pattern transferring formed by described relief pattern, wherein, described inner side resin bed is formed by PETG, and described outside resin bed is formed by polybutylene terephthalate (PBT).
According to above-mentioned structure, in transfer film, be laminated with the outside resin bed formed by polybutylene terephthalate (PBT) on the two sides of the inner side resin bed formed by PETG.Thus, because the tracing ability of transfer film relative to the change in shape being transferred layer improves, therefore, it is possible to obtain good embeddability.In addition, by the stacked inner side resin bed formed by PETG, even if when the expansion on direction, face due to factor impacts such as variations in temperature of the outer surface of outside resin bed, contraction, the distortion of outside resin bed also can be alleviated by inner side resin bed.And owing to being laminated with outside resin bed on the two sides of inner side resin bed, the power of the outer surface of outside resin bed can be made thus to expand on direction, face, shrinking is cancelled out each other, and alleviates the distortion of transfer film further.Therefore, when the screened film with stacked film of the present invention is bonded in printed circuit board and hot pressing time, the problem that causes because stacked film distortion can be prevented.
In addition, by transfer film and be transferred layer adhesive surface on form relief pattern and pattern transferring, make because anchoring effect improves transfer film relative to the bonding force being transferred layer, can prevent from being immersed in transfer film in the medium general subsequent handling of liquid, from the problem being transferred layer stripping, also can prevent liquid from entering into transfer film and being transferred between layer in such operation.
In addition, stacked film of the present invention can be following structure, that is, the arithmetic average roughness (Ra) of described relief pattern formed at described outside resin bed is 0.2 μm ~ 2.5 μm.
According to above-mentioned structure, transfer film can be made for the bonding force optimization being transferred layer.
In addition, stacked film of the present invention can be following structure, that is, the deviation of arithmetic average roughness (Ra) of the described relief pattern formed at described outside resin bed is less than 0.50 μm.
According to above-mentioned structure, by being formed as the structure that the deviation of mean roughness is less than 0.50 μm, transfer film can be made and be transferred each several part adhesive surface between layer bonding force stablize.
In addition, stacked film of the present invention can be configured to: described transfer film is that two sides outside resin bed 63 being layered in described inner side resin bed by extruding layer platen press forms.Outside resin bed can be formed concavo-convex, its method is form irregular two rollers by the surface of wherein at least one to implement pressurization and form.
According to above-mentioned structure, the duplexer be laminated by outside resin bed on the two sides of inner side resin bed by extruding layer platen press is utilized and on a roll surface, at least forms irregular two rollers pressurization and formed.Thus, the outside relief pattern of resin bed and the deviation being transferred the arithmetic average roughness of layer pattern transferring by described relief pattern can be reduced, thus transfer film can be made and be transferred the bonding force of layer, peeling force stablizes.In addition, according to above-mentioned structure, above-mentioned stacked film to be positioned on printed wiring board and after carrying out heating, pressurizeing, transfer film significantly declines relative to the bonding force being transferred layer.Thus, transfer film is easy from the operation transfiguration being transferred layer stripping.
In addition; stacked film of the present invention can be configured to: described in be transferred layer and can be; have the described protective layer in the screened film of conductive adhesive oxidant layer, metal level and protective layer, this metal layer is stacked in described conductive adhesive oxidant layer, and this protective layer is layered on described metal level.
According to the transfer film of above-mentioned structure, due to transfer film can be prevented to be out of shape, therefore, it is possible to it is stacked easily to carry out to screened film.And, because transfer film has good embeddability, thereby, it is possible to the space formed when suppressing the position of exposing ground connection wiring pattern in dielectric film to embed conductive adhesive, thus the conduction property of earthy wiring pattern can be suppressed to decline.
In addition, stacked film of the present invention can be configured to: described in be transferred layer can be have the described protective layer in the screened film of conductive adhesive oxidant layer and protective layer, this protective layer is layered in described conductive adhesive oxidant layer.
According to above-mentioned structure, due to transfer film can be prevented to be out of shape, therefore, it is possible to it is stacked easily to carry out to screened film.And, because transfer film has good embeddability, thereby, it is possible to the space produced when suppressing the position of exposing ground connection wiring pattern in dielectric film to embed conductive adhesive, thus the conduction property of earthy wiring pattern can be suppressed to decline.
Shielding printed wiring board of the present invention, is characterized in that, described screened film and printed wiring board bond.
According to above-mentioned structure; such shielding printed wiring board can be obtained, that is, described screened film to be bonded on printed wiring board and hot pressing time; can prevent the problem produced due to the distortion of described stacked film, and the operation of being peeled off from described protective layer by described transfer film is easy to implement.
Brief Description Of Drawings
Fig. 1 is the key diagram of the stacked film of present embodiment.
Fig. 2 is the key diagram of the manufacture method of the transfer film representing present embodiment.
Fig. 3 represents that the earthed circuit to shielding printed wiring board embeds the key diagram of conductive adhesive, and this shielding printed wiring board employs the stacked film of present embodiment.
Fig. 4 represents that the earthed circuit to shielding printed wiring board embeds the key diagram of conductive adhesive, and this shielding printed wiring board employs the stacked film of present embodiment.
Fig. 5 is the key diagram shielding printed wiring board under representing the state after being peeled off by the transfer film of present embodiment.
Fig. 6 is the key diagram of the shielded flexible printed wiring board representing embodiment.
Fig. 7 is the test method key diagram of the evaluation test of peel strength.
Detailed description of the invention
Below, with reference to accompanying drawing, the preferred embodiment of the present invention is described.
The stacked film 1 that Fig. 1 represents comprises: transfer film 6, there is inner side resin bed 62 and respectively at the one side of described inner side resin bed 62 and the stacked outside resin bed 63 of another side, further, relief pattern 61 is formed with at the outer surface of at least one of described outside resin bed 63; And be transferred layer 7, be strippingly layered in the outer surface of described transfer film 6 relief pattern 61, and be there is the pattern transferring 71 formed by described relief pattern 61.In addition, in the present embodiment, across the stacked transfer film 6 of the parting agent layer 6b that formed of coating mould release be transferred layer 7.
Inner side resin bed and outside resin bed can be bonded by adhesive, also can not use adhesive and stacked by thermal welding etc.When stacked by thermal welding, can easily manufacture stacked film well closely sealed between inner side resin bed and outside resin bed by extruding layer platen press.In addition, 2 outside resin beds preferably have identical thickness, but are not limited to this.
(transfer film 6)
As shown in Figure 1, transfer film 6 is laminated with outside resin bed 63,63 respectively in the one side of inner side resin bed 62 and another side.In the present embodiment, inner side resin bed 62 is formed by PET (PETG) resin, and outside resin bed 63,63 is formed by PBT (polybutylene terephthalate (PBT)) resin.Here, table 1 represents the general physical property of PBT resin and PET resin and the comparison of characteristic.
[table 1]
As shown in table 1, known PBT resin and PET resin are the closely similar materials of physical property, stratification characteristic, engineering properties.
Therefore, by being formed inner side resin bed 62 by PET resin, form outside resin bed 63,63 by PBT resin, even if make resin bed 63 outside such as when transfer film 6 occurrence temperature changes shrink similarly, expand, can curling distortion of Denging be prevented.And, because outside resin bed 63 is formed by PBT resin, be therefore easy to changes shape when being applied in pressure etc.That is, outside resin bed 63 is easy to follow the stacked change in shape being transferred layer, can obtain good embeddability.
In addition, the Resin crystallization of inner side resin bed 62 and outside resin bed 63 is used, percent thermal shrinkage can be made to reduce thus reduces the distortion of transfer film 6.
Preferably, the material of inner side resin bed 62 adopts PET resin, and the material of outside resin bed 63 adopts PBT resin, but is not limited to this.In addition, such as, PEN, polyimides, polyethylene, polypropylene, polyvinyl chloride, nylon, Merlon, polymethylpentene can be enumerated as the material of outside resin bed 63; Polypropylene, polymethylpentene, PEN, polyimides can be enumerated as the material of inner side resin bed 62.The thickness lower limit of inner side resin bed 62 is preferably 6 μm, is more preferably 8 μm, more preferably 25 μm.Higher limit is preferably 50 μm in addition, is more preferably 38 μm.The thickness lower limit of outside resin bed 63 is preferably 6 μm, is more preferably 8 μm.Higher limit is preferably 30 μm in addition, is more preferably 20 μm, more preferably 12 μm.
In addition, as shown in Figure 1, outside resin bed 63 be transferred in the stacked lamination surface of layer 7, its whole face is formed with the relief pattern 61 (protuberance 61a, recess 61b) be made up of multiple concaveconvex shape.
(transfer film 6: manufacture method)
Below, the manufacture method of transfer film 6 is described.Transfer film 6 is laminated with outside resin bed 63 by extruding layer platen press and forms on the two sides of inner side resin bed 62, and gives pressurization form by using the surface of wherein at least one to form irregular two rollers.
Specifically, first, the extruder (extruding width 1300mm) being 280 DEG C-290 DEG C by design temperature extrudes PET resin and is formed membranaceous by inner side resin bed 62, and batches on roller.Then, as shown in Figure 2, batch inner side resin bed roller 21 feed of PET resin, supply forming membranaceous inner side resin bed 62 between dandy roll 23 and casting roller (casting roll) 24, the arithmetic average roughness of this dandy roll 23 is 0.2 μm-2.5 μm.On the other hand, 2 the film extruders 22,22 (effectively extruding width 1300mm) being 220 DEG C-260 DEG C by design temperature extrude PBT, and the membranaceous outside resin bed 63,63 extruded is supplied between dandy roll 23 and casting roller 24, on the one side being layered in inner side resin bed 62 respectively to make resin bed 63,63 outside this and another side.Between dandy roll 23 and casting roller 24, the duplexer of inner side resin bed 62 and outside resin bed 63,63 is pressurizeed, and be formed with at the outer surface of the outside resin bed 63 being layered in dandy roll 23 side the relief pattern 61 that arithmetic average roughness is 0.2 μm-2.5 μm.Like this, the transfer film 6 of lamination outside resin bed 63,63 (PBT) on the two sides being formed in inner side resin bed 62 (PET resin), and relief pattern 61 can be formed on transfer film 6.The transfer film 6 of such as above-mentioned formation is batched and is taken care of on transfer film roller 25.Also can with 1 film extruder 22 stacked layer by layer outside resin bed 63.
In addition, in fig. 2, eliminate cooling roller etc., can suitably the resin after extruding be cooled and be formed the end of film resin.
In addition, above-mentioned manufacture method suitably can change according to the factor such as material, design.
Convex-concave pattern 61 is preferably formed in the whole surface, outside of outside resin bed 63, but is not limited to this.In addition, do not limit the pattern of relief pattern 61, such as, can be the pattern that repetition predetermined pattern is formed, can be randomly formed concavo-convex pattern yet.In addition, when 2 layers of outside resin bed 63,63 form relief pattern 61,2 dandy rolls 23 also can be used to carry out lamination process.
In addition, for formation relief pattern, in order to reduce the deviation of the concaveconvex shape of production lot, compared with sandblasting processing, the coating of chemical hair side, preferred use embossing processing, this embossing is processed by the concaveconvex shape formed on dandy roll can form predetermined shape continuously.In addition, by use through the screened film of transfer film of embossing processing to be positioned on printed wiring board and carry out heating, pressurize to make shields printed wiring board, transfer film declines to a great extent relative to the bonding force being transferred layer.Thus, transfer film is easy from the operation transfiguration being transferred layer stripping.
(being transferred layer 7)
As shown in Figure 3, in the present embodiment, being transferred layer 7 is, has conductive adhesive oxidant layer 8a, is layered in the metal level 8b on described conductive adhesive oxidant layer 8a and is layered in the protective layer of screened film of the protective layer on described metal level 8b.That is, being transferred layer 7 is the protective layers be made up of the coating layer of cover layer and insulating resin.
Polyester, polybenzimidazoles, aramid fiber, polyimides, polyimide amide, PEI, polyphenylene sulfide (PPS), PEN (PEN) etc. can be enumerated as the material formed covered film.
When not too requiring heat resistance, preferably using cheap polyester film, when requiring flame resistance, preferably using polyphenylene sulfide film, preferably using aramid fiber film or polyimide film when requiring heat resistance further.
As long as insulating resin has the resin of insulating properties, such as, heat-curing resin or uv curing resin can be enumerated.As heat-curing resin, such as, phenolic resin, acrylic resin, epoxy resin, melmac, silicones, acrylic acid modified silicones etc. can be enumerated.As uv curing resin, such as, Epocryl, polyester acrylate resin and methacrylate modified product thereof can be enumerated.In addition, as curing mode, as long as material cured can be made, such as, can be any one modes such as heat cure, ultraviolet curing, electron ray curing.
In addition, from preventing because outside resin bed 63 is water white transparency and cause forgetting the viewpoint of stripping, carry out painted preferably by adding pigment (such as white etc.) when molten resin.
In addition, the lower thickness limit being transferred layer 7 is preferably 1 μm, is more preferably 3 μm, more preferably 5 μm.In addition, the upper thickness limit being transferred layer 7 is preferably 15 μm, is more preferably 10 μm, more preferably 7 μm.In addition, be transferred the protective layer that layer is not limited to screened film, also can be used in the film such as cover layer, antiglare film.
In addition, being transferred layer 7 and being not limited to monolayer constructions will, also can be multi-ply construction.Such as, can be coated with successively by the excellent resin of mar proof, resistance to blocking the hard layer of transfer film 6 side that forms and by the excellent resin of resiliency the double-decker that formed of the soft layer that forms.
In the present embodiment, being transferred layer 7 is after the upper coating of the one side (outside resin bed 63 has the face of relief pattern 61) of transfer film 6, is formed for the resin being transferred layer 7 by coating.Thus, be transferred under the state that layer 7 is strippingly layered in transfer film 6, the relief pattern 61 of transfer film 6 is transferred to and is transferred layer 7 and forms pattern transferring 71 (top 71a, bottom 71b).That is, formed the bottom 71b of pattern transferring 71 by the protuberance 61a of relief pattern 61, formed the top 71a (with reference to figure 1) of pattern transferring 71 by the recess 61b of relief pattern 61.
Further illustrate, be transferred under the state that layer 7 is strippingly layered in transfer film 6, the protuberance 61a of relief pattern 61 engages with the bottom 71b of pattern transferring 71, and the recess 61b of relief pattern 61 engages with the top 71a of pattern transferring 71.Its result, because anchoring effect improves transfer film 6 relative to the bonding force being transferred layer 7, can prevent transfer film 6 in the usual subsequent handlings such as dipping liquid from peeling off from being transferred layer 7, thus can prevent from entering into transfer film 6 at such operation herb liquid and being transferred between layer 7.
In addition, after transfer film 6 is stripped, the arithmetic average roughness being provided with the surface of pattern transferring 71 being transferred layer 7 is preferably 0.2 μm-2.5 μm, more preferably 0.5 μm-1.7 μm.When being less than 0.2 μm, transfer film becomes too small relative to the bonding force being transferred layer, and in the usual subsequent handlings such as dipping liquid, transfer film may be peeled off from being transferred layer.When being greater than 2.5 μm, by transfer film from when being transferred layer stripping, due to excessive bonding force, be sometimes transferred layer itself damaged.And also can be following structure, that is, after transfer film 6 is stripped, the deviation being provided with the arithmetic average roughness on the surface of pattern transferring 71 being transferred layer 7 be less than 0.50 μm.By the deviation of arithmetic average roughness is set in less than 0.50 μm, transfer film 6 can be made and be transferred layer 7 adhesive surface each several part in bonding force stablize.
In addition, in the one side of transfer film 6, the stacked method being transferred film 7 is preferably coating, but also can use lamination, extrudes, impregnating is as the layer forming method beyond coating.
(parting agent layer 6b)
As long as transfer film 6 is transferred layer 7 relatively for having the layer of fissility, then there is no particular limitation for parting agent layer 6b, such as, can use the mould release of silicon class or non-silicon class.In addition, the maximum thickness of parting agent layer 6b is preferably less than the height of the relief pattern 61 in transfer film 6.When being coated with mould release to the irregular transfer film 6 of tool, mould release accumulates in each recess in relief pattern 61, and mould release is dispersed on transfer film 6 naturally.That is, be transferred mould release in the process of layer 7 and can be in dispersion naturally stacked and be configured in the state on the surface of transfer film 6 roughly equably.Thereby, it is possible to by transfer film 6 relative to the cohesive being transferred layer 7 control from be transferred to be transferred layer 7 itself when layer 7 peels off transfer film 6 can not the degree of the breakage due to excessive bonding force.Like this, due to can suitably control transfer film 6 relative to be transferred layer 7 bonding force, therefore, it is possible to prevent with the problem produced when excessive bonding force or too small bonding force adhesive transfer film.
In addition, from being transferred transfer film 6 when layer 7 peels off transfer film 6 relative to being 1N/50mm-20N/50mm the state of the peel strength being transferred layer 7 preferably before heating, pressurization.If peel strength value is less than 1N/50mm; then when screened film 10 is immersed in liquid, transfer film 6 can be peeled off from being transferred layer 7; on the other hand; if the value of peel strength is greater than 20N/50mm; then mould release membrance (transfer film 6) is excessively strong relative to the bonding force being transferred layer 7, even protective layer can be caused damaged with being transferred to peel off together with layer 7 when being peeled off by transfer film 6.In addition, in order to after being adhered to by screened film printed wiring board carrying out hot pressing, transfer film 6 is preferably 0.2N/50mm-3.0N/50mm relative to the peel strength being transferred layer 7, more preferably 0.2N/50mm-1.0N/50mm.If peel strength value is less than 0.2N/50mm, then after hot pressing, transfer film 6 can be peeled off naturally from being transferred layer 7 sometimes, on the other hand, if peel strength value is greater than 3N/50mm, then by people or manufacturing installation by transfer film from the operability worsens be transferred when layer is peeled off.
In addition, in the present embodiment, transfer film 6 and be transferred layer 7 stacked together and this therebetween between across parting agent layer 6b, but the present invention is not limited to this, also can carry out stacked across the resin with release, or, also can not carry out stacked across mould release.If said two devices is do not carry out stacked structure across the resin or mould release with release, so, arbitrary outside resin bed can be formed by the material being wherein added with mould release.
Here, the transfer film 6 under the state before heating, pressurization is measured in the following manner relative to the peel strength being transferred layer 7.Specifically, as shown in Figure 7, before hot pressing the conductive adhesive oxidant layer 8a of the screened film 10 of (heating, pressurization before) surface on stick two-sided tape, the one side of this two-sided tape is posted on testing machine (PALMEK PFT-50S peel strength tester) base with fixed mask film 10.Then, the end of the transfer film 6 of screened film 10 is arranged on the chuck (omitting diagram) of testing machine, measures transfer film 6 relative to the peel strength being transferred layer 7.Here, as shown in Figure 7, as stripping conditions, peel angle is set as 170 °, and the peeling rate setting the transfer film 6 produced by chuck is 1000mm/min.And, carry out 5 tests, the maximum of the peel strength value of each gained and the minimum of a value value as peel strength is calculated.
(shielded flexible printed wiring board 100)
Fig. 3 be represent on base film 5, load screened film 10 after heat on layer direction and the key diagram of the state of pressurizeing with forcing press etc.Wherein, base film 5 is configured to: comprise basilar memebrane 2, printed circuit 3 and dielectric film 4, printed circuit 3 is made up of signal circuit 3a and earthed circuit 3b and is formed on basilar memebrane 2, and printed circuit 3 is covered by dielectric film 4 after removing (nonisulated portion) at least partially 3c of wherein earthed circuit 3b.
Here, can bond with adhesive between basilar memebrane 2 and printed circuit 3, also can not use adhesive and engage with so-called adhesive-free type copper-clad laminated board.In addition, dielectric film 4 both can use adhesive to bond flexible insulating film, also can be formed by serial of methods such as the coating of photosensitive insulating resin, drying, exposure, development, heat treatments.In addition, base film 5 can be implemented by suitably selecting following structure, that is: only the one side of basilar memebrane have printed circuit single side FPC, basilar memebrane two-sided have printed circuit double-side type FPC, multi-layered type FPC multilayer laminated for above-mentioned FPC (flexible printing wiring board), " Off レ Network ス ボ ー De " (Japan's registration mark) with multi-layer part equipped section and cable portion, the material that forms multi-layer portion are the rigid and flexibility substrate of hard material or are with for the TAB of carrier package.
Screened film 10 has transfer film 6 and screened film main body 9.Screened film main body 9 has and is transferred layer 7 and adhesive phase 8a, is transferred layer 7 and is formed by coating on transfer film 6, above-mentioned adhesive phase 8a be arranged on across metal level 8b be transferred the face opposite side that layer 7 contacts with transfer film 6 face on.Here, the adhesive phase 8a be made up of conductive adhesive and metal level 8b forms electromagnetic wave shielding 8.In this electromagnetic wave shielding 8, when pressurizeing to the adhesive phase 8a by heating deliquescing, adhesive flows into insulation removal unit 4a as shown by arrows, with earthed circuit conducting (with reference to figure 3).Like this, in the present embodiment, the earthed circuit 3b of base film 5 (printed wiring board) is connected with conductive adhesive oxidant layer 8a, but the present invention is not limited thereto, and conductive adhesive oxidant layer not necessarily needs to be connected with the ground wire of printed wiring board.
When above-mentioned distortion occurs adhesive phase 8a, as shown in Figure 4, the direction of following adhesive phase 8a distortion exerts a force to metal level 8b, thus causes metal level 8b to be out of shape.Then, by being transferred layer 7, have the outside resin bed 63 of relief pattern 61, inner side resin bed 62, the order of outermost outside resin bed 63 produces distortion in equidirectional force.At this moment, owing to being transferred layer 7 and outside resin bed 63 bonds, therefore result from be transferred layer 7 be out of shape the power that produces well laterally resin bed 63 transmit.In addition, because outside resin bed 63 is formed by polybutylene terephthalate (PBT), inner side resin bed 62 is formed by PETG, and therefore for the distortion being transferred layer 7, outside resin bed 63 can present good tracing ability.Thus, due to transfer film 6 with by the distortion being transferred whole duplexer that layer 7 forms and can following adhesive phase 8a, therefore, adhesive phase 8a can not be hindered towards the distortion on the direction of insulation removal unit 4a flowing.That is, by using transfer film 6 and being transferred layer 7, can prevent from producing the space with adhesive phase 8a at insulation removal unit 4a, and can embeddability be improved.
And, after the nonisulated portion 3c of adhesive phase 8a and earthed circuit 3b and dielectric film 4 fully bond and form shielded flexible printed wiring board 100, when being peeled off together with parting agent layer 6b (with reference to figure 1) by the transfer film 6 of screened film 10, obtain the shielding FPC101 being provided with pattern transferring 71 on the surface being transferred layer 7 shown in Fig. 5.
Form the material of basilar memebrane 2 and dielectric film 4, such as, the resins such as polyester, polybenzimidazoles, polyimides, polyimide amide, PEI, polyphenylene sulfide (PPS), epoxy resin can be enumerated.When not too requiring heat resistance, preferably using cheap polyester film, when requiring flame resistance, can polyphenylene sulfide film being used, preferably using polyimide film when requiring heat resistance further.
Adhesive phase 8a is made up of polystyrene type, vinyl acetate class, polyesters, polyethylene kind, PP type, polyamide-based, the thermosetting resin such as thermoplastic resin or phenol, epoxies, urethanes, melamine class, alcohol acids such as rubber-like and propylene class as resin of binding property.In addition, also can be used in and be mixed into the electroconductive stuffing such as metal, carbon in these resin of binding property and the conductive adhesive with electric conductivity.Like this, by using conductive adhesive to be reliably electrically connected by earthed circuit 3b and metal level 8b.In addition, the anisotropic conductive adhesive reducing conductive filler amounts also can be used as conductive adhesive.Like this, during as conductive adhesive use anisotropic conductive adhesive, more easily form thin film compared with isotropic conductivity adhesive, because conductive filler amounts is few, therefore, it is possible to make flexible excellent screened film.In addition, isotropic conductivity adhesive also can be used as conductive adhesive.Like this, when using isotropic conductivity adhesive as conductive adhesive, the conductive adhesive oxidant layer formed by isotropic conductivity adhesive is only set, except can allow to the grounding connection of earthed circuit 3b etc. become may except, and can electromagnetic shielding effect be had.In addition, when not specially requiring heat resistance, preferred use by the thermoplastic resin of the polyesters of the restriction such as maintaining requirement, and require heat resistance or require more excellent flexible time, preferably use and form the high epoxies heat-curing resin of reliability after electromagnetic wave shielding 8.In addition, adhesive phase 8a also can use and have fusible conductive adhesive at normal temperatures.
In addition, in the above-described embodiment, metal level 8b and adhesive phase 8a is used as electromagnetic wave shielding 8, but, as mentioned above when using isotropic conductivity adhesive as adhesive phase 8a, also can for omitting the structure of metal level 8b.
Carbon, silver, copper, nickel, scolding tin, aluminium can be used as electroconductive stuffing, mixture that silver silver-plated on copper powder covers copper gasket and the filler on resin balls or glass marble etc. after plating or these fillers.Because the price of silver is high, copper is not enough in resistance to thermal reliability, aluminium is not enough in moisture-proof reliability, and scolding tin is difficult to obtain enough electric conductivity, therefore preferably use less expensive and have excellent electric conductivity and the silver that reliability is high covers copper gasket or nickel.
The electroconductive stuffings such as metal packing also affect by the shape etc. of filler the mixing ratio of resin of binding property, when using silver to cover copper gasket, relative to resin of binding property 100 weight portion, preferably use the silver of 10-400 weight portion to cover copper gasket, more preferably use the silver of 20-150 weight portion to cover copper gasket.When more than 400 weight portion, the cohesive of earthed circuit (Copper Foil) 3b is reduced, the deteriorated flexibility of shielding FPC101.In addition, when being less than 10 weight portion, electric conductivity significantly reduces.In addition, when using nickel filler, relative to resin of binding property 100 weight portion, preferably using the nickel filler of 40-400 weight portion, more preferably using the nickel filler of 100-350 weight portion.When more than 400 weight portion, the cohesive of earthed circuit (Copper Foil) 3b is reduced, the deteriorated flexibility of shielding FPC101.In addition, when being less than 40 weight portion, electric conductivity significantly reduces.The shape of the electroconductive stuffings such as metal packing can be any one shape in spherical, needle-like, threadiness, flake or dendroid.
As previously mentioned, when being mixed with the electroconductive stuffings such as metal packing, increase only the thickness of these fillers, being about 20 ± 5 μm.In addition, when not mixed conductivity filler, the thickness of adhesive phase 8a is 1 μm-10 μm.Therefore, it is possible to reduce the thickness of electromagnetic wave shielding 8, and thin shielding FPC101 can be made.
Aluminium, copper, silver, gold etc. can be enumerated as the metal material forming metal level 8b.Also suitably can select metal material according to required shielding character, but due to copper exist contact with air time the problem that is easily oxidized, gold expensive, the aluminium of preferably use cheapness or the high silver of reliability.Suitably select thickness according to required shielding character and flexibility, but general preferred settings thickness is 0.01 μm-1.0 μm.When thickness is less than 0.01 μm, shield effectiveness is insufficient, otherwise, the deteriorated flexibility when thickness is more than 1.0 μm.Formation method as metal level 8b has vacuum evaporation, sputtering, CVD, MO (metallorganic) and plating etc., but if consider production, preferably uses vacuum evaporation, can obtain cheap and stable metal film.In addition, metal level is not limited to metal film, also can use metal forming.Use the lower thickness limit of metal forming during metal forming to be preferably 2 μm, be more preferably 6 μm.In addition, the upper thickness limit of metal forming is preferably 18 μm, is more preferably 12 μm.
Be explained above embodiments of the present invention, but only illustrate object lesson, be not particularly limited the present invention, suitably can carry out design alteration to concrete structure.In addition, effect described in working of an invention mode just lists the optimal effect drawn by the present invention, and the effect drawn by the present invention is not limited to the content recorded in embodiments of the present invention.
[embodiment]
Below, the embodiment of the stacked film of present embodiment and comparative example is used to specifically describe the present invention.
Use the structure represented as Fig. 1, that is, there is the screened film 10 of transfer film 6 and screened film main body 9 as embodiment, this screened film main body 9 have be layered in outside resin bed 63 one on be transferred layer 7.
Embodiment transfer film 6 used adopts the film processed by extruding layer platen press, and its thickness is total 57 ± 3 μm.In addition, the arithmetic average roughness Ra of relief pattern 61 is 0.35 μm.In addition, the tensile strength TD (transverse direction) of transfer film 6 or MD (perpendicular direction) is 220-225MPa.In addition, transfer film 6 adopts as following thing: after the heat treatment of 170 DEG C × 10 minutes, and its shrinkage test result is TD be 0%, MD is 0.7%.
Illustrate the manufacture method of the transfer film 6 used in embodiment.The PBT resin (trade name: " ジ ュ ラ ネ ッ Network ス (Japan's registration mark) ") that outside resin bed 63,63 uses WinTechPolymer company to manufacture.The thickness that inner side resin bed 62 uses Unitika company to manufacture is the PET resin (trade name: " エ Application Block レ ッ ト (Japan's registration mark) ") of 25 μm.
First, as shown in Figure 2, batch and be directed to transfer film roller 25 in the above-mentioned biaxial stretch-formed PET film of inner side resin bed roller 21.On the other hand, above-mentioned PET resin is dropped into arbitrary film extruder 22,22, at design temperature be melted in the extruder of 235 ± 5 DEG C mixing.Then, PBT resin is expressed into the two sides of described PET resin from catwalk (smooth extrusion) (effectively the extruding width 1300mm) of film extruder 22,22, and makes resin thickness be about 16 ± 3 μm.
Like this, receive transfer film 6 with the dandy roll 23 rotated and casting roller 24 and form film, this transfer film 6 forms by the two sides that PBT resin is expressed into PET resin.At this moment, the temperature of dandy roll 23 and casting roller 24 is adjusted to 130 ± 3 DEG C.In addition, the roller diameter of setting dandy roll 23 and casting roller 24 is 500mm, and peripheral speed is 20m/ minute.The transfer film 6 formed after film slowly cools with the speed of 10 DEG C/sec and from amorphism to crystallinity after transformation, is batched by transfer film roller 25.
Transfer film 6 by above-mentioned manufacture is configured as the transfer film of material as embodiment of width 1200mm.
In addition, comparative example use width 1200mm through sandblasting processing and thickness is that the PET film of 50 μm is as transfer film.
As shown in Figure 6, across the stacked screened film main body 209 of parting agent layer (not shown) of about 0.6 μm, screened film 210 is manufactured to the transfer film 206 of above-described embodiment and comparative example, this screened film main body 209 by thickness be 5-7 μm be transferred layer 207, thickness is about the metallic film, namely of 0.1 μm, the conductive adhesive oxidant layer 208a that metal level 208b and thickness are about 16 μm is formed.
In addition, be transferred layer 207 and the side by transfer film 206 transfer printing pattern transferring is provided with transparent resin bed, and use the double-decker with stacked black resin layer on this transparent resin layer.
(evaluation of the transfer film of embodiment)
In this manufacturing process, the transfer film of embodiment does not produce curling and to shrink therefore operability good.In addition, owing to being formed with relief pattern (through hair side processing) in the one side (outside resin bed) of transfer film, therefore the sliding of transfer film is good, and the completion status that painting can be made to roll up is more good.
(evaluation of embeddability)
As shown in Figure 6, being configured to of base film 205, be, on the polyimides basilar memebrane 202 of 25 μm, be the Copper Foil printed circuit 203 of 55 μm across stacked 2 thickness in enough intervals, each printed circuit 203 be laminated with the polyimides dielectric film 204 that thickness is 50 μm in thickness.In addition, enough intervals refer to the interval of following degree, that is, when to screened film 210 hot pressing, even if conductive adhesive oxidant layer 208a flows into this gap 213, conductive adhesive oxidant layer 208a also can not arrive printed circuit 203.In addition, each dielectric film 204 be formed insulation removal unit (through hole) 204a expose to make a part for each printed circuit 203.When the diameter of this insulation removal unit 204a is 0.5mm, 0.8mm and 1.0mm, after carrying out hot pressing to the screened film of embodiment and comparative example, respectively measure 3 times to the resistance value between 2 routine printed circuits 203, its result is as shown in table 2.
[table 2]
As shown in table 2, in embodiment, which value the diameter of the removal unit 204a that no matter insulate is, all low than the contact resistance value of comparative example, and is easy to conducting between printed circuit.That is, known embodiment arrives printed circuit 203 by making more conductive adhesive oxidant layer 208a compared with comparative example flow into insulation removal unit 204a resistance value is reduced, and can obtain good embeddability.
(evaluation of surface roughness)
The embodiment using Fig. 6 to represent, the screened film 210 of comparative example.Use the rectangle test film of long 200mm, wide 50mm respectively.
Ultra-deep shape measure microscope VX-8550 (KEYENCE) is used to measure surface roughness (Ra (μm)) in embodiment.Measuring condition is with JIS B0601 (1994) for foundation, and 20 times of object lens, the measurement spacing of thickness direction is 0.2 μm.
Specifically, screened film 210 is batched after on reel, choose 5 test films (n=5) (amount to 15 test films) respectively from 3 parts (start portion, 1000m (pars intermedia), 2000m place (rearmost part)) in flow direction (MD direction), use ultra-deep shape measure microscope VX-8550 (KEYENCE) to measure surface roughness (Ra) in embodiment.Obtain the mean value of 5 test films in each several part of described flow direction, maximum, minimum of a value as measured value.In addition, using the deviation of the difference of the maxima and minima of described 15 experiment slices as arithmetic average roughness.Result is as shown in table 3.
[table 3]
The deviation (0.38 μm, 0.31 μm, 0.35 μm) of the arithmetic average roughness of embodiment is significantly smaller than comparative example (0.85 μm, 0.73 μm, 0.73 μm).Its reason is, in the processing using dandy roll, roller is formed with relief pattern, because this relief pattern is concatenated to form the outside resin bed 63 at transfer film 6, therefore can realizes the relief pattern of rule.Therefore, and use compared with the comparative example process of sandblasting, embodiment can make transfer film 6 and be transferred the bonding force of each several part adhesive surface between layer 7, peeling force is stable.
(the fissility evaluation before heating)
Under measuring the state before hot pressing by the following method, transfer film 6 is relative to the peel strength being transferred layer 7.Specifically, the test film that the screened film 210 of the comparative example represented from Fig. 6 and embodiment cuts wide 50mm × long 200mm is sample, using this test film as screened film 10, as shown in Figure 7, two-sided tape is sticked on the surface of the conductive adhesive oxidant layer 8a of screened film 10, the one side of this two-sided tape to be posted on testing machine (PALMEK PFT-50S peel strength tester) base and fixed mask film 10.Then, the end of the transfer film 6 of screened film 10 is arranged on the chuck of testing machine, measures transfer film 6 relative to the peel strength being transferred layer 7.Here, as shown in Figure 7, as stripping conditions, peel angle is set as 170 °, and the peeling rate setting the transfer film 6 produced by chuck is 1000mm/min.And, respectively 5 tests are carried out to comparative example and embodiment, maximum and minimum of a value are calculated to each tester.Result is as shown in table 4.
In addition, the evaluation criterion of fissility is as described below.Specifically, before hot pressing, confirm the disengaging situation (without coming off: zero, having and coming off: ×) of transfer film when being immersed in liquid.In addition, before hot pressing, confirm to be transferred whether layer 7 there is breakage (without damaged: zero, have breakage: ×) after layer 7 peels off transfer film 6 from being transferred.In addition, after hot-pressing, confirm whether transfer film 6 there is breakage (without damaged: zero, there is breakage: ×).In addition, confirm after hot pressing from the operability be transferred when layer 7 peels off transfer film 6 (good: ◎, common: zero, poor: ×).
[table 4]
(the fissility evaluation after heating)
On the other hand, under measuring state after hot-pressing in the following manner, transfer film 6 is relative to the peel strength being transferred layer 7.Use hot press that the surface heat of the conductive adhesive oxidant layer 208a of the screened film 210 of comparative example and embodiment is crimped on the polyimide surface side of the copper-clad laminated board with polyimide surface and copper foil surface.Preferably set that pressure is 2-5MPa, temperature is 140-180 DEG C as the thermo-compressed condition in now hot press, the time is 3-60 minute.In this is measured, using 170 DEG C as design temperature, by load-carrying under 0.5MPa 60 seconds, afterwards, under 3MPa, load-carrying carries out thermo-compressed in 180 seconds.
Then, the copper foil surface side sticking two-faced adhesive tape band of the copper-clad laminated board in thermo-compressed after screened film 210, as shown in Figure 7, the one side of this two-sided tape is posted in the upper also fixed mask film 210 of test board (PALMEK PFT-50S peel strength tester).The mode that test method illustrated by measuring with the peel strength before above-mentioned hot pressing is afterwards identical calculates peel strength value.
As shown in table 4, under state after hot-pressing, in 5 peel tests, the maximum of embodiment, minimum of a value are respectively 0.88N/50mm and 0.29N/50mm, and the maximum of comparative example, minimum of a value are respectively 2.94N/50mm and 1.37N/50mm, and embodiment is less than the deviation of comparative example.Thus, after hot-pressing, good from the operability be transferred when layer peels off transfer film.
In addition, as shown in table 4, when the peeling force of comparing embodiment and comparative example, before hot pressing, (before embodiment hot pressing: maximum is 5.34N/50mm, minimum of a value is 3.78N/50mm not have very big difference between embodiment and comparative example; Before comparative example hot pressing: maximum is 5.88N/50mm, minimum of a value is 3.92N/50mm), but after hot-pressing, compared with comparative example, the peeling force of embodiment significantly reduces that (after embodiment hot pressing: maximum is 0.88N/50mm, minimum of a value is 0.29N/50mm; After comparative example hot pressing: maximum is 2.94N/50mm, minimum of a value is 1.37N/50mm).Specifically, when being conceived to the maximum of peeling force, comparative example after hot-pressing peeling force drops to about original 1/2, and on the other hand, embodiment drops to about original 1/6.Thus, before hot pressing, in embodiment, transfer film is high relative to the bonding force being transferred layer, can prevent transfer film in the usual subsequent handlings such as dipping liquid from peeling off, and make bonding force significantly reduce after hot pressing, operability during stripping transfer film can be made to improve.
Description of reference numerals
1: screened film;
2: basilar memebrane;
2a: insulation removal unit
3: printed circuit;
3a: signal circuit;
3b: earthed circuit;
3c: nonisulated portion;
4: dielectric film;
4a: insulation removal unit;
5: base film;
6: transfer film;
6b: parting agent layer;
7: be transferred layer;
8: electromagnetic wave shielding;
8a: adhesive phase;
8b: metal level;
9: screened film main body;
10: screened film;
21: inner side resin bed roller;
22: film extruder;
23: dandy roll;
24: casting roller;
25: transfer film roller;
61: relief pattern;
61a: protuberance;
61b: recess;
71: pattern transferring;
71a: top;
71b: bottom;
100: shielded flexible printed wiring board;
101: shielded flexible printed wiring board

Claims (7)

1. a stacked film, is characterized in that, comprising:
Transfer film, has inner side resin bed and respectively at the one side of described inner side resin bed and the stacked outside resin bed of another side, and, be formed with relief pattern at the outer surface of at least one of described outside resin bed; And
Be transferred layer, be strippingly layered in the outer surface being formed with described relief pattern of described transfer film, and be there is the pattern transferring formed by described relief pattern,
Wherein, described inner side resin bed is formed by PETG, and described outside resin bed is formed by polybutylene terephthalate (PBT).
2. stacked film according to claim 1, is characterized in that,
The arithmetic average roughness of described relief pattern formed at described outside resin bed is 0.2 μm ~ 2.5 μm.
3. stacked film according to claim 2, is characterized in that,
The deviation of arithmetic average roughness of the described relief pattern formed at described outside resin bed is less than 0.50 μm.
4. the stacked film according to any one of claims 1 to 3, is characterized in that,
The two sides that described outside resin bed is laminated in described inner side resin bed is formed by extruding layer platen press by described transfer film, and, form irregular two rollers by the surface of wherein at least one and implement pressurization and form.
5. the stacked film according to any one of Claims 1-4, is characterized in that,
The described layer that is transferred is the described protective layer had in the screened film of conductive adhesive oxidant layer, metal level and protective layer, and described metal layer is stacked in described conductive adhesive oxidant layer, and described protective layer is layered on described metal level.
6. the stacked film according to any one of Claims 1-4, is characterized in that,
The described layer that is transferred is the described protective layer had in the screened film of conductive adhesive oxidant layer and protective layer, and described protective layer is layered in described conductive adhesive oxidant layer.
7. shield a printed wiring board, it is characterized in that,
Screened film described in claim 5 or 6 and printed wiring board bond.
CN201380060143.5A 2012-11-19 2013-11-19 Stacked film and shielding printed wiring board Active CN104797420B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012253166 2012-11-19
JP2012-253166 2012-11-19
PCT/JP2013/081143 WO2014077406A1 (en) 2012-11-19 2013-11-19 Multilayer film and shielded printed wiring board

Publications (2)

Publication Number Publication Date
CN104797420A true CN104797420A (en) 2015-07-22
CN104797420B CN104797420B (en) 2018-01-12

Family

ID=50731313

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380060143.5A Active CN104797420B (en) 2012-11-19 2013-11-19 Stacked film and shielding printed wiring board

Country Status (6)

Country Link
JP (1) JP6014680B2 (en)
KR (1) KR101949302B1 (en)
CN (1) CN104797420B (en)
HK (1) HK1212301A1 (en)
TW (1) TWI613956B (en)
WO (1) WO2014077406A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110027268A (en) * 2018-01-12 2019-07-19 拓自达电线株式会社 Electromagnetic shielding film
CN110168357A (en) * 2017-01-11 2019-08-23 Lg电子株式会社 Sensor
CN110177448A (en) * 2018-02-20 2019-08-27 拓自达电线株式会社 Electromagnetic shielding film
CN110769667A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110876256A (en) * 2018-08-29 2020-03-10 拓自达电线株式会社 Electromagnetic wave shielding film, method for manufacturing same, and method for manufacturing shielded printed wiring board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056329A (en) * 2016-09-29 2018-04-05 信越ポリマー株式会社 Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film
JP6345855B1 (en) * 2017-01-17 2018-06-20 太陽インキ製造株式会社 Photosensitive film laminate and cured product formed using the same
JP6978994B2 (en) * 2018-02-20 2021-12-08 タツタ電線株式会社 Transfer film
KR20210039332A (en) * 2018-05-16 2021-04-09 쇼와덴코머티리얼즈가부시끼가이샤 Method of forming photosensitive film and permanent mask resist
TWI768213B (en) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 Electromagnetic wave shielding film, method for producing electromagnetic wave shielding film, and method for producing shielded printed wiring board
JP7268446B2 (en) * 2019-03-29 2023-05-08 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shielding sheet, electromagnetic wave shielding printed circuit board and electronic equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211602A (en) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd Release multilayered film and cover-lay molding method
JP2004002592A (en) * 2001-06-29 2004-01-08 Sekisui Chem Co Ltd Sheet
CN102047777A (en) * 2008-05-30 2011-05-04 大自达电线股份有限公司 Electromagnetic-wave shielding material, and printed-wiring board
CN102625564A (en) * 2011-01-28 2012-08-01 大自达电线股份有限公司 Shielded type printed circuit board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11208193A (en) * 1998-01-26 1999-08-03 Dainippon Printing Co Ltd Transfer sheet
JP4524024B2 (en) 2000-06-26 2010-08-11 藤森工業株式会社 Release film
JP4201548B2 (en) * 2002-07-08 2008-12-24 タツタ電線株式会社 SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM
CN101304878B (en) * 2005-11-08 2012-06-13 东丽株式会社 Multilayer polyester film and transfer foil
JP2007175885A (en) * 2005-12-27 2007-07-12 Asahi Kasei Chemicals Corp Mold release film
KR100803619B1 (en) * 2006-10-30 2008-02-19 도레이새한 주식회사 Polyester film for window embossing and manufacturing method thereof
JP5023765B2 (en) 2007-03-30 2012-09-12 住友ベークライト株式会社 Release film and circuit board manufacturing method
JP2011088352A (en) * 2009-10-22 2011-05-06 Unitika Ltd Release film
WO2011111826A1 (en) * 2010-03-12 2011-09-15 積水化学工業株式会社 Mold release film and method for manufacturing mold release film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004002592A (en) * 2001-06-29 2004-01-08 Sekisui Chem Co Ltd Sheet
JP2003211602A (en) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd Release multilayered film and cover-lay molding method
CN102047777A (en) * 2008-05-30 2011-05-04 大自达电线股份有限公司 Electromagnetic-wave shielding material, and printed-wiring board
CN102625564A (en) * 2011-01-28 2012-08-01 大自达电线股份有限公司 Shielded type printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
石安富、龚云表: "《工程塑料—性能·成型·应用》", 30 September 1986, 上海科学技术出版社 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110168357A (en) * 2017-01-11 2019-08-23 Lg电子株式会社 Sensor
CN110168357B (en) * 2017-01-11 2022-07-08 Lg电子株式会社 Sensor with a sensor element
CN110027268A (en) * 2018-01-12 2019-07-19 拓自达电线株式会社 Electromagnetic shielding film
CN110027268B (en) * 2018-01-12 2022-02-01 拓自达电线株式会社 Electromagnetic wave shielding film
CN110177448A (en) * 2018-02-20 2019-08-27 拓自达电线株式会社 Electromagnetic shielding film
TWI734930B (en) * 2018-02-20 2021-08-01 日商拓自達電線股份有限公司 Electromagnetic wave shielding film
CN110769667A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110769667B (en) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110876256A (en) * 2018-08-29 2020-03-10 拓自达电线株式会社 Electromagnetic wave shielding film, method for manufacturing same, and method for manufacturing shielded printed wiring board

Also Published As

Publication number Publication date
KR101949302B1 (en) 2019-02-18
TW201429379A (en) 2014-07-16
KR20150087353A (en) 2015-07-29
TWI613956B (en) 2018-02-01
CN104797420B (en) 2018-01-12
HK1212301A1 (en) 2016-06-10
JPWO2014077406A1 (en) 2017-01-05
WO2014077406A1 (en) 2014-05-22
JP6014680B2 (en) 2016-10-25

Similar Documents

Publication Publication Date Title
CN104797420A (en) Multilayer film and shielded printed wiring board
JP2014112576A (en) Shield film
KR102213344B1 (en) Fpcb manufacturing method using roll lamination method
WO2005063467A1 (en) Method for producing flexible laminate
KR20180048816A (en) A method for producing a printed wiring board and a printed wiring board protective film and a sheet-
KR102213349B1 (en) Fpcb manufacturing method using roll lamination method
JP2022087315A (en) Method for manufacturing laminate
KR102260416B1 (en) Fpcb manufacturing method of double access method
JP2003200496A (en) Method for manufacturing heat resistant flexible laminate
CN103021878B (en) For forming the method and system of electronic module
JP2003001753A (en) Method for manufacturing heat-resistant flexible laminated sheet
KR102260412B1 (en) Fpcb manufacturing method of double access method
CN104754866A (en) Flexible printed circuit board (FPC) and manufacture method thereof, and flat-panel display (FPD)
KR20120103185A (en) Apparatus and method for producting of conductive metal tape
KR102260413B1 (en) Fpcb manufacturing method of double access method
JP4643861B2 (en) Method for producing flexible laminate
KR102321821B1 (en) Packing For Pressure Head Of Hot-Press
KR20170108624A (en) Manufacturing method of the Flat Flexible Cable
JP3954831B2 (en) Method for producing heat-resistant flexible laminate
JP3749201B2 (en) Method for manufacturing printed wiring board
JPH0447614A (en) Cover layer film and manufacture thereof
JP2007069617A (en) Method for manufacturing flexible metal foil laminated plate
KR101491340B1 (en) Autoclave, a device manufacturing method using a flexible printed circuit board and manufacturing flexible printed circuit boards that are prepared by the method
JP2008030329A (en) Manufacturing method for metal-foiled laminated plate, and metal-foiled laminated plate obtained by it
TWM626881U (en) Thick metal clad laminate manufacturing apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1212301

Country of ref document: HK

GR01 Patent grant
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1212301

Country of ref document: HK