CN104797420B - Stacked film and shielding printed wiring board - Google Patents

Stacked film and shielding printed wiring board Download PDF

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Publication number
CN104797420B
CN104797420B CN201380060143.5A CN201380060143A CN104797420B CN 104797420 B CN104797420 B CN 104797420B CN 201380060143 A CN201380060143 A CN 201380060143A CN 104797420 B CN104797420 B CN 104797420B
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China
Prior art keywords
layer
film
resin bed
transfer film
transferred
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CN201380060143.5A
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Chinese (zh)
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CN104797420A (en
Inventor
篠原启彰
芳野真次
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Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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Publication of CN104797420A publication Critical patent/CN104797420A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Abstract

Present invention offer is a kind of can be obtained good embeddability, processability and can suitably control stacked film of the transfer film relative to the bonding force for being transferred layer.The stacked film of the present invention includes transfer film (6) and is transferred layer (7), transfer film (6) include inner side resin bed (62) and respectively inner side resin bed (62) one side and another side be laminated outside resin bed (63), and on the outside of these resin bed (63) the outer surface of at least one formed with relief pattern (61)；It is transferred the outer surface that layer (7) is strippingly layered in transfer film (6) relief pattern (61), and with the transfer pattern (71) formed by relief pattern (61), wherein, inner side resin bed (62) is formed by polyethylene terephthalate, and outside resin bed (63) is formed by polybutylene terephthalate (PBT).

Description

Stacked film and shielding printed wiring board
Technical field
The present invention relates to stacked film, in more detail, is related to the stacking of the shielding electromagnetic waves film of shielded electronic equipment etc. Film and shielding printed wiring board.
Background technology
Shielding printed wiring board will be used on conventional portable equipment and PC etc..The shielding printed wiring board is to press down Noise processed is provided with screened film for the purpose of shielding to the electromagnetic wave of external emission in the circuit substrate of flexible distributing board etc..
Generally, above-mentioned shielding printed wiring board manufactures in the following manner.Firstly, for the one side in mould release membrance (transfer film) On across parting agent layer coating resin form the stacked film of cover layer (being transferred layer), be coated with screen layer in cover layer side and Form screened film.By bonding screened film and hot pressing formation shielding printed wiring board, the printed wiring board on printed wiring board Substrate parts with earthy wiring pattern and signal wiring pattern and it is layered on substrate parts and exposes one Divide the dielectric film of earthy wiring pattern.Screened film is in its conductive adhesive phase of binding face with printed wiring board, warm During pressure, conductive adhesive oxidant layer is embedded into the exposed portion of earthy wiring pattern of dielectric film.Thus, earthy wiring diagram Case is electrically connected with screen layer, and electromagnetic wave shielding function is further improved.
Mould release membrance purposes used in above-mentioned manufacturing process is different, such as patent document 1,2.
In patent document 1, disclose release used in the pre-preg stamping procedure when manufacturing copper-clad laminated board Film, the mould release membrance are provided with parting agent layer in the single or double of Polyester foam films.In patent document 2, one kind is disclosed The mould release membrance used in the stamping procedure of circuit substrate, the mould release membrance have embossing and its embossed surfaces roughness (Rz：Ten Put mean roughness) it is less than more than 5 μm 20 μm before stamping procedure, and be less than more than 2 μm 8 μm after stamping procedure.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2002-1726 publications
Patent document 2：Japanese Unexamined Patent Publication 2008-246882 publications
The content of the invention
The technical problems to be solved by the invention
But the mould release membrance of patent document 1,2 is to be used in the stamping procedure of circuit substrate as padded coaming, because This, possibly enough bonding forces can not be obtained because mould release membrance is too high relative to the rippability for being transferred layer.It is in addition, logical Often, mould release membrance is formed by one layer of resin, and in some conditions, mould release membrance drops for the product having shape-following-up properties for the cover layer to be bonded It is low, therefore, in printed wiring board earthy wiring pattern from the part that dielectric film exposes it is more narrow and small when, electric conductivity may be caused Adhesive phase can not obtain sufficient embeddability.
To solve the above problems, it is an object of the invention to provide can obtain good embeddability and machinability and Can suitable control the stacked film of layer bonding force is transferred for transfer film.
Solves the technical scheme needed for technical problem
The stacked film of the present invention, it is characterised in that including：Transfer film, there is inner side resin bed and respectively described interior The outside resin bed of one side and the another side stacking of side resin bed, also, in the outside of at least one of the outside resin bed Surface is formed with relief pattern；And layer is transferred, the outer surface of the transfer film relief pattern is strippingly layered in, and With the transfer pattern formed by the relief pattern, wherein, the inner side resin bed is by polyethylene terephthalate Formed, the outside resin bed is formed by polybutylene terephthalate (PBT).
According to above-mentioned construction, in transfer film, the two of the inner side resin bed formed by polyethylene terephthalate Surface layer is laminated with the outside resin bed formed by polybutylene terephthalate (PBT).Thus, because transfer film is relative to being transferred layer The tracing ability of change in shape improve, therefore good embeddability can be obtained.In addition, by being laminated by poly terephthalic acid second The inner side resin bed that diol ester is formed, even if the outer surface of outside resin bed is due to the influence of the factors such as temperature change and in face side Upwards in the case of expansion, contraction, it can also mitigate the deformation of outside resin bed by inner side resin bed.Including being additionally, since The two sides of side resin bed be laminated with outside resin bed, thus enable that outside resin bed outer surface expand in the surface direction, The power of contraction is cancelled out each other, and further mitigates the deformation of transfer film.Therefore, glued when by the screened film of the stacked film with the present invention Close in printed circuit board and hot pressing, the problem because caused by deforming stacked film can be prevented.
In addition, by transfer film and be transferred on the adhesive surface of layer formed relief pattern and transfer pattern so that due to Anchoring effect improves transfer film relative to the bonding force for being transferred layer, can prevent from being immersed in the medium general subsequent handling transfer of decoction Die from be transferred layer peel off the problem of, can also be prevented in such process decoction enter transfer film and be transferred layer it Between.
In addition, the stacked film of the present invention can be following construction, i.e. in the bumps that the outside resin bed is formed The arithmetic average roughness (Ra) of pattern is 0.2 μm~2.5 μm.
According to above-mentioned construction, transfer film can be made to be optimized for being transferred the bonding force of layer.
In addition, the stacked film of the present invention can be following construction, i.e. in the bumps that the outside resin bed is formed The deviation of the arithmetic average roughness (Ra) of pattern is less than 0.50 μm.
According to above-mentioned construction, the construction that the deviation by being formed as mean roughness is less than 0.50 μm, transfer can be made The bonding force of film and each several part adhesive surface being transferred between layer is stable.
In addition, the stacked film of the present invention is configured to：The transfer film is by extruding laminating by outside resin bed 63 two sides for being layered in the inner side resin bed form.Bumps can be formed on the resin bed of outside, its method is by wherein extremely The surface of few one forms irregular two rollers implementation pressurization and formed.
According to above-mentioned construction, it is laminated on the two sides of interior side resin bed by outside resin bed by extruding laminating Layered product is formed using irregular two rollers pressurization is at least formed on a roll surface.Thus, it is possible to reduce outside resin The relief pattern of layer and the deviation for being transferred layer and transferring the arithmetic average roughness of pattern formed by the relief pattern, from And transfer film can be made and be transferred the bonding force of layer, peeling force stabilization.In addition, according to above-mentioned construction, above-mentioned stacked film is carried After putting on printed wiring board and heated, pressurizeing, transfer film is remarkably decreased relative to the bonding force for being transferred layer.Thus, Transfer film is become easy from the operation for being transferred layer stripping.
In addition, the stacked film of the present invention is configured to：The layer that is transferred can be, conductive adhesive phase, The protective layer in the screened film of metal level and protective layer, the metal layer are stacked in the conductive adhesive oxidant layer, should Protective layer is layered on the metal level.
According to the transfer film of above-mentioned construction, due to that can prevent transfer film from deforming, therefore can easily carry out to shielding The stacking of film.Being additionally, since transfer film has good embeddability, and thereby, it is possible to suppress to expose ground connection wiring in dielectric film The space formed during the position insertion conductive adhesive of pattern, so as to suppress under the conduction property of earthy wiring pattern Drop.
In addition, the stacked film of the present invention is configured to：The layer that is transferred can be, conductive adhesive phase and The protective layer in the screened film of protective layer, the protective layer are layered in the conductive adhesive oxidant layer.
According to above-mentioned construction, due to that can prevent transfer film from deforming, therefore the stacking to screened film can be easily carried out. Being additionally, since transfer film has good embeddability, and thereby, it is possible to the position for suppressing to expose ground connection wiring pattern in dielectric film Space caused by embedded conductive adhesive, decline so as to suppress the conduction property of earthy wiring pattern.
The shielding printed wiring board of the present invention, it is characterised in that the screened film bonds with printed wiring board.
According to above-mentioned construction, such shielding printed wiring board can be obtained, i.e. the screened film is being bonded in printing On wiring plate and during hot pressing, the problem of can preventing due to the deformation of the stacked film and produce, and by the transfer film from The operation that the protective layer is peeled off is easy to implement.
Brief Description Of Drawings
Fig. 1 is the explanation figure of the stacked film of present embodiment.
Fig. 2 is the explanation figure of the manufacture method for the transfer film for representing present embodiment.
Fig. 3 is the explanation figure for representing the earthed circuit insertion conductive adhesive to shielding printed wiring board, and the shielding prints Brush wiring plate has used the stacked film of present embodiment.
Fig. 4 is the explanation figure for representing the earthed circuit insertion conductive adhesive to shielding printed wiring board, and the shielding prints Brush wiring plate has used the stacked film of present embodiment.
Fig. 5 be after representing to peel off the transfer film of present embodiment in the state of shield the explanation figure of printed wiring board.
Fig. 6 is the explanation figure for the shielded flexible printed wiring board for representing embodiment.
Fig. 7 is the test method explanation figure of the evaluation test of peel strength.
Embodiment
Below, refer to the attached drawing illustrates the preferred embodiment of the present invention.
The stacked film 1 that Fig. 1 is represented includes：Transfer film 6, there is inner side resin bed 62 and respectively in the inner side resin bed The outside resin bed 63 of 62 one side and another side stacking, also, in the outside table of at least one of the outside resin bed 63 Face is formed with relief pattern 61；And layer 7 is transferred, strippingly it is layered in the outside table of the relief pattern 61 of transfer film 6 Face, and with the transfer pattern 71 formed by the relief pattern 61.In addition, in the present embodiment, it is release across being coated with The parting agent layer 6b stacking transfer films 6 and be transferred layer 7 that agent is formed.
Inner side resin bed and outside resin bed can also pass through hot melt by adhesive bonding without using adhesive The stacking such as connect.When being laminated by thermal welding, inner side resin bed and outside resin can be easily manufactured by extruding laminating Good closely sealed stacked film between layer.In addition, 2 outside resin beds preferably have identical thickness, but be not restricted to that this.
(transfer film 6)
As shown in figure 1, transfer film 6 the one side and another side of inner side resin bed 62 be laminated with respectively outside resin bed 63, 63.In the present embodiment, inner side resin bed 62 is formed by PET (polyethylene terephthalate) resin, outside resin bed 63rd, 63 formed by PBT (polybutylene terephthalate (PBT)) resin.Here, table 1 represents the general of PBT resin and PET resin The comparison of physical property and characteristic.
[table 1]
As shown in table 1, it is known that PBT resin and PET resin are that physical property, layered characteristic, engineering properties are closely similar Material.
Therefore, by forming inner side resin bed 62 by PET resin, outside resin bed 63,63 is formed by PBT resin so that Such as when temperature change occurs for transfer film 6 on the outside of resin bed 63 similarly shrinks, expand, the change such as can prevent from crimping Shape.It is additionally, since outside resin bed 63 to be formed by PBT resin, therefore is easy to changes shape when being pressurized etc..I.e., outside Side resin bed 63 is easy to follow the change in shape for being transferred layer of stacking, can obtain good embeddability.
In addition, by the Resin crystallization of inner side resin bed 62 and outside resin bed 63 and using, percent thermal shrinkage can be subtracted It is small so as to reducing the deformation of transfer film 6.
Preferably, the material of inner side resin bed 62 uses PET resin, and the material of outside resin bed 63 uses PBT resin, but It is to be not limited to this.In addition, for example, can enumerate PEN, polyimides, polyethylene, polypropylene, The material of polyvinyl chloride, nylon, makrolon, polymethylpentene as outside resin bed 63；Polypropylene, poly- methyl can be enumerated The material of amylene, PEN, polyimides as inner side resin bed 62.The thickness lower limit of inner side resin bed 62 Value is preferably 6 μm, more preferably 8 μm, more preferably 25 μm.Other higher limit is preferably 50 μm, more preferably 38 μm.Outside The thickness lower limit of side resin bed 63 is preferably 6 μm, more preferably 8 μm.Other higher limit is preferably 30 μm, more preferably 20 μ M, more preferably 12 μm.
In addition, as shown in figure 1, outside resin bed 63 and be transferred layer 7 stacking lamination surface on, its entire surface formed with The relief pattern 61 (convex portion 61a, recess 61b) being made up of multiple concaveconvex shapes.
(transfer film 6：Manufacture method)
Below, the manufacture method of transfer film 6 is illustrated.Transfer film 6 is by extruding laminating on the two sides of interior side resin bed 62 On be laminated with outside resin bed 63 and form, and form irregular two rollers by using the surface of at least one of which and give Pressurization forms.
Specifically, first, extruded by the extruder (extrusion width 1300mm) that design temperature is 280 DEG C -290 DEG C PET resin forms inner side resin bed 62 membranaceous, and batches on roller.Then, as shown in Fig. 2 batching the inner side of PET resin Resin bed roller 21 is fed, will be formed membranaceous inner side resin bed 62 to dandy roll 23 and casting roller (casting roll) 24 it Between supply, the arithmetic average roughness of the dandy roll 23 is 0.2 μm -2.5 μm.On the other hand, by design temperature be 220 DEG C- 260 DEG C 2 film extruders 22,22 (effectively extrusion width 1300mm) extruding PBT, and by the membranaceous outside resin bed of extrusion 63rd, 63 supplied between dandy roll 23 and casting roller 24, to cause the outside resin bed 63,63 to be layered in inner side resin bed respectively In 62 one side and another side.To inner side resin bed 62 and outside resin bed 63,63 between dandy roll 23 and casting roller 24 Layered product pressurizes, and is formed with arithmetic average roughness in the outer surface for being layered in the outside resin bed 63 of the side of dandy roll 23 0.2 μm -2.5 μm of relief pattern 61.So, formed on the two sides of inner side resin bed 62 (PET resin) and be laminated outside tree The transfer film 6 of lipid layer 63,63 (PBT), and relief pattern 61 can be formed on transfer film 6.The transfer that will be formed as above Film 6 batches to be taken care of on transfer film roller 25.Outside resin can also be laminated layer by layer with 1 film extruder 22 Layer 63.
In addition, in fig. 2, eliminating cooling roller etc., suitably the resin after extrusion can be cooled down and to film The end of shape resin is formed.
In addition, above-mentioned manufacture method can suitably change according to factors such as material, designs.
Convex-concave pattern 61 is preferably formed in the outside whole surface of outside resin bed 63, but is not limited to this.In addition, not The pattern of relief pattern 61 is limited, for example, it may be repeating the pattern that is formed of predetermined pattern or being randomly formed bumps Pattern.In addition, when 2 layers of outside resin bed 63,63 form relief pattern 61,2 dandy rolls 23 can also be used to carry out layer Pressure processing.
In addition, for forming relief pattern, in order to reduce the deviation of the concaveconvex shape of production batch, processed compared with sandblasting, Chemical hair side coating, preferably can be continuous by the concaveconvex shape formed on dandy roll using Embossing processing, the Embossing processing Form predetermined shape.Gone forward side by side in addition, the screened film using the transfer film Jing Guo Embossing processing is positioned on printed wiring board When row heating, pressurization make shielding printed wiring board, transfer film declines to a great extent relative to the bonding force for being transferred layer.Thus, will Transfer film becomes easy from the operation for being transferred layer stripping.
(being transferred layer 7)
As shown in figure 3, in the present embodiment, being transferred layer 7 is, conductive adhesive phase 8a, be layered in it is described The protective layer of the screened film of metal level 8b and the protective layer being layered on the metal level 8b on conductive adhesive oxidant layer 8a. That is, it is the protective layer being made up of the coating layer of cover layer and insulating resin to be transferred layer 7.
Polyester, polybenzimidazoles, aramid fiber, polyimides, polyimide amide, PEI, polyphenylene sulfide can be enumerated Ether (PPS), PEN (PEN) etc. are as the material to form covered film.
When less requiring heat resistance, preferably using cheap polyester film, when requiring flame resistance, preferably using polyphenyl Thioether film, aramid fiber film or polyimide film are preferably used in further requirement heat resistance.
As long as resin of the insulating resin with insulating properties, for example, heat-curing resin or ultraviolet can be enumerated Curable resin.As heat-curing resin, for example, phenolic resin, acrylic resin, epoxy resin, melamine can be enumerated Polyimide resin, silicones, acrylic acid modified silicones etc..As uv curing resin, for example, epoxy acrylic can be enumerated Ester resin, polyester acrylate resin and its methacrylate modified product.In addition, as curing mode, as long as material can be made Material solidification, for example, can be any of which such as heat cure, ultraviolet curing, electron ray curing.
In addition, from preventing because outside resin bed 63 causes from the viewpoint of forgetting stripping for water white transparency, it is preferably logical The addition pigment (such as white etc.) in molten resin is crossed to be coloured.
In addition, the lower thickness limit for being transferred layer 7 is preferably 1 μm, more preferably 3 μm, more preferably 5 μm.In addition, by The upper thickness limit of transfer printing layer 7 is preferably 15 μm, more preferably 10 μm, more preferably 7 μm.In addition, it is transferred layer and unlimited In the protective layer of screened film, it also can be used in the films such as cover layer, antiglare film.
In addition, being transferred layer 7 is not limited to monolayer constructions or multi-ply construction.For example, it may be it is coated with successively by resistance to The hard layer for the side of transfer film 6 that the excellent resin of abrasiveness, resistance to blocking is formed and it is made up of the excellent resin of resiliency The double-decker that is formed of soft layer.
In the present embodiment, it is that (outside resin bed 63 has relief pattern 61 in the one side of transfer film 6 to be transferred layer 7 Face) on be coated with parting agent layer 6b after, formed by being coated with the resin for being used to be transferred layer 7.Thus, be transferred layer 7 can It is layered in the state of transfer film 6 with peeling off, the relief pattern 61 of transfer film 6, which is transferred to, to be transferred layer 7 and form transfer figure Case 71 (top 71a, bottom 71b).That is, the bottom 71b of transfer pattern 71 is formed by the convex portion 61a of relief pattern 61, passed through The recess 61b of relief pattern 61 forms the top 71a of transfer pattern 71 (with reference to figure 1).
Further illustrate, in the state of being transferred layer 7 and being strippingly layered in transfer film 6, relief pattern 61 it is convex Portion 61a engages with transferring the bottom 71b of pattern 71, and the recess 61b of relief pattern 61 engages with transferring the top 71a of pattern 71. As a result, because anchoring effect improves transfer film 6 relative to the bonding force for being transferred layer 7, can prevent logical in dipping decoction etc. Transfer film 6 is peeled off from layer 7 is transferred in normal subsequent handling, so as to prevent from entering transfer film in such process herb liquid 6 and it is transferred between layer 7.
In addition, after transfer film 6 is stripped, the arithmetic average for being transferred the surface for being provided with transfer pattern 71 of layer 7 is thick Rugosity is preferably 0.2 μm -2.5 μm, more preferably 0.5 μm -1.7 μm.When less than 0.2 μm, transfer film is relative to being turned The bonding force of print layer becomes too small, and in the generally subsequent handling such as dipping decoction, transfer film may be peeled off from layer is transferred.When big When 2.5 μm, by transfer film from when being transferred layer stripping, due to excessive bonding force, it is damaged in itself that layer is transferred sometimes.And And or following construction, i.e. after transfer film 6 is stripped, be transferred the surface for being provided with transfer pattern 71 of layer 7 The deviation of arithmetic average roughness is less than 0.50 μm.By the way that the deviation of arithmetic average roughness is set in into less than 0.50 μm, Transfer film 6 and the bonding force in each several part for the adhesive surface for being transferred layer 7 can be made stable.
In addition, the method that stacking is transferred film 7 in the one side of transfer film 6 is preferably to be coated with, but layer can also be used Pressure, extrusion, impregnating form method as the layer beyond coating.
(parting agent layer 6b)
As long as it is the layer with fissility that transfer film 6 is transferred layer 7 relatively, then there is no particular limitation by parting agent layer 6b, Such as the mould release of silicon class or non-silicon class can be used.In addition, parting agent layer 6b maximum thickness is preferably less than transfer film 6 In relief pattern 61 height.When being coated with mould release to having irregular transfer film 6, mould release accumulates in relief pattern 61 In each recess, mould release is dispersed on transfer film 6 naturally.That is, mould release can be located during stacking is transferred layer 7 In naturally scattered and substantially evenly configure the state on the surface of transfer film 6.Thereby, it is possible to by transfer film 6 relative to quilt Transfer printing layer 7 cohesive control from be transferred layer 7 peel off transfer film 6 when be transferred layer 7 itself will not be due to excessive bonding Power and breakage degree.So, due to can suitably control transfer film 6 relative to the bonding force for being transferred layer 7, therefore can The problem that preventing with when excessive bonding force or too small bonding force adhesive transfer film.
In addition, preferably adding relative to the peel strength for being transferred layer 7 from transfer film 6 when layer 7 peels off transfer film 6 is transferred It is 1N/50mm-20N/50mm in the state of before heat, pressurization.If peel strength value is less than 1N/50mm, when screened film 10 soaks Transfer film 6 can be peeled off from being transferred on layer 7 when stain is in decoction, on the other hand, if the value of peel strength is more than 20N/50mm, Then mould release membrance (transfer film 6) is too strong relative to the bonding force for being transferred layer 7, even can be even transferred when transfer film 6 is peeled off Layer 7 is peeled off together causes protective layer damaged.In addition, in order to which screened film is adhered on printed wiring board and after carrying out hot pressing, Transfer film 6 is preferably 0.2N/50mm-3.0N/50mm relative to the peel strength of layer 7 is transferred, more preferably 0.2N/ 50mm-1.0N/50mm.If peel strength value is less than 0.2N/50mm, transfer film 6 can be from being transferred on layer 7 sometimes after hot pressing Naturally peel off, on the other hand, if peel strength value is more than 3N/50mm, by people or manufacture device by transfer film from being turned Operability when layer is peeled off is printed to be deteriorated.
In addition, in the present embodiment, transfer film 6 and be transferred layer 7 it is stacked together and this therebetween between across Parting agent layer 6b, still, the present invention is not limited thereto, can also be laminated across the resin with release, or, also may be used Not to be laminated across mould release.If said two devices are what is be not laminated across the resin with release or mould release Structure, then, any outside resin bed can be formed by the material for being wherein added with mould release.
Here, heat, pressurize before in the state of transfer film 6 relative to being transferred the peel strength of layer 7 in the following manner Measurement.Specifically, as shown in fig. 7, the conductive adhesive oxidant layer 8a of the screened film 10 (heated, before pressurization) before hot pressing table Two-sided tape is sticked on face, the one side of the two-sided tape is posted in testing machine (PALMEK PFT-50S peel strength tests Instrument) on base with fixed mask film 10.Then, chuck of the end set of the transfer film 6 of screened film 10 in testing machine (is omitted Diagram) on, measurement transfer film 6 is relative to the peel strength for being transferred layer 7.Here, as shown in fig. 7, as stripping conditions, peel off Angle initialization is 170 °, sets the peeling rate of the transfer film 6 as caused by chuck as 1000mm/min.Moreover, carry out 5 examinations Test, the maximum and minimum value of the peel strength value of each gained are calculated as the value of peel strength.
(shielded flexible printed wiring board 100)
Fig. 3 is to represent to load the shape for being heated and being pressurizeed on layer direction with forcing press etc. after screened film 10 on base film 5 The explanation figure of state.Wherein, base film 5 is configured to：Including basilar memebrane 2, printed circuit 3 and dielectric film 4, printed circuit 3 is by signal Circuit 3a and earthed circuit 3b is formed and formed on basilar memebrane 2, and printed circuit 3 removes at least one of wherein earthed circuit 3b Covered after dividing (nonisulated portion) 3c by dielectric film 4.
Here, adhesive bonding can be used between basilar memebrane 2 and printed circuit 3, can also without using adhesive and with institute The adhesive-free type copper-clad laminated board engagement of meaning.In addition, dielectric film 4 can both use adhesive bonding flexible insulating film, also may be used With by being coated with of photosensitive insulating resin, dry, expose, develop, the serial of methods such as be heat-treated and formed.In addition, base film 5 Can be by suitably selecting following structures to be practiced, i.e.,：Only basilar memebrane one side have printed circuit single side FPC, The two-sided double-side type FPC with printed circuit in basilar memebrane, form above-mentioned FPC (flexible printing wiring board) is multilayer laminated Multi-layered type FPC, " Off レ Network ス ボ ー De " (Japan's registration mark) with multi-layer part equipped section and cable portion, composition are more Rigid and flexibility substrate of the material in layer portion for hard material or the TAB bands for carrier package etc..
Screened film 10 has transfer film 6 and screened film main body 9.Screened film main body 9, which has, is transferred layer 7 and adhesive phase 8a, layer 7 is transferred by being coated with transfer film 6 to be formed, above-mentioned adhesive phase 8a is arranged on across metal level 8b and is transferred On the face for the face opposite side that layer 7 is contacted with transfer film 6.Here, the adhesive phase 8a and gold being made up of conductive adhesive Belong to layer 8b and form electromagnetic wave shielding 8.In the electromagnetic wave shielding 8, when the adhesive phase 8a to being softened by heating pressurizes When, adhesive flows into insulation removal portion 4a as shown by arrows, is turned on earthed circuit (with reference to figure 3).So, in present embodiment In, the earthed circuit 3b of base film 5 (printed wiring board) is connected with conductive adhesive oxidant layer 8a, but the present invention is not limited to This, conductive adhesive oxidant layer is not necessarily required to be connected with the ground wire of printed wiring board.
When above-mentioned deformation occurs for adhesive phase 8a, as shown in figure 4, to gold on the direction for following adhesive phase 8a deformations Belong to layer 8b forces, so as to cause metal level 8b to deform.Then, by be transferred layer 7, have relief pattern 61 outside resin bed 63, Inner side resin bed 62, the order of outermost outside resin bed 63 exert a force and are deformed in equidirectional.At this moment, due to being turned Print layer 7 and outside resin bed 63 bond, thus due to be transferred layer 7 deform caused by power resin bed 63 laterally well Transmit.Further, since outside resin bed 63 is formed by polybutylene terephthalate (PBT), inner side resin bed 62 is by poly- terephthaldehyde Sour glycol ester is formed, therefore for being transferred the deformation of layer 7, good tracing ability can be presented in outside resin bed 63.Thus, The whole layered product formed due to transfer film 6 and by being transferred layer 7 can follow adhesive phase 8a deformation, therefore, Bu Huifang Hinder adhesive phase 8a towards the deformation on the direction of insulation removal portion 4a flowings.That is, by using transfer film 6 and layer 7, energy are transferred Enough prevent from producing the space with adhesive phase 8a in insulation removal portion 4a, and embeddability can be improved.
Moreover, adhesive phase 8a and earthed circuit 3b nonisulated portion 3c and dielectric film 4, which are fully bonded, forms shielded flexible After printed wiring board 100, when the transfer film 6 of screened film 10 and parting agent layer 6b are peeled off together (with reference to figure 1), Fig. 5 is obtained The shown shielding FPC101 that transfer pattern 71 is provided with the surface for being transferred layer 7.
The material of basilar memebrane 2 and dielectric film 4 is formed, for example, polyester, polybenzimidazoles, polyimides, polyamides can be enumerated The resins such as imines acid amides, PEI, polyphenylene sulfide (PPS), epoxy resin.When less requiring heat resistance, preferably make With cheap polyester film, when requiring flame resistance, polyphenylene sulfide film can be used, is preferably used in further requirement heat resistance Polyimide film.
Adhesive phase 8a is as resin of binding property by polystyrene type, vinyl acetate class, polyesters, polyethylene kind, poly- third The thermoplastic resins such as alkenes, polyamide-based, rubber-like and propylene class or phenol, epoxies, urethanes, melamine The thermosetting resins such as class, alcohol acids are formed.The conductions such as metal, carbon are mixed into these resin of binding property alternatively, it is also possible to use Property filler and conductive conductive adhesive.So, can be reliably by ground connection electricity by using conductive adhesive Road 3b and metal level 8b electrical connections.In addition, as conductive adhesive can also use reduce conductive filler amounts it is each to Different in nature conductive adhesive.So, when using anisotropic conductive adhesive as conductive adhesive, led with isotropism Conductive adhesive is compared to thin film is more readily formed, and because conductive filler amounts are few, therefore flexible excellent screen can be made Cover film.Alternatively, it is also possible to use isotropic conductivity adhesive as conductive adhesive.So, when using isotropism When conductive adhesive is as conductive adhesive, the conductive adhesive formed by isotropic conductivity adhesive is only set Layer, in addition to it can allow and earthed circuit 3b etc. grounding connection is possibly realized, and can have electromagnetic shielding effect.In addition, work as When not specially required to heat resistance, the thermoplastic resin of the not polyesters by restrictions such as maintaining requirements is preferably used, and is being wanted When seeking heat resistance or requiring more excellent flexibility, the high epoxies thermosetting preferably using reliability after electromagnetic wave shielding 8 is formed The property changed resin.In addition, adhesive phase 8a can also use the conductive adhesive at normal temperatures with cohesive.
In addition, in the above-described embodiment, metal level 8b and adhesive phase 8a is used as electromagnetic wave shielding 8, still, As described above when using isotropic conductivity adhesive as adhesive phase 8a, or omit metal level 8b knot Structure.
As electroconductive stuffing can use carbon, silver, copper, nickel, scolding tin, aluminium, silver silver-plated on copper powder cover copper gasket, with And the mixture of filler or these fillers after metal is plated in resin balls or glass marble etc..Because the price of silver is high, copper is resistance to Deficiency, aluminium are insufficient in terms of moisture-proof reliability in terms of thermal reliability, and scolding tin is difficult to obtain enough electric conductivity, therefore preferably Copper gasket or nickel are covered using silver that is less expensive and having excellent electric conductivity and reliability high in ground.
The electroconductive stuffings such as metal packing are also influenceed on the mixing ratio of resin of binding property by shape of filler etc., are being used When silver covers copper gasket, relative to the parts by weight of resin of binding property 100, copper gasket preferably is covered using the silver of 10-400 parts by weight, it is more excellent Choosing covers copper gasket using the silver of 20-150 parts by weight.When more than 400 parts by weight, earthed circuit (copper foil) 3b cohesive is dropped It is low, shield FPC101 deteriorated flexibility.In addition, electric conductivity significantly reduces when less than 10 parts by weight.In addition, using nickel filler When, relative to the parts by weight of resin of binding property 100, preferably using the nickel filler of 40-400 parts by weight, more preferred with 100-350 The nickel filler of parts by weight.When more than 400 parts by weight, earthed circuit (copper foil) 3b cohesive is reduced, shields FPC101's Deteriorated flexibility.In addition, electric conductivity significantly reduces when less than 40 parts by weight.The shape of the electroconductive stuffings such as metal packing can be Any of spherical, needle-like, threadiness, flake or dendroid shape.
As it was previously stated, when being mixed with the electroconductive stuffings such as metal packing, the thickness of these fillers, as 20 increase only ± 5 μm or so.In addition, when not mixed conductivity filler, adhesive phase 8a thickness is 1 μm -10 μm.Therefore, it is possible to reduce The thickness of electromagnetic wave shielding 8, and thin shielding FPC101 can be made.
Aluminium, copper, silver, gold etc. can be enumerated as the metal material for forming metal level 8b.Can also be according to required screen Cover characteristic and properly select metal material, but because copper has the problem of with easily being aoxidized during air contact, golden price is held high It is expensive, preferably using the high silver of cheap aluminium or reliability.Thickness is properly selected according to required shielding character and flexibility, but It is generally preferably to set thickness as 0.01 μm -1.0 μm.When thickness is less than 0.01 μm, shield effectiveness is insufficient, conversely, working as thickness Deteriorated flexibility during more than 1.0 μm.Forming method as metal level 8b has vacuum evaporation, sputtering, CVD, MO, and (metal is organic Thing) and plating etc., but if it is considered that production then preferably uses vacuum evaporation, cheap and stable gold can be obtained Belong to film.In addition, metal level is not limited to metal film, metal foil can also be used.Lower thickness limit using metal foil during metal foil is excellent Elect 2 μm, more preferably 6 μm as.In addition, the upper thickness limit of metal foil is preferably 18 μm, more preferably 12 μm.
Embodiments of the present invention are explained above, but specific example only has been illustrated, are not limited especially The fixed present invention, can suitably be designed change to specific configuration.In addition, effect described in the embodiment of invention and Effect is to list the optimal effect drawn by the present invention and effect, and the effect and effect drawn by the present invention does not limit In the content described in embodiments of the present invention.
[embodiment]
Below, using present embodiment stacked film embodiment and comparative example specifically describe the present invention.
The construction represented using such as Fig. 1, i.e. the screened film 10 with transfer film 6 and screened film main body 9 is used as embodiment, The screened film main body 9, which has to be layered on one of outside resin bed 63, is transferred layer 7.
For transfer film 6 used in embodiment using the film being process by extruding laminating, its thickness is 57 ± 3 μ of total m.In addition, the arithmetic average roughness Ra of relief pattern 61 is 0.35 μm.In addition, the tensile strength TD (transverse direction) of transfer film 6 Or MD (perpendicular direction) is 220-225MPa.In addition, transfer film 6 is using such as following things：At the heat of 170 DEG C × 10 minutes After reason, its shrinkage test result is that TD is 0%, MD 0.7%.
The manufacture method of the transfer film 6 used in specific illustrative embodiment.Outside resin bed 63,63 uses PBT resin (the trade name of WinTechPolymer companies manufacture：" ジ ュ ラ ネ ッ Network ス (Japan's registration mark) ").It is interior PET resin (the trade name that the thickness that side resin bed 62 is manufactured using Unitika companies is 25 μm：" エ Application Block レ ッ ト (Japan State's registration mark) ").
First, it is directed to transfer film with the above-mentioned biaxial stretch-formed PET film of roller 21 in inner side resin bed as shown in Fig. 2 batching With roller 25.On the other hand, above-mentioned PET resin is put into any film extruder 22,22, design temperature be 235 ± 5 DEG C squeeze Mixing is melted in press.Then, by PBT resin, from the catwalk (flat extrusion) of film extruder 22,22, (effectively extrusion is wide Degree 1300mm) two sides of the PET resin is expressed into, and make resin thickness be about 16 ± 3 μm.
So, receive transfer film 6 with the dandy roll 23 and casting roller 24 of rotation and form film, the transfer film 6 is by by PBT Formed on the resin extruded two sides to PET resin.At this moment, by the temperature adjustment of dandy roll 23 and casting roller 24 to 130 ± 3 DEG C. In addition, setting the roller diameter of dandy roll 23 and casting roller 24 as 500mm, peripheral speed is 20m/ minutes.The transfer formed after film Film 6 is slowly cooled down with 10 DEG C/sec of speed and from amorphism to after crystallizing sex reversal, batched by transfer film roller 25.
Width 1200mm transfer film of the material as embodiment will be configured to by the transfer film 6 of above-mentioned manufacture.
In addition, comparative example uses PET film that width 1200mm process sandblasting processing and thickness are 50 μm as transfer film.
As shown in fig. 6, parting agent layer of the transfer film 206 of above-described embodiment and comparative example across about 0.6 μm (is not schemed Show) stacking screened film main body 209 manufactures screened film 210, and the screened film main body 209 is 5-7 μm by thickness and is transferred layer 207th, the conductive adhesive oxidant layer that thickness is about 0.1 μm metallic film, i.e., metal level 208b and thickness are about 16 μm 208a is formed.
In addition, be transferred layer 207 is provided with transparent resin bed in the side that transfer pattern is transferred by transfer film 206, And using with the double-decker that black resin layer is laminated on the transparent resin layer.
(evaluation of the transfer film of embodiment)
Do not produce curling in this manufacturing process, on the transfer film of embodiment and shrink therefore operational good.In addition, by In (being processed in the one side of transfer film (outside resin bed) formed with relief pattern by hair side), therefore the sliding of transfer film Well, the completion status that can roll up painting is more good.
(evaluation of embeddability)
As shown in fig. 6, the construction of base film 205 is, on the polyimides basilar memebrane 202 that thickness is 25 μm, across Enough intervals are laminated the copper foil printed circuit 203 that 2 thickness are 55 μm, and it is 50 μ to be laminated with thickness on each printed circuit 203 M polyimides dielectric film 204.In addition, enough intervals refer to the interval of following degree, i.e. to the hot pressing of screened film 210 When, even if conductive adhesive oxidant layer 208a flows into the gap 213, conductive adhesive oxidant layer 208a will not also reach printed circuit 203.In addition, each dielectric film 204 formed with insulation removal portion (through hole) 204a to cause a part for each printed circuit 203 Expose.In the case of insulation removal portion 204a a diameter of 0.5mm, 0.8mm and 1.0mm, to embodiment and comparative example Screened film carry out hot pressing after, between 2 printed circuits 203 resistance value respectively measurement 3 times, its result is as shown in table 2.
[table 2]
As shown in table 2, in embodiment, which a diameter of value for the removal portion 204a that no matter insulate, all company than comparative example Connecting resistance value is low, and is easy to turn between printed circuit.I.e., it is known that embodiment is by making more electric conductivity compared with comparative example Adhesive phase 208a flows into insulation removal portion 204a and reaches printed circuit 203 and resistance value is reduced, and can obtain good Embeddability.
(evaluation of surface roughness)
Use the embodiment of Fig. 6 expressions, the screened film 210 of comparative example.Respectively using long 200mm, wide 50mm rectangle Test film.
Surface roughness (the Ra in embodiment is measured using ultra-deep shape measure microscope VX-8550 (KEYENCE) (μm)).Measuring condition is with JIS B0601 (1994) for foundation, and 20 times of object lens, the measurement spacing of thickness direction is 0.2 μm.
Specifically, after screened film 210 is batched on reel, since 3 parts in flow direction (MD directions) (portion, At (pars intermedia) at 1000m, 2000m (rearmost part)) 5 test films (n=5) (amounting to 15 test films) are chosen respectively, use Ultra-deep shape measure microscope VX-8550 (KEYENCE) measures the surface roughness (Ra) in embodiment.Obtain the stream The average value of 5 test films in each several part in dynamic direction, maximum, minimum value are as measured value.In addition, by 15 realities Test deviation of the difference as arithmetic average roughness of the maxima and minima of piece.As a result it is as shown in table 3.
[table 3]
The deviation (0.38 μm, 0.31 μm, 0.35 μm) of the arithmetic average roughness of embodiment is significantly smaller than comparative example (0.85 μm、0.73μm、0.73μm).Its reason is, in the processing using dandy roll, formed with relief pattern on roller, because this is recessed Convex pattern is concatenated to form the outside resin bed 63 in transfer film 6, therefore can realize the relief pattern of rule.Therefore, with using spray The comparative example of sand processing is compared, embodiment can make transfer film 6 and the bonding force of each several part adhesive surface that is transferred between layer 7, Peeling force is stable.
(the fissility evaluation before heating)
Transfer film 6 is relative to the peel strength for being transferred layer 7 in the state of measuring by the following method before hot pressing.It is specific and Speech, the test film that wide 50mm × long 200mm is cut from the screened film 210 of Fig. 6 comparative examples represented and embodiment is sample, by this Test film is as screened film 10, as shown in fig. 7, sticking double faced adhesive tape on the conductive adhesive oxidant layer 8a of screened film 10 surface Band, the one side of the two-sided tape is posted on testing machine (PALMEK PFT-50S peel strength testers) base and fixed Screened film 10.Then, by the end set of the transfer film 6 of screened film 10 on the chuck of testing machine, measurement transfer film 6 relative to It is transferred the peel strength of layer 7.Here, as shown in fig. 7, as stripping conditions, peel angle is set as 170 °, sets by chuck The peeling rate of caused transfer film 6 is 1000mm/min.Moreover, 5 experiments are carried out to comparative example and embodiment respectively, to each Secondary tester calculates maximum and minimum value.As a result it is as shown in table 4.
In addition, the evaluation criterion of fissility is as described below.Specifically, before hot pressing, turn when confirmation is immersed in decoction (nothing comes off the disengaging situation of die：Zero, have and come off：×).In addition, before hot pressing, confirm to peel off transfer film 6 from being transferred layer 7 After be transferred on layer 7 whether have damaged (no breakage：Zero, there is breakage：×).In addition, after hot-pressing, confirm on transfer film 6 whether There is damaged (no breakage：Zero, there is breakage：×).In addition, from the operability being transferred when layer 7 peels off transfer film 6 after confirming hot pressing It is (good：◎, commonly：Zero, it is poor：×).
[table 4]
(the fissility evaluation after heating)
On the other hand, transfer film 6 is strong relative to the stripping for being transferred layer 7 in the state of measuring after hot-pressing in the following manner Degree.The surface heat of comparative example and the conductive adhesive oxidant layer 208a of the screened film of embodiment 210 is crimped on tool using hot press There is the polyimide surface side of the copper-clad laminated board of polyimide surface and copper foil surface.As the thermo-compression bonding in now hot press Condition preferred settings pressure is 2-5MPa, temperature is 140-180 DEG C, the time is 3-60 minutes.In this measurement, with 170 DEG C As design temperature, by load-carrying 60 seconds under 0.5MPa, afterwards, under 3MPa load-carrying be thermally compressed within 180 seconds.
Then, the copper foil surface side sticking two-faced adhesive tape band of the copper-clad laminated board after screened film 210 has been thermally compressed, such as Fig. 7 It is shown, the one side of the two-sided tape is posted on experiment board (PALMEK PFT-50S peel strength testers) and fixed Screened film 210.Afterwards stripping is calculated in a manner of the illustrated test method identical of the peel strength measurement before above-mentioned hot pressing Intensity level.
As shown in table 4, in the state of after hot-pressing, maximum, the minimum value of embodiment are respectively in 5 peel tests 0.88N/50mm and 0.29N/50mm, and the maximum of comparative example, minimum value are respectively 2.94N/50mm and 1.37N/50mm, it is real It is smaller than the deviation of comparative example to apply example.Thus, after hot-pressing, it is good from the operability being transferred when layer peels off transfer film.
In addition, as shown in table 4, when comparing embodiment and the peeling force of comparative example, before hot pressing, embodiment and comparative example Between there is no very big difference (before embodiment hot pressing：Maximum is 5.34N/50mm, minimum value 3.78N/50mm；Comparative example heat Before pressure：Maximum is 5.88N/50mm, minimum value 3.92N/50mm), but after hot-pressing, compared with comparative example, embodiment Peeling force be substantially reduced (after embodiment hot pressing：Maximum is 0.88N/50mm, minimum value 0.29N/50mm；Comparative example heat After pressure：Maximum is 2.94N/50mm, minimum value 1.37N/50mm).Specifically, when the maximum for being conceived to peeling force When, peeling force drops to about original 1/2 to comparative example after hot-pressing, and on the other hand, embodiment drops to about original 1/6.By This, before hot pressing, transfer film is high relative to the bonding force for being transferred layer in embodiment, can prevent after dipping decoction etc. is usual Transfer film is peeled off in continuous process, and significantly reduces bonding force after hot pressing, can improve operability during stripping transfer film.
Description of reference numerals
1：Screened film；
2：Basilar memebrane；
2a：Insulation removal portion
3：Printed circuit；
3a：Signal circuit；
3b：Earthed circuit；
3c：Nonisulated portion；
4：Dielectric film；
4a：Insulation removal portion；
5：Base film；
6：Transfer film；
6b：Parting agent layer；
7：It is transferred layer；
8：Electromagnetic wave shielding；
8a：Adhesive phase；
8b：Metal level；
9：Screened film main body；
10：Screened film；
21：Inner side resin bed roller；
22：Film extruder；
23：Dandy roll；
24：Casting roller；
25：Transfer film roller；
61：Relief pattern；
61a：Convex portion；
61b：Recess；
71：Transfer pattern；
71a：Top；
71b：Bottom；
100：Shielded flexible printed wiring board；
101：Shielded flexible printed wiring board

Claims (6)

  1. A kind of 1. stacked film, it is characterised in that including：
    Transfer film, have crystallization inner side resin bed and respectively the inner side resin bed one side and another side be laminated The outside resin bed of crystallization, also, the outside resin bed the outer surface of at least one formed with relief pattern, its In, the inner side resin bed formed by polyethylene terephthalate and thickness be 6~50 μm, the outside resin bed by Polybutylene terephthalate (PBT) is formed and thickness is 6~30 μm；And
    Layer is transferred, is strippingly layered in the outer surface of the relief pattern of the transfer film, and with by described The transfer pattern that relief pattern is formed.
  2. 2. stacked film according to claim 1, it is characterised in that
    It it is 0.2 μm~2.5 μm in the arithmetic average roughness for the relief pattern that the outside resin bed is formed.
  3. 3. stacked film according to claim 2, it is characterised in that
    It it is less than 0.50 μm in the deviation of the arithmetic average roughness for the relief pattern that the outside resin bed is formed.
  4. 4. the stacked film according to any one of claims 1 to 3, it is characterised in that
    The two sides that the transfer film is laminated in the inner side resin bed by extruding laminating by the outside resin bed forms, and And irregular two rollers are formed by the surface of at least one of which implement pressurization and form.
  5. 5. the stacked film according to any one of claims 1 to 3, it is characterised in that
    The protective layer being transferred in the screened film that layer is conductive adhesive phase, metal level and protective layer, The metal layer is stacked in the conductive adhesive oxidant layer, and the protective layer is layered on the metal level.
  6. 6. the stacked film according to any one of claims 1 to 3, it is characterised in that
    The protective layer being transferred in the screened film that layer is conductive adhesive phase and protective layer, the protective layer It is layered in the conductive adhesive oxidant layer.
CN201380060143.5A 2012-11-19 2013-11-19 Stacked film and shielding printed wiring board Active CN104797420B (en)

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JP2012253166 2012-11-19
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WO2014077406A1 (en) 2014-05-22
HK1212301A1 (en) 2016-06-10

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