KR101491340B1 - Autoclave, a device manufacturing method using a flexible printed circuit board and manufacturing flexible printed circuit boards that are prepared by the method - Google Patents

Abstract

The present invention relates to a method for manufacturing a flexible printed circuit board by using autoclave, and the flexible printed circuit board manufactured by using the same. More particularly, in manufacturing the flexible printed circuit board, a board is temporarily bonded with a copper foil and an electric circuit protection film (cover lay) and is surrounded with a film. Then, the autoclave is used to heat and pressurize the board and the film. The cover lay and the board where a circuit pattern is formed are temporarily bonded to each other. The temporarily bonded board is surrounded with the film, and the film is inserted into the autoclave. The flexible printed circuit board is manufactured by using the pressurization and heating of the autoclave. The present invention is possible to minimize the number of members necessary for a conventionally used stacking method, thereby reducing the manufacturing costs and minimizing the failure rate. Since the flexible printed circuit board can be manufactured by using the autoclave, a new technology is applied to the manufacturing of the flexible printed circuit board, thereby improving the productivity of the flexible printed circuit board.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board manufacturing method using an autoclave device and a flexible printed circuit board manufactured by the manufacturing method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board using an autoclave device and a flexible printed circuit board manufactured by the method, The flexible printed circuit is fabricated by using an autoclave device capable of manufacturing a flexible printed circuit board by heating and pressing the substrate and the film by using an autoclave device, And a flexible printed circuit board manufactured by the method.

2. Description of the Related Art In recent years, high-performance and miniaturization of electronic devices have been progressing at a great speed, and there is a demand for miniaturization and weight reduction of electronic components used therefor. In addition, a flexible printed wiring board (hereinafter referred to as an FPC) that is flexible with respect to a wiring board for mounting electronic components and a normal hard printed wiring board has attracted attention and has rapidly increased in demand.

However, the FPC has a basic structure in which a circuit pattern is formed on a flexible and thin base film and a film called a cabal film is laminated on the circuit surface as a basic structure. As the base film or the cabal film, Polyimide films are the most widely used materials as materials satisfying required characteristics such as electrical characteristics, chemical resistance, heat resistance and environmental resistance.

A manufacturing process of such an FPC will be briefly described. First, a flexible copper clad laminate (hereinafter referred to as an FPC) is produced by laminating a polyimide film as a base film and a copper foil, and then a screen printing method or a photoresist method Then, a resist pattern is formed and etched to form a circuit pattern.

And thereafter lamination or lamination of the cabal film on the circuit surface of the film on which the circuit pattern is formed. In such a process, an acrylic adhesive, an epoxy adhesive, or the like is mainly used as an adhesive for attaching the base film and the copper foil or as a cabaret adhesive for attaching the carabine film to the circuit surface.

However, these adhesives have poor heat resistance and high water absorption.

Therefore, the properties such as heat resistance and dimensional stability of the FPC obtained depend on the characteristics of the adhesive, and there is a problem that many of the polyimide films used as the cover film and the base film can not sufficiently exhibit excellent x-ray properties. In recent years, demand for a double-sided adhesive sheet having an adhesive on both sides of a base film has increased as the FPC has been made more multilayered. However, since the above-mentioned adhesive is used also in such double-sided adhesive sheet, the polyimide film can exhibit excellent characteristics That is not the case.

In the FPC manufacturing process, as a method for adhering the surface of a circuit to a circuit surface, there is a method in which a surface of a polyimide film is adhered to the surface of the polyimide film, And then thermocompression-bonding and curing them with a press or the like is generally used. In this method, when the above adhesive is used, since hole drilling can not be performed after the carvure film is adhered to the FPC, it is preferable that a hole is formed in the connection portion between the terminal portion and the component of the circuit formed on the conductor, And it was necessary to process it by piercing the window.

2. Description of the Related Art [0002] Flexible printed circuit boards (FPCs) having flexibility are widely used in recent years due to miniaturization and high density of electronic devices. Usually, the FPC uses a copper clad laminate (CCL = Copper Clad Laminate) made of an insulating resin such as polyimide and having an insulating layer having plasticity laminated thereon as a material, etching the copper foil of the copper clad laminate to form a circuit and wiring, And a carvara (CL-Cover Lay) having plasticity is adhered thereon to cover the CCL circuit.

As the adhesive used in the conventional FPC, an adhesive in which an elastomer (rubber component) is added to an epoxy adhesive composed of an epoxy resin and a curing agent is used in order to improve the flexibility of the adhesive layer after curing and the adhesion between the adhesive layer and the metal layer .

As for the conventionally used production method,

Regarding the method of manufacturing a flexible PCB, the registration number 0146607 discloses a method of laminating a photosensitive dry film on the surface of a copper foil of a one-sided flexible copper-clad laminate and then laminating the dry- And the copper foil is thermally adhered to the polyimide film processed with an approach hole to thermally adhere the polyimide film to the copper foil from the lower surface of the flexible PCB, A circuit is formed by a silk printing technique by using a conductive ink on the base, and the upper and lower circuits are formed so as to be energized through the contact points. Then, the flexible PCB is dried, and an insulating resistor or polyimide Wherein the film is applied to form an insulating layer. And shows a manufacturing method.

Registration No. 10-0326655 relates to a polyimide laminate used in a Karaaba film or an FPC production film and a process for producing the laminate, wherein the aromatic diamine or aromatic tetracarboxylic dianhydride containing an ester group is reacted with at least one A polyimide laminate for use in a carabi film comprising a polyimide polymer having low water absorption obtained by reacting a diamine and an acid anhydride and containing a species on both sides or one side of a non-thermoplastic polyimide film, and an aromatic group- Preparing a precursor solution of a thermoplastic polyimide polymer having low water absorption, which is obtained by reacting a diamine and at least one acid anhydride containing at least one diamine or aromatic tetracarboxylic dianhydride, a base film made of a non-thermoplastic polyimide polymer Process, corresponding heat A step of applying a precursor solution of the polyimide polymer to the base film made of the non-thermoplastic polyimide polymer, a step of drying the base film coated with the precursor solution of the thermoplastic polyimide polymer and imidizing the precursor of the thermoplastic polyimide polymer , A step of superimposing a conductor layer on the obtained thermoplastic polyimide layer, and a step of lamination by heating and pressing.

No. 10-0332338 relates to a method of manufacturing a flexible double-sided PCB, which comprises cutting a substrate of a double-sided flexible PCB formed into a roll type into a sheet state of a required size, forming a through hole and polishing, A flexible printed circuit board (PCB) manufacturing method comprising: a taping step of forming a substrate on which a plating process is completed as a roll type substrate; A dry film adhering and exposing step of forming a pattern by attaching a dry film to a substrate by supplying the dry film with a rolled film after polishing the tapped roll type substrate; A developing and etching step of developing and etching the substrate in the roll state after the exposure step; A separating step of separating the roll type substrate having completed the etching step back into a sheet type; And a finishing step of thermally bonding and finishing the cabaret to the separated substrate; Side flexible printed circuit board (PCB).

Registration No. 10-0617585 relates to a method of manufacturing a flexible printed circuit board, which comprises cutting a printed circuit board into a sheet of a predetermined size and forming a through hole in the printed circuit board, A first step of attaching the printed circuit board to the surface of the support plate so as not to move; A second step of polishing the printed circuit board through the first step and performing electroless copper plating and electrolytic copper plating so that electricity can be conducted through the through holes of the printed circuit board; A third step of polishing the printed circuit board after the second step, attaching a dry film to the printed circuit board, and exposing the printed circuit board to a necessary pattern; A fourth step of developing the printed circuit board through the third step and then etching the developed printed circuit board; A fifth step of thermally adhering a cabinet to a portion of the printed circuit board that has undergone the fourth step except for a portion requiring soldering; A sixth step of removing the support plate from the printed circuit board after the fifth step, and then finishing the printed circuit board by machining; The method of manufacturing a flexible printed circuit board according to claim 1,

In addition, a brief description will be given of a conventionally used method,

After placing the release film, the PVC sheet, and the kraft paper symmetrically on both sides of the substrate after the coverlay and the substrate are brought into contact with each other, the resultant is heated and pressed by a hot press to adhere, or the symmetrically formed release film, PVC sheet, A plurality of symmetrical substrates were laminated and heated and pressed by a hot press to bond them.

As described above, many manufacturing methods for a conventional printed circuit board (PCB) or a flexible printed circuit board (FPCB) have been developed and used. However, A plurality of sheets of a release paper, a cushion film, a kraft paper, and the like are stacked in order to manufacture the stacked subsidiary materials by drawing them into a device for manufacturing PCB or FPCB by pressurization and heating, , There is a problem in that most of them are one-time, which is not recycled after use, raising a manufacturing cost for PCB or FPCB.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a substrate on which a cover pattern and a circuit pattern are formed is brought into contact with the substrate, the substrate is wrapped with a film, and the film is sealed in an autoclave A method of manufacturing a flexible printed circuit board using pressure and heating of the autoclave device, and a flexible printed circuit board manufactured by the method.

According to an aspect of the present invention, there is provided a method of manufacturing a circuit board, including: a first step of contacting an electric circuit protective film (cover lay) with a substrate on which a circuit pattern is formed; A third step of sealing the film wrapped with the substrate in the second step and a third step of sealing the film wrapped in the substrate in the second step after inserting the sealed film into the autoclave device, And a fourth step of bonding the coverlay and the substrate bonded to each other by heating and pressing the film. The method of manufacturing a flexible printed circuit board using the autoclave device and the flexible printed circuit board manufactured by the method are provided I want to solve the problem.

The flexible printed circuit board manufactured by the method of manufacturing a flexible printed circuit board using the autoclave apparatus according to the present invention and the manufacturing method thereof can minimize the quantity of subsidiary materials required in the conventional lamination method, And the defect rate is minimized, and a flexible printed circuit board can be manufactured by using the autoclave device, so that a new technology for manufacturing a flexible printed circuit board is applied, thereby improving the productivity of the flexible printed circuit board I will call it an epoch-making invention.

1 is a flowchart showing a manufacturing method of a flexible printed circuit board according to the present invention

It is essential that the substrate 120, which is in contact with an electric circuit protection film (hereinafter referred to as a cover layer) 110, is heated, pressurized, and adhered by using the autoclave device 200.

In the flexible printed circuit board manufacturing method using the autoclave apparatus of the present invention and the flexible printed circuit board manufactured by the manufacturing method,

First, a flexible printed circuit board manufacturing method includes a first step 10 in which an electric circuit protection film (cover lay) 110 and a substrate 120 on which a circuit pattern is formed are brought into contact with each other, The encapsulated substrate 120 is wrapped with the film 130 and the encapsulated film 130 is inserted into the autoclave 200 and positioned in the second step 20 and the encapsulated film 130 in the second step 20 A third step 30 of heating and pressing the film 130 by the operation of the autoclave device 200 to adhere the coverlay 110 and the substrate 120 to each other.

After the inside of the film 130 is vacuumed in the second step 20, the film 130 may be sealed.

In the second step 20, the film 130 can be inserted into the autoclave device 200 without being sealed to the film 130 according to the heating and pressing operation of the autoclave device 200.

In the first step 10, the electric circuit protection film 110 may be selectively in contact with one or both surfaces depending on the formation of a circuit pattern on one side or both sides of the substrate 120.

In the second step 20, the film 130 may be selectively wrapped on one side or both sides of the electrical circuit protection film 110, which is bonded to the substrate 120, on one or both sides .

The sealed film 130 in the second step 20 can be closely contacted with the rollers before being inserted into the autoclave device 200.

The deformation of the substrate 120 due to the high temperature during heating in the autoclave device 200 before the substrate 120 having the electric circuit protection film 110 bonded to the film 130 is wrapped in the second step 20 A protective pad may be formed on one side or both sides of the substrate 120. [

When the reinforcing plate is attached to the substrate 120 which has been heated and pressurized in the third step 30 and the second step 20 and the third step 30 are sequentially repeated, .

A flexible printed circuit board is manufactured using the above-described method of manufacturing the flexible printed circuit board 100 using the autoclave device.

A method of manufacturing a flexible printed circuit board using the autoclave device according to the present invention and a flexible printed circuit board manufactured by the method will be described in more detail with reference to FIG.

[First step (10)]

After the substrate 120 on which the circuit pattern is formed is provided, the coverlay 110 is brought into contact with the substrate 120.

The substrate 120 and the coverlay 110 are in contact with each other using a conventionally used technique, and an adhesive or the like used in the contact bonding is generally used.

At this time, the coverlay 110 may contact one surface or both surfaces according to a circuit pattern formed on the substrate 120.

[Second Step (20)]

In the second step 20, the substrate 120 bonded in the first step 10 is wrapped and sealed using the film 130.

The wrapping of the film 130 may be performed on one or both sides of the substrate 120 according to a circuit pattern on which the substrate 120 is formed.

The film 130 is a film formed by applying a silicone composition and an inorganic particle exhibiting an antistatic effect on one side or both sides of a polyester film (PET) for efficiency of uniform running property and excellent adhesion. The film 130 has a uniform peeling force and residual Adhesion and antistatic properties, and is a functional film used as a base film for protecting an adhesive layer of electric, electronic parts, and display materials or forming MLCC ceramics.

The film 130 has good surface roughness and thickness uniformity and has excellent applicability to various applications and process conditions. The film 130 is used for protecting the temporary support and the adhesive layer of the adhesive component. The MLCC multi-layer ceramic capacitor, , Chip varistors, and chip inductors, and is used as a substrate film for display materials such as ACF anisotropic conductive films and DAF (Die Attached Film).

The film 130 is collectively referred to as a film 130. It may be a release film, a silicon envelope, a silicone pad, or the like.

In the case of the release film, after the substrate 120, which is extended in the longitudinal direction and is covered with the coverlay 110, is positioned at one central portion of the release film, the other side of the release film is covered in one direction One side of the release film may be closed and the other side thereof may be opened and closed. In addition, when the cover layer 110 is bonded to only one side of the substrate 120 according to the formation of the circuit pattern, the substrate 120 may be covered with the release film so as to cover only the portion where the circuit pattern is formed.

In the case of a silicon envelope, the substrate 120 to which the coverlay 110 is attached may be inserted into the silicon envelope to enclose the substrate 120.

In order to prevent the shape of the substrate 120 from being deformed during heating and pressing by using the autoclave device 200, the substrate 120 is placed on the substrate 130 before the substrate 130 is wrapped on the film 130, 120 may be formed on one or both sides thereof.

The protection pad is placed on one side or both sides of the substrate 120 along one side or both sides of the substrate 120 on which the circuit pattern is formed before the substrate 120 is enclosed and sealed by the film 130, The film 130 is inserted into the autoclave 200 and is prevented from being deformed due to high temperature and pressure when the substrate 120 is wrapped around the film 130 when heated and pressurized. The protection pad may be a silicon pad, a wood material, a synthetic resin material, or the like, which prevents deformation of the substrate 120, and may use a pad capable of preventing deformation of the substrate 120, But is not limited to the silicon pads described above.

The sealed film 130 in the second step 20 can be closely contacted with the rollers before being inserted into the autoclave device 200. This is for the purpose of enhancing the adhesion of the coverlay 110 and the substrate 120 when the autoclave 200 is heated or pressurized. A hot roller heated to a predetermined temperature or a generally used roller may be used.

In the case of the adhesion operation using the rollers, the substrate 120 may be wrapped before or after wrapping the film 130 on the film 130 or before insertion into the autoclave device 200 as described above, And it can be varied depending on the coverlay 110 and the substrate to be bonded, so that the description is not limited to the above description.

In the second step 20, the cover rails 110 and the substrate 120 may be vacuumed to increase the adhesive force when heating and pressing the autoclave device 200. This increases the adhesion of the coverlay 110 to the substrate 120 due to the vacuum operation and increases the adhesion of the substrate 120 to the film 130. The substrate 120 is then heated and pressurized by the autoclave 200, So that the adhesive strength to the coverlay 110 and the substrate 120 can be increased.

The release film, the silicon envelope, and the silicone pad are auxiliary materials for protecting the substrate 120 when heated and pressed against the substrate 120 to which the coverlay 110 is attached. The use of the zippered bag may increase the recyclability of the encapsulating auxiliary material, and the auxiliary materials are not limited to the release film or the silicon envelope that can protect the substrate 120, and the like.

The sealing process of the film 130 wrapped around the substrate 120 that is in contact with the coverlay 110 proceeds in the second step 20.

The film 130 will be described on one side and both sides of the substrate 120 during the sealing operation.

When the substrate 120 is wrapped with the film 130, the substrate 120 is positioned on the substrate 120 after the substrate 120 is placed on the autoclave device 200, The film 130 is positioned so as to cover and cover the substrate 120, and the substrate 120 is enclosed and sealed. At this time, the substrate 120 may be directly placed in the autoclave device 200, but a separate plate may be provided to position the substrate 120 on the plate, and then the substrate 120 may be laminated The film 130 may be positioned so as to cover the substrate 120, and the substrate 120 may be enclosed and sealed.

When the film 130 is wrapped on both sides of the substrate 120 when both sides of the substrate 120 are wrapped with the film 130, the film 130 is sealed with the film 130, It may be placed in the clave device 200.

In the second step 20, the film 130 may be inserted into the autoclave device 200 without being sealed to the film 130 according to the heating or pressing operation of the autoclave device 200.

[Third Step (30)]

In the third step 30, the sealed film 130 is inserted into the autoclave device 200 and heated and pressurized by the operation of the autoclave device 200 so that the coverlay 110 and the substrate 120 .

The bonded substrate 120 is positioned inside the film 130 and the film 130 is put into the autoclave device 200 to be heated and pressed to be bonded.

The pressure applied to the film 130 during the heating and pressing is applied to the autoclave apparatus 200 by pressurizing and heating the autoclave apparatus 200. The pressure applied to the autoclave apparatus 200 and the heated temperature are varied according to the autoclave apparatus 200 It is not limited.

A reinforcing plate is attached to the substrate 120 heated and pressed in the third step 30 and the work of the second step 20 is sequentially applied to the substrate 120 to which the coverlay 110 is adhered The reinforcing plate can be bonded to the substrate 120 repeatedly.

The reinforcing plate is generally used, and the type thereof is capton, metal, plastic, tape, epoxy, EMI film and the like, and is not limited to the type of the reinforcing plate adhered to the substrate 120, And can be adhered using the autoclave device 200 when adhering to the substrate 120 to which the ray 110 is adhered.

As described above, in the present invention, after the substrate 120, which is in contact with the coverlay 110, is placed on the film 130, the flexible printed circuit board 100 can be manufactured using the autoclave device 200 Respectively.

As described above, the present invention can minimize the number of subsidiary materials required in the conventional lamination method, thereby reducing the manufacturing cost and minimizing the defective rate, and the flexibility of the flexible printed circuit board 100 ). Thus, a new technique for manufacturing the flexible printed circuit board 100 is applied, thereby improving the productivity of the flexible printed circuit board 100.

10: First step 20: Second step 30: Third step
100: flexible printed circuit board
110: electric circuit protection film (coverlay) 120: substrate 130: film
200: autoclave device

Claims (9)

A first step of bringing an electric circuit protection film (cover lay) into contact with a substrate on which a circuit pattern is formed, a second step of wrapping and sealing the substrate bonded in the first step, and a second step of sealing the protective film and the substrate A method for manufacturing a circuit board, comprising the steps of:
In the first step, the electric circuit protection film 110 may be selectively in contact with one or both surfaces of the substrate 120 according to the formation of a circuit pattern on one side or both sides of the substrate 120,
In the second step, the inside of the film 130 is vacuumed, and the film 130 is selectively sealed in one side or both sides along one side or both sides of the electrical circuit protection film 110, Respectively,
The encapsulated film 130 may be applied to the electrical circuit protection film 110 and the substrate 120 either before or after the encapsulation of the film 130 according to the work or to the autoclave device 200 A pressing operation is performed using a roller in one of the following steps before and after the insertion and pressing,
The substrate 120 is heated to prevent deformation of the substrate 120 due to the high temperature when heating the substrate 120 in the autoclave 200 before the substrate 120 having the electric circuit protection film 110 is bonded to the film 130. [ A protective pad can be formed on one surface or both surfaces of the substrate,
In the third step, the film 130 sealed in the second step is inserted and positioned in the autoclave device 200, and then the film 130 is heated, pressurized (pressurized) by the operation of the autoclave device 200, The electric circuit protection film 110 is adhered to the substrate 120,
The second step (20) and the third step (30) are sequentially repeated on the heated and pressured substrate (120) to form a reinforcing plate on the substrate (120) A method of manufacturing a flexible printed circuit board using a clave device.
delete The method according to claim 1,
In the second step 20, the film 130 may be inserted into the autoclave device 200 without being sealed to the film 130 according to the heating or pressing operation of the autoclave device 200 Method of manufacturing flexible printed circuit board using autoclave device
delete delete delete delete delete Wherein the flexible printed circuit board is manufactured using the method of manufacturing the flexible printed circuit board (100) using the autoclave device according to any one of claims 1 to 3.

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