KR20100011476A

KR20100011476A - Transfoermational prevention method of provisional procession at manufacturing process of flexible pcb board

Info

Publication number: KR20100011476A
Application number: KR1020080072712A
Authority: KR
Inventors: 구미숙
Original assignee: 구미숙
Priority date: 2008-07-25
Filing date: 2008-07-25
Publication date: 2010-02-03

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing process of a flexible PCB substrate, and in particular, in the welding process, to prevent deformation of the kraft paper inserted between the substrate and the substrate and to recycle it.

The present invention is intended to minimize the occurrence of defects by placing dust on the kraft by placing a Teflon film made of PTFE (Poly Tetra Fluoro Ethylene) Teflon resin on a substrate instead of kraft paper, which is a brown paper made of kraft pulp. There is this.

The present invention as described above can reduce the waste of raw materials by not using the filling film and the release film,

In addition, the present invention can reduce the work time by reducing the process of laminating the filling film, release film and kraft paper in the welding process by using a Teflon film.

And it is a useful invention that can prevent the occurrence of defects due to dust during hot-press molding by preventing the generation of dust by not using kraft paper.

Description

In the flexible PCB manufacturing process, the deformation prevention method of the welding process {Transfoermational Prevention method of Provisional Procession at manufacturing Process of flexible PCB board}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing process of a flexible PCB substrate, and in particular, in a welding process, a deformation of the welding process is prevented in a flexible PCB manufacturing process that is capable of preventing and recycling the deformation of the kraft paper inserted between the substrate and the substrate. It is about a method.

Generally, flexible printed circuit boards (FPCBs) are electronic components developed as electronic products become smaller and lighter, and have excellent workability, heat resistance, bending resistance, chemical resistance, and heat resistance. .

Looking at the manufacturing process of a typical flexible PCB bood (flexible pcb bood) as follows.

The manufacturing process of the flexible PCB is as shown in FIG.

Base input process as the first process

Cutting process for cutting raw materials in the second process

Drill process as the third process

Copper plating process as the fourth process

Soft-etching process with the fifth process

Dry-film is in close contact with the sixth process

Exposure process to the seventh process

Development, corrosion process

Peeling process by the ninth process

Temporary welding process to the tenth process

Hot-press process as the eleventh process

Nickel gold (NI, AU) plating process as the 12th process

Temporary welding process to attach reinforcing bar in 13th process

Lamination process of closely adhering the reinforcing bar in the 14th process

Primary external press (punching) process as the 15th process

BBT (BARE BOARD TESTER) process as the 16th process (process to check if the work is consistent when the PCB is manufactured with the designer's data)

Second external press (punching) process with the 17th process

Inspection process by the 18th process

Shipment inspection process to the 19th process

Package shipment process to the 20th process

In a twenty-first process, a surface mount technology (SMT) process of placing a component on an electronic substrate is performed.

Looking at the temporary process which is the 10th process in the said process is as follows.

It is a process of attaching a processed coverlay to a flexible copper clad laminate (fccl) in which circuit formation is completed.

That is, the role of fixing the coverlay to the flexible copper foil laminated film so as not to fall off during the movement or lamination, and most of the temporary welding process is performed by hand.

The most common defects in the welding process are the circuit defects caused by coverlay bias, and the coverlay welding tolerance is generally 0.1mm, so it should not be skewed more than 0.1mm by hand.

In the lamination process using the temporary welding process as the tenth process and the hot press as the eleventh process, the filling film 2 and the transfer film 3 are respectively disposed on the upper and lower portions of the flexible substrate 1 as shown in FIG. 2. Place the kraft paper (4) on top of it, laminate it, and then weld it. In this state, it is press-molded by using a hot press, and then the filling film (2), the release film (3) and the kraft paper on the flexible substrate (1). As a process of separating (4), the separated packing film, release film and kraft paper were reused.

The kraft paper used above was a brown paper made of unbleached kraft pulp, placed on top and bottom of the substrate, and used by welding.

However, the conventional method using kraft paper has a disadvantage in that a defect occurs in the substrate by forming the substrate by hot-pressing in the state of manufacturing the substrate due to the dust generated in the kraft paper by using kraft paper. There is this.

In addition, the worker is inhaled by the dust generated from the kraft paper, there is a bad health problem.

Meanwhile, the conventional method using kraft paper has the disadvantage that the thickness of the kraft paper is deformed by the force compressed in the press, but the kraft paper is laminated on the substrate, welded, molded and then separated and reused. This short and frequent replacement led to unnecessary expenses.

The present invention has been invented to solve the above problems, and its object is to minimize the occurrence of defects by preventing dust from occurring in the kraft used during the welding process.

Another additional object of the present invention is to prevent the kraft paper from being deformed in the hot press so that it can be reused semi permanently.

As a means for solving the above problems, a Teflon film made of PTFE (Poly Tetra Fluoro Ethylene) Teflon resin is placed on a substrate and welded in place of kraft paper, which is brown paper made of kraft pulp.

By not using kraft paper, it is possible to prevent the generation of dust, thereby preventing the occurrence of defects due to dust during hot-press molding.

In addition, the Teflon film itself is a non-toxic fluorocarbon resin that does not cause chemical action, and thus the resin is not deformed during hot-press molding, and thus semi-permanent reuse can reduce waste of raw materials.

In the welding process which is a 10th process in the manufacturing process of a flexible PCB substrate,

A process of laminating and welding the substrates in a multi-stage manner by covering and covering a Teflon film 32, which serves as filling, releasing, and separation on the upper and lower portions of the flexible PCB substrate 31,

A process of forming the flexible substrate 31 to which the Teflon film 32 is welded to the upper and lower parts by hot-press as an eleventh process,

The teflon film 32 is separated from the upper and lower portions of the flexible substrate 31 formed by the hot-press.

In the above, the Teflon film 32 is used at -100 ° C. to 260 ° C. for non-adhesion, and the weight is preferably 160 g / m 2 and the thickness is 0,08 mm.

In the present invention as described above, the Teflon film 32 is placed on the upper and lower portions of the flexible substrate 31, and another flexible substrate is placed on the upper portion of the flexible substrate 31, and then a plurality of stacks are stacked in multiple stages. The substrate and the Teflon film 32 are fixed to complete the temporary welding process.

As described above, in a state where the Teflon film 32 is fixed to each layer and upper and lower portions of the flexible substrate, the flexible substrate 31 is hot-pressed, placed in a press, and pressed and heated to form the flexible substrate 31.

In this manner, after the molding is completed by hot pressing, the Teflon film 32 that is welded to the flexible substrate 31 may be separated.

1 is a block diagram showing a manufacturing process of a conventional flexible PCB substrate

Figure 2 is an exploded perspective view showing whether the conventional temporary welding process

Figure 3 is a side cross-sectional view showing a bonding state for a conventional welding process

Figure 4 is an exploded perspective view of the main portion extract showing the welding process of the present invention

Figure 5 is a side cross-sectional view showing a bonding state of the present invention welding process

** The surface of the sign for the main part of the drawing **

31. Flexible substrate 32. Teflon film

Claims

In the flexible PCB manufacturing process, characterized in that the step of separating the Teflon film (32) on the upper and lower portions of the flexible substrate (31) formed in the hot-press, the deformation prevention method of the welding process.

In the flexible PCB manufacturing process, the Teflon film 32 is used at -100 ° C to 260 ° C for non-adhesion, and has a weight of 160g / m 2 and a thickness of 0,08mm. .

The method for preventing deformation of the welding step in the flexible PCB manufacturing step according to claim 1, wherein the Teflon film (32) is laminated in the welding step.