JP2009289936A - Method of manufacturing electronic component and heat press apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce intricateness of alignment lamination and facility addition with respect to dissimilar lamination constitution including a ceramic substrate. <P>SOLUTION: Each reference hole formed in the ceramic substrate and a resin material member, etc., is fitted to a pin by insertion to facilitate positioning, and after lamination, control is performed using a temperature rise profile of a heat press. In a predetermined resin viscosity region, the pin is extracted, the heat press is changed to a high-pressure press, and an insulating resin sheet is thermally cured to form a cured body, which is finally divided to produce an electronic component. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electronic component having a component built-in structure in which different materials of a ceramic substrate and a resin material are laminated, and a hot press apparatus.

  Electronic component modules on which electronic components, mainly semiconductor chips, are mounted greatly contribute to miniaturization, thinning, and high performance of information communication devices, office electronic devices, household electronic devices, medical electronic devices, etc. is doing. In order to increase the mounting density of electronic components such as semiconductor chips in response to the demand for miniaturization and thinning, particularly in the field of information and communication equipment, the wiring pitch of electronic components and the wiring rules for wiring substrates on which electronic components are mounted Miniaturization is progressing more and more. Recently, in addition to the conventional two-dimensional mounting in which electronic parts are mounted on the surface of the wiring board, the electronic parts are built in the wiring board, and the mounting area is greatly reduced, and the three-dimensional structure is aimed at reducing the size and increasing the density. Development of built-in component modules using various mounting methods is also actively underway.

In addition, when mounting electronic components such as semiconductor chips on a mother board of an electronic device such as a personal computer or a mobile phone, wiring between the electronic parts with fine wiring rules and the mother board with relatively coarse wiring rules for the electronic parts In order to adjust the rules, electronic components are mounted on a wiring board called an interposer board or module board, and then BGA (Ball Grid Array) mounting using solder balls or LGA (Land Guard Array) by electrode part solder printing. In many cases, stepwise mounting forms such as secondary mounting on a mother board are adopted. Resin substrates are usually used for this mother board, but wiring rules for electronic components and mother boards, required board area and thickness, and electronic component wiring are often used for interposer boards and module boards. A resin substrate or a ceramic substrate is selected and used from various viewpoints such as heat dissipation. Here, when a ceramic substrate is used as an interposer substrate or a module substrate, the thermal expansion coefficients of the ceramic substrate and the mother substrate are greatly different, so that a large stress is applied to the secondary mounting portion, for example, a crack is generated in a solder ball of BGA mounting. An electrical connection failure such as occurrence may occur. In response to the occurrence of defects due to the use of such dissimilar materials, by forming a resin layer on the mother substrate mounting surface of an interposer substrate or module substrate made of a ceramic material, stress can be relieved and defects can be prevented. A method (Patent Document 1) has been proposed.
JP 2003-124435 A

  However, the ceramic substrate has high rigidity but is easily cracked and has a low coefficient of thermal expansion. On the other hand, metal materials used for resin substrates, resin materials, press jigs, etc. have a large coefficient of thermal expansion. Breakage such as cracking occurs from the pin insertion hole of the board. This is because the clearance between the holes and pins for alignment lamination needs to be as small as possible in order to improve the lamination accuracy of each member, and this is a slight distortion caused by the difference in thermal expansion coefficient of different materials due to heating by hot press. Get up.

  In order to prevent this, a laminated alignment mark is provided on each member, alignment is performed by camera recognition, and temporarily fixed with an adhesive or the like. There is a method of repeating this and laminating. However, since this method makes it difficult to increase the size of the ceramic substrate itself in the manufacturing process, a large number of alignment lamination facilities based on camera recognition are required to repeat the lamination of small substrates, and a large capital investment is required. In addition, there is a problem in that a temporary fixing operation using an adhesive or the like is required for each lamination, which increases costs.

  Below, the manufacturing method of the conventional electronic component is demonstrated using FIG. 10 (a)-(d) and FIG. 11 (a)-(d).

  In FIG. 10A, the position of the laminated alignment mark 103 on the resin substrate 101 is memorized by a camera, and an adhesive is applied to a surplus portion around the substrate. Next, an insulating resin sheet 203 on which a via hole conductor 202 for electrical connection between layers composed of a conductive resin composition and a via hole conductor 204 to be a laminated alignment mark are formed is prepared. The position of the via-hole conductor 204 serving as a laminated alignment mark is memorized with a camera, aligned with the resin substrate 101, laminated, and temporarily fixed with an adhesive to produce a laminated body 301 in FIG. Thereby, the alignment of the wiring pattern 102 of the resin substrate 101 and the via-hole conductor 202 is performed. Next, circuit components such as a semiconductor chip or semiconductor package 403 and a chip component 404 such as a chip resistor, a chip capacitor, and a chip inductor are mounted on the ceramic substrate 402. Adhesive is applied to the surplus portion around the laminate 301. The position of the laminated alignment mark 406 of the circuit board 401 on which the circuit components are mounted is memorized by a camera, aligned with the via hole conductor 204 of the laminated body 301, laminated, and temporarily fixed with an adhesive, as shown in FIG. A stacked body 501 is produced. FIG. 10 (d) is an explanatory view in which jigs for hot-pressing and integrating the laminated body 501 are arranged up and down. Reference numeral 601 denotes a laminated jig base for facilitating handling of the laminated body. Is a rubber cushion material for equalizing the applied pressure, 603 is a pressing plate, 604 is a release film, and 605 is an insulating resin sheet. In FIG. 11A, reference numeral 701 denotes a heating plate of a hot press, and reference numeral 702 denotes a heater. In the state of being laminated as shown in FIG. 11 (b), for example, pressure heating is performed at 200 ° C. and 3 MPa, and the insulating resin sheet is thermally cured to integrate the laminated body 801 shown in FIG. 11 (c). can do. Thereafter, as shown in FIG. 11D, the electronic component 802 can be manufactured by cutting into modules. As described above, it is necessary to repeat the alignment process by camera recognition and the lamination process of temporarily fixing with an adhesive twice. In addition, since the ceramic substrate size is also about □ 100 mm, there is a problem that when the production amount is increased, the equipment cost and man-hours are greatly increased.

  The present invention has been made in view of such points, and its main purpose is to suppress the occurrence of cracks in the ceramic substrate due to the hot pressing process of the heterogeneous laminated structure of the electronic component including the ceramic substrate, and The purpose is to provide a technology that enables hot pressing at low cost without investment.

  The method for manufacturing an electronic component according to the present invention includes an insulating resin layer between a plurality of circuit boards including a ceramic substrate, the circuit component is embedded in the insulating resin layer, and a conductive resin composition is filled. In a method for manufacturing an electronic component having a via-hole conductor and configured to obtain electrical connection between the plurality of circuit boards, a plurality of circuit boards including at least a ceramic substrate having holes for alignment lamination are prepared. A conductive resin composition on an uncured insulating resin sheet having holes for alignment lamination, a step of mounting circuit components on a wiring pattern on at least one main surface of the plurality of circuit boards, A step of forming a filled via-hole conductor, and an uncured insulating material in which at least the circuit board and the via-hole conductor are formed by a pin through a hole for alignment lamination The step of aligning the wiring pattern of the circuit board and the via-hole conductor by sequentially laminating the grease sheet and the circuit board, and removing the pins of the laminated body to perform pressure heating The method includes a step of integrating the laminate by thermally curing a cured insulating resin sheet.

  According to this configuration, alignment can be performed only by laminating the resin substrate and the insulating resin sheet on which the via-hole conductor is formed and the ceramic substrate on the basis of the pins. After that, by removing the pins and performing hot pressing, it is not affected by the distortion due to the difference in thermal expansion, so it does not cause cracking of the ceramic substrate, so it is possible to produce electronic components without a significant increase in production time Can do.

  In the method for producing an electronic component according to the present invention, the laminate is heated under pressure in a pressure range of 0 to 2 MPa, then a pin is removed and pressure heating is performed in a pressure range of 1 to 10 MPa. The step of integrating the laminate by thermally curing the insulating resin sheet is included. According to this structure, since it fixes with the pin when arrange | positioning a laminated body in a hot press apparatus, it does not slip | deviate. Also, in the low pressure area, it is difficult to be affected by distortion due to the difference in thermal expansion coefficient due to different materials, so pressurize at low pressure for a certain time, soften the insulating resin sheet and adhere it to the substrate, then pull out the pin and The insulating resin sheet can be thermoset at the stage of increasing and pressurizing.

  As the timing for removing the pin, the viscosity of the insulating resin sheet is preferably 3000 Pa · s or less. When the pin is pulled out beyond this, the laminated body is partially pulled by the pin, and the position is shifted.

  Moreover, the manufacturing method of the electronic component of this invention heats the said laminated body in the temperature range of 30-150 degreeC, it bonds with the said circuit board with the adhesive force of the said unhardened insulating resin sheet, and pulls out the said pin. Then, the step of integrating the laminate by pressurizing and heat-curing the uncured insulating resin sheet is included.

  In the electronic component manufacturing method of the present invention, at least the circuit board, the uncured insulating resin sheet on which the via-hole conductor is formed, and the circuit board are sequentially laminated by pins through holes for alignment lamination. In doing so, it includes a step of partially temporarily fixing with an adhesive or an adhesive. According to these structures, it is not necessary to pull out the laminating pins on the hot press apparatus, and the equipment can be simplified.

  Specifically, the insulating resin sheet is made of a mixture containing 50% to 75% volume of inorganic filler and a thermosetting resin. According to this configuration, mixing the inorganic filler has an effect of reducing the thermal expansion coefficient of the insulating resin sheet, which is one of the causes of internal stress in the heterogeneous laminated structure. In addition, when the mixing ratio is 75% by volume or more, the amount of liquid is too small with respect to the amount of powder, making it difficult to form a sheet, and when it is 50% by volume or less, the thermal expansion is reduced by mixing the inorganic filler. And the effect of improving heat dissipation is reduced. When the circuit component such as a semiconductor chip is embedded in the insulating resin sheet by pressurization and heating, if the viscosity does not damage the circuit component, the compounding ratio of the inorganic filler is preferably large.

Specifically, the inorganic filler contains at least one inorganic filler selected from Al ₂ O ₃ , SiO ₂ , MgO, BN, and AlN. By using these inorganic fillers, there is an effect that the heat dissipation of the insulating resin sheet is increased and the thermal expansion coefficient is small.

  Specifically, the thermosetting resin contains at least one thermosetting resin selected from an epoxy resin, a phenol resin, and a cyanate resin. A wide variety of these resins are commercially available, and by using these resins, the resin becomes excellent in heat resistance and electrical insulation.

  Specifically, the conductive resin composition includes metal particles including at least one metal selected from gold, silver, copper, and nickel as a conductive component, and includes an epoxy resin as a resin component. The metal has a low electrical resistance, and the epoxy resin is excellent in heat resistance and electrical insulation. In particular, metal particles coated with silver on the surface using copper powder as a core material are suitable because they have both the characteristics of copper powder that has high mechanical strength and is inexpensive and silver powder that is resistant to oxidation and low resistance.

  The hot press device of the present invention is a hot press device having a heating plate on the upper and lower sides, a mechanism in which a pin is housed in one heating plate and jumps out from the surface of the heating plate and slides, It is a heat press apparatus having a hole in a position corresponding to the arrangement and having a mechanism for storing the pin.

  The heat press device of the present invention has a function of capturing temperature rise profile data of a product to be heated under pressure, and a function of changing pressure and sliding the pin at a predetermined temperature of the temperature rise profile data. This is a hot press device. According to this configuration, it is possible to change the viscosity of the insulating resin sheet by temperature management, and to control the pressure and the insertion / extraction of the alignment lamination pins according to the viscosity of the resin. Therefore, the distortion to the ceramic substrate can be reduced and the occurrence of cracks can be prevented.

  According to the present invention, in the manufacturing process of an electronic component composed of an insulating resin layer in which circuit components are embedded between a plurality of circuit substrates including a ceramic substrate, the ceramic substrate is prevented from cracking in a hot press process, Since the addition of equipment in the previous process can be reduced, low-cost electronic components can be provided. Since each layer can be aligned only by using pins, a large device such as a recognition device is not required.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

(First embodiment)
A method for manufacturing an electronic component according to the first embodiment of the present invention will be described with reference to schematic process cross-sectional views in FIGS. 1, 2, and 3 and FIG.

  1 (a), 1 (b), 2 (a) to 2 (c), 3 (a), and 3 (b), 42 is a ceramic substrate, 44 is a circuit component, resistor, capacitor Chip components such as inductors, 43 semiconductor chips or semiconductor packages, 11 resin substrates, 12 wiring patterns, 23 and 65 insulating resin sheets, 22 via-hole conductors, 64 release films, 63 pressing plates, 62 is a cushioning material, 61 is a stacking jig base, 66 is a stacking pin for alignment, and 67 is a reference hole for stacking formed in each constituent material.

  In FIG. 4, 72 is a heater of the heat press device, 74 is a lower surface side heating plate, 75 is a relief hole for collecting the alignment laminated pins, 71 is an upper surface side heating plate, and 73 is the alignment laminated pins removed. The electronic component precursor manufactured by the punching pin, the manufacturing method of the present invention and the hot press apparatus is 81, and the electronic component is 82.

The insulating resin sheets 23 and 65 are made of a mixture containing 50% by volume to 75% by volume of an inorganic filler and a thermosetting resin. Here, the inorganic filler includes at least one inorganic filler selected from Al ₂ O ₃ , SiO ₂ , MgO, BN and AlN, and the thermosetting resin is at least one selected from an epoxy resin, a phenol resin and a cyanate resin. It consists of what contains a thermosetting resin. Furthermore, the conductive resin composition constituting the via-hole conductor 22 includes metal particles including at least one metal selected from gold, silver, copper, and nickel as a conductive component, and includes an epoxy resin as a resin component. Consists of things. Such a configuration is the same in the second embodiment. Here, the size of the via-hole conductor 22 is φ0.18 mm.

  The insulating resin sheet 23 in FIG. 1A has a size of 120 × 120 mm and a thickness that matches the height of the built-in component, and when via holes are formed at positions where the substrates are electrically connected by laser processing or puncher processing. At the same time, the reference hole 67 for stacking for alignment stacking with the circuit board is processed. Next, an insulating resin sheet 21 in which the via-hole conductor 22 is formed is prepared by filling the via hole with a conductive resin paste by printing. Next, the ceramic substrate 41 on which the chip component 44 and the semiconductor chip or the semiconductor package 43 are mounted is prepared on the ceramic substrate 42 in which the reference hole 67 for lamination is formed according to the circuit configuration.

  Next, the alignment lamination pins 66 are set on the lamination jig base 61. The cushion material 62 and the pressing plate 63 are sequentially laminated on the upper portion, and then the uncured insulating resin sheet 23 on which the resin substrate 11 and the via-hole conductor 22 are formed, the ceramic substrate 41 on which the circuit components are mounted, the uncured insulation. The functional resin sheet 65 is laminated, and the release film 64, the pressing plate 63, the cushion material 62, and the lamination jig base 61 are respectively inserted into the alignment lamination pins 66 to be laminated.

  As shown in FIG. 1B, the alignment laminated pin 66 is preferably shorter than the thickness of the laminated structure and positioned at the thickness center of the upper laminated jig base 61. Further, by reducing the clearance between the alignment laminated pin 66 and the reference hole 67 for laminating the resin substrate 11, the insulating resin sheet 21, and the ceramic substrate 41, the wiring pattern 12 on the resin substrate and the wiring pattern on the ceramic substrate are reduced. 45 and the via-hole conductor 22 can be accurately aligned. The cushion material 62 is arranged for the purpose of equalizing the pressure when performing the heat press, and the lamination jig base 61 and the press plate are used to prevent irregularities in the flatness of the heating plate of the hot press machine and variations in the thickness of each member. 63 can absorb.

  In this example, the thickness of each layer is 5 mm for the laminated jig base 61, 2 mm for the cushion material 62, 1 mm for the pressing plate 63, 0.035 mm for the release film 64, an insulating resin sheet, uncured insulation The conductive resin sheet 23 is about 0.6 mm, and the ceramic substrate 42 is 0.5 mm including the chip component 44 and the semiconductor chip or semiconductor package 43 thereon.

  Here, the size of the reference hole 67 for lamination formed in each layer is φ3 mm and tolerance +0.01 to +0.05 for the resin substrate 11, the insulating resin sheet 21, and the ceramic substrate 41. 61, the hole formed in the cushioning material 62 and the pressing plate 63 was set to φ3.5 mm. Further, the alignment laminated pin 66 has a diameter of 3 mm and a tolerance of +0 to −0.05. Further, the length of the alignment laminated pin 66 was 15 mm and a cylinder. The holes formed in the stacking jig base 61, the cushion material 62, and the pressing plate 63 are slightly larger because these materials do not have the via-hole conductor 22 and do not need to be accurately aligned. By making it a little larger, it is easy to pull out the alignment laminated pin 66.

  As shown in FIG. 2A, the laminate is set between the lower surface side heating plate 74 and the upper surface side heating plate of the hot press machine heated to a temperature of 200 ° C., and is pressurized at a pressure of 0.5 MPa. Reference numeral 72 denotes a heater, and the upper surface heating plate 71 is provided with a punch pin 73 for pressing out the alignment laminated pin 66. The lower surface side heating plate 74 is provided with a relief hole 75 when the alignment laminated pin 66 is pushed out. When the laminated insulating resin sheets 23 and 65 rise to a predetermined temperature, they are melted to lower the viscosity and embed circuit components.

  2 (a) to 2 (c) show that when the viscosity of the insulating resin sheet becomes 3000 Pa · s or less, the punch pin 73 is lowered and the alignment laminated pin 66 is punched, punched, punched, and heated on the lower surface side. The state where the punch pin 73 is raised and returned to the original position after being accommodated in the escape hole 75 of the plate is illustrated. In this state, the pressure is increased to 3 MPa, and the insulating resin sheet is thermoset to be integrated with the resin substrate 11 and the ceramic substrate 41. As a result, the insulating resin sheet 23 is melted and low-pressure hot pressing is performed in a low viscosity state, so that the substrate can be welded with a small amount of distortion in the vicinity of the lamination holes. Here, in a low-viscosity state, it is in a state where adhesiveness is exhibited. Then, the insulating resin sheet can be cured without removing the distortion from the ceramic substrate by removing the alignment laminated pin 66 and performing hot pressing at a high pressure.

  If the alignment multi-layer pin 66 is not removed until hot pressing at a high pressure, the alignment multi-layer pin 66 is bonded to each layer and cannot be pulled out, and cracking of the ceramic substrate occurs due to thermal strain. Conversely, if the layers are removed before the low-pressure hot press, the layers will be displaced.

  FIG. 4 is a diagram showing a control image of the hot press apparatus used in the description of the present embodiment. First, the temperature rise profile (a) of the insulating resin sheet is measured in advance by hot press of the simulated laminate, and data is input to the hot press apparatus. Next, the viscosity characteristic (b) of the insulating resin sheet is measured with, for example, a rheometer, which is a viscometer, at a temperature increase rate close to a temperature increase profile in a hot press. When heat is applied to the uncured insulating resin sheet, the viscosity rapidly decreases, and then curing proceeds as the temperature rises. The insulating resin sheet used in the present embodiment has the lowest viscosity in the range of 80 to 120 ° C., and curing is completed in about 20 minutes at 200 ° C. From the correlation between the viscosity characteristics of the insulating resin sheet and the temperature rise profile, the temperature and viscosity of the insulating resin sheet are estimated with the passage of time of hot pressing, and the viscosity is the lowest when the laminated pin is pulled out at 3000 Pa · s or less. Control to shift the pressure to the high pressure side at the same timing.

  Preferably, the temperature rise profile is measured for each hot press by means such as contacting a thermocouple from the side surface of the laminate, and control is performed in real time. In addition, the timing for removing the alignment pin or switching to the high-pressure press is not limited to this embodiment, and the resin viscosity considering the shape of the embedded component and the clearance accuracy between the hole and the alignment pin You may decide by.

  FIG. 3A shows a precursor 81 of an electronic component that has been hot-pressed. A desired circuit component is incorporated as shown in FIG. 3B by dividing into modules by dicing. The electronic component 82 can be obtained.

  In the description, the ceramic substrate and the resin substrate are bonded with an insulating resin sheet to embed the circuit component, but the present invention is also useful in a configuration in which the ceramic substrates are bonded together.

(Second Embodiment)
A method for manufacturing an electronic component according to a second embodiment of the present invention will be described with reference to FIGS. 1A and 1B and schematic process cross-sectional views of FIGS. 5A to 5C. I will explain. Each component is the same as in the first embodiment.

  In FIG. 1A, alignment lamination pins 66 are set on the lamination jig base 61. On top of that, a cushion material 62, a pressing plate 63, a resin substrate 11, an uncured insulating resin sheet 23 on which via-hole conductors 22 are formed, and a ceramic substrate 41 on which circuit components are mounted are laminated and heated at 80 ° C. After the insulating resin sheet 23 is once softened and adhered to the resin substrate 11 and the ceramic substrate 41, the uncured insulating resin sheet 65, the release film 64, the pressing plate 63, the cushion material 62, The lamination jig base 61 is inserted into the alignment lamination pins 66 and laminated. The heating method is preferably vacuum lamination. Further, instead of the vacuum lamination in the middle of the lamination, all the constituent materials may be laminated and the atmosphere may be heated in a drying furnace.

  As shown in FIG. 1B, the resin substrate 11 and the conductive resin sheet 21 on which the via-hole conductors 22 are formed and the ceramic substrate 41 on which circuit components are mounted are laminated in a welded state. Next, in this state, the alignment laminated pins 66 are pulled out, set in a hot press machine as shown in FIG. 5A, and heated and pressed to cure the insulating resin sheet without distorting the ceramic substrate. be able to. The subsequent steps are the same as those in the first embodiment, and correspond to FIGS. 3A and 3B, and are as shown in FIGS. 5B and 5C.

  Preferably, pressurization is performed at 0.5 MPa as described in the first embodiment, and when the viscosity of the insulating resin sheet 23 becomes 3000 Pa · s or less, the pressure is increased to 3 MPa to heat the insulating resin sheet. The resin substrate 11 and the ceramic substrate 41 are integrated by curing. The temporary fixing between the resin substrate, the insulating resin sheet, and the ceramic substrate is performed by heating and welding the insulating resin sheet. However, the temporary bonding may be performed by applying an adhesive when laminating. .

  In the second embodiment, it is necessary to perform temporary fixing before hot pressing. However, since the alignment laminated pins can be easily removed before hot pressing, there is an advantage that the mechanism of the hot pressing machine is not complicated.

  As described above, the electronic component manufacturing method and the heat press apparatus of the present invention estimate the resin viscosity from the temperature rising profile when laminating the ceramic substrate and the dissimilar material of the resin material and integrating them by pressurization and heating. By inserting / extracting the laminated pin for viscosity alignment and performing high-pressure press control from a low pressure, it is possible to provide a method for manufacturing an electronic component in which the ceramic substrate is not distorted and does not crack.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS. Each component is the same as in the first embodiment. This embodiment relates to the relationship between the reference hole 67 and the alignment laminated pin 66. Those not displayed are the same as in the above embodiment.

  Fig.6 (a) is sectional drawing of a laminated body. Reference numeral 2 denotes a reference hole provided in the ceramic substrate. FIG. 6B and FIG. 6C are cross-sectional views of the ceramic substrate 42 in the laminated body laminated in the first embodiment using the alignment laminated pins 66. FIG. 6B is a diagram at the time of lamination, and FIG. 6C is a diagram in which the laminated pin 66 for alignment is removed after heating and low-pressure hot pressing.

  In this case, since the reference hole 2 provided in the ceramic substrate is enlarged, the alignment laminated pin 66 can be pulled out even if the insulating resin sheet 65 and the laminated jig base 61 are extended by heat. Prior to the heat treatment, the reference hole 67 is positioned inside the reference hole 2 provided in the ceramic substrate. By the heat treatment, the insulating resin sheet 65 and the lamination jig base 61 are extended and moved to the center, and the alignment lamination pins 66 come off.

  Fig.7 (a) is sectional drawing of a laminated body. Reference numeral 2 denotes a reference hole provided in the ceramic substrate. FIG. 7B and FIG. 7C are cross-sectional views at the ceramic substrate 42 in the laminated body laminated in the first embodiment using the alignment laminated pins 66.

  The difference from FIG. 6 is that the reference hole 2 provided in the ceramic substrate is enlarged only in one direction and is enlarged only in one direction. As for the other, the reference hole and the laminated pin for alignment coincide.

  In this case, the right hole is used as a reference. The effect is that the direction of shifting can be specified in addition to the effect of FIG. For example, by using as a reference the more arrangements that require positional accuracy, a laminated substrate with less positional deviation can be obtained.

  FIGS. 8 (a) and 8 (b) correspond to FIGS. 7 (b) and 7 (c), and the reference hole 2 provided in the ceramic substrate is enlarged so that there is relief in both. It can be seen that the film expands in both directions due to thermal expansion. The effect is high when positional accuracy is required at the center of the multilayer substrate. At the time of lamination, the pins are disposed on the inner surface of the reference hole.

  Fig.9 (a) is sectional drawing of a laminated body. Reference numeral 2 denotes a reference hole provided in the ceramic substrate. FIG. 9B and FIG. 9C are cross-sectional views at the ceramic substrate 42 in the laminated body laminated in the first embodiment using the alignment laminated pins 66. FIG. 9B is a diagram at the time of lamination, and FIG. 9C is a diagram in which the laminated pin 66 for alignment is removed after heating and after low-pressure hot pressing.

  Here, the difference from FIG. 6 is that the reference hole 2 provided in the ceramic substrate is similarly formed up to the ceramic substrate 42, the insulating resin sheet 23, and the insulating resin sheet 65, and the reference hole 67 larger than the hole is That is, the stacking jig base 61, the cushion material 62, and the pressing plate 63 are formed. From this, even if it expands by heat treatment, the relationship between the ceramic substrate 42, the insulating resin sheet 23, and the insulating resin sheet 65 that require alignment accuracy does not deviate, and the lamination jig base 61 that does not require much positional accuracy, It shifts between the cushion material 62 and the pressing plate 63. As a result, from FIG. 9B to FIG. 9C, the alignment laminated pin 66 can be taken out.

  That is, the reference hole in the layer around the ceramic substrate that requires the positional accuracy of the inner layer is the same as the pin, and the other upper and lower layers have larger reference holes.

  Note that the materials and numbers in Embodiments 1, 2, and 3 are examples, and the present invention is not limited to these.

  INDUSTRIAL APPLICABILITY The present invention is useful when manufacturing a high-quality electronic component that does not crack when a heterogeneous laminated structure including a ceramic substrate is hot-pressed.

(A), (b) Process sectional drawing which shows the manufacturing method of the electronic component in the 1st Embodiment of this invention (A)-(c) Process sectional drawing which shows the manufacturing method of the electronic component in the 1st Embodiment of this invention (A), (b) Process sectional drawing which shows the manufacturing method of the electronic component in the 1st Embodiment of this invention Control timing chart of hot press apparatus in first embodiment of the present invention (A)-(c) Process sectional drawing which shows the manufacturing method of the electronic component in the 2nd Embodiment of this invention. (A)-(c) Sectional drawing of the electronic component in the 3rd Embodiment of this invention. (A)-(c) Sectional drawing of the electronic component in the 3rd Embodiment of this invention. (A), (b) Sectional drawing of the electronic component in the 3rd Embodiment of this invention (A), (b) Sectional drawing of the electronic component in the 3rd Embodiment of this invention (A)-(d) Process sectional drawing which shows the manufacturing method of the conventional electronic component (A)-(d) Process sectional drawing which shows the manufacturing method of the conventional electronic component

Explanation of symbols

11, 101 Resin substrate 12, 102 Wiring pattern 22, 202 Via hole conductor 23, 65, 203, 605 Insulating resin sheet 42, 402 Ceramic substrate 43, 403 Semiconductor chip or semiconductor package 44, 404 Chip component 45 Wiring pattern 61, 601 Lamination jig base 62, 602 Cushion material 63, 603 Holding plate 64, 604 Release film 66 Lamination pin for alignment 67 Reference hole 71 Upper surface side heating plate 72, 702 Heater 73 Removal pin 74 Lower surface side heating plate 75 Escape hole 103 Lamination Alignment mark 204 Via-hole conductor 406 Laminated alignment mark 701 Heating plate

Claims (12)

An insulating resin layer between a plurality of circuit boards including a ceramic substrate; a via hole conductor formed by embedding a circuit component in the insulating resin layer and filling a conductive resin composition; and In a method of manufacturing an electronic component configured to obtain an electrical connection between circuit boards,
Preparing a plurality of circuit boards including at least a ceramic substrate having holes for alignment lamination; and
Forming a via-hole conductor formed by filling a conductive resin composition on an uncured insulating resin sheet having holes for alignment lamination; and
By laminating at least the circuit board, the uncured insulating resin sheet on which the via-hole conductor is formed, and the circuit board with pins through the holes for alignment lamination, the wiring pattern of the circuit board and Aligning the via-hole conductor;
The manufacturing method of an electronic component including the process of extracting the said pin of the laminated | stacked laminated body, pressurizing and heating, and integrating the said laminated body by thermosetting the said non-hardened insulating resin sheet. The method of manufacturing an electronic component according to claim 1, further comprising a step of mounting a circuit component on a wiring pattern on at least one main surface of the plurality of circuit boards. After the laminate is pressurized and heated in a pressure range of 0 to 2 MPa, the pin is pulled out and pressurized and heated in a pressure range of 1 to 10 MPa to thermally cure the uncured insulating resin sheet. The method for manufacturing an electronic component according to claim 1, wherein the laminate is integrated. The laminate is integrated by heating the laminate and heating the uncured insulating resin sheet after the pins are pulled out when the insulating resin sheet has a viscosity of 3000 Pa · s or less. The method of manufacturing an electronic component according to claim 1 or 2, wherein: The laminated body is heated in a temperature range of 30 to 150 ° C., bonded to the circuit board by the adhesive force of the uncured insulating resin sheet, and after the pins are removed, the uncured insulating resin sheet The method of manufacturing an electronic component according to claim 1, wherein the laminate is integrated by pressurizing and thermosetting the substrate. When the circuit board, the uncured insulating resin sheet on which the via-hole conductors are formed, and the circuit board are sequentially laminated by a pin through holes for alignment lamination, an adhesive or an adhesive is partially laminated. 6. The method of manufacturing an electronic component according to claim 1, wherein temporary fixing is performed with a material. The method for manufacturing an electronic component according to claim 1, wherein the insulating resin sheet is made of a mixture containing 50% to 75% volume of an inorganic filler and a thermosetting resin. Wherein the inorganic filler _{is, Al 2 O 3, SiO 2} , MgO, at least one method of manufacturing an electronic component according to claim 7, characterized in that it comprises an inorganic filler selected from BN and AlN. 10. The method of manufacturing an electronic component according to claim 1, wherein the thermosetting resin contains at least one thermosetting resin selected from an epoxy resin, a phenol resin, and a cyanate resin. The conductive resin composition contains metal particles containing at least one metal selected from gold, silver, copper, and nickel as a conductive component, and contains an epoxy resin as a resin component. The manufacturing method of the electronic component of 1 thru | or 9. In a hot press apparatus having a heating plate on the top and bottom, a mechanism for storing pins on one heating plate and projecting and sliding from the heating plate surface;
The other heating plate has a hole at a position corresponding to the pin arrangement, and has a mechanism for storing the pin. A function that can capture temperature rise profile data of products that are heated under pressure,
12. The hot press apparatus according to claim 11, further comprising a function of changing pressure and sliding the pin at a predetermined temperature of the temperature rise profile data.

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