KR102213349B1 - Fpcb manufacturing method using roll lamination method - Google Patents

Abstract

The present invention relates to a method of manufacturing an FPCB by using a roll lamination scheme, including: a cleaning step of cleaning a surface of a raw material; a dry film lamination step of bonding a dry film to the raw material; an exposure step of curing the dry film positioned on a circuit portion; a development step of peeling an uncured portion of the dry film; an etching step of etching an exposed copper portion of the raw material; a peeling step of removing the cured dry film; preparing a base produced through the cleaning step to the peeling step in a form of a roll; preparing a coverlay in a form of a roll; preparing a release film in a form of a roll; and a coverlay roll lamination step of allow an end of the roll-shaped base, an end of the roll-shaped coverlay, and an end of the roll-shaped release film to sequentially pass between a pair of rollers including an inner core and an outer shell surrounding the inner core to make contact with the pair of rollers. Accordingly, a working time is shortened, and a cost is reduced.

Description

FPCB manufacturing method using roll lamination method {FPCB MANUFACTURING METHOD USING ROLL LAMINATION METHOD}

The present invention relates to an FPCB manufacturing method using a roll lamination method, and more specifically, a release film, a coverlay, and a base are manufactured in a roll form, and the coverlay and the base are passed through so as to sequentially contact between a pair of rollers. It is characterized by laminating. For this reason, by omitting the process of attaching coverlays and laminating subsidiary materials in the conventional FPCB manufacturing process, it is possible to shorten work time and reduce costs, and to manufacture FPCBs of various sizes that are not restricted by size, and a release film is inserted, The inner core in the form of a heating element and the roller with the outer skin surrounding the inner core are pressed and heated to minimize damage to the coverlay during the lamination process.

With the recent development of electronic component technology, a flexible flat cable (hereinafter, referred to as'FFC') has been used in various fields to reduce the weight and volume of products and free wiring.

FFC is manufactured through a process in which conductors are arranged at regular intervals between the top and bottom of the insulating film and laminated with instantaneous heat and pressure. However, the width and thickness of the applicable conductors are limited, and only straight wires are possible. Due to such a low degree of freedom in circuit design, there is a disadvantage that it is difficult to expand to various application fields.

In order to overcome the limitations of the conventional FFC, recently, a flexible printed circuit board (hereinafter referred to as'FPCB') has been developed. Since it has the flexible characteristics of FFC and forms a circuit pattern through an etching process, it has a higher degree of freedom in circuit design than FFC, and has the advantage of being able to cope with the line width of narrow microcircuits, which is expanding to various application fields.

Hereinafter, a conventional manufacturing process of the above-described FPCB will be described with reference to FIGS. 1 to 3.

1 shows the manufacturing process of a conventional FPCB, FIG. 2 shows the configuration of raw materials of the conventional FPCB, and FIG. 3 shows a hot press process through layup of subsidiary materials of the conventional FPCB.

First, a cleaning step (S10) of cleaning the surface of the raw material 10 is performed. Here, the raw material 10 is formed by sequentially stacking a copper layer 11, a raw material adhesive layer 12, and an insulating film layer 13 as shown in FIG. 2. In this case, the insulating film layer 13 is generally a polyimide film (hereinafter referred to as a “PI film”).

Next, a dry film lamination step (S20) of bonding the dry film to the raw material 10 and an exposure step (S30) of curing the dry film positioned at a portion to be formed in a circuit are performed. This is an operation for forming a circuit, and a detailed description thereof will be omitted because it is a well-known technique.

Next, a developing step of peeling off the uncured portion of the dry film (S40), a corrosion step of etching the copper portion of the exposed raw material 10 (S50), and a peeling step (S60) of removing the cured dry film. It's rough. The so-called'D (Developing). E (Etching). It is also called'S (Striping) stage'. For this reason, the raw material 10 is formed as the base 20.

Next, referring to FIG. 3, through the step (S80) and the press machine (1) of temporarily attaching the coverlay 30 on the base 20 (S70), and laying up the subsidiary material 40 (S80). It goes through the step (S90) of hot pressing. At this time, the coverlay 30 is a configuration in which the PI film 31 and the coverlay adhesive layer 32 are sequentially stacked. Through this, it is possible to manufacture the FPCB by bonding the base 20 and the coverlay 30.

In the conventional coverlay temporary folding, in general, the open point is aligned and the temporary welding is performed with an iron. In addition, the laminated subsidiary material 40 is made of Kraft paper, Sus plate, PVC, or the like.

This conventional coverlay bonding method has the following problems. Since manual work is reflected, it is difficult to manufacture FPCBs with a size larger than a certain area. In addition, the process of stacking and removing subsidiary materials takes a lot of time, and thus there is a problem in that work efficiency is deteriorated. In addition, there is a problem in that the cost burden for the provision of a large amount of laminated subsidiary materials increases.

Korean Patent Application Publication No. 10-2015-0030684

The present invention relates to an FPCB manufacturing method using a roll lamination method, and more specifically, a release film, a coverlay, and a base are manufactured in a roll form, and the coverlay and the base are passed through so as to sequentially contact between a pair of rollers. It is characterized by laminating. For this reason, by omitting the process of attaching coverlays and laminating subsidiary materials in the conventional FPCB manufacturing process, it is possible to shorten work time and reduce costs, and to manufacture FPCBs of various sizes that are not restricted by size, and a release film is inserted, The inner core in the form of a heating element and the roller with the outer skin surrounding the inner core are pressed and heated to minimize damage to the coverlay during the lamination process.

In order to achieve the above object, the FPCB manufacturing method using the roll lamination method according to the present invention includes a cleaning step of washing the surface of the raw material; A dry film lamination step of bonding a dry film to the raw material; An exposure step of curing the dry film positioned on the circuit formation portion; A developing step of peeling off the uncured portion of the dry film; A corrosion step of etching the exposed copper portion of the raw material; A peeling step of removing the cured dry film; Manufacturing a base completed through the cleaning step to the peeling step in a roll form; Manufacturing a coverlay in a roll form; Manufacturing a release film in a roll form; And a cover passing through the end of the roll-shaped base, the end of the roll-shaped coverlay, and the end of the roll-shaped release film to sequentially contact between a pair of rollers formed of an inner core and an outer shell surrounding the inner core. Including; lay roll lamination step, wherein the shell is a silicone cover.

In addition, as the raw material of the FPCB manufacturing method using the roll lamination method according to the present invention, copper, raw material adhesive, and raw material film are sequentially laminated.

In addition, in the coverlay of the FPCB manufacturing method using the roll lamination method according to the present invention, a coverlay film and a coverlay adhesive layer are sequentially laminated.

In addition, the roller of the FPCB manufacturing method using the roll lamination method according to the present invention applies heat to the base, the coverlay, and the release film to bond the base and the coverlay to each other.

In addition, the roller of the FPCB manufacturing method using the roll lamination method according to the present invention applies pressure to the base, the coverlay, and the release film to bond the base and the coverlay.

In addition, the coverlay film of the FPCB manufacturing method using the roll lamination method according to the present invention is a PI film.

In addition, the raw material film of the FPCB manufacturing method using the roll lamination method according to the present invention is an insulating film.

In addition, the raw material film of the FPCB manufacturing method using the roll lamination method according to the present invention is a PI film.

In addition, the rollers of the FPCB manufacturing method using the roll lamination method according to the present invention rotate in opposite directions to each other.

In addition, the roller of the FPCB manufacturing method using the roll lamination method according to the present invention rotates at the same speed.

In addition, the inner core of the FPCB manufacturing method using the roll lamination method according to the present invention is a cylindrical heating element.

According to the present invention, instead of the FPCB process in which the coverlay is laminated to the base through the conventional coverlay attachment, subsidiary material layup, and hot press, the above process is omitted and the coverlay and the base are manufactured in a roll form to form a pair of rollers. Since the coverlay and the base are laminated by passing through the gap, the cost for not using subsidiary materials is reduced, the manufacturing time is shortened due to the need for a joining process, and the application field is expanded because there is no size limitation, and facilities such as hot presses The initial cost of equipment construction is low because there is no need to build the equipment, and the release film is inserted, and the inner core in the form of a heating element and the roller with the outer shell surrounding the inner core are pressed and heated to minimize damage to the coverlay during the lamination process. have.

1 shows the manufacturing process of a conventional FPCB.
Figure 2 shows the configuration of the raw material of the conventional FPCB.
3 shows a hot press process through lay-up of subsidiary materials of a conventional FPCB.
Figure 4 shows the manufacturing process of the FPCB according to the present invention.
5 is a schematic diagram of a coverlay roll lamination step in the FPCB manufacturing method using the roll lamination method according to the present invention.
6 shows a state in which a base, a coverlay, and a release film are sequentially stacked in the FPCB manufacturing method using the roll lamination method according to the present invention.
7 shows a configuration of a coverlay of the FPCB manufacturing method using the roll lamination method according to the present invention.
8 is a cross-sectional view of a roller of the FPCB manufacturing method using the roll lamination method according to the present invention.
9 is a result of measuring the storage elasticity (Strage modulus) of the coverlay adhesive layer according to an embodiment of the present invention.
10 is a photograph of the result that the coverlay adhesive layer is not filled in the etched copper copper foil when the coverlay is laminated when manufacturing the FPCB according to an embodiment of the present invention.
11 is a photograph of a result of filling an etched copper copper foil with a coverlay adhesive layer when the coverlay is laminated when manufacturing an FPCB according to an embodiment of the present invention.
12 is a reflow temperature condition table according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein.

Figure 4 shows the manufacturing process of the FPCB according to the present invention. Hereinafter, a method of manufacturing an FPCB using a roll lamination method according to the present invention will be described with reference to FIG. 4.

As described above, the FPCB manufacturing method using the roll lamination method according to the present invention also includes a cleaning step (S100), a dry film lamination step (S200), an exposure step (S300), a developing step (S400), a corrosion step (S500), and The base 200 is manufactured through the peeling step (S600). This has been described in detail in the prior art, and a detailed description thereof will be omitted to prevent redundant description.

At this time, the raw material 100 is sequentially laminated into a copper layer, a raw material adhesive layer, and a raw material film layer, and the raw material film layer is preferably an insulating film, and also a PI film.

5 is a schematic diagram of a coverlay roll lamination step in the FPCB manufacturing method using the roll lamination method according to the present invention. Hereinafter, a coverlay roll lamination step (S700) will be described with reference to FIG. 5.

First, before the roll lamination step (S700), after forming the base 200, a step of manufacturing the base 200 in a roll form is performed. At this time, it is preferable that the base 200 is wound around the base winding roller 2200, and when the base winding roller 2200 is rotated, the base 200 wound around the base winding roller 2200 is released as shown in FIG. It is desirable to be able to move in the longitudinal direction.

In addition, a step of manufacturing the coverlay 300 in a roll shape is performed. At this time, it is preferable that the coverlay 300 is also wound around the coverlay winding roller 2100, and when the coverlay winding roller 2100 rotates, the coverlay 300 wound around the coverlay winding roller 2100 is pulled. While it is desirable to be able to move in the longitudinal direction as shown in FIG.

In addition, it undergoes a step of manufacturing the release film 400 in a roll form. At this time, the release film 400 is also preferably wound on the release film take-up roller 2300, and when the release film take-up roller 2300 rotates, the release film 400 wound on the release film take-up roller 2300 is pulled While being able to move in the longitudinal direction as shown in FIG.

Accordingly, the release film 400, the coverlay 300, and the base 200 are sequentially positioned from the top to the bottom.

For convenience of explanation, the release film winding roller 2300, the base winding roller 2200, and the coverlay winding roller 2100 are referred to as a pair of winding rollers 2000.

At this time, as shown in FIG. 5, the base winding roller 2200 and the coverlay winding roller 2100 are preferably rotated in opposite directions, and thus, the wound base 200 and the coverlay 300 are in the longitudinal direction. You can move in the same direction. Referring to FIG. 5, the base 200 and the coverlay 300 are simultaneously moved in the left direction.

In addition, the release film winding roller 2300 and the coverlay winding roller 2100 are preferably rotated in the same direction, and for this reason, the rolled release film 400 and the coverlay 300 are in the same direction among the lengthwise directions. You can move. Referring to FIG. 5, the release film 400 and the coverlay 300 are simultaneously moved in the left direction.

A release film is a type of film used for product protection. It is characterized by easy peeling when using the product. According to the present invention, the release film 400 is inserted between the coverlay roller 1100 and the coverlay 300, rather than the coverlay roller 1100 directly in contact with the coverlay 300. Accordingly, damage to the coverlay 300 by the coverlay roller 1100 can be minimized, thereby increasing product completion. In addition, in the present invention, since the release film is in the form of a roll, the release film 400 is released on the surface of the coverlay 300 while the release film 400 is released in a roll form rather than a method of inserting the release films one by one in the laminating process. Since this is located, there is an advantage of increasing work efficiency and precision.

At this time, it is preferable that the release film 400 according to the present invention is formed in a multi-layer structure.

The release film is formed in a multi-layered structure, more specifically, the first release film; Cushion film; And the second release film may be stacked in order. When manufacturing the FPCB, one side of the first release film is in contact with the coverlay, and the other side is laminated with a cushion film. If only a simple release film is used in a roll lamination or quick press process, a problem of pattern unfilling may occur.

In the case of the hot press method, the press time is long, so the thickness and material of the film do not significantly affect the filling property.However, in the case of the roll lamination method or the quick press method, the process time is shorter than the hot press method, so that the coverlay adhesive is used between patterns. There is a problem that is difficult to fill. In order to prevent this problem, unlike the hot press method, a multilayered release film may be used to prevent the problem of unfilled patterns.

The first release film and the second release film may be selected from the group consisting of a polymethylpentene film, a modified polybutylene terephthalate film, and a polypropylene film. The cushion film may be selected from the group consisting of a polyvinyl chloride film, a polybutylene terephthalate/polyethylene film, and a polypropylene film. The first release film, the cushion film, and the second release film are not limited to the listed example films, and all can be used without limitation as long as the filling property of the pattern can be increased by a roll lamination method or a quick press method.

The release film of the present invention is formed in a multilayer structure in order to improve the filling property of the pattern, and the first release film; The cushion film and the second release film may be formed in a thickness ratio of 0.5:1:0.5 to 2:1:1. When manufacturing within the above range, it is possible to prevent the occurrence of the problem of unfilling of the pattern in the roll lamination method or the quick press method, and if it is less than the above range, the thickness of the cushion film is too thin, or the first release film and the second release film If the thickness of the release film is too thin, the effect of the formation of the release film as a multilayer structure may be insufficient, resulting in a problem of unfilling of the pattern, and damage to the coverlay may occur. In addition, when the value exceeds the above range, the pressure and temperature transmitted to the coverlay may be lowered through the release film, so that the pattern may not be filled.

When the base 200 and the coverlay 300 are laminated by a pair of rollers 1000, the release film 400 is then removed.

7 shows the configuration of the coverlay of the FPCB manufacturing method using the roll lamination method according to the present invention. Hereinafter, the configuration of the coverlay will be described with reference to FIG. 7.

In the coverlay 300 according to the present invention, it is preferable that a coverlay film 310 and a coverlay adhesive layer 320 (or coverlay adhesive) are sequentially laminated. In this case, the coverlay film 310 is preferably a PI film, for example.

The coverlay adhesive layer is formed using an adhesive composition for a coverlay, and can be formed without limitation using a known method capable of forming an adhesive layer on one side of the coverlay film. Any manufacturing method capable of forming an adhesive layer having a predetermined thickness or more may be used without limitation.

The adhesive composition for the coverlay is an epoxy resin; Rubber resin; Thermoplastic resin; Hardener; Inorganic particles; And containing a flame retardant, based on 100 parts by weight of the epoxy resin, 50 to 80 parts by weight of a rubber resin; 3 to 10 parts by weight of a thermoplastic resin; 8 to 15 parts by weight of a curing agent; 30 to 60 parts by weight of inorganic particles; And 50 to 80 parts by weight of a flame retardant.

The adhesive composition may further include an inner curing agent, and in this case, it may be included in an amount of 0.01 to 0.1 parts by weight based on 100 parts by weight of the epoxy resin.

When manufacturing an adhesive using the adhesive composition, an epoxy resin; Rubber resin; Thermoplastic resin; Hardener; It can be prepared by mixing inorganic particles and flame retardant with a solvent, and the solvent is selected from the group consisting of methyl ethyl ketone (MEK), toluene, and mixtures thereof, preferably a mixed solvent of methyl ethyl ketone and toluene can be used. .

Preferably, the adhesive composition for the coverlay is based on 100 parts by weight of the epoxy resin, 50 to 80 parts by weight of a rubber resin; 3 to 10 parts by weight of a thermoplastic resin; 8 to 15 parts by weight of a curing agent; 30 to 60 parts by weight of inorganic particles; 50 to 80 parts by weight of a flame retardant; It may contain 0.01 to 0.1 parts by weight of the fast curing agent and 500 to 600 parts by weight of the solvent.

The epoxy resin is a bisphenol A type epoxy resin having an epoxy equivalent (EEW, g/eq) of 184 to 190 and an epoxy equivalent of 450 to 500 (EEW, g/eq) of a bisphenol A type epoxy resin of 1:3 to 1:7. It can be used by mixing in a molar ratio of, preferably 1:5, but is not limited to the above example. When mixed within the above range, it moves between a pair of rollers, and flowability increases under conditions of instantaneous high-temperature and high-pressure provision to improve the filling of FPCB, and also at room temperature when an adhesive layer is formed on one side of the coverlay film. It is easily cured to facilitate formation into an adhesive layer.

The phenoxy resin may be additionally included in the epoxy resin. The phenoxy resin has a softening point and a glass transition temperature (Tg) in the range of 0°C to 200°C as a resin exhibiting fluidity while controlling the curing rate, and the weight average molecular weight is preferably in the range of 10,000 to 1,000,000. Do. When the phenoxy resin has a softening point and a weight average molecular weight within the above range, it maintains a solid state at room temperature to reduce adhesion to the coverlay film during processing, thereby facilitating storage on the take-up roller, and flowability at high temperature. By giving it, the filling property can be improved. The phenoxy resin may be included in an amount of 80 to 100 parts by weight based on 100 parts by weight of the epoxy resin, and it is possible to exhibit fluidity while controlling the curing rate within the above range value, and maintain a solid state at room temperature to prevent the coverlay film and It is possible to facilitate storage in the take-up roller by reducing the adhesive force of and improve the filling property by imparting flowability at a high temperature.

The rubber resin is nitrile-butadiene rubber, butadiene rubber, styrene-butadiene rubber, hydrogenated nitrile-butadiene rubber, carboxy-terminated liquid It may be selected from the group consisting of butadiene-acrylonitrile rubber (Carboxyl terminated butadiene acrylonitrile) and mixtures thereof, and is preferably carboxylated NBR with xNBR, but is not limited to the above examples.

The xNBR has almost the unique characteristics of NBR, and additionally has high tear resistance, abrasion resistance, tensile strength, and modulus.

Although a small amount of the thermoplastic resin is included, when used within the above range, flowability is increased by instantaneous heat and pressure, and due to this flowability, the filling property of the etched copper copper foil can be improved. Preferably, the thermoplastic resin is a polyester resin having a glass transition temperature (Tg) of 20 to 100°C, but is not limited to the above example, and when used in the adhesive composition for a coverlay of the present invention, flowability due to instantaneous heat and pressure If it can be improved, all can be used without limitation.

The curing agent may be selected from the group consisting of an amine-based curing agent, a phenol-based curing agent, an imidazole-based curing agent, and a mixture thereof. Preferably, the curing agent may be used by mixing 3,3'-diaminodiphenylsulfone and 2-undecylimidazole, but is not limited to the above examples.

The main feature of the present invention is to use a fast curing agent, rather than using a passing agent alone.

The coverlay adhesive composition used in the hot press method does not cause problems due to sufficient curing even if only a curing agent is used, but in the case of the roll lamination method, some curing occurs when passing through a pair of rollers, followed by hot air drying. It is characterized in that it further includes an inner curing agent to enable rapid curing so as not to cause a lifting phenomenon in the process (baking process). The fast curing agent is a modified alicyclic amine (Cycloaliphatic modified amine)-based curing agent.

The inner curing agent is also included in a small amount like a thermoplastic resin, but when used within the above range, the filling property is increased by causing some curing in the roll lamination process, and then rapid curing in the hot air drying process can be promoted to prevent the lifting phenomenon. have. If the value is less than the above range, a lifting phenomenon may occur during the hot air drying process, and if the value exceeds the range, curing proceeds before sufficient filling occurs during the roll lamination process, resulting in a problem of unfilling.

When the inorganic particles and the flame retardant are included within the above range, lead heat resistance may be increased, and a lifting phenomenon after evaluation in a reflow process may be prevented.

The inorganic particles may be selected from the group consisting of titanium dioxide, talc, aluminum hydroxide trihydroxide, alumina, magnesium hydroxide, and mixtures thereof, preferably aluminum hydroxide and titanium dioxide, but are not limited to the above examples. Does not.

The flame retardant is selected from the group consisting of a phosphorus-based flame retardant, a nitrogen-based flame retardant, an inorganic flame retardant and a mixture thereof, and a phosphorus-based flame retardant, preferably, a particulate phosphorus-based flame retardant and a resin-type phosphorus-based flame retardant are used.

As described above, the inorganic particles may include aluminum hydroxide and titanium dioxide, and the flame retardant includes a phosphorus-based flame retardant, a particulate phosphorus-based flame retardant and a resin-type phosphorus-based flame retardant to increase lead heat resistance, and is lifted after evaluation in the reflow process. The phenomenon can be prevented from occurring.

The manufacturing apparatus used in the FPCB manufacturing method using the roll lamination method according to the present invention includes a pair of rollers 1000. 5, the end of the roll-shaped base 200, the end of the roll-shaped coverlay 300, and the end of the roll-shaped release film 400 penetrate between a pair of rollers 1000. .

At this time, the end of the roll-shaped base 200, the end of the roll-shaped coverlay 300, and the end of the roll-shaped release film 400 penetrate between the pair of rollers 1000 and at the same time The roller 1000 presses the lower surface of the base 200 and the upper surface of the release film 400 to form a structure in which the base 200 and the coverlay 300 come into contact with each other.

To explain in more detail, the base roller 1200 presses the base 200 in the direction in which the coverlay 300 is positioned while rotating and moves the base 200 in the longitudinal direction, and the coverlay roller 1100 While rotating, the coverlay 300 and the release film 400 are pressed in the direction in which the base 200 is located, and the coverlay 300 and the release film 400 are moved in the longitudinal direction.

Accordingly, the pair of rollers 1000 is pressed in a state in which the base 200, the coverlay 300 and the release film 400 are sequentially in contact, and the base 200 and the coverlay 300 are laminated in the longitudinal direction. And it is possible to move the release film 400. This process is referred to as a coverlay roll lamination step (S700) in the present invention.

At this time, in the pair of rollers 1000, the base roller 1200 and the coverlay roller 1100 are preferably rotated in opposite directions. Based on FIG. 5, the base roller 1200 rotates in a counterclockwise direction (CCW), and the coverlay roller 1100 rotates in a clockwise direction (CW). Due to this, the laminated base 200 and the coverlay 300 and the release film 400 can be moved in the longitudinal direction.

In addition, it is preferable that heat is generated from the pair of rollers 1000 to melt the coverlay adhesive layer 320 of the coverlay 300 so that the coverlay 300 and the base 200 are laminated. For this reason, it is possible to easily laminate the coverlay 300 and the base 200 without a conventional temporary welding and hot pressing process.

At this time, preferably, the pair of rollers 1000 is preferably composed of an inner core 1110 and an outer shell 1120 surrounding the inner core 1110. Refer to FIG. 8 to describe this. 8 is a cross-sectional view of a coverlay roller among a pair of rollers according to the present invention. Although the configuration of the coverlay roller is disclosed in FIG. 8, it is preferable that the base roller also has the same structure.

The coverlay roller 1100 is preferably formed of a cylindrical heating element 1110 extending in the longitudinal direction and an outer shell 1120 surrounding the heating element 1110.

If the entire roller is a heating element, the following problems arise. First, when the heating element directly comes into contact with the base 200, the coverlay 300, the release film 400, etc., the base 200 and the coverlay 300 may be damaged and the laminated FPCB may be a defective product. However, according to the present invention, the heating element 1110 is wrapped by the outer shell 1120, and the outer shell 1120 comes into contact with the base 200, the coverlay 300, the release film 400, and the like, so the heating element 1110 There is an advantage that the probability that the laminated FPCB is a defective product is lowered because heat is applied indirectly without contacting directly.

It is preferable that the outer skin is made of a material that can function as a cushion. For example, it is preferable that it is a silicone cover. When silicon is used, cost can be reduced, and since heat transfer power is high, heat of the heating element 1110 can be effectively transferred to the base 200 and the coverlay 300.

In this case, the silicone cover is composed of a silicone cover composition, and the silicone cover composition includes a silicone rubber resin and a metal powder. Any material having a predetermined elasticity is not limited to silicone rubber. For example, as a heat-resistant polymer material having a crosslinked structure, polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubbers may be included.

In addition to the rubber resin, metal powder may be blended. The metal powder may be composed of iron, nickel, cobalt, or other magnetic single metal or an alloy of two or more. Alternatively, it may be configured in a mixed form in which the metal particles are plated on an insulating core. Alternatively, the conductive silicone rubber may be composed of a compound in which a filler such as carbon (C) is excessively filled.

The metal particles are excellent in thermal conductivity, and thus heat resistance of the silicone cover may be increased.

More specifically, with respect to 100 parts by weight of the soft liquid silicone rubber composition, 10 to 30 parts by weight of metal powder is mixed and stirred so that it can be uniformly distributed to prepare a silicone cover composition. Thereafter, the outer skin may be formed as if forming a coating layer directly on the inner core of the roller, or the silicone cover composition was injected into a mold suitable for the shape of the outer shell, and then cured to produce an outer shell, and the outer shell was bonded to the inner core of the roller I can.

In addition, it is preferable that the pair of rollers 1000 rotate at the same speed. Accordingly, since the base 200 and the coverlay 300 can be uniformly laminated, there is an advantage in that the probability of producing a defective product such as a twisted FPCB is lowered.

Figure 6 shows a state in which the base and the coverlay of the FPCB manufacturing method using the roll lamination method according to the present invention are laminated. In this way, the base 200 and the coverlay 300 passing through the pair of rollers 1000 are laminated by the heat and pressure of the pair of rollers 1000 and can be moved in the longitudinal direction. In addition, the release film 400 can be moved in the longitudinal direction together with the base 200 and the coverlay 300 laminated on the top of the coverlay 300. After moving, the release film 400 is removed.

At this time, a release film removal roll (not shown) may be formed so that the release film 400 to be removed in another embodiment is wound in a roll shape again. After the release film 400 unwound from the release film winding roller 2300 assists the lamination of the base 200 and the coverlay 300, it is again wound on the release film removal roll. Through this, since the operator does not manually remove the used release film 400, there is an advantage in that the working speed is increased, and since a large release film 400 can be used, there is an advantage that the size is not limited.

[Production Example: Preparation of adhesive composition for coverlay]

It was mixed according to the composition ratio of Table 1 to prepare an adhesive composition for a coverlay. An adhesive composition was prepared by mixing an epoxy resin, a phenoxy resin, a rubber resin, a thermoplastic resin, a curing agent, a fast curing agent, an inorganic particle and a flame retardant in a solvent.

HL1 HL2 HL3 HL4 HL5 HL6 HL7 HL8 HL9 HL10 HL11 HL12 HL13 HL14 Epoxy 100 100 100 100 100 100 100 100 100 100 100 100 100 100 Phenoxy - - - 90 - - - - - - - - - - Rubber resin 50 60 80 60 60 60 60 60 40 90 60 60 60 60 Thermoplastic resin 3 5 10 5 5 5 One 15 5 5 5 5 5 5 Hardener 8 12 15 12 12 12 12 12 12 12 12 12 12 12 Fast curing agent 0.01 0.05 0.1 0.05 - 0.15 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 Inorganic particles 30 45 60 45 45 45 45 45 45 45 20 70 45 45 Flame retardant 50 65 80 65 65 65 65 65 65 65 65 65 40 90 solvent 500 500 500 500 500 500 500 500 500 500 500 500 500 500

(Unit weight part)

here,

The epoxy resin is a mixture of a bisphenol A type epoxy resin having an epoxy equivalent (EEW, g/eq) of 184 to 190 and a bisphenol A type epoxy resin having an epoxy equivalent of 450 to 500 (EEW, g/eq), and a molar ratio of 1:5 It is an epoxy resin mixed with,

Phenoxy resin has a weight average molecular weight (Mw) of 10,000 or more,

The rubber resin is xNBR,

The thermoplastic resin is a polyester resin with a glass transition temperature (Tg) of 20 to 100°C,

The curing agent is a mixture of 3,3'-diaminodiphenylsulfone and 2-undecylimidazole, and 3,3'-diaminodiphenylsulfone and 2-undecylimidazole are 1 : It is mixed at a weight ratio of 0.5,

The inner curing agent is a modified alicyclic amine type curing agent,

The inorganic particles are a mixture of aluminum hydroxide and titanium dioxide, and are a mixture of aluminum hydroxide and titanium dioxide in a weight ratio of 1:3,

The flame retardant is a particulate phosphorus-based flame retardant and a resin-type phosphorus-based flame retardant, and is a mixture of the particulate phosphorus-based flame retardant and a resinous phosphorus-based flame retardant in a weight ratio of 1:3.

[Experimental Example 1: Preparation of Coverlay]

A polyimide film (PI) was used as a coverlay film, and an adhesive layer was formed on one side of the polyimide film using the adhesive composition for a coverlay of Preparation Example.

The adhesive layer may be formed on one surface of the polyimide film using a known method.

[Experimental Example 2: Storage elasticity measurement result]

The storage modulus (Pa) of the coverlay formed with the adhesive layer using the adhesive compositions of HL2, HL5, HL7, HL9 and HL11 was measured.

The storage modulus was measured using TA's Dynamic Mechanical Analyzer (DMA) Q800. Each coverlay was cut to be 5mm in width and 50mm in length in the mechanical direction (MD) and the width direction (TD), and then mounted on a dynamic mechanical analyzer so that the actual measurement length was about 20mm. Then, after raising the temperature at a rate of 10 °C/min from 20 °C to 200 °C under the following conditions, the storage modulus value was measured.

The results are shown in FIG. 9.

According to FIG. 9, it can be seen that HL2 is formed at the lowest temperature based on the lowest storage elasticity value compared to HL5, HL7, HL9 and HL11, and has the lowest storage elasticity value.

[Experimental Example 3: Filling Test Results]

After the coverlay prepared in Experimental Example 1 was bonded to the base using a roll lamination method, the degree of filling was checked.

More specifically, a pair of rollers was used to simultaneously pass the wound base, the coverlay and the release film, bonded to each other, and then subjected to a hot air drying (baking) process at 120° C. for 5 hours.

At this time, the filling property was evaluated after the roll lamination method was performed, and whether or not a lifting phenomenon occurred after the hot air process was confirmed.

As shown in FIG. 10, when unfilling occurred, it was marked as X, and as shown in FIG. 11, it was evaluated as O.

HL1 HL2 HL3 HL4 HL5 HL6 HL7 HL8 HL9 HL10 HL11 HL12 HL13 HL14 Fillability Roll lamination O O O O O X X O O X O O O O hot air dry O O O O X X X O O X O O O O

According to the above experimental results, it can be confirmed that unfilling is affected depending on whether the inner curing agent is included. When the inner curing agent was not included, the problem of unfilling did not occur under the roll lamination process, but a lifting phenomenon occurred in the hot air drying process step.

In addition, when the thermoplastic resin is included in the content range, it was confirmed that unfilling and lifting phenomena appear simultaneously in the roll lamination process and the hot air drying process. On the other hand, it was confirmed that the unfilled and lifted phenomena were not a problem when included in excess.

Judging from the above experimental results, it was confirmed that when the thermoplastic resin was included in the minimum range or more, it was possible to prevent the occurrence of the unfilling problem in the roll lamination process step and the lifting phenomenon in the hot air drying process.

In addition to that, it was confirmed that unfilling and lifting did not occur in other adhesive layers.

[Experimental Example 4: Lead heat resistance test result]

For the evaluation of the reflow process, the lead bath evaluation was performed. The solder bath temperature condition was floating at 280°C for 30 seconds, and after the evaluation, it was confirmed that the occurrence of a lifting phenomenon occurred.

The reflow temperature condition table is shown in Fig. 12, and the experimental results are shown in Table 3 below.

HL1 HL2 HL3 HL4 HL5 HL6 HL7 HL8 HL9 HL10 HL11 HL12 HL13 HL14 Lead heat resistance O O O O O O O X X O X X X X

According to the experimental results, it was confirmed that the lifting phenomenon occurred in HL8, HL9, and HL11 to HL14. In the other adhesive layers, it was confirmed that the lifting phenomenon did not occur and lead heat resistance was excellent.

[Experimental Example 5: Evaluation of physical properties]

The adhesion and flame retardancy of the prepared coverlay adhesive layer were evaluated. The adhesion was measured by applying the JIS K 6850 test method. Flame retardancy was measured according to UL94 flame retardant regulations. The experimental results are shown in Table 4 below.

HL1 HL2 HL3 HL4 HL5 HL6 HL7 HL8 HL9 HL10 HL11 HL12 HL13 HL14 Adhesion (kgf/cm) 0.98 1.05 1.02 1.03 0.90 0.89 1.01 1.00 0.67 1.01 0.79 0.75 0.65 0.64 Flame retardant O O O O O O O O O O O O O O

According to the experimental results, it was confirmed that the flame retardancy in all adhesive layers exhibited a flame retardancy of V0 grade. On the other hand, in the case of adhesion, it was confirmed that HL9 containing a small amount of rubber resin, and HL11 to HL14 that did not contain inorganic particles and flame retardants as values within the range showed low adhesion.

[Experimental Example 6: Evaluation of flowability of adhesive layer]

In order to evaluate the flowability of the adhesive layer of the present invention, a specimen was prepared using a hot press.

Between the hot press upper plate and the lower plate, an aluminum plate; TPX film; Coverlay; TPX film; PVC film; Kraft paper and aluminum plate were sequentially stacked and pressed at 160° C. for 1 hour at a pressure of 45 kgf/cm ² .

Resin flowability was measured using a Visual Microscops system. The adhesive layer of the coverlay was formed to have a thickness of 38 μm to conduct an experiment, and the experimental result was an average value of five samples measured in μm units.

As a comparative example, a conventional hot press coverlay adhesive composition was used. More specifically, in the same content range as HL2, the fast curing agent is not included, only aluminum hydroxide is included as inorganic particles, and only the particulate phosphorus-based flame retardant is mixed as the flame retardant.

Resin flow measurement by hot pressing Resin flow measurement by heat curing after roll lamination Comparative example 60 to 90 μm 0 to 20 μm HL2 90 to 150 μm 40 to 60 μm

According to the above experimental results, HL2, which is an embodiment of the present invention, has high flowability in the hot press process and is difficult to apply to the hot press process.However, when applying the roll lamination process, there is no problem in the filling property with proper flowability, but general In the case of compounding, the flowability is suitable during the hot press process, so that there is no problem in the filling property, but when the roll lamination process is applied, the resin hardly flows, and a problem of unfilling may occur.

In addition, after the roll lamination process, in the case of the adhesive layer of the general formulation during thermal curing, a lifting phenomenon occurs because there is little flowability, but in the case of HL2 of the present invention, it was confirmed that the lifting phenomenon does not occur due to flowability.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It belongs to the scope of rights of

200: base
300: coverlay
310: coverlay film
320: coverlay adhesive layer
400: release film
1000: a pair of rollers
1100: Coverlay roller
1110: inner core
1120: outer skin
1200: base roller
2000: a pair of winding rollers
2100: Coverlay winding roller
2200: base winding roller
2300: release film winding roller

Claims (11)

A cleaning step of washing the surface of the raw material;
A dry film lamination step of bonding a dry film to the raw material;
An exposure step of curing the dry film positioned on the circuit formation portion;
A developing step of peeling off the uncured portion of the dry film;
A corrosion step of etching the exposed copper portion of the raw material;
A peeling step of removing the cured dry film;
Manufacturing a base completed through the cleaning step to the peeling step in a roll form;
Manufacturing a coverlay in a roll form;
Manufacturing a release film in a roll form; And
Coverlays passing through the end of the roll-shaped base, the end of the roll-shaped coverlay, and the end of the roll-shaped release film to sequentially contact between a pair of rollers formed of an inner core and an outer shell surrounding the inner core It includes; roll lamination step;
The shell is a silicone cover,
The raw material is copper, raw material adhesive, raw material film are sequentially laminated,
In the coverlay, a coverlay film and a coverlay adhesive layer are sequentially laminated,
The coverlay adhesive layer includes an adhesive composition for a coverlay,
The adhesive composition for the coverlay is an epoxy resin; Rubber resin; Thermoplastic resin; Hardener; Inorganic particles; Flame retardant; And a fast curing agent,
The epoxy resin is a bisphenol A type epoxy resin having an epoxy equivalent (EEW, g/eq) of 184 to 190 and an epoxy equivalent of 450 to 500 (EEW, g/eq) of a bisphenol A type epoxy resin of 1:3 to 1:7. Is to be mixed in a molar ratio of
FPCB manufacturing method using the roll lamination method.
delete delete The method of claim 1,
The roller applies heat to the base, the coverlay, and the release film to mutually bond the base and the coverlay.
FPCB manufacturing method using the roll lamination method.
The method of claim 4,
The roller applies pressure to the base, the coverlay, and the release film to bond the base and the coverlay.
FPCB manufacturing method using the roll lamination method.
The method of claim 5,
The coverlay film is a PI film
FPCB manufacturing method using the roll lamination method.
The method of claim 1,
The raw material film is an insulating film
FPCB manufacturing method using the roll lamination method.
The method of claim 7,
The raw material film is a PI film
FPCB manufacturing method using the roll lamination method.
The method of claim 1,
The rollers rotate in opposite directions to each other
FPCB manufacturing method using the roll lamination method.
The method of claim 9,
The roller rotates at the same speed
FPCB manufacturing method using the roll lamination method.
The method of claim 1,
The inner core is a cylindrical heating element
FPCB manufacturing method using the roll lamination method.

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