TW200536445A - Printed circuit board including track gap-filled resin and fabricating method thereof - Google Patents

Abstract

The present invention relates to a printed circuit board (PCB) including a track gap-filled resin (TGFR). In the inventive PCB, a new resin TGFR 10 having a special composition is filled in a track gap 6, so that delamination is prevented to improve the electrical insulation and dielectric strength between tracks. Also, since the track gap 6 on the dielectric layer 1 is filled with the TGFR 10, a product where the thickness of a dielectric layer 1 is smaller than that of the track can be produced. Furthermore, as the synthetic resin TGFR is used, the PCBs or electrical components mounted thereon show an excellent cooling effect in their operation, and also have excellent reliability against their use environments (heat, humidity and insulation). In addition, as the TGFR 10 is filled in the cavity of the track gap 6, the inventive PCB shows low flexibility, so that inferior rate in a process of mounting and assembling components on the PCB is significantly reduced. Also, the TGFR 10 prevents a portion of the copper foil at the wall of the conductor pad 2 from being exposed to the external environment, so that a short-circuit phenomenon in the mounting and soldering of components on the PCB can be prevented.

Description

200536445 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a printed circuit board (PCB), and more specifically, to a PCB (hereinafter also referred to as "TGFR") containing a linear track gap filling resin (TGFR) TGFR PCB) and a manufacturing method thereof, wherein the TGFR with a special composition is coated in a track gap formed on the PCB and is planarized, so that the electrical insulation effect between the tracks can be improved And the dielectric strength, and can avoid the short circuit phenomenon when the electrical components on the PCB are placed and soldered. [Prior art] ^ Generally, a PCB is a thin plate on which electrical components (such as CJC, circuits: resistors, and switches) can be soldered. In the manufacture of PCBs, the materials will be adhered to—a sheet made of electrically insulating resin (such as epoxy resin or epoxy resin), and then the resist will be coated. Then, the board of the anti-adhesive agent will be immersed-capable of refining the part of the second A that is not covered with the anti-money agent will be engraved. 'There will be children left on this board,

Drill; The part of the patterned copper so-called center discharge component will be cut into a hole, and a blue solder paste will be printed on the copper shaft: other parts. Personnel Defense W Figure j is a schematic cross-sectional view of the structure of a previous PCB. 〆Figure t X first, the PCB will be formed on the middle part of it—dielectric Guangguang 200536445 1 on each outer surface ’will form—conductor contact 2 and road 3. A wire-holding gap 6 having a specific width is formed between the touch pad 2 and the wire 3. On the conductor pad 2 and on the conductor ', a solder mask path 3 body 5 with a specific pattern will be formed. X 疋 The surface Seiko 6H dielectric layer 1 is also called "prepreg", and it / is as follows. The supplier made of paper or glass fiber: is a reinforcing material) is heat-treated 'and then silane Coupling agents are used: 、, '', and then coated with various resins (or immersed in resin). The prepreg is pressed against a copper foil 'and squeezed. Pig laminated dielectric board. A plurality of these dielectric plates are stacked on top of each other, and the heat and dust are completely cured. During this stacking process, the principle is to adhere to the surface of one or both of the laminates. ’M stomach rupture

Will use the ink or dry film anti-knock to the part for circuit use, and then the money will be engraved on the steel 耒 ^ Baizhong and other anti-surname agents. The amount of leftovers left after the money engraving process should be perforated, and the electricity mined for the connection. Then we will close: the component will be welded to the correct position on the copper cymbal. In the case of electrical energy, epoxy resin adhesives are used to light these electrical units. In the case of PCBs according to the prior art, therefore, the output of the dielectric layer 1 having a thickness smaller than the thickness of the wire can be used. Kouya ^ The previous PCB was affected by its use environment (such as Betrayal 3, the response is very loud. For example, when 1 cooling, degrees, and insulation) should be reduced, the temperature will rise because of temperature rise. In turn, delamination occurred in the PCB. In addition, when the Anchorage Division is installed in the former PCB before 200536445, the reliability of the product may be affected by the PCB or the tower, and the Qiaoqiao Temple Electrical Component Institute. The heat generated decreases. Also, because. The Haixianyu PCB will exhibit extremely high elasticity due to the relationship between the wire-holding gap 6 ', so that during the process of installing and assembling the transfer module on the PCB, < can cause many poor products. In the case of a PCB containing a large amount of copper, the copper_ which constitutes the conductor contact 2 will be exposed to the external environmental towel during soldering, so it may become & road phenomenon. In addition, because of the possibility of incomplete resin infusion, the dielectric layer must have a very large thickness. [Summary of the Invention] Accordingly, the present invention can solve the above-mentioned problems in the prior art, and the object of the present invention is to provide a printed circuit board (PCB) containing a wire-fill gap-filling resin (TGFR). The method includes the following steps: engraving and cleaning the surface of a board; using oxidation or soft etching to treat the surface and wall of a wire holder; applying TGFR in a track gap, curing and planarizing the coated TGFR , So as to complete a PCB board that has been filled with the TGFR in the track gap. In addition, the present invention provides a multilayer PCB with a large amount of copper, the manufacturing method of which is as follows: the steps described in the above purpose; performing an oxidation treatment step, a lay-up step, and a lamination step on an internal wire holder; And performing a surface cleaning step, a PSF coating and drying step, an exposure step, a developing step, a PSR curing step, and a screen printing step on an external wire rail. 200536445 [Embodiment] The present invention will be described in detail below with reference to the accompanying drawings, in which the diagrams are a schematic cross-sectional view of the structure of the TGFR pCB according to the present invention; A schematic cross-sectional view of a plurality of TGFR PCBs stacked on each other: and the fourth drawing is a schematic flow chart of a process for manufacturing a Tgfr pcb according to the present invention. & As shown in the second figure, the TGFR PCB according to the present invention will form a dielectric layer on the middle wound. On each outer surface of the dielectric layer], a conductor pad 2 and a circuit 3 will be formed, and a conductor fill resin (TGFR) IO will be filled in the conductor pad 2 and the circuit Between 3. On the conductor pad 2 and the circuit 3, a solder mask 4 or a surface finish body 5 having a specific pattern will be formed. The TGFR (Wire Gap Filling Resin) 10 is a new synthetic resin whose composition can improve the insulation effect and the dielectric strength between the wires. In the specific embodiments of the present invention, g TGFR preferably includes DGEBPA (bisphenol A diglycidyl ether) with a weight percentage of 18% to 23%, and a weight percentage of 3% to 7%. Cyclic epoxy resin, DBDPO (weight: 20% to 33 / 〇): benzene, 3% to antimony (III) oxide, 30% to 50% aluminum hydroxide, and Dicyandiamide from 3% to 7% by weight. DGEBPA (Double Test A Diepoxy Glycerol CAS Nq 25_ 38 6) is an epoxy resin used in coating agents and molding agents. If the content of DGEBPA is low If the weight percentage is 18%, the tgfr's viscosity will be too high. Therefore, it is difficult to perform the screen printing step. On the contrary, if it exceeds 23% by weight, then inorganic materials may be formed. Shen Dianwu. This modified cyclic epoxy resin is a reaction product of 3,4_EPOXYCYCLOHEXYL METHYL 3 丨, 4, -EPXOY-CYCLOHEANE CARBOXYLAT, BISPHENOL-A, and DGEBPA, and shows good heat resistance. Properties and good electrical properties. Assuming the modified cyclic epoxy tree If the content is less than 3% by weight, the heat resistance may be poor. On the contrary, if it exceeds 7% by weight, cracks may form because the hardness of the cured material is too high. DBDPO is a kind Bromide flame retardant. If the DBDPO content is less than 20% by weight, the flame retardancy may be poor. Conversely, if it exceeds 33% by weight, the electrical characteristics of TGFR may be poor. Antimony (III) oxide is an adjuvant for DBDPO. The preferred content of antimony (in) is in the range of 100/0 to 30% by weight of DBDPO. Hydroxide is also a flame retardant, and may be a flame retardant. An inorganic material used to control anti-wear properties. If the content of aluminum hydroxide is less than 30% by weight, the flame retardancy may be poor. Conversely, if it exceeds 50% by weight, the tgfr's Electrical properties may be poor. Dicyandiamide is a curing agent for the cyclic epoxy resin. If the dicyandiamide content is less than 3% by weight, the characteristics of the cured material However, if the curing redness is insufficient, it may become very poor. On the contrary, if it exceeds 7% by weight, the electrical characteristics of tgFR may be poor. 10 200536445 In another embodiment, the TGFR 1 〇 The preferred line includes 18% DGEBPA, 3% by weight modified cyclic ring gas di-ester, 20% by weight DBDPO, 3% by weight oxidation (III), and 5 by weight. / ί > rat emulsified inscription, and dicyandiamide in a weight percentage of 3 < ^ /. This composition can exhibit an excellent endothermic effect. The solder mask 4 is a part of the PCB, which is formed by applying ink to prevent the solder from attaching to unexpected parts when the component is placed on the PCB, and prevent the The circuit on the surface of the PCB is affected by the external environment. It is also called "flux resist" or "flux mask". In the present invention, for convenience of explanation, the portion to which the ink is applied is referred to as a solder mask 4. The solder mask 4 can be formed by a process selected appropriately depending on the use environment and conditions. Examples of this process include: a photoresist (PSR) process in which an ink having a viscosity of 150-300 poise is applied to the entire surface of a substrate on which a plurality of circuits are formed, and exposed and developed; liquid light imaging ( Lpi)% process, which runs in the same way as the PSR | process, and uses inks with a viscosity lower than ιιο poise, as well as infrared (IR) processes, mask processes, and carbon processes, which will produce a mesh-like board Apply ink to the surface of a substrate. Stabbed and printed without any exposure. In one specific embodiment of the present invention, the solder mask 4 is formed by the pSR process. Furthermore, in the present invention, the position where the solder mask 4 is formed is higher than the surface precision body 5 formed on the conductor pad 2, so that the electrical insulation effect between the wires can be improved, and it can be prevented The steel foil was exposed to the external environment 200536445 and caused a short circuit. At the same time, the multilayer structure can be used to form the Tgf = wherein—in the specific embodiment, the multilayer copper PCB with the structure shown in the third figure is a multilayer structure. —Yue Fangcai, according to this issue, a multi-layer copper PCB with an upper dielectric layer is placed on the basin]. The surface really fills the TGFR10 in the gap of the rail between the conductor contact 2 and the line 3. On the lower surface of the conductor contact, the specific pattern of solder mask 4 or the surface of the two-line electrical layer "will constitute -internal /, and, as follows: The conductor contact塾 2, contact the conductor 2 and the line 3, and the circuit 3, and fill

1〇. The TGFR in the line track gap] of the inner == Huazhilai / the inner line track 11 is used to strengthen the adhesion effect with the intermediate dielectric layer 1 located on the facing surface. Connect :: Machine U can be closely located to the inside =; Γ1: Γ Electrical layer ™ ^ is filled in the conductor pad 2 such as two · two conductor = 2, the line 3, with * Table: Upper = gap; :: The dielectric thickness 1 rail 12 below it has the following composition: Physical touch 2: It will constitute-the external wire child circuit 3, and fills the gap between the conductor pad 2 and the circuit 3 of 2005 200536445 TGFP 10. On the conductor contact pad 2 and the circuit 3 ^ ^, a solder mask 4 with a # fixed pattern or a surface precision layer 1 is placed on these single layers, and the above can be easily manufactured. As discussed, a large number of copper PCBs are formed between the internal lines of the dielectric TGFRPCB. Hereinafter, each of the six < ^^ diagrams shown in the fourth figure will be used to explain each method of manufacturing the TGFRPCB according to the present invention.

According to the designed circuit diagram, a plurality of side holes must first be formed in the pcb board using the drilling step si. In order to form a plurality of electrical interconnections on the PCB, a chemical and electrical copper bonding step S2 is then performed on the PCB. After the copper plating, the PCB will be subjected to the etching steps% and S4 to form a track gap 6 having a specific width. The pCB substrate in which the wire rail gap 6 is formed is subjected to a surface cleaning step S5 to remove foreign substances. In the surface cleaning step, soft etching and / or oxidation treatments are performed to treat the surface and inner protective wall of the thread gap. After the surface cleaning step S5 is completed, the step S6 of applying the track gap filling resin 10 to the track gap 6 can be performed. The TGFr 10 can be applied by printing or roller coating, and the applied TGFR 10 can be quickly cured by a hot air machine or heater located outside. After curing the TGFR 10, the TgFR surface can be planarized by sanding, brushing, cutting, or a combination of the three steps. 13 200536445 Step S7. The later steps will be implemented by the difference between the inner rail 11 and the outer rail 12.

For the inner rails 11, a step S11 of treating the inner surface with oxidation is performed to improve the adhesion effect of the inner rails u and the resin forming the dielectric: 1. Next, 'the lamination step and the pressing step S13 are performed sequentially. Next steps and for manufacturing — PCB

The steps in the tjW general process are the same, so the description will be omitted in this article. For the outer thread holder 12, the surface cleaning step S21 is performed before the PSR is applied. In the surface cleaning step 21, softening or oxidation treatment is performed to treat the surface of the wire rail and the protective wall. On the surface of the PCB that has been subjected to the surface cleaning step s2i, the following steps will be performed in order: step S22 of recording and drying the photoresist resin (psR), exposure step S23, development step-like, coffee curing step, And screen printing steps. This pen boat talks about the identification of smokers, only one step, and the following steps are the same as those in the general process used to omit their description examples. Therefore, this article will save the openings that have been used in ... . The cymbal board is made by forming a plurality of electric green and M wires on the necessary PCB boards. In order to implement the electrical copper plating step on this, Xing, Quanquan, and then the PCB after the PCB will be copper 5_ thickness steel H. The gap of the line track after being plated with a width of 0.6mm: an etching step to form—have; where the wire base is formed 14 200536445 The board is subjected to a surface cleaning step to remove foreign substances. In the surface cleaning step, an oxidation treatment is performed to treat the surface of the thread gap and the inner protective wall. After the surface cleaning step is completed, a step of applying a rail gap-filling resin to the rail gap can be performed. The TGFR includes 18% by weight of DGEBPA (bisphenol A diglycidyl ether), 3% by weight of modified cyclic epoxy resin, 20% by weight of DBDPO, and 3% by weight of antimony (III) oxide. , 50% by weight of Hydroxide • Ming, and 3% by weight of dicyandiamide. The gastric TGFR was applied by printing, and the applied TGFR was rapidly cured by a hot air machine. When the TGFR is cured, a step of planarizing the TGFR surface is performed by a sanding method. The later steps will be implemented by the difference between the internal line manager and the external line manager. For the internal wire rail, a step of treating the internal wire holding surface by oxidation is performed to improve the adhesion effect of the internal wire rail and the resin forming the dielectric layer. Then, the laminating step and the laminating step are sequentially performed. The subsequent steps are the same as those in a general process for manufacturing a multilayer PCB. For external wires, a surface cleaning step is performed before PSR is applied. In the surface cleaning step, a soft etching process is performed to treat the surface of the thread and the protective wall. On the surface of the PCB that has been subjected to the surface cleaning step, the following steps are sequentially performed: a step of applying and drying a photo-resin resin (PSR), an exposure step, a developing step, a PSR curing step, and screen printing. step. These steps are the same as the following steps in the general process for manufacturing a multi-layer PCB. 0 Example 2 15 200536445 Take the example of the track clearance as example 3 Take the example of the line clearance as the comparison example and An example is TGFR. 1 to prepare a TGFR PCB in the same way, but 1.1mm 〇1 to prepare a TGFR PCB in the same way, but 1.6mm 〇1 1 to prepare a PCB in the same way, but did not make

Comparative Example 2 A PCB was prepared in the same manner as in Example 2, but TGFR was not used. Comparative Example 3 A PCB was prepared in the same manner as in Example 3, but TGFR was not used.

Test Example High-Acceleration Stress Test To confirm whether delamination occurs in the PCB prepared in Examples 1-3 and Comparative Examples 1-3, a high-acceleration stress test can be performed. The test conditions are DC 400V, 40 ° C, and 80% Humidity. These results are shown in Figure 5. As shown in the fifth figure, the short-circuit time of the TGFR PCB of the present invention is longer than the short-circuit time of the PCB according to the prior art. Although the preferred embodiments of the present invention have been described for explanatory purposes, those skilled in the art will find that various modifications, additions, and substitutions can also be made without departing from the scope disclosed in the accompanying patent application16 200536445 The scope and spirit of the present invention. From the above we can see that the dielectric layer of the PCB according to the prior art must have a large thickness during use. Therefore, the heat transfer rate and the cooling rate are very slow. However, the thickness of the dielectric layer of the PCB according to the present invention is very thin due to the relationship of the TGFR applied in the gap between the rails. Accordingly, the heat transfer rate and the cooling rate are very fast.

In addition, the heat transfer rate of the TGFR of the present invention is H6W / mK (which is 6 times or 20 times the heat transfer rate of the epoxy resin used in the prepreg). Therefore, the cooling effect is quite superior, and delamination is avoided. In contrast, the thickness of the PSR layer on the side of the PCB according to the prior art is very thin (1-20 nanometers), which in turn poses the risk of cracking. Accordingly ’the PCB

Problems such as voltage interference and reliability may occur. However, the PCB of the present invention includes TGFR, which occupies the position of the PSR on the side of the PCB ', so there is no problem of cracking. The industrial applicability is as described above. In the TGFR PCB according to the present invention, the new resin TGFR 10 with a special composition is filled in the track gap 6, so it is possible to avoid delamination and improve the electricity between the wires. Insulation effect and dielectric strength. In addition, because the wire gap 6 on the dielectric layer 1 is filled with the TGFR, a product having a thickness of the dielectric layer smaller than the thickness of the wire rail can be manufactured. Furthermore, when the synthetic resin is used, the PCBs or the electrical components mounted thereon will exhibit a good cooling effect when they operate ', and can also counteract their use environment (heat, clarity, and Insulation) and good reliability. 17 200536445 In addition, when the TGFR 10 is filled in the wire holder gap 6, the PCB of the present invention exhibits extremely high elasticity, so that the components installed and assembled on the PCB can be greatly reduced. Defective rate in the manufacturing process. In addition, the TGFR 10 can prevent a portion of the copper foil located on the protective wall of the conductor pad 2 from being exposed to the external environment, and thus can prevent a short circuit when the component is placed and soldered on the PCB. [Brief description of the drawings] The first figure is a schematic cross-sectional view of the structure of a PCB. The second figure is a schematic sectional view of the structure of a TGFR PCB according to the present invention. The third figure is a schematic cross-sectional view of a plurality of TGFR PCBs stacked according to the present invention. The fourth figure is a schematic flowchart of a process for manufacturing a TGFR PCB according to the present invention. The fifth graph shows the results of the high acceleration stress test of the PCB prepared in Comparative Examples 1-3 and 1-3. [Description of main component symbols] 1 Dielectric layer 2 Conductor contact pad 3 Circuit 4 Solder mask 5 Surface finish 18 200536445 6 Line track gap 10 Line track gap filling resin 11 Internal wire holder 12 External wire track

Claims (1)

200536445 ι · Application for a patent: A printed circuit board (PCB) containing a gap-filling resin (TGFR). The PCB includes a dielectric layer, conductive pads 2 and wires 3 formed on two surfaces of the dielectric. And the formation: two-dimensional history, the edge conductive layer contact pad 2 and the line 3 with a specific width of the wire holder gap 6 2. 3 · in this line track gap 6 is filled with a wire holder gap to fill its (TGFR) IO, with In order to improve the insulation effect and dielectric strength, the position of the solder mask 4 above the circuit 3 and the TGFR 10 is shaped on the surface of the precision body 5 formed on the conductor pad 2. It is directed to the PCB as described in the first item of the patent application scope, wherein the TGFR includes a modified DGEBPA (bisphenol A diepoxy glycol, ether) in an amount of 18% to M%, and a modified ring in an amount of 3% to 7% Epoxy resin: weight = DBDPO (decabromodiphenyl ether) of 20% to 33%, weight% = antimony (III) oxide from 3% to 7%, 300 / ❹ to 50% by weight Aluminum hydroxide, and dicyandiamide from 3% to 7% by weight. For example, for the PCB with the scope of patent application No. 1, the preferred TGFR 10 is a modified cyclic epoxy resin containing 18% by weight of DGEBPA (Bisphenol A Diepoxy Glycol), and 3% by weight. Resin, 20% by weight DBDPO, 3% by weight antimony oxide (m), 50% by weight hydroxide hydroxide, and 3% by weight digassing amine. A method for manufacturing a PCB containing TGFR, comprising: a drilling step S1 for forming a plurality of necessary openings in a PCB; weight 20 4 · 200536445 a chemical and electrical copper plating step S2, for forming a plurality of electrical interconnections on the PCB; etching steps S3 and S4, so as to form a track gap 6 in the copper-plated PCB; surface cleaning step S5, for use there Remove foreign matter from the PCB board forming the line track gap 6; The coating and curing step S6 is used to fill a thread gap filling resin (TGFR) 10 in the thread gap 6; the TGFR surface planarization step S7 is performed by sanding, brushing, cutting, Or a combination of the three to planarize the surface of the cured TGFR 10; sequentially perform an oxidation treatment step S11 on the inner wire holder 11 to improve the adhesion effect of the inner wire holder 11 and the resin forming the dielectric layer 1 Layering step S12 and laminating step S13; surface cleaning step 21, PSR (photosolder resin) coating and drying step S22, exposure step S23, developing step S24, PSR A curing step S25 and a screen printing step S26. For example, the method in the fourth scope of the patent application, wherein the surface treatment steps S5 and S21 can be implemented by an oxidation treatment method or a soft etching method. For example, the method in the fourth scope of the patent application, wherein in the TGFR coating and curing step S6, coating can be performed by printing method or roller coating method, and by an external hot air machine or Heater to quickly cure the coated TGFR 10. 21 6.