JP2001068856A - Insulation resin sheet and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation resin sheet and a double-sided laminate plate which are suitable as a material for manufacturing a via hole filled multi- layered printed wiring board enabling high density mounting and a multi-layered printed wiring board manufactured by using them. SOLUTION: An insulation resin sheet 1 consisting of an insulation film 10 and adhesive layers 11 and 11 laminated on both its surfaces has a via hole which penetrates the insulation film 10, and both adhesive layers 11 and 11 are filled with plating metal 17. The double-sided laminate plate having metal layers 22a and 22b laminated on both the top and reverse surfaces of the insulating layer 20 has a via hole which penetrates the insulation layer 20, and is filled with plating metal 27 which is united with the upper and lower metal layers 22a and 22b. This insulation resin sheet 1 and double-sided printed wiring board 3 manufactured by using the double-sided laminate plate are stacked to obtain a multi-layered printed wiring board 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating resin sheet having via holes filled with plating metal as a whole, which is a material for manufacturing a via-hole-filled multilayer printed wiring board capable of high-density mounting, and a method of manufacturing the same. About. Further, the present invention provides a double-sided laminated board having via holes filled with plated metal as a whole, which is a material for manufacturing a double-sided printed wiring board and a multilayer printed wiring board capable of high-density mounting. About.

[0002] Further, the present invention relates to the multilayer printed wiring board comprising the double-sided printed wiring board manufactured from the double-sided laminated board and the insulating resin sheet, and a method of manufacturing the same.

[0003]

2. Description of the Related Art Printed wiring boards on which various electronic components are mounted are becoming increasingly finer with terminal pad wiring and via holes for mounting the chips and packages of semiconductors such as CPUs and memories as the density of mounting terminals increases. Is required. In particular, a BGA having an area array type terminal arrangement
For a wiring board on which a CSP, a CSP, or a flip chip is mounted, a wiring board with the highest density is required, and miniaturization of wiring and miniaturization of via holes are considered to be important technologies.

[0004] Therefore, finer via holes are also required for insulating resin sheets and double-sided laminated boards which are materials for manufacturing printed wiring boards. In the manufacture of a conventional printed wiring board, it is common to form a hole for a via hole by drilling. However, when the diameter of the hole is less than about 200 microns, drilling with a drill is technically very difficult.

In various build-up printed wiring board construction methods developed in recent years, the thickness of the insulating layer is reduced by a method such as coating of a liquid resin or lamination of a resin sheet. By using the laser via method, the diameter of the via hole can be reduced to 200 microns or less. Also, in a general sequential lamination type build-up printed wiring board construction method, a method of forming a metal layer along the inner wall of a via hole using electroless plating or, if necessary, electrolytic plating, is used. The metal layers on both sides of the printed wiring board make the metal layers conductive.

However, in order to cope with a further increase in the mounting terminal density in the future, it is better to fill the entire hole with a conductive material than to form a metal plating layer such as copper along the inner wall of the hole. It is considered advantageous in the following points. That is, the electric resistance can be reduced, the pad-on-via structure in which a mounting pad is formed on a via hole, and the via-on-via structure in which a via hole is further formed on a via hole can be achieved, which is extremely effective for high-density mounting. It is.

As such a method, a method of filling a via hole with a plating metal such as copper by electrolytic plating, and removing excess metal plating projecting and depositing on a circuit surface by polishing has been attempted. . In addition, a non-glass prepreg made of an organic base material is opened with a laser through hole for a via hole by a laser, and the hole is filled with a thermosetting conductive paste. Also, a technique of manufacturing a via-hole-filled multilayer printed wiring board having excellent productivity and good conductivity by a method of pressure curing with a hot press has been developed.

[0008]

However, in a general method of manufacturing a successively laminated build-up printed wiring board, since the wiring layers are sequentially laminated, the manufacturing process is increased with the increase in the number of layers of the printed wiring board. Has become a major factor in cost increase. Further, the conventional method of filling a via hole with a plating metal has a problem that voids are easily generated in the via hole.

Further, in the method of filling the conductive paste, the lamination can be performed at a time and the manufacturing process is simplified, but the conductive powder in the conductive paste is reduced according to the reduction in the diameter of the via hole. There is a problem that it is necessary to pulverize, and it is necessary to optimize the conductive paste according to the diameter of the via hole. From the above, the miniaturization of the via hole has not been sufficient yet, and the mounting density of the semiconductor chip or the like has not been sufficiently high.

The present invention solves the above-mentioned problems of the prior art and can manufacture a via-hole-filled multilayer printed wiring board capable of high-density mounting, and has a fine via-hole. It is an object to provide an insulating resin sheet and a double-sided laminated board which are easy, and a method for producing them. Another object of the present invention is to provide a via-hole-filled multilayer printed wiring board having fine via holes and capable of high-density mounting, and a method of manufacturing the same.

[0011]

In order to solve the above problems, the present invention has the following arrangement. That is, the insulating resin sheet according to claim 1 of the present invention is an insulating resin sheet including an insulating film and an adhesive layer laminated on both surfaces thereof, wherein the insulating resin sheet penetrates the insulating film and both of the adhesive layers. And a via hole filled with a plating metal.

Such a configuration is very suitable as a material for manufacturing a via-hole-filled multilayer printed wiring board which can be stacked with a double-sided printed wiring board or the like and which can be mounted at a high density. This insulating resin sheet may have a composite structure of an insulating film that mainly has mechanical properties such as strength and dimensional accuracy and an adhesive layer that mainly has adhesion to a double-sided printed wiring board or the like to be laminated. It is a feature. By adopting such a structure, the degree of freedom of material selection is greatly expanded as compared with a single material, and it is possible to meet various characteristic requirements depending on the application.

Further, since it has a front-back symmetric structure, it can be widely applied from a double-sided board to a multilayer wiring board. In this respect, it is similar to the relationship between the glass cloth and the epoxy resin in the conventional glass epoxy prepreg. In addition, since a resin film is used as a base, it is easy to cope with a film thickness accuracy and composition uniformity even in a thin film region of 50 μm or less.

The adhesive constituting the adhesive layer has sufficient adhesiveness to an insulating film, and
The type is not particularly limited as long as it has sufficient adhesiveness even when laminated with a double-sided printed wiring board or the like. However, an adhesive made of a thermoplastic resin that is solid at normal temperature and softens at high temperature to exhibit adhesiveness is preferable in terms of storage and handling of the insulating resin sheet.

Further, the insulating resin sheet according to claim 2 of the present invention is the same as the insulating resin sheet according to claim 1,
The insulating film is an aramid film. Since the aramid film has high elasticity, even if a thin insulating film is used, sufficient strength can be given to the insulating resin sheet, and the insulating resin sheet can be made thin. In addition, since it has a low linear expansion coefficient comparable to that of silicon, it is easy to align via holes at the time of lamination, and high-precision lamination can be performed.

According to a third aspect of the present invention, there is provided a method of manufacturing an insulating resin sheet, comprising: laminating an adhesive layer on both upper and lower surfaces of an insulating film; and laminating two upper and lower metal layers on both surfaces. An opening step of removing the upper metal layer, the insulating film, and both of the adhesive layers in a portion where a via hole is provided, and making a hole exposing the lower metal layer; and A selective plating step of filling the holes with plating metal by a plating method of applying a potential to the metal layer, and a metal layer removing step of removing the upper and lower metal layers after completion of the selective plating step. This is a method for producing an insulating resin sheet.

Further, the method for producing an insulating resin sheet according to claim 4 of the present invention comprises a laminating step of laminating an adhesive layer on both upper and lower surfaces of an insulating film and further laminating two upper and lower metal layers on both surfaces thereof. A removing step of removing a portion provided with a via hole in the upper metal layer, and in a part of a region where the upper metal layer is removed, the insulating film and the insulating film until the lower metal layer is exposed. An opening step of making a hole in both adhesive layers, a selective plating step of filling the hole with a plating metal by a plating method of applying a potential to the lower metal layer, and after the completion of the selective plating step, And a metal layer removing step of removing the metal layer.

As described above, in the method for manufacturing an insulating resin sheet according to the third and fourth aspects, the hole is filled with the plating metal by the plating method, so that it is easy to cope with the reduction in the diameter of the via hole. That is, it is not necessary to consider the optimization of the filling material according to the reduction in diameter, which is necessary when filling the via hole with the filling material such as the conductive paste. Further, in the method for manufacturing an insulating resin sheet according to claim 3, since a potential is applied to the lower metal layer and the plating metal is filled in one direction upward from the lower metal layer. ,
Even if the hole has a small diameter, generation of voids in the via hole is suppressed.

Furthermore, since the filling of the metal by the plating method is performed before the metal layer is patterned, a stable via can be formed regardless of the circuit pattern. In the method of manufacturing an insulating resin sheet according to claim 4, the lower metal layer is loaded with a potential, and the upper metal layer is separated from the opening of the hole. The plated metal contacts the upper metal layer, a potential is applied to the upper metal layer via the plated metal, and plating on the upper metal layer starts to close the upper portion of the hole. Before that, the hole is sufficiently filled with the plating metal. Therefore, even if the hole has a small diameter, generation of a void in the via hole is suppressed.

Further, in the method of manufacturing an insulating resin sheet according to a fifth aspect of the present invention, in the method of manufacturing an insulating resin sheet according to the third aspect, the opening step includes forming the via hole in the upper metal layer. The hole is made by using a covering material that covers the entire surface of the lower metal layer other than the portion to be provided, and the selective plating step is performed in a state where the upper and lower metal layers are covered with the covering material. Features.

With such a configuration, the upper and lower metal layers are also covered with the coating material in the selective plating step, so that the plating metal is selectively deposited without being deposited on the surface portions of the upper and lower metal layers. This is a very suitable method for filling the holes. Further, in the method for manufacturing an insulating resin sheet according to claim 6 according to the present invention, in the method for manufacturing an insulating resin sheet according to claim 4, the removing step is a part of the upper metal layer other than a part where the via hole is provided. And using a covering material that covers the entire surface of the lower metal layer to remove a portion of the upper metal layer where a via hole is to be provided. It is characterized in that it is performed in a covered state.

With this configuration, the filling of the plating metal in the selective plating step is performed without being affected by not only the lower metal layer but also the upper metal layer. Via holes can be formed. Then, plating is not performed on portions other than the holes, and the plating metal is selectively filled in the holes. Therefore, the utilization rate of the plating metal is almost 100%.

Further, according to a method of manufacturing an insulating resin sheet according to claim 7 of the present invention, in the method of manufacturing an insulating resin sheet according to claim 6, the portion of the upper metal layer other than the portion where the via hole is provided is covered. The covering material covers a part of the region where the upper metal layer is removed. With such a configuration, the deposition of the plating metal on the upper metal layer does not occur even after the filling of the plating metal into the hole is completed. Therefore, the plating metal filled in the hole is deposited on the upper metal layer. Almost at the same time, bonding to the upper metal layer takes place. Therefore, the hole is filled with the plating metal and joined to the upper metal layer without depositing unnecessary plating metal on the upper metal layer.

Further, in the double-sided laminated board according to claim 8 of the present invention, in the double-sided laminated board in which a metal layer is laminated on both sides of an insulating layer, a via hole penetrating the insulating layer and filled with a plating metal is provided. Wherein the plating metal is integrally bonded to the metal layers on both surfaces. Such a configuration is very suitable as a material for manufacturing a via-hole-filled double-sided printed wiring board capable of high-density mounting and a multilayer printed wiring board.

A double-sided printed wiring board or the like can be manufactured by forming a wiring pattern on a metal layer on both sides by a pattern etching method, a pattern plating method, or the like according to a standard method of manufacturing a printed wiring board. Further, the metal layers on both surfaces and the plating metal are integrally bonded, that is, the metal layers on both surfaces and the plating metal are not connected by mere contact but are integrated as one metal solid. Therefore, it exhibits excellent bonding strength, bonding reliability, and conductivity, and thus is suitable for use as an electronic / electric part.

Further, according to a twelfth aspect of the present invention, there is provided a double-sided laminated board in which a metal layer is laminated on both sides of an insulating layer, wherein a via hole penetrating the insulating layer and filled with a plating metal is provided. The plating metal is integrally bonded to the metal layers on both surfaces, and a portion of the plating metal exposed to the outside is flat.

With such a structure, the double-sided laminate according to claim 8 has the above-mentioned advantages and is suitable for forming a circuit pattern because the surfaces of the two metal layers are flat. For example, in the dry film pattern formation, the adhesion of the pattern mask to the dry film is good,
Fine patterns can be obtained with good yield. Furthermore, a double-sided laminated board according to a tenth aspect of the present invention is the double-sided laminated board according to the eighth or ninth aspect, wherein the insulating layer is an aramid film.

Since the aramid film has high elasticity,
Even if a thin insulating film is used, sufficient strength can be imparted to the insulating layer, and the thickness of the double-sided laminate can be reduced. In addition, since it has a low linear expansion coefficient comparable to that of silicon, it is easy to align via holes at the time of lamination, and high precision lamination can be performed. Claim 11 according to the present invention.
The manufacturing method of the double-sided laminated board described above includes two
Removing the upper metal layer and the insulating layer in a portion where a via hole is provided, on a double-sided laminated plate in which two metal layers are stacked,
An opening step of opening a hole where the lower metal layer is exposed, and filling the hole with a plating metal by a plating method of applying a potential to the lower metal layer, and forming the upper metal layer and the plating metal. And a selective plating step of integrally bonding.

Further, according to a twelfth aspect of the present invention, in the method for manufacturing a double-sided laminated board, a via hole is provided in the upper metal layer of the double-sided laminated board in which upper and lower two metal layers are laminated on both surfaces of an insulating layer. An opening step of making a hole in the insulating layer until the lower metal layer is exposed, in a part of the region where the upper metal layer has been removed,
A selective plating step of filling the hole with a plating metal by a plating method of applying a potential to the lower metal layer, and integrally bonding the upper metal layer and the plating metal. I do.

As described above, in the method for manufacturing a double-sided laminated board according to the eleventh and twelfth aspects, since the plating metal is filled in the hole by the plating method, it is easy to cope with the reduction in the diameter of the via hole. That is, it is not necessary to consider the optimization of the filling material according to the reduction in diameter, which is necessary when filling the via hole with the filling material such as the conductive paste. Further, in the method for manufacturing a double-sided laminate according to claim 11, a potential is applied to the lower metal layer, and the plating metal is filled in one direction upward from the lower metal layer. Even if the hole has a small diameter, the generation of voids in the via hole is suppressed.

When the plating metal contacts the upper metal layer, the plating metal in the via hole and the upper metal layer are integrated, and the growth of the plating metal proceeds. For this reason, the bonding interface between the plated metal of the via hole and the upper and lower metal layers exhibits excellent bonding strength, bonding reliability, and conductivity equivalent to those of an integrated and continuous metal layer. Furthermore, since the filling of the via hole by the plating method is performed before the metal layer is patterned, a stable via hole can be formed regardless of the circuit pattern.

According to a twelfth aspect of the present invention, in the method for manufacturing a double-sided laminated board, a potential is applied to the lower metal layer, and the upper metal layer is separated from the opening of the hole. The plating metal filled in the hole comes into contact with the upper metal layer, a potential is applied to the upper metal layer via the plating metal, and plating of the upper metal layer is started by starting plating of the upper metal layer. Before the upper part closes, the hole is sufficiently filled with the plating metal. Therefore, even if the hole has a small diameter, generation of a void in the via hole is suppressed.

Further, in the method for manufacturing a double-sided laminated board according to claim 13 of the present invention, in the method for manufacturing a double-sided laminated board according to claim 11, the opening step includes forming the via hole in the upper metal layer. The hole is made by using a covering material that covers the entire surface of the lower metal layer other than the portion to be provided, and the selective plating step is performed in a state where the upper and lower metal layers are covered with the covering material. Features.

With such a configuration, the upper and lower metal layers are also covered with the coating material in the selective plating step, so that the plating metal is selectively deposited without being deposited on the surface portions of the upper and lower metal layers. This is a very suitable method for filling the holes. Furthermore, claim 14 according to the present invention.
13. The method for manufacturing a double-sided laminated board according to claim 12, wherein, in the method for manufacturing a double-sided laminated board according to claim 12, the opening step is performed on the entire upper surface of the lower metal layer except for the portion where the via hole is provided. And using a covering material covering the upper metal layer to remove a portion provided with a via hole in the upper metal layer, wherein the selective plating step is performed in a state where the upper and lower metal layers are covered with the covering material. And

With this configuration, the filling of the plating metal in the selective plating step is performed without being affected not only by the lower metal layer but also by the upper metal layer. Via holes can be formed. Then, plating is not performed on portions other than the holes, and the plating metal is selectively filled in the holes. Therefore, the utilization rate of the plating metal is almost 100%.

Further, according to a method of manufacturing a double-sided laminated board according to a fifteenth aspect of the present invention, in the method of manufacturing a double-sided laminated board according to the fourteenth aspect, a portion of the upper metal layer other than a portion provided with the via hole is covered. The covering material covers a part of the region where the upper metal layer is removed. With such a configuration, the deposition of the plating metal on the upper metal layer does not occur even after the filling of the plating metal into the hole is completed. Therefore, the plating metal filled in the hole is deposited on the upper metal layer. Almost at the same time, bonding to the upper metal layer takes place. Therefore, unnecessary plating metal is not deposited on the upper metal layer,
Filling of the hole with the plating metal and bonding to the upper metal layer are performed.

Further, in the method for manufacturing a double-sided laminated board according to a sixteenth aspect of the present invention, in the method for manufacturing a double-sided laminated board according to the fourteenth aspect, in the selective plating step, the upper surface of the upper metal layer is removed. The hole is filled with the plating metal by polishing, and thereafter, the upper surface is polished and flattened. With such a configuration, not only the lower metal layer but also the surface of the upper metal layer are flat (that is, there is no unevenness), which is suitable for forming a circuit pattern. For example, in forming a dry film pattern, the pattern mask has good adhesion to the dry film, and a fine pattern can be obtained with high yield.

Further, a multilayer printed wiring board according to claim 17 of the present invention is a multilayer printed wiring board formed by laminating an insulating resin sheet and a double-sided printed wiring board. Or the insulating resin sheet according to claim 2, wherein the double-sided printed wiring board is provided.
A double-sided printed wiring board manufactured by patterning the metal layers on both surfaces of the double-sided laminate according to any one of the above-described items 10 to 10 and providing wiring.

As described above, since the double-sided printed wiring boards can be stacked in multiple layers via the insulating resin sheet according to claim 1 or 2, higher density and complicated wiring can be realized. It is possible to Claim 1
3. A laminated pattern of the insulating resin sheet according to claim 2 and the double-sided printed wiring board, wherein at least one insulating resin sheet according to claim 1 or 2 is interposed between the two double-sided printed wiring boards. If it is not particularly limited, it can be designed freely.

Further, according to a method of manufacturing a multilayer printed wiring board according to claim 18 of the present invention, wiring is performed by patterning the metal layers on both surfaces of the double-sided laminated board according to claim 8. 18. The method for manufacturing a multilayer printed wiring board according to claim 17, comprising: a step of laminating the double-sided laminated board provided with the wiring and the insulating resin sheet according to claim 1 or 2. It is.

In the present invention, the plating metal means a metal precipitated from a plating solution by a plating method. Next, the materials constituting the insulating resin sheet according to the first and second aspects and the respective methods used in the method for manufacturing the insulating resin sheet according to the third to seventh aspects will be described in detail. [Regarding Insulating Film] Examples of the material of the insulating film which mainly has mechanical properties such as strength and dimensional accuracy include an insulating resin alone or a composite material of an insulating resin and an additive. Examples of the insulating resin include polyester resins, polyimide resins, aramid resins, liquid crystal resins, thermosetting resins such as thermosetting polyphenylene ether resins, BT resins, and thermoplastic resins. Are used alone or in combination of two or more. These are also
It is selected according to the requirements such as heat resistance, dielectric constant, and cost depending on the application.

Examples of the additive include a woven or nonwoven fabric of organic or inorganic fibers, or a composite material with organic or inorganic powder. An insulating layer used for a general copper-clad laminated substrate can also be used as an insulating film. For example, paper phenol-based, glass epoxy-based, resin filler composite-based substrates, and the like.

In particular, films of an aramid resin and a liquid crystalline resin have a high modulus of elasticity, and thus can be easily made thinner than other materials. Therefore, it is advantageous and preferable for miniaturization of the wiring pattern. In addition, since the coefficient of linear expansion in the film surface direction is small, the positioning of the via holes during lamination is easy, and lamination with high accuracy can be performed.

For reference, Table 1 shows the physical properties of other typical materials used for the aramid film and the insulating film.

[0045]

[Table 1]

[Adhesive Layer] The adhesive layer mainly responsible for the adhesion to the metal layer or wiring board to be laminated is made of a thermosetting resin or thermosetting resin generally used for a copper-clad laminated substrate. A plastic resin system or a composite material thereof can be used. These can be selected based on the requirements such as adhesion, electrical properties, heat resistance, curing conditions, and cost, depending on the combination with the mating material to be bonded. For example, general types include epoxy resin, phenol resin, polyimide resin, fluorinated polyimide resin, polyamide imide resin, polyester resin, fluororesin, and composites thereof.

However, in the case of etching, which is a technique applicable to the opening step, and electrolytic plating, which is a technique applicable to the selective plating step, even if it is immersed in a processing solution in each step, the adhesive property, etc. It is preferable that the properties of the above do not change. From such a viewpoint, an adhesive mainly composed of a heat-resistant thermoplastic resin is preferable because the content of a low-molecular compound that is easily eluted into the treatment liquid is small.

Examples of the laminating method include a method in which an adhesive solution is directly applied to the surface of an insulating film and drying, a method in which the adhesive solution is applied to another film and laminated with a laminator, and a method in which a film thinned by an inflation method or the like is thermocompressed. Is raised. In addition, by performing a surface treatment on the surface of the insulating film as necessary, the adhesive strength with the adhesive layer can be improved. General surface treatment methods include surface treatment with a silane coupling agent, corona treatment,
There is a plasma treatment and the like.

The thickness of the adhesive layer is preferably as thin as possible as long as it is uniform and a gap is not generated between a metal layer such as a copper foil or a multilayer substrate during lamination. When laminating with a multilayer board,
It is necessary to optimize the thickness of the adhesive layer according to the thickness of the circuit pattern layer so that no void is formed around the circuit pattern layer. [Regarding Metal Layer Laminating Method] Copper is generally used as a metal on which a circuit can be formed, but is not particularly limited as long as it is conductive and can be patterned. Examples of a method of laminating a metal layer such as a copper layer include a method of pressing a copper foil, a method of electroplating after electroless plating, a direct plating method, and a method of electroplating after sputtering or vapor deposition of copper. If necessary, pressure and heat may be applied by a hot press to improve the adhesiveness with the adhesive layer. When it is desired to form a fine pattern by thinning the metal layer, a plating method is preferable to a plating method in that a thin film can be easily formed. [Regarding the opening process] The method of forming a hole for a via hole is not particularly limited, but after removing a predetermined metal layer by an etching method, irradiating the exposed upper adhesive layer with a laser, Adhesive layer, insulating film,
And a method of decomposing and removing the lower adhesive layer is preferably used.

In the etching method, the upper and lower metal layers are coated with a coating material such as a resist so as to expose the metal layer at the portion to be removed and cover the metal layer at the other portions. Then, using the coating material as a mask, the exposed metal layer is removed. In addition, since this coating material covers the upper and lower metal layers also in the subsequent selective plating step, it is possible to prevent the plating metal from being deposited on the surface portions of the upper and lower metal layers. Then, the plating metal is selectively deposited only on the exposed portion of the lower metal layer (the lower surface of the via hole), and the plating metal is filled in the via hole. Therefore, it is very preferable to use an etching method in the opening step.

Further, according to the diameter of the hole of the coating material opened to expose the upper metal layer at the portion where the via hole is provided,
It is preferable to increase the diameter of the hole of the upper metal layer formed by removing the upper metal layer. Because, when filling the plating metal into the via hole, when the filled plating metal comes into contact with the upper metal layer, deposition of the plating metal starts on the entire upper metal layer. This is because the metal deposited on the upper metal layer is prevented from closing the holes in the upper metal layer before the plated metal passes over the upper surface of the upper metal layer. As a result, the formation of a via hole without voids becomes more reliable.

For this purpose, when etching the upper metal layer while masking with the coating material, the etching is further continued from a state where a hole having the same diameter as the hole of the coating material is opened in the upper metal layer. To the portion of the metal layer located below the covering material (the upper metal layer located below the portion forming the outer periphery of the hole in the covering material). That is, etching is performed until the diameter of the hole of the upper metal layer becomes larger than the diameter of the hole of the coating material. This makes it possible to achieve a state in which the covering material covering the portion of the upper metal layer other than the portion where the via hole is provided covers part of the region where the upper metal layer has been removed.

As the above-mentioned etching method, a general etching method can be used without any problem. The resist and the etchant are not limited as long as they have the necessary pattern resolution and etching function. Examples of the resist include a liquid resist for a printing method, a liquid resist for a photographic method, a dry film resist, an electrodeposition resist, and the like, and may be a negative type or a positive type. As an etching solution, a copper chloride type, an iron chloride type or the like is generally used.

In addition, as a method of drilling by laser,
There is no particular limitation as long as a hole can be made through the insulating resin layer (insulating film and both adhesive layers).
A carbon dioxide laser, a YAG laser, an excimer laser, or the like can be used. In particular, in the method of the present invention, in which the insulating resin layer is selectively decomposed and the metal layer is left, it is preferable to use a short wavelength and a wavelength in an ultraviolet region since the influence on the metal layer is small. Therefore, a YAG laser or an excimer laser is preferable.

Further, the diameter of the hole formed in the insulating resin layer by the laser needs to be smaller than the diameter of the hole formed in the upper metal layer. As a result, when filling the plated metal into the via hole, the time until the filled plated metal comes into contact with the upper metal layer can be delayed, and the deposition of the plated metal on the entire upper metal layer starts. Therefore, it is possible to prevent the metal deposited on the upper metal layer from closing the hole of the upper metal layer before the filled plating metal passes over the upper surface of the upper metal layer. Therefore, the formation of via holes without voids becomes more reliable.

The hole of the insulating resin layer formed by the laser can be easily formed smaller than the hole of the upper metal layer by narrowing the spot. Further, the etching can be performed so that the hole of the upper metal layer is larger than the hole of the insulating resin layer formed by laser. In this case, this can be achieved by enlarging the hole of the coating material used as an etching mask.

By combining the above methods, the metal layer above the portion where the via hole is provided is removed,
Further, in a part of the region where the upper metal layer has been removed, it is possible to make holes in the insulating film and both the adhesive layers until the lower metal layer is exposed. In addition,
By drilling holes in the insulating resin layer with a laser, 200
The diameter can be reduced to μm or less. [About Selective Plating Step] As a plating method for selectively filling a plating metal into a via hole formed in the opening step, an electrolytic plating method or the like can be applied. In particular, a general electrolytic copper plating method used for a printed wiring board is preferably employed. For example, a copper sulfate method, a copper pyrophosphate method, or the like can be used. Electroplating is preferably performed to a height equal to or higher than the upper surface of the upper metal layer in order to obtain sufficient connection reliability with the metal layer. If necessary, the plating surface is treated with a noble metal or another metal to improve the reliability of interlayer connection during lamination. [Metal layer removing step] As a method for removing the metal layers on both surfaces after the completion of the selective plating step, an etching method is preferable. The etching method used is not particularly limited as long as the metal layer can be removed and the characteristics of the insulating resin layer such as an adhesive layer can be maintained. Typical copper etchants for printed wiring boards include copper chloride solution, iron chloride solution, alkali etchant and the like. [Multilayering (Lamination)] When a multilayer printed wiring board is manufactured by laminating a double-sided printed wiring board or the like, it is preferable to use a hot press, particularly a vacuum press. The pressure, temperature, time, etc. must be determined mainly according to the properties of the adhesive.

Next, the materials constituting the double-sided laminate according to claims 8 to 10 and the respective methods used in the method for producing a double-sided laminate according to claims 11 to 16 will be described.
It will be described in detail. [About the insulating layer] The type of the insulating layer is not particularly limited as long as it can be applied as a base material of a printed wiring board and can be perforated using a laser or the like, depending on required characteristics. You can choose freely.

Examples of the material used for the insulating layer are exactly the same as the above-mentioned materials used for the insulating resin sheet. These are selected according to the requirements such as heat resistance, dielectric constant, and cost according to the application. Among them, particularly, an aramid resin and a liquid crystal resin film are preferable for the same reason as described above in the case of an insulating resin sheet. [Regarding metal layer and metal layer laminating method] Copper is generally used as the metal for the metal layer. However, even if other conductive metals are used, uniform thin film formation, wiring pattern formation, substrate adhesion, etc. are required. If the performance is satisfied, there is no particular limitation including the alloy. However, copper is most preferable in terms of conductivity, workability, stability and the like.

As a method of laminating a metal layer such as a copper layer,
The same method as in the case of the insulating resin sheet described above can be used. Further, similarly to the case of the insulating resin sheet, if necessary, the adhesiveness with the adhesive layer may be improved by pressurizing and heating with a hot press. When it is desired to form a fine pattern by thinning the metal layer, a plating method is preferred because a thin film can be formed more easily than a pressure bonding method. [Regarding the opening step] The method of forming a via hole is not particularly limited, but after removing a predetermined metal layer by an etching method, irradiating the exposed portion of the insulating layer with a laser, Is preferably used.

It is very preferable to use an etching method in the opening step for the same reason as in the case of the insulating resin sheet. The etching method and the perforating method using a laser are the same as those in the case of the insulating resin sheet described above, and thus the description thereof is omitted. [About the selective plating process] Copper is the most common plating metal.

Further, the plating method for selectively filling the plating metal into the via hole formed in the opening step is the same as that of the above-described insulating resin sheet, and therefore the description is omitted. However, in the double-sided laminate, one of the important points that determines the reliability of the substrate obtained by subsequent processing is the reliability of the via hole.
Therefore, that the plating metal completely fills the hole and that there are no voids, and that the plating metal is integrally joined to the upper and lower metal layers and that there is no constriction in shape,
This is an important point. For this reason, it is essential to completely fill the upper metal layer with the plating metal that is filled in the via hole when the hole is closed during processing.

For this reason, the above-described requirements in the description of the opening step are necessary, and the plating is also performed in the selective plating step until the plating metal filling the hole for the via hole completely exceeds the upper surface of the upper metal layer. It is necessary to perform plating until the via holes in the entire substrate are securely filled with the plated metal. Then, a convex portion exists on the upper surface of the upper metal layer. However, in the subsequent resist formation for forming a circuit, the convex portion hinders the formation of a fine pattern. Therefore, after the selective plating step, it is necessary to polish and flatten the upper surface of the upper metal layer. This polishing is also an underlying treatment for improving the adhesion of the resist, and is efficient.

The polishing can be performed using an apparatus used in a general manufacturing process of a printed wiring board. For example, a buffing machine, a jet scrub polishing machine, a belt polishing machine, an orbital sander, chemical polishing by soft etching and the like can be mentioned. For example, in a belt polishing machine,
If the hardness of the roll that presses the polishing cloth against the substrate is increased, only the convex portions are polished. An orbital sander is most suitable for polishing only the convex portion, but for polishing other than the via hole portion (convex portion) together,
Belt polishing or buff polishing with a roll of low hardness is effective. [Regarding circuit pattern formation] As a method of patterning the metal layers on both sides of the double-sided laminated board and providing wiring, a general method for manufacturing a printed wiring board, such as a pattern etching method or a pattern plating method, can be applied. .

In the pattern etching method, a negative pattern is formed using a liquid resist for printing, a liquid or dry film type photoresist, an electrodeposition resist, and the like, and is etched with an etching solution such as copper chloride or iron chloride. In the pattern plating method, a positive pattern is formed with a dry film type photoresist or the like, pattern plating is performed by electrolytic plating, and after removing the resist, the mask metal layer is removed by etching.

Generally, the etching method is characterized by high productivity, and the pattern plating method is advantageous for forming lines having a high aspect ratio (line thickness / line width ratio). Select a construction method suitable for the specifications. Further, the thickness of the metal layer to be used needs to be appropriately selected according to the method of forming the circuit pattern.
In the pattern etching method, the thickness of the metal layer must match the thickness of the circuit pattern. In the case of the pattern plating method, the fine pattern should be as thin as possible as long as the conductivity as a seed layer for pattern plating is maintained. It is advantageous for formation.

[0067]

Embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals. (First Embodiment) First, FIG.
This will be described with reference to FIG.

A thermoplastic polyimide resin (trade name: Iupitite (solid content: 20% by weight) was coated on both upper and lower surfaces of an insulating film 10 composed of an aramid film (trade name; Aramica, manufactured by Asahi Kasei Corporation) having a thickness of 4.5 μm. THF solution) and Ube Industries, Ltd.) were applied at a thickness of 4 μm on each side to obtain an insulating resin sheet material in which adhesive layers 11 and 11 were laminated on both sides. By plating this sheet,
Copper foil layers 12a and 12b having a thickness of 3 μm were laminated on both upper and lower surfaces (FIG. 1A).

The obtained copper foil layered sheet was subjected to heat treatment under pressure at 270 ° C. and 0.98 MPa by a hot press. Further, dry film resists 13 having a film thickness of 10 μm were laminated on both sides, and exposed and developed so as to form a resist opening 15 having a diameter of 11 μm, thereby forming a resist pattern (FIG. 1B). Next, the exposed portion of the upper copper foil layer 12a is removed by etching,
The upper adhesive layer 11 was exposed (FIG. 1C).

Then, using an excimer laser irradiation device and a glass chrome mask, the exposed adhesive layer 11 is irradiated with a laser by a reduced projection method, and both adhesive layers 11 and 11 are exposed.
And the insulating film 10 is disassembled and removed, and the opening diameter is 10 μm.
A hole 16 for a via hole was made to expose the lower copper foil layer 12b (FIG. 1 (d)). By copper sulfate plating method,
Electroplating is performed by applying an electric potential only to the lower copper foil layer 12b, the plating metal (copper) 17 is filled in the via hole 16 and the plating interface exceeds the upper surface of the upper copper foil layer 12a. To complete the plating (FIG. 1 (e)).

After the dry film resists 13 were stripped (FIG. 1 (f)), the upper and lower copper foil layers 12a, 12b were removed by copper chloride etching (FIG. 1 (g)). Thus, an insulating resin sheet 1 having via holes filled with metallic copper was obtained. Next, the conductivity of the via hole of the insulating resin sheet 1 thus obtained was measured.

On both sides of the insulating resin sheet 1 as described above,
A copper foil (not shown) having a thickness of 9 μm is heated at 270 ° C. and 0.98 M
Pressure treatment was performed under the conditions of Pa and 40 minutes, and the layers were laminated. Further, a dry film resist (not shown) having a film thickness of 10 μm is laminated on both surfaces thereof, and exposed, developed, and pattern-etched according to a conventional method, and lands (not shown) having a diameter of 40 μm are respectively formed on both sides of the via hole. Formed. The resistance between the lands on both surfaces was measured to determine the conductivity of the via hole. As a result, good conductivity was shown at 3.5 mΩ / via hole. Second Embodiment An insulating resin sheet according to a second embodiment will be described with reference to FIG.

The steps up to the step of FIG. 2B are completely the same as the steps up to the step of FIG. 1B of the first embodiment. Next, the exposed portion of the upper copper foil layer 12a and the portion located below the outer peripheral portion of the resist opening 15 were removed by etching to expose the upper adhesive layer 11 ((FIG. 2) c)). Copper foil layer 12a formed by the removal
The opening 18 had a diameter of 15 μm.

Then, the steps after the step (d) in FIG. 2 are completely the same as the steps after the step (d) in FIG. 1 of the first embodiment.
An insulating resin sheet 1 having via holes filled with metallic copper was obtained ((g) in FIG. 2). Next, the conductivity of the via hole of the insulating resin sheet 1 thus obtained was measured in exactly the same manner as in the first embodiment. As a result, 3.5
It showed good conductivity with mΩ / via hole. (Third Embodiment) Next, an embodiment of a double-sided laminated board according to the present invention will be described with reference to FIG.

A 30 μm-thick dry film is formed on both sides of a glass epoxy double-sided laminated board (FIG. 3A) in which copper foils 22 a and 22 b of 35 μm are laminated on both upper and lower surfaces of an insulating layer 20 having a thickness of 100 μm. The resists 23, 23 were laminated, and exposed and developed to form a resist opening 25 having a diameter of 110 μm, thereby forming a resist pattern (FIG. 3B).

Next, the upper copper foil layer 22 is etched.
The exposed portion of “a” was removed to expose the insulating layer 20 (FIG. 3C). The insulating layer 20 is irradiated with a laser using a carbon dioxide laser irradiation apparatus, and the insulating layer 20 is decomposed and removed to form a via hole 26 having an opening diameter of 100 μm.
The lower copper foil layer 22b was exposed (FIG. 3D).

The lower copper foil layer 22 is formed by copper sulfate plating.
Electroplating is performed by applying a potential to only b, plating metal 27 (copper) is filled in the via hole 26, and plating is completed when the plating interface exceeds the upper surface of the upper copper foil layer 22a ( FIG. 3 (e)). Then, the dry film resists 23 were peeled off to obtain a via-hole-filled double-sided laminate 2 ((f) in FIG. 3).

Next, a method for manufacturing a double-sided printed wiring board 3 from the obtained double-sided laminated board 2 will be described. Double-sided laminated board 2
A dry film resist 31 having a film thickness of 30 μm is again laminated on both sides of the substrate to form a resist pattern for etching (FIG. 3 (g)). Then, pattern etching is performed by a copper chloride etching method (FIG. 3 (h)).
The dry film resists 31, 31 are peeled off, and L / S
A via-hole-filled double-sided printed wiring board 3 having a wiring pattern of = 50/50 μm was obtained ((i) in FIG. 3).
The resistance value of the via hole of this double-sided printed wiring board 3 is 0.5.
Good conductivity was shown at 4 mΩ / via hole. (Fourth Embodiment) A double-sided laminated board according to a fourth embodiment will be described with reference to FIG.

The steps up to the step of FIG. 4B are exactly the same as the steps up to the step of FIG. 3B of the third embodiment. Next, the exposed portion of the upper copper foil layer 22a and the portion located below the outer peripheral portion of the resist opening 25 were removed by etching to expose the insulating layer 20 (FIG. 4C). . The diameter of the opening 28 of the copper foil layer 22a formed by the removal was 165 μm.

Then, the steps after step (d) in FIG. 4 are completely the same as the steps after step (d) in FIG.
A via-hole-filled double-sided laminate 2 was obtained (FIG. 4 (f)). Next, from the obtained double-sided laminate 2, L / L was obtained in exactly the same manner as in the step after FIG. 3 (g) of the third embodiment.
A via-hole-filled double-sided printed wiring board 3 having a wiring pattern of S = 50/50 μm was obtained ((i) in FIG. 4). The resistance value of the via hole of this double-sided printed wiring board 3 was 0.4 mΩ / via hole, indicating good conductivity. (Fifth Embodiment) A double-sided laminated board according to a fifth embodiment will be described with reference to FIG.

On both upper and lower surfaces of an insulating layer 20 made of polyimide having a thickness of 50 μm, copper foils 22 a and 22 b having a thickness of 12 μm were laminated (FIG. 3A). Then, a dry film resist 23 having a thickness of 29 μm was laminated on both surfaces of the polyimide double-sided laminated board, and exposed and developed so as to form a resist opening 25 having a diameter of 80 μm, thereby forming a resist pattern (FIG. 3 (b)).

The exposed portion of the upper copper foil layer 22a is removed by etching to expose the insulating layer 20 (FIG. 3C), and then the insulating layer 20 is irradiated with a laser using an excimer laser irradiator. Then, the insulating layer 20 was decomposed and removed to form a hole 26 for a via hole having an opening diameter of 70 μm, thereby exposing the lower copper foil layer 22b (FIG. 3D). Then, in exactly the same manner as in the third embodiment, a plating metal 27 (copper) is filled in the via hole 26 by copper sulfate plating (FIG. 3E).
23 was peeled off to obtain a via-hole-filled double-sided laminate 2 (FIG. 3 (f)).

Next, a method of manufacturing a double-sided printed wiring board 3 from the obtained double-sided laminated board 2 will be described. Except for the point that the film thickness of the dry film resists 31, 31 is 20 μm and the obtained wiring pattern is L / S = 30/30 μm, pattern etching is performed in exactly the same manner as in the third embodiment, and the via holes are formed. The filling type double-sided printed wiring board 3 was obtained ((i) of FIG. 3). The resistance value of the via hole of this double-sided printed wiring board 3 was 0.4 mΩ / via hole, indicating good conductivity. (Sixth Embodiment) A double-sided laminated board according to a sixth embodiment will be described with reference to FIG.

The steps up to the step of FIG. 4B are completely the same as the steps up to the step of FIG. 3B of the fifth embodiment. Next, the exposed portion of the upper copper foil layer 22a and the portion located below the outer peripheral portion of the resist opening 25 were removed by etching to expose the insulating layer 20 (FIG. 4C). . The diameter of the opening 28 of the copper foil layer 22a formed by the removal was 100 μm.

Then, the steps after step (d) in FIG. 4 are exactly the same as the steps after step (d) in FIG.
A via-hole-filled double-sided laminate 2 was obtained (FIG. 4 (f)). Next, from the obtained double-sided laminated board 2, L / L was obtained in exactly the same manner as in and after the step of FIG.
A via-hole-filled double-sided printed wiring board 3 having a wiring pattern of S = 30/30 μm was obtained ((i) in FIG. 4). The resistance value of the via hole of this double-sided printed wiring board 3 was 0.4 mΩ / via hole, indicating good conductivity. (Seventh Embodiment) A double-sided laminated board according to a seventh embodiment will be described with reference to FIG.

The process of irradiating the insulating layer 20 with a laser using an excimer laser irradiating apparatus, decomposing and removing the insulating layer 20, opening a hole 26 for a via hole, and exposing the lower copper foil layer 22b is described below. This is exactly the same as the sixth embodiment (FIG. 5 (d)). Next, electrolytic plating is performed by applying a potential only to the lower copper foil layer 22b by copper sulfate plating, and plating metal (copper) 2 is formed in the hole 26 for the via hole.
7 was charged. Then, on the entire surface of the processed substrate,
The plating was completed when the plating interface exceeded the upper surface of the upper copper foil layer 22a (FIG. 5 (e)).

After the dry film resists 23 were stripped, the shape of the copper foil surface (the upper surface of the upper copper foil layer 22a) was measured with an external shape measuring instrument. No portion was observed, but there was a via hole having a portion that was 10 μm higher than the periphery (FIG. 5 (f)). Therefore, using a belt having a roughness of # 1000, a feed speed of 1 m / min, and a belt rotation speed of 2
The copper foil surface was polished by a belt polisher at 00 m / min. After that, when the measurement was again performed by the external shape measuring device, no convex portion of 1 μm or more from the surrounding copper foil surface was observed in the via hole portion ((f ′) in FIG. 5).

On both sides of the double-sided laminate 2, a film having a thickness of 10 μm
The m dry film resists 31 are laminated to form a resist pattern for etching (FIG. 5 (g)). Then, pattern etching is performed by a copper chloride etching method (FIG. 5 (h)), the dry film resists 31, 31 are peeled off, and a via hole filling type double-sided printed wiring board having a wiring pattern of L / S = 20/20 μm. 3 was obtained ((i) in FIG. 5).

The defect of the wiring pattern is 200 × 200 m
Since there was no flat portion in the region of m, the adhesion of the dry film resist was proved to be extremely high. (Eighth Embodiment) A double-sided laminated board according to an eighth embodiment will be described with reference to FIG. Until the step of peeling off the dry film resists 13 in the first embodiment, that is, up to (f) of FIG. 1 in the drawing, the via hole filled with plated copper is exactly the same as in the first embodiment. Was obtained.

Next, the conductivity of the via hole of the double-sided laminate 2 thus obtained was measured. This double-sided laminate 2
A dry film resist (not shown) having a thickness of 10 μm was laminated on both surfaces of the substrate, and exposed, developed, and pattern-etched in accordance with a standard method, so that lands (not shown) having a diameter of 40 μm were formed on both sides of the via hole. The resistance between the lands on both surfaces was measured to determine the conductivity of the via hole. As a result, good conductivity was shown at 3.5 mΩ / via hole. (Ninth Embodiment) A double-sided laminated board according to a ninth embodiment will be described with reference to FIG.

Up to the step of peeling off the dry film resists 13 in the second embodiment, that is, up to FIG. 2 (f) in the drawing, filling with plated copper is performed in exactly the same manner as in the second embodiment. A double-sided laminated board 2 having a via hole (FIG. 2 (f)) was obtained. Next, the conductivity of the via hole of the double-sided laminate 2 thus obtained was measured. On both sides of this double-sided laminated board 2, a 10 μm thick
Then, exposure, development, and pattern etching were performed in accordance with a conventional method to form lands (not shown) having a diameter of 40 μm on both sides of the via hole. As a result of measuring the resistance value between the lands on both surfaces and determining the conductivity of the via hole, 3.5 mΩ /
Good conductivity was shown in the via hole. (Tenth Embodiment) Next, an embodiment of a multilayer printed wiring board according to the present invention will be described with reference to FIG.

First, a desired wiring pattern is applied to the double-sided laminated board 2 manufactured in the fifth embodiment by a conventional method as described above, and a double-sided printed wiring board 3 is manufactured.
The insulating resin sheet 1 of the first embodiment is interposed between the two double-sided printed wiring boards 3 so that the positions of the via holes are matched (FIG. 6A), and the hot pressing method as described above is used. To obtain a multilayer (four-layer) printed wiring board 4 (FIG. 6B). (Eleventh Embodiment) A multilayer printed wiring board according to an eleventh embodiment will be described with reference to FIG.

First, a desired wiring pattern is applied to the double-sided laminated board 2 manufactured in the seventh embodiment by a conventional method as described above, and a double-sided printed wiring board 3 is manufactured.
The insulating resin sheet 1 of the second embodiment is interposed between the two double-sided printed wiring boards 3 so that the positions of the via holes are matched (FIG. 7A), and the hot press method as described above is used. To obtain a multilayer (four-layer) printed wiring board 4 (FIG. 7B). (Twelfth Embodiment) A method of manufacturing a multilayer printed wiring board from a double-sided laminated board 2 substantially the same as the eighth embodiment and the insulating resin sheet 1 of the first embodiment will be described with reference to FIGS. I will explain it.

The point that the thickness of the adhesive layers on both sides is 2 μm;
A double-sided laminate 2 was manufactured in exactly the same manner as in the eighth embodiment except that the thickness of the copper foil was 9 μm (FIG. 1).
(F)). Dry film resists 32, 32 each having a thickness of 10 μm were laminated on both surfaces of the double-sided laminated board 2, and exposed and developed according to a standard method (FIG. 8A). Then, pattern etching is performed in the same manner as in the conventional method (FIG. 8B), and the diameter of the via hole is reduced to 40 at the openings on both sides.
A wiring pattern having a land (not shown) of μm was formed. Then, the dry film resists 32 were stripped to obtain a double-sided printed wiring board 3 having an insulating film filled with plated copper and a via hole penetrating both adhesive layers (FIG. 8C). As a result of measuring the resistance value between the lands on both sides and determining the conductivity of the via hole, 2.5 m was obtained.
Good conductivity was shown in Ω / via hole.

Next, the insulating resin sheet 1 manufactured according to the first embodiment is interposed between the two double-sided printed wiring boards 3 and laminated with the positions of the respective via holes aligned (see FIG. 8). (D)) and bonded by a vacuum hot press to obtain a multilayer (four-layer) printed wiring board (FIG. 8 (e)). Press conditions were 270 ° C., 2.9 MPa, and 30 minutes. Three
Resistance value of the part where two via holes are connected in series is 9m
Good conductivity was shown in the Ω / 3 via hole. (Thirteenth Embodiment) A method of manufacturing a multilayer printed wiring board from a double-sided laminate 2 substantially the same as the ninth embodiment and the insulating resin sheet 1 of the second embodiment will be described with reference to FIGS. This will be described with reference to FIG.

The thickness of the adhesive layers 11 on both sides is 2 μm.
, The point where the thickness of the copper foil layers 12a and 12b is 9 μm, and after the process of FIG.
5 was polished by a belt polisher at a feed speed of 1 m / min and a belt rotation speed of 200 m / min.
(F '), except that the upper surface of the upper copper foil layer 12a was flattened similarly to the ninth embodiment. The metal 17 was manufactured by flattening the irregularities on the upper surface.

A dry film resist 32 having a thickness of 10 μm was laminated on both sides of the double-sided laminate 2 and exposed and developed according to a standard method (FIG. 9A). Then, pattern etching is performed in the same manner as in the conventional method (FIG. 9B), and a diameter 40
A wiring pattern having a land (not shown) of μm was formed. Then, the dry film resists 32, 32 were peeled off to obtain a double-sided printed wiring board 3 having a via hole penetrating the insulating film and both adhesive layers and being filled with plated copper (FIG. 9 (c)). As a result of measuring the resistance value between the lands on both surfaces and determining the conductivity of the via hole, 2.5
Good conductivity was shown at mΩ / via hole.

Next, the insulating resin sheet 1 manufactured according to the second embodiment is interposed between the two double-sided printed wiring boards 3 and is laminated so that the positions of the via holes are aligned (see FIG. 9). (D)) and bonded by a vacuum hot press to obtain a multilayer (four-layer) printed wiring board (FIG. 9 (e)). The pressing conditions were 270 ° C., 2.9 MPa, and 30 minutes. Three
Resistance value of the part where two via holes are connected in series is 9m
Good conductivity was shown in the Ω / 3 via hole.

[0099]

As described above, the insulating resin sheet according to the first and second aspects of the present invention and the double-sided laminate according to the eighth to tenth aspects of the present invention provide a via-hole-filled multilayer printed wiring board capable of high-density mounting. It is suitable as a material to be manufactured. According to the method for manufacturing an insulating resin sheet according to claims 3 to 7 of the present invention, it is possible to easily manufacture the insulating resin sheet as described above.

Further, according to the method for manufacturing a double-sided laminated board of the present invention, it is possible to easily produce the double-sided laminated board as described above. Further, the multilayer printed wiring board according to claim 17 of the present invention is a via-hole-filled multilayer printed wiring board capable of high-density mounting, and the method for manufacturing a multilayer printed wiring board according to claim 18 of the present invention. According to this, it is easy to manufacture the multilayer printed wiring board.

[Brief description of the drawings]

FIG. 1 shows a manufacturing process of an insulating resin sheet according to a first embodiment;
It is a figure explained by the sectional view of a layered product in each stage.

FIG. 2 shows a manufacturing process of the insulating resin sheet of the second embodiment,
It is a figure explained by the sectional view of a layered product in each stage.

FIG. 3 is a diagram illustrating a manufacturing process of a double-sided laminated board according to a third embodiment with reference to cross-sectional views of a laminate at each stage.

FIG. 4 is a diagram illustrating a manufacturing process of a double-sided laminated board according to a fourth embodiment with reference to cross-sectional views of a laminate at each stage.

FIG. 5 is a diagram illustrating a manufacturing process of a double-sided laminated board according to a seventh embodiment with reference to cross-sectional views of a laminate at each stage.

FIG. 6 is a diagram illustrating a manufacturing process of the multilayer printed wiring board according to the tenth embodiment with reference to cross-sectional views of a laminate at each stage.

FIG. 7 is a diagram illustrating a manufacturing process of the multilayer printed wiring board according to the eleventh embodiment with reference to cross-sectional views of a laminate at each stage.

FIG. 8 is a diagram illustrating a manufacturing process of the multilayer printed wiring board according to the twelfth embodiment, with reference to cross-sectional views of a laminate at each stage.

FIG. 9 is a diagram illustrating a manufacturing process of the multilayer printed wiring board according to the thirteenth embodiment with reference to cross-sectional views of a laminate at each stage.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating resin sheet 2 Double-sided laminated board 3 Double-sided printed wiring board 4 Multilayer printed wiring board 10 Insulating film 11 Adhesive layer 12a, 22a Upper copper foil layer 12b, 22b Lower copper foil layer 16, 26 Hole for via hole 17 , 27 Plating metal 20 Insulation layer

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA24 BB03 BB12 CC25 CC33 CC53 CD11 CD17 CD25 CD32 5E346 CC03 CC04 CC05 CC08 CC10 CC12 CC32 CC41 DD12 DD17 DD24 DD48 EE06 EE08 EE12 FF04 FF07 FF14 FF22 GG15 GG22 HH25

Claims (18)

[Claims] 1. An insulating resin sheet comprising an insulating film and an adhesive layer laminated on both surfaces thereof, wherein a via hole penetrating through the insulating film and both the adhesive layers and being filled with a plating metal is provided. An insulating resin sheet, comprising: 2. The insulating resin sheet according to claim 1, wherein the insulating film is an aramid film. 3. A laminating step of laminating an adhesive layer on both upper and lower surfaces of an insulating film and further laminating two upper and lower metal layers on both surfaces thereof, and a step of providing a via hole, the upper metal layer, the insulating film, And an opening step of removing both the adhesive layers and exposing a hole exposing the lower metal layer, and selecting the filling of the hole with a plating metal by a plating method of applying a potential to the lower metal layer. A method for manufacturing an insulating resin sheet, comprising: a plating step; and a metal layer removing step of removing the upper and lower metal layers after the completion of the selective plating step. 4. A laminating step of laminating an adhesive layer on both upper and lower surfaces of an insulating film, and further laminating two upper and lower metal layers on both surfaces, and a removing step of removing a portion of the upper metal layer where a via hole is provided. An opening step of making a hole in the insulating film and both the adhesive layers until the lower metal layer is exposed, in a part of the region where the upper metal layer has been removed, A selective plating step of filling the hole with a plating metal by a plating method of applying a potential to the metal layer, and a metal layer removing step of removing the upper and lower metal layers after the completion of the selective plating step. A method for producing an insulating resin sheet. 5. The selective plating step, wherein the opening step is performed by using a covering material that covers a portion of the upper metal layer other than a portion where the via hole is provided and an entire surface of the lower metal layer. The method according to claim 3, wherein the step (a) is performed in a state where the upper and lower metal layers are covered with the covering material. 6. The method according to claim 1, wherein the removing step is performed by using a coating material covering a portion of the upper metal layer other than the portion where the via hole is provided and an entire surface of the lower metal layer. 5. The method according to claim 4, wherein a portion provided with is provided, and the selective plating step is performed in a state where the upper and lower metal layers are covered with the covering material. 7. The coating material covering a portion of the upper metal layer other than a portion where the via hole is provided, covers a part of a region from which the upper metal layer is removed. Production method of an insulating resin sheet. 8. A double-sided laminated plate in which a metal layer is laminated on both sides of an insulating layer, comprising a via hole penetrating the insulating layer and being filled with a plating metal, wherein the plating metal is integrated with the metal layers on both sides. A double-sided laminated plate characterized by being bonded. 9. A double-sided laminated board in which a metal layer is laminated on both sides of an insulating layer, comprising a via hole penetrating the insulating layer and being filled with a plating metal, wherein the plating metal is integrated with the metal layers on both sides. And a portion of the plated metal exposed to the outside is flat. 10. The double-sided laminate according to claim 8, wherein the insulating layer is an aramid film. 11. A double-sided laminated plate in which upper and lower two metal layers are laminated on both surfaces of an insulating layer, the upper metal layer and the insulating layer in a portion where a via hole is provided are removed, and the lower metal layer is exposed. An opening step of making a hole, a selective plating step of filling the hole with a plating metal by a plating method of applying a potential to the lower metal layer, and integrally bonding the upper metal layer and the plating metal, A method for producing a double-sided laminate, comprising: 12. A portion where a via hole is provided in the upper metal layer of a double-sided laminated plate in which two metal layers are laminated on both surfaces of an insulating layer, and a region where the upper metal layer is removed is further removed. In part, an opening step of making a hole in the insulating layer until the lower metal layer is exposed, and filling the hole with a plating metal by a plating method of applying a potential to the lower metal layer; A selective plating step of integrally bonding the metal layer and the plated metal to each other. 13. The selective plating step, wherein the opening step is performed by using a covering material that covers a portion of the upper metal layer other than a portion where the via hole is provided and an entire surface of the lower metal layer. The method for producing a double-sided laminated board according to claim 11, wherein the step (a) is performed in a state where the upper and lower metal layers are covered with the coating material. 14. The method according to claim 14, wherein the opening step uses a covering material that covers a portion of the upper metal layer other than a portion where the via hole is provided and an entire surface of the lower metal layer. 13. The method for manufacturing a double-sided laminated board according to claim 12, wherein a portion provided with is provided, and the selective plating step is performed in a state where the upper and lower metal layers are covered with the covering material. 15. The coating material covering a portion of the upper metal layer other than the portion where the via hole is provided, covers a part of a region where the upper metal layer is removed. Production method of a double-sided laminated board. 16. The selective plating step, wherein the plating metal is filled into the hole beyond the upper surface of the upper metal layer, and thereafter, the upper surface is polished and flattened. 15. The method for producing a double-sided laminate according to 14 above. 17. A multilayer printed wiring board formed by laminating an insulating resin sheet and a double-sided printed wiring board,
The said insulating resin sheet is the insulating resin sheet of Claim 1 or 2, The said double-sided printed wiring board is Claims 8-1.
A double-sided printed wiring board, which is a double-sided printed wiring board manufactured by patterning the metal layers on both sides of the double-sided laminated board according to any one of the above-mentioned items and providing wiring. 18. A wiring step of patterning the metal layers on both sides of the double-sided laminated board according to claim 8 and providing wiring, and a double-sided laminated board provided with the wiring. A laminating step of laminating the insulating resin sheet of
The method for manufacturing a multilayer printed wiring board according to claim 17, further comprising: