JPS62124896U - - Google Patents
Info
- Publication number
- JPS62124896U JPS62124896U JP1081186U JP1081186U JPS62124896U JP S62124896 U JPS62124896 U JP S62124896U JP 1081186 U JP1081186 U JP 1081186U JP 1081186 U JP1081186 U JP 1081186U JP S62124896 U JPS62124896 U JP S62124896U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- base material
- coating layer
- surface coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000002345 surface coating layer Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Description
第１図は、本考案の一実施例による可撓性回路
基板のシールド構造を概念的に示す要部断面構成
図、第２図は、回路パターンとアース・シールド
パターンとに導通部を設けるように構成した例を
示す同様な要部断面構成図、第３図は、従来の両
面可撓性回路基板及びスルーホール導通の形成手
法でシールド構造を設けるようにした場合の概念
的な要部断面構成図、そして、第４図は、片面可
撓性回路基板にシールド層を有する他の可撓性回
路基板を接合してシールド構造を構成するように
した従来の他のシールド構造例を説明する為の同
様な要部断面構成図である。
１：可撓性ベース材、２：回路パターン、３：
表面被覆層、４：アース・シールドパターン、４
Ａ：導通部、５：表面保護層。
FIG. 1 is a cross-sectional configuration diagram of main parts conceptually showing a shield structure of a flexible circuit board according to an embodiment of the present invention, and FIG. 3 is a conceptual cross-sectional view of the main parts when a shield structure is provided using a conventional double-sided flexible circuit board and through-hole conduction formation method. The configuration diagram and FIG. 4 explain another example of a conventional shield structure in which a shield structure is constructed by bonding a single-sided flexible circuit board to another flexible circuit board having a shield layer. It is a similar cross-sectional configuration diagram of essential parts. 1: Flexible base material, 2: Circuit pattern, 3:
Surface coating layer, 4: Earth shield pattern, 4
A: Conductive portion, 5: Surface protective layer.
Claims (1)
すると共に該回路パターン上に表面被覆層を設け
るようにした可撓性回路基板に於いて、上記ベー
ス材又は表面被覆層の面上に導電性インクからな
るアース・シールドパターンを形成するように構
成したことを特徴とする可撓性回路基板のシール
ド構造。 In a flexible circuit board in which a required circuit pattern is formed on a flexible base material and a surface coating layer is provided on the circuit pattern, a conductive layer is provided on the surface of the base material or surface coating layer. A shield structure for a flexible circuit board, characterized in that it is configured to form an earth shield pattern made of ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1081186U JPS62124896U (en) | 1986-01-28 | 1986-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1081186U JPS62124896U (en) | 1986-01-28 | 1986-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124896U true JPS62124896U (en) | 1987-08-08 |
Family
ID=30797455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1081186U Pending JPS62124896U (en) | 1986-01-28 | 1986-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124896U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017143275A (en) * | 2013-12-26 | 2017-08-17 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Production method of electromagnetic wave shielding film and electromagnetic wave shielding film produced by the method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596861B2 (en) * | 1975-05-19 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | Method for producing 5-[(2-halogeno-1-hydroxy)alkyl[carbostyryl derivative] |
-
1986
- 1986-01-28 JP JP1081186U patent/JPS62124896U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596861B2 (en) * | 1975-05-19 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | Method for producing 5-[(2-halogeno-1-hydroxy)alkyl[carbostyryl derivative] |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017143275A (en) * | 2013-12-26 | 2017-08-17 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Production method of electromagnetic wave shielding film and electromagnetic wave shielding film produced by the method |
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