JPS6076091U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6076091U
JPS6076091U JP16777983U JP16777983U JPS6076091U JP S6076091 U JPS6076091 U JP S6076091U JP 16777983 U JP16777983 U JP 16777983U JP 16777983 U JP16777983 U JP 16777983U JP S6076091 U JPS6076091 U JP S6076091U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board
pattern layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16777983U
Other languages
Japanese (ja)
Inventor
山野 純一
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP16777983U priority Critical patent/JPS6076091U/en
Publication of JPS6076091U publication Critical patent/JPS6076091U/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図はそれぞれプリント配線基板に対する
従来のシールド構造を示す断面図及び側面図、第ana
w b及びCはそれぞれこの考案の実施例を示す断面図
、一部破断正面図及び背面図、第4図a、 b及びCは
それぞれこの考案の実施例の全体概略を示す断面図であ
る。 図において、10・・・・・・基板、20・・・・・・
配線パターン、40・・・・・・シールド用パターン層
。なお、図中、同一符号は同一または相当部分を示す。
FIGS. 1 and 2 are a cross-sectional view and a side view showing a conventional shield structure for a printed wiring board, respectively, and FIG.
w b and C are a sectional view, a partially cutaway front view, and a rear view showing an embodiment of this invention, respectively, and FIGS. 4a, b, and C are sectional views showing an overall outline of an embodiment of this invention, respectively. In the figure, 10... substrate, 20...
Wiring pattern, 40... Pattern layer for shielding. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)  配線パターンを有する基板内に該基板の面方
向に広がるシールド用パターン層が形成されていること
を特徴とするプリント配線基板。
(1) A printed wiring board characterized in that a shield pattern layer extending in the surface direction of the board is formed within the board having a wiring pattern.
(2)シールド用パターン層が配線パターンのアース回
路を形成していることを特徴とする実用新案登録請求の
範囲第1項記載のプリント配線基板。
(2) The printed wiring board according to claim 1, wherein the shielding pattern layer forms a ground circuit of the wiring pattern.
JP16777983U 1983-10-27 1983-10-27 printed wiring board Pending JPS6076091U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16777983U JPS6076091U (en) 1983-10-27 1983-10-27 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16777983U JPS6076091U (en) 1983-10-27 1983-10-27 printed wiring board

Publications (1)

Publication Number Publication Date
JPS6076091U true JPS6076091U (en) 1985-05-28

Family

ID=30366977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16777983U Pending JPS6076091U (en) 1983-10-27 1983-10-27 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6076091U (en)

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