CN104576570B - 电子部件、电子装置以及用于制造电子部件的方法 - Google Patents

电子部件、电子装置以及用于制造电子部件的方法 Download PDF

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Publication number
CN104576570B
CN104576570B CN201410575148.8A CN201410575148A CN104576570B CN 104576570 B CN104576570 B CN 104576570B CN 201410575148 A CN201410575148 A CN 201410575148A CN 104576570 B CN104576570 B CN 104576570B
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CN
China
Prior art keywords
component
thermal conductivity
electronic unit
framework
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410575148.8A
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English (en)
Chinese (zh)
Other versions
CN104576570A (zh
Inventor
片濑悠
伊藤富士雄
小坂忠志
都筑幸司
片冈郎
片冈一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN104576570A publication Critical patent/CN104576570A/zh
Application granted granted Critical
Publication of CN104576570B publication Critical patent/CN104576570B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201410575148.8A 2013-10-25 2014-10-24 电子部件、电子装置以及用于制造电子部件的方法 Expired - Fee Related CN104576570B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013222521A JP6214337B2 (ja) 2013-10-25 2013-10-25 電子部品、電子機器および電子部品の製造方法。
JP2013-222521 2013-10-25

Publications (2)

Publication Number Publication Date
CN104576570A CN104576570A (zh) 2015-04-29
CN104576570B true CN104576570B (zh) 2017-09-12

Family

ID=52812013

Family Applications (1)

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CN201410575148.8A Expired - Fee Related CN104576570B (zh) 2013-10-25 2014-10-24 电子部件、电子装置以及用于制造电子部件的方法

Country Status (4)

Country Link
US (1) US9585287B2 (enExample)
JP (1) JP6214337B2 (enExample)
CN (1) CN104576570B (enExample)
DE (1) DE102014221650A1 (enExample)

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JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
CN106257652B (zh) * 2015-06-16 2020-03-27 台达电子企业管理（上海）有限公司 封装模块及封装方法
JP6431618B2 (ja) * 2015-10-26 2018-11-28 京セラ株式会社 撮像装置、車両、および筐体
US10580811B2 (en) 2015-11-24 2020-03-03 Sony Corporation Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus
JP6648525B2 (ja) * 2015-12-28 2020-02-14 株式会社ニコン 基板、撮像ユニットおよび撮像装置
CN106252293B (zh) * 2016-01-06 2018-12-18 苏州能讯高能半导体有限公司 封装外壳及应用该封装外壳的电子元件
US9971235B2 (en) * 2016-01-29 2018-05-15 Seiko Epson Corporation Light source device, projector, and method of manufacturing light source device
EP3759827A4 (en) * 2018-04-06 2021-11-10 IPG Photonics Corporation OPTICAL UNDERWATER AMPLIFIER WITH HIGH VOLTAGE INSULATION
CN110544674A (zh) * 2018-05-28 2019-12-06 浙江清华柔性电子技术研究院 芯片集成结构
CN109830494A (zh) * 2019-03-13 2019-05-31 赵雯萱 一种具有散热功能的影像芯片封装结构及其制作方法
JP2020150207A (ja) 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
JP7362280B2 (ja) * 2019-03-22 2023-10-17 キヤノン株式会社 パッケージユニットの製造方法、パッケージユニット、電子モジュール、および機器
JP7406314B2 (ja) 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

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US6759266B1 (en) * 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
US7145253B1 (en) * 2004-06-09 2006-12-05 Amkor Technology, Inc. Encapsulated sensor device

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JP2001102470A (ja) * 1999-09-30 2001-04-13 Sony Corp 半導体装置
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JP2004087512A (ja) * 2002-06-25 2004-03-18 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2004165181A (ja) 2002-06-26 2004-06-10 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
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US6526653B1 (en) * 1999-12-08 2003-03-04 Amkor Technology, Inc. Method of assembling a snap lid image sensor package
US6759266B1 (en) * 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
CN1419286A (zh) * 2001-11-12 2003-05-21 三洋电机株式会社 引线架、树脂密封模型及使用它们的半导体
US7145253B1 (en) * 2004-06-09 2006-12-05 Amkor Technology, Inc. Encapsulated sensor device

Also Published As

Publication number Publication date
US20150116946A1 (en) 2015-04-30
JP6214337B2 (ja) 2017-10-18
CN104576570A (zh) 2015-04-29
US9585287B2 (en) 2017-02-28
JP2015084377A (ja) 2015-04-30
DE102014221650A1 (de) 2015-04-30

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