CN104471693B - 形成导线互连结构的方法 - Google Patents

形成导线互连结构的方法 Download PDF

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Publication number
CN104471693B
CN104471693B CN201380037938.4A CN201380037938A CN104471693B CN 104471693 B CN104471693 B CN 104471693B CN 201380037938 A CN201380037938 A CN 201380037938A CN 104471693 B CN104471693 B CN 104471693B
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wire
length
bond
bonding
forming
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Chinese (zh)
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CN104471693A (zh
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T·J·小科洛西莫
J·W.·布伦纳
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
CN201380037938.4A 2012-07-17 2013-07-01 形成导线互连结构的方法 Active CN104471693B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261672449P 2012-07-17 2012-07-17
US61/672,449 2012-07-17
PCT/US2013/048860 WO2014014643A1 (en) 2012-07-17 2013-07-01 Methods of forming wire interconnect structures

Publications (2)

Publication Number Publication Date
CN104471693A CN104471693A (zh) 2015-03-25
CN104471693B true CN104471693B (zh) 2018-05-08

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CN201380037938.4A Active CN104471693B (zh) 2012-07-17 2013-07-01 形成导线互连结构的方法

Country Status (6)

Country Link
US (3) US9502371B2 (cg-RX-API-DMAC10.html)
JP (1) JP6297553B2 (cg-RX-API-DMAC10.html)
KR (1) KR102094563B1 (cg-RX-API-DMAC10.html)
CN (1) CN104471693B (cg-RX-API-DMAC10.html)
TW (1) TWI531015B (cg-RX-API-DMAC10.html)
WO (1) WO2014014643A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014014643A1 (en) * 2012-07-17 2014-01-23 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures
US9870946B2 (en) 2013-12-31 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level package structure and method of forming same
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
KR20160055100A (ko) 2014-10-03 2016-05-17 인텔 코포레이션 수직 기둥들을 갖는 오버랩핑 적층형 다이 패키지
US11145620B2 (en) * 2019-03-05 2021-10-12 Asm Technology Singapore Pte Ltd Formation of bonding wire vertical interconnects
SG10202003450RA (en) * 2019-05-02 2020-12-30 Asm Tech Singapore Pte Ltd Method for measuring the heights of wire interconnections
JP2022033633A (ja) 2020-08-17 2022-03-02 キオクシア株式会社 半導体装置
KR20220045684A (ko) 2020-10-06 2022-04-13 에스케이하이닉스 주식회사 지그재그 모양의 와이어를 포함하는 반도체 패키지
KR102866415B1 (ko) 2020-11-25 2025-09-29 가부시키가이샤 신가와 반도체 장치의 제조 방법 및 반도체 장치의 제조 장치
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
WO2023042333A1 (ja) 2021-09-16 2023-03-23 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
JP7741745B2 (ja) 2022-02-15 2025-09-18 キオクシア株式会社 半導体装置およびその製造方法
TW202347637A (zh) 2022-02-15 2023-12-01 美商庫利克和索夫工業公司 確定用於產生與工件相關的複數個導線迴路的順序的方法
WO2026024695A1 (en) * 2024-07-24 2026-01-29 Kulicke And Soffa Industries, Inc. Wire bonding systems and related methods of forming a vertical wire structure

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US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
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Also Published As

Publication number Publication date
JP2015533258A (ja) 2015-11-19
KR102094563B1 (ko) 2020-03-27
US10153247B2 (en) 2018-12-11
TWI531015B (zh) 2016-04-21
US9865560B2 (en) 2018-01-09
US20150132888A1 (en) 2015-05-14
US9502371B2 (en) 2016-11-22
TW201405683A (zh) 2014-02-01
US20170040280A1 (en) 2017-02-09
US20170345787A1 (en) 2017-11-30
JP6297553B2 (ja) 2018-03-20
KR20150036074A (ko) 2015-04-07
WO2014014643A1 (en) 2014-01-23
CN104471693A (zh) 2015-03-25

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