CN104419013B - 呈色聚酰亚胺膜 - Google Patents
呈色聚酰亚胺膜 Download PDFInfo
- Publication number
- CN104419013B CN104419013B CN201410177387.8A CN201410177387A CN104419013B CN 104419013 B CN104419013 B CN 104419013B CN 201410177387 A CN201410177387 A CN 201410177387A CN 104419013 B CN104419013 B CN 104419013B
- Authority
- CN
- China
- Prior art keywords
- polyimide film
- film
- weight
- red
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 79
- 239000000178 monomer Substances 0.000 claims abstract description 35
- 239000004642 Polyimide Substances 0.000 claims abstract description 34
- 150000004985 diamines Chemical class 0.000 claims abstract description 21
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 16
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims abstract description 9
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000002834 transmittance Methods 0.000 claims abstract description 9
- 229920000642 polymer Polymers 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 29
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical group C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000001054 red pigment Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011787 zinc oxide Substances 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 235000014692 zinc oxide Nutrition 0.000 claims description 10
- 238000004040 coloring Methods 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000000376 reactant Substances 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 16
- 239000003086 colorant Substances 0.000 abstract description 3
- 239000006224 matting agent Substances 0.000 abstract 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 abstract 1
- 239000002002 slurry Substances 0.000 description 61
- 229920005575 poly(amic acid) Polymers 0.000 description 38
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 36
- 229940113088 dimethylacetamide Drugs 0.000 description 36
- 239000000243 solution Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 30
- 239000000049 pigment Substances 0.000 description 28
- 238000003756 stirring Methods 0.000 description 16
- 239000004615 ingredient Substances 0.000 description 14
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 12
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 11
- 239000004952 Polyamide Substances 0.000 description 10
- 239000006229 carbon black Substances 0.000 description 10
- 235000019241 carbon black Nutrition 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 229920002647 polyamide Polymers 0.000 description 10
- 239000002245 particle Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 210000000988 bone and bone Anatomy 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 4
- 239000002932 luster Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000009738 saturating Methods 0.000 description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 239000005083 Zinc sulfide Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 3
- 230000002045 lasting effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 3
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004150 EU approved colour Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- JGDFBJMWFLXCLJ-UHFFFAOYSA-N copper chromite Chemical compound [Cu]=O.[Cu]=O.O=[Cr]O[Cr]=O JGDFBJMWFLXCLJ-UHFFFAOYSA-N 0.000 description 2
- -1 diamine compound Chemical class 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000006233 lamp black Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229940006093 opthalmologic coloring agent diagnostic Drugs 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910002477 CuCr2O4 Inorganic materials 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 229910002551 Fe-Mn Inorganic materials 0.000 description 1
- 229910000604 Ferrochrome Inorganic materials 0.000 description 1
- 229910000003 Lead carbonate Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- IHBCFWWEZXPPLG-UHFFFAOYSA-N [Ca].[Zn] Chemical compound [Ca].[Zn] IHBCFWWEZXPPLG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 1
- 229910052925 anhydrite Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- WTFXARWRTYJXII-UHFFFAOYSA-N iron(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+2].[Fe+3].[Fe+3] WTFXARWRTYJXII-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
- YWCLWGMTGGFSDF-UHFFFAOYSA-N lead;dihydrate Chemical compound O.O.[Pb] YWCLWGMTGGFSDF-UHFFFAOYSA-N 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- PPNAOCWZXJOHFK-UHFFFAOYSA-N manganese(2+);oxygen(2-) Chemical class [O-2].[Mn+2] PPNAOCWZXJOHFK-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002979 perylenes Chemical class 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
本发明涉及一种呈色聚酰亚胺膜,包括:由二胺单体与二酐单体反应所得的聚酰亚胺聚合物,其中,该二胺单体由二氨基二苯醚及苯二胺所组成,且该二酐单体为均苯四甲酸二酐;消光剂,包括聚酰亚胺;以及着色剂。本发明的聚酰亚胺膜具有低光泽度值、低光穿透率、及低热膨胀系数。
Description
【技术领域】
本发明涉及一种呈色聚酰亚胺膜,尤其是关于一种呈现特定颜色、具有遮蔽性及良好薄膜特性的聚酰亚胺薄膜。
【背景技术】
软性电路板是广泛应用于3C产品、光学镜头模块、LCD模块及太阳能电池等产品,而聚酰亚胺(polyimide,PI)由于符合软性电路板对于机械强度、可挠性、耐溶性、介电性质及耐热性等需求,可作为软性电路板的基材或覆盖层(coverlay)的材料。一般而言,聚酰亚胺薄膜呈现黄色透明,因此,将聚酰亚胺薄膜覆盖于印刷电路板上,仍可观察到设置于印刷电路板上的电路图案。为进一步符合美观上的需求,同时可保护印刷电路板上的电路布局可能涉及的技术机密,因此,业界致力于开发出呈现特定颜色且具有高遮蔽性的聚酰亚胺薄膜。
此外,在此种应用中,理想的聚酰亚胺膜需具备低光泽度及低透光性等特性,其中,低光泽度可使组件外观更具质感与美观,绝缘性及低透光性则可保护内部电路板的电路设计。通常可通过添加着色剂及消光剂以达到所需光泽度及透光性,然而,熟知聚酰亚胺膜常因添加大量着色剂及消光剂而影响薄膜本身特性,如热膨胀系数或机械性质等,使得聚酰亚胺膜与印刷电路板无法良好匹配。
据此,对于呈现特定颜色、具有遮蔽性及良好薄膜特性的聚酰亚胺薄膜仍有其需求。
【发明内容】
本发明提供了一种呈色聚酰亚胺膜,包括:聚酰亚胺聚合物,由二胺单体与二酐单体反应所得,其中,该二胺单体由二氨基二苯醚及苯二胺所组成,且该二酐单体为均苯四甲酸二酐;消光剂,包括聚酰亚胺;以及一着色剂。
依据本发明另一实施例,提供一种红色聚酰亚胺膜,包括:聚酰亚胺聚合物,由二氨基二苯醚、苯二胺及均苯四甲酸二酐反应所得;约6-15重量%的聚酰亚胺消光剂;约6-15重量%的红色颜料;以及约10-22重量%的白色颜料。
此外,本发明又另一实施例提供一种黑色聚酰亚胺膜,包括:聚酰亚胺聚合物,由二氨基二苯醚、苯二胺及均苯四甲酸二酐反应所得;约6-15重量%的聚酰亚胺消光剂;以及约3-8重量%的黑色颜料。
本发明亦提供一种金属积层板,包括前述呈色聚酰亚胺膜;以及一金属层,设置于该聚酰亚胺膜的至少一表面上。
【实施方式】
本发明的呈色聚酰亚胺膜系包括做为基底膜的聚酰亚胺聚合物、消光剂、及着色剂。依据所欲呈现的颜色,聚酰亚胺膜中可使用不同的着色剂。在一实施中,该聚酰亚胺膜呈红色,优选呈雾面、低透光的红色。在另一实施中,该聚酰亚胺膜呈黑色。
本发明的呈色聚酰亚胺膜具有至少一种下列所述的所欲薄膜特性,包括低60度光泽度值(60°gloss)、低热膨胀系数(coefficient of thermal expansion,CTE)、及低光穿透率(TT)。在一实施例中,该膜的60度光泽度值为15以下,优选为12以下,例如约为10、8、6、5、3、1。
在一实施例中,本发明的呈色聚酰亚胺膜应用于软性电路板,是与铜箔结合并进行后续加工,因此,该聚酰亚胺膜的薄膜特性需与铜箔匹配,例如,铜箔的热膨胀系数为约17ppm/℃,而聚酰亚胺膜的热膨胀系数必须与其匹配,以避免产品翘曲、变形或甚至破裂。在一实施例中,该呈色聚酰亚胺膜的热膨胀系数为约10-28ppm/℃。在部分实施例中,该热膨胀系数可视着色剂成分、比例及消光剂比例而变化,例如,举例但非限制,在黑色聚酰亚胺膜中,其CTE值可为10-25ppm/℃、15-23ppm/℃、17-22ppm/℃等;在红色聚酰亚胺膜中,其CTE值可为12-28ppm/℃、15-28ppm/℃、20-28ppm/℃等。
在一实施例中,本发明呈色聚酰亚胺膜除了呈现特定颜色以外,更具有良好遮蔽度(即,低光穿透率)以保护并遮蔽印刷电路板的电路。具体而言,该聚酰亚胺膜的光穿透率为6%以下,优选为5%以下,例如4%、3%、2%、1%或更低。
在本发明呈色聚酰亚胺膜中,做为基底膜的该聚酰亚胺聚合物由二胺单体与二酐单体经缩合反应所得,该二胺单体与该二酐单体约为等摩尔比例。在实施例中,该二胺单体包括二氨基二苯醚(oxydianiline,ODA),例如3,4-ODA、4,4′-ODA等,及苯二胺(phenylenediamine,PDA),例如对苯二胺(para-phenylenediamine,p-PDA)、间苯二胺(meta-phenylenediamine,m-PDA)等。在实施例中,该二酐单体包括均苯四甲酸二酐(pyromellitic dianhydride,PMDA)。
对于所使用的二胺单体,ODA:PDA的摩尔比例为90:10至50:50。在一实施例中,以二胺单体总摩尔数为基础,ODA的比例可占约50%以上,例如55%以上、60%以上、63%以上、或65%以上;并且为约90%以下,例如88%以下、85%以下、80%以下、75%以下、或70%以下。在一实施例中,以二胺单体总摩尔数为基础,PDA的比例可占约50%以下,例如45%以下、40%以下、38%以下、或35%以下;并且为约10%以上,例如15%以上、20%以上、25%以上、或30%以上。
在一优选实施例中,以二胺单体总摩尔数为基础,ODA为55-85%,且PDA为15-45%。在一更优选实施例中,ODA为60-70%,且PDA为30-40%。
本发明的呈色聚酰亚胺膜所包含的消光剂,为聚酰亚胺消光剂,例如聚酰亚胺粉末。做为消光剂的聚酰亚胺成分并未特别限制,该二胺与二酐的单体成分及种类亦未特别限制,例如,该二胺化合物可为对苯二胺(p-PDA)、二氨基二苯醚(ODA)、2-(4-胺基苯基)-5-胺基苯并咪唑(PBOA)等;而该二酐化合物可为联苯四羧酸二酐(BPDA)、均苯四甲酸二酐(PMDA)等;二胺及二酐可分别为单一成分或多种成分。在实施例中,该聚酰亚胺粉末可由ODA/PMDA、ODA/BPDA、PDA/BPDA、PBOA/PMDA、或PDA/ODA/PMDA反应所形成。在一实施例中,亦可采用与基底膜为相同单体成分的聚酰亚胺粉末。聚酰亚胺粉末的平均粒径约为3~8μm。
在一实施例中,以该膜总重为基础,该消光剂占约4-15重量%(wt%),优选为约6-15wt%、更优选为约6-12wt%。
本发明聚酰亚胺膜所包含的着色剂可选白红色颜料、白色颜料、及黑色颜料,可单独或组合使用。所采用的颜料可为有机颜料或无机颜料。在一些实施例中,该颜料可包括,由比色指数(color index(CI),由The Society of Dyers and Colourists出版)分类为颜料(pigment)的化合物。
在一些实施例中,该红色颜料可包含但不限于下列材料:镉红(Cadmium Red)、镉朱红(Cadmium Vermilion)、暗红(Alizarin Crimson)、耐久紫红(Permanent Magenta)、鲜红(Scarlet Lake)等。
在另一些实施例中,该红色颜料之具体实例可包括:C.I.颜料红9、C.I.颜料红97、C.I.颜料红105、C.I.颜料红122、C.I.颜料红123、C.I.颜料红144、C.I.颜料红149、C.I.颜料红166、C.I.颜料红168、C.I.颜料红176、C.I.颜料红177、C.I.颜料红180、C.I.颜料红192、C.I.颜料红209、C.I.颜料红215、C.I.颜料红216、C.I.颜料红224、C.I.颜料红242、C.I.颜料红254、C.I.颜料红264、C.I.颜料红265等。
在一些实施例中,该白色颜料可包含但不限于:氧化钛(TiO2)(如金红石(rutile)TiO2、锐钛矿(anatase)TiO2、或板钛矿(brookite)TiO2等)、氧化锆(ZrO2)、氧化钙(CaO)、氧化锌(ZnO2)、氧化铝(Al2O3)、硫化锌(ZnS2)、碳酸钙(CaCO3)、碳酸铅(PbCO3)、氢氧化铅(Pb(OH)2)、硫酸钙(CaSO4)、硫酸钡(BaSO4)、二氧化硅(SiO2)、氮化硼(BN)、氮化铝(AlN)、碱式钼酸锌(basic zinc molybdate)、碱式钼酸锌钙(basic calcium zinc molybdate)、铅白(lead white)、钼白(molybdenum white)、锌钡白(lithopone)(硫酸钡及硫化锌的混合物)、黏土等。
在一些实施例中,该黑色颜料可包括,举例但非限制,碳黑、氧化钴(cobaltoxide)、铁锰铋黑(Fe-Mn-Bi black)、铁锰氧化物尖晶石黑(Fe-Mn oxide spinel black)、(Fe,Mn)2O3黑、铜铬铁矿黑尖晶石(copper chromite black spinel)、灯黑(lampblack)、骨黑(bone black)、骨灰(bone ash)、骨炭(bone char)、赤铁矿(hematite)、黑色氧化铁、云母状氧化铁、黑色错合无机颜料(CICP)、CuCr2O4黑、(Ni,Mn,Co)(Cr,Fe)2O4黑、苯胺黑、苝黑、蒽醌黑、铬绿黑赤铁矿、铬铁氧化物等。
在一些实施例中,该黑色颜料的具体实例可包括:C.I.颜料黑1、C.I.颜料黑7等。
上述所列出之颜料均可单独或组合使用。
依据本发明的实施例,为提供红色聚酰亚胺膜,该红色聚酰亚胺膜的着色剂可包含红色颜料及视需要选用的白色颜料,以达成所欲的颜色及遮蔽度。在一实施例中,以该膜总重为基础,该红色颜料可占约6-15重量%。在另一实施例中,所使用的颜料包含红色颜料及白色颜料,该红色颜料可占约6-15重量%,且该白色颜料可占约10-22重量%。在又一实施例中,所使用的颜料可包含红色颜料及黑色颜料,该红色颜料可占约6-15重量%,且该黑色颜料占约3-8重量%。
依据本发明另一实施例,为提供黑色聚酰亚胺膜,该黑色聚酰亚胺膜的着色剂包含黑色颜料。在一实施例中,以该膜总重为基础,该黑色颜料占约3-8重量%。
在一实施例中,前述呈色聚酰亚胺膜可用以制备金属积层板,系通过例如物理气相沉积、化学气相沉积、蒸镀、电解电镀、无电解电镀等方式,将一金属层设置于该聚酰亚胺膜的至少一表面上而得。在实施例中,该金属层的金属可包括金、银、铜、铝、镍、其合金、或前述任意的组合。
以下以实施例详细说明本发明。
实施例
聚酰亚胺消光剂的制备:
将400克(g)的以4,4′-ODA、p-PDA及PMDA共聚合而得的聚酰胺酸溶液(固含量为约6%)置入三颈烧瓶内搅拌,并以2℃/min的升温速率加热至约160℃并持温反应约3小时,而获得聚酰亚胺粒子。待冷却至室温后,将所得聚酰亚胺粒子以二甲基乙酰胺(DMAc)及乙醇清洗,再以真空过滤收集该粒子,并于烘箱内以160℃加热干燥1小时备用。
取约10g的经干燥的聚酰亚胺粒子与60g之DMAc混合,于室温下搅拌1小时,再以研磨机研磨而制得聚酰亚胺粒子(PIP)浆料。该浆料所含聚酰亚胺粒子的平均粒径经测定为约3~8μm(以扫描式电子显微镜(型号JEOL5410)进行测量及计算)。
着色剂的制备:
红色浆料:使用颜料红149(商品名称red04,购白永光化学),固含量为10wt%,使用前以研磨机研磨均匀。
白色浆料:主成分为二氧化钛的白色颜料(商品名称为white01,购白永光化学),固含量为50wt%,使用前以研磨机研磨均匀。
碳黑浆料:将100g碳黑(SB4A,购白EVONIK)与600g的DMAc混合并搅拌1小时,再以研磨机研磨后而得。
<实施例1>
将约400g的DMAc置入反应瓶中,加入35.86g(0.1793mole)的4,4′-ODA与8.3g(0.0768mole)的p-PDA,搅拌至完全溶解,再加入约55.84g(0.2561mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸(PAA)溶液。
将约30g的所得聚酰胺酸溶液置于约100mL的反应瓶中,加入约26.81g的DMAc进行稀释。接着将约7.88g的红色浆料、约2.37g的白色浆料与约3.31g的聚酰亚胺粒子浆料加入该反应瓶中,持续搅拌约1小时,以低温冷藏约30分钟。
将前述聚酰胺酸溶液、脱水剂乙酸酐、及催化剂甲基吡啶依摩尔比约1:2:1混合。以刮刀将该溶液于玻璃平板上涂布成层,并放入烘箱内以约80℃加热约30分钟,再以约170℃至370℃加热约4小时,使该溶液烤干成膜,之后将该膜白玻璃板剥离,即获得本发明的呈色聚酰亚胺薄膜。
<实施例2>
重复实施例1的步骤,但各成分重量改为约38g的实施例1的PAA溶液、约26.47g的DMAc、约2.71g的碳黑浆料、与约3.33g的PIP浆料。
<比较例1>
将约400g的DMAc置入反应瓶中,加入约47.85g(0.2393mole)的4,4′-ODA搅拌至完全溶解,再加入约51.11g(0.2344mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸溶液。
将约30g的所得聚酰胺酸溶液、约26.47g的DMAc、约7.95g的红色浆料、约2.38g的白色浆料与约3.33g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例2>
重复比较例1的步骤,但各成分重量改为约38g的比较例1的聚酰胺酸溶液、约26.48g的DMAc、约2.73g的碳黑浆料与约3.27g的PIP浆料。
<比较例3>
将约400g的DMAc置入反应瓶中,加入约39.22g(0.1961mole)的4,4′-ODA搅拌至完全溶解,再加入约59.57g(0.1922mole)的4,4′-联苯醚二酐(4,4-Oxydiphthalicanhydride,ODPA)持续搅拌4小时进行反应,形成粘度约200,000cps的聚酰胺酸溶液。
将约30g的所得聚酰胺酸溶液、约26.48g的DMAc、约8.08g的红色浆料、约2.73g的白色浆料与约3.27g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例4>
将约400g的DMAc置入反应瓶中,加入约14.04g(0.13mole)的p-PDA与约29.28g(0.13mole)的PBOA搅拌至完全溶解,再加入约55.55g(0.2548mole)的PMDA持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸溶液。
将约30g的所得聚酰胺酸溶液、约26.81g的DMAc、约7.88g的红色浆料、约2.36g的白色浆料与约3.31g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例5>
将约400g的DMAc置入反应瓶中,加入约33.13g(0.3068mole)的p-PDA搅拌至完全溶解,再加入约65.54g(0.3006mole)的PMDA持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸溶液。
将约30g的所得聚酰胺酸溶液、约26.68g的DMAc、约7.74g的红色浆料、约2.32g的白色浆料与约3.25g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例6>
重复比较例5的步骤,但各成分重量改为约38g的比较例5的聚酰胺酸溶液、约26.45g的DMAc、约2.66g的碳黑浆料与约3.19g的PIP浆料。
各实施例所得的聚酰亚胺膜均以下列方式测定其薄膜特性,结果如表1所示。
60度光泽值:以手持式光泽度计(型号为Micro Tri Gloss-BYK Gardner)进行检测,取3个独立测量值的平均值。
透光度(TT):以雾度计(型号为NIPPON DEMSHOKU NDH2000)进行检测,取3至6个独立测量值的平均值。
线性热膨胀系数(CTE):以热机械分析仪(型号为TA Instruments TMAQ400)测量100~200℃之间的CTE值,并取其平均值。
如表1所示,本发明的实施例1及2,以特定单体组成ODA/PDA/PMDA,搭配适量颜料及聚酰亚胺消光剂所制得的呈色聚酰亚胺膜,具有优良的成膜性、低于35的光泽度值、光穿透率低于6%的高遮蔽度、以及可与铜箔匹配的适当热膨胀系数(铜箔为约17ppm/℃,本发明的聚酰亚胺膜为约20~22ppm/℃)等优异特性,相当适合作为电路板的覆盖膜。
反之,测试其它不同的单体组合,如比较例1至6所示,均无法达到如本发明的聚酰亚胺膜的全部优点。比较例1-3的聚酰亚胺膜的CTE值均高于30ppm/℃,与铜箔CTE的差异过大,两者贴合加工时易导致产品翘曲、破裂或变形。比较例4的单体组合的成膜性差,且CTE值过低(仅8.5ppm/℃),与铜箔CTE的差异过大。比较例5及6的单体组合则无法成膜,完全不适用。
由表1所示的结果显示,考虑到添加物及后续加工之应用性,并非任意二胺单体与二酸酐单体的组合均可达到产品所欲特性,仅有本发明的特定单体组合ODA/PDA/PMDA可与着色剂及消光剂组合而获得兼具良好的成膜性、光学特性、与铜箔的匹配性的呈色聚酰亚胺膜。
以下的实施例及比较例的聚酰亚胺膜,均采用单体组合ODA/PDA/PMDA进行。
<实施例3>
将约400g的DMAc置入反应瓶中,加入约44.03g(0.2202mole)的4,4′-ODA与约2.64g(0.0244mole)的p-PDA,搅拌至完全溶解,再加入约52.26g(0.2397mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸(PAA)溶液。
将约25g的所得聚酰胺酸溶液、约22.62g的DMAc、约4.8g的红色浆料、约3.52g的白色浆料与约8.39g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<实施例4>
重复实施例1的步骤,但各成分重量改为约25g的实施例1的PAA溶液、约28.55g的DMAc、约4.77g的红色浆料、约3.5g的白色浆料、与约8.34g的PIP浆料。
<实施例5>
将约400g的DMAc置入反应瓶中,加入约26.88g(0.1344mole)的4,4′-ODA与约14.52g(0.1344mole)的p-PDA,搅拌至完全溶解,再加入约57.43g(0.2634mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸(PAA)溶液。
将约25g的所得聚酰胺酸溶液、约28.51g的DMAc、约4.75g的红色浆料、约3.49g的白色浆料与约8.31g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<实施例6>
重复实施例1的步骤,但各成分重量改为约26g的实施例1的PAA溶液、约21.93g的DMAc、约11.79g的红色浆料、约1.57g的白色浆料、与约8.24g的PIP浆料。
<实施例7>
重复实施例1的步骤,但各成分重量改为约35g的实施例1的PAA溶液、约25.2g的DMAc、约1.62g的碳黑浆料、与约8.12g的PIP浆料。
<实施例8>
重复实施例1的步骤,但各成分重量改为约33g的实施例1的PAA溶液、约24.4g的DMAc、约4.35g的碳黑浆料、与约8.15g的PIP浆料。
<比较例7>
将约400g的DMAc置入反应瓶中,加入约45.96g(0.2298mole)的4,4′-ODA与约1.31g(0.0121mole)的p-PDA,搅拌至完全溶解,再加入约51.68g(0.2371mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸(PAA)溶液。
将约25g的所得聚酰胺酸溶液、约28.63g的DMAc、约4.8g的红色浆料、约3.52g的白色浆料与约8.4g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例8>
将约400g的DMAc置入反应瓶中,加入约22.05g(0.1103mole)的4,4′-ODA与约17.86g(0.1654mole)的p-PDA,搅拌至完全溶解,再加入约58.89g(0.2701mole)的PMDA,持续搅拌约4小时进行反应,形成粘度约200,000cps的聚酰胺酸(PAA)溶液。
将约25g的所得聚酰胺酸溶液、约22.62g的DMAc、约4.74g的红色浆料、约3.48g的白色浆料与约8.29g的PIP浆料混合,接着以与实施例1相同的步骤制得聚酰亚胺薄膜。
<比较例9>
重复实施例1的步骤,但各成分重量改为16g的实施例1的PAA溶液、约25.32g的DMAc、约16.58g的红色浆料、约4.97g的白色浆料、与约8.7g的PIP浆料。
<比较例10>
重复实施例1的步骤,但各成分重量改为约33g的实施例1的PAA溶液、约25.63g的DMAc、约2.33g的红色浆料、约0.78g的白色浆料、与约8.15g的PIP浆料。
<比较例11>
重复实施例1的步骤,但各成分重量改为约32g的实施例1的PAA溶液、约23.93g的DMAc、约5.41g的碳黑浆料、与约8.12g的PIP浆料。
<比较例12>
重复实施例1的步骤,但各成分重量改为约36g的实施例1的PAA溶液、约25.61g的DMAc、约0.27g的碳黑浆料、与约8.1g的PIP浆料。
<比较例13>
重复实施例1的步骤,但各成分重量改为约40g的实施例1的PAA溶液、约26.97g的DMAc、与约1.57g的PIP浆料。
<比较例14>
重复实施例1的步骤,但各成分重量改为约30g的实施例1的PAA溶液、约23.13g的DMAc、与约16.3g的PIP浆料。
<比较例15>
重复实施例1的步骤,但各成分重量改为约33g的实施例1的PAA溶液、约22.27g的DMAc、约7.98g的红色浆料、与约8.37g的PIP浆料。
各实施例所得的聚酰亚胺膜的60度光泽值、透光度(TT)、及线性热膨胀系数(CTE)如表2所示。
由实施例3-5与比较例7-8相较可知,本发明所使用的特定二胺单体须进一步于特定比例下才能达成所欲膜特性(低光泽度、高遮蔽性、适当的热膨胀系数)。具体而言,二胺单体ODA:PDA的摩尔比例为0.9-0.5:0.1-0.5。比较例7显示当ODA含量过高、PDA含量过低时,会使所得呈色聚酰亚胺膜的CTE值过高(超过30ppm/℃),与铜箔匹配性差;而比较例8显示当ODA含量过低、PDA含量过高时,所得聚酰亚胺膜的CTE虽适合,但成膜性差,不适于工业规模量产。
另外,比较例9、11、及14显示,若颜料或消光剂的添加量过高,亦导致成膜性差,不适于工业规模量产;且添加量过高亦会影响聚酰亚胺膜的机械性质。反之,比较例10、12及15显示,当颜料添加量过低或不添加白色浆料时,虽不影响成膜性,但所得聚酰亚胺膜的透光度过高,作为覆盖膜则无法有效遮蔽下方电路图案,其光学性质不符所需,无法应用于电路板。而比较例13显示,当消光剂添加量过低(少于6wt%)时,消光效果不足,导致所得聚酰亚胺膜的60度光泽值过高,亦不符合所需。
综上述,本发明实施例3-8证实,必须采用二胺及二酐的特定单体组合及特定比例,并配合适当添加量的颜料及消光剂,才可获得具有低光泽度(15以下)、高遮蔽性(光穿透率<6%)、及可与铜箔匹配的低热膨胀系数(28ppm/℃以下)的呈色聚酰亚胺膜(例如红色或黑色聚酰亚胺膜),并可兼顾良好成膜性,能应用于工业规模量产。
上述特定实施例的内容为了详细说明本发明,然而,这些实施例仅用于说明,并非意欲限制本发明。本领域技术人员可理解,在不悖离后附权利要求书所界定的范畴下针对本发明所进行的各种变化或修改落入本发明的一部分。
Claims (7)
1.一种呈色聚酰亚胺膜,包括:
聚酰亚胺聚合物,其由二胺单体与二酐单体反应所得,其中,所述二胺单体由二氨基二苯醚ODA及苯二胺PDA所组成,且所述二酐单体为均苯四甲酸二酐PMDA,其中,在所述二胺单体中,二氨基二苯醚:苯二胺的摩尔比例为90:10至50:50;
消光剂,包括聚酰亚胺,其中,以所述膜总重为基础,所述消光剂占4-15重量%;以及
着色剂,其中,所述着色剂包含红色颜料及白色颜料,以所述膜总重为基础,所述红色颜料占6-15重量%。
2.如权利要求1所述的呈色聚酰亚胺膜,其中,以所述膜总重为基础,所述白色颜料占10-22重量%。
3.如权利要求1所述的呈色聚酰亚胺膜,其具有下列的薄膜特性:
60度光泽度值为15以下;
热膨胀系数为28ppm/℃以下;及
光穿透率为6%以下。
4.一种金属积层板,包括:
如权利要求1-3中任一项所述的呈色聚酰亚胺膜;以及
金属层,设置于所述聚酰亚胺膜的至少一表面上。
5.如权利要求4所述的金属积层板,其中,所述金属层由物理气相沉积、化学气相沉积、蒸镀、电解电镀、或无电解电镀所形成。
6.如权利要求4所述的金属积层板,其中,所述金属层包括金、银、铜、铝、镍、其合金、或前述任意的组合。
7.一种红色聚酰亚胺膜,包括:聚酰亚胺聚合物,其由二氨基二苯醚、苯二胺及均苯四甲酸二酐反应所得,其中,二氨基二苯醚:苯二胺的二胺单体的摩尔比例为90:10至50:50;6-15重量%的聚酰亚胺消光剂;6-15重量%的红色颜料;以及10-22重量%的白色颜料。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102130703 | 2013-08-27 | ||
TW102130703A TWI487745B (zh) | 2013-08-27 | 2013-08-27 | 呈色聚醯亞胺膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104419013A CN104419013A (zh) | 2015-03-18 |
CN104419013B true CN104419013B (zh) | 2017-09-22 |
Family
ID=52583656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410177387.8A Active CN104419013B (zh) | 2013-08-27 | 2014-04-29 | 呈色聚酰亚胺膜 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150064484A1 (zh) |
JP (1) | JP5902236B2 (zh) |
KR (1) | KR20150024763A (zh) |
CN (1) | CN104419013B (zh) |
TW (1) | TWI487745B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI735421B (zh) * | 2015-01-22 | 2021-08-11 | 日商尤尼吉可股份有限公司 | 積層體、其製造方法及使用方法、暨無鹼玻璃基板積層用聚醯亞胺前驅體溶液 |
CN105331103A (zh) * | 2015-08-28 | 2016-02-17 | 昆山斯格威电子科技有限公司 | 高导热、耐高温聚酰亚胺复合材料的制备方法 |
US9999905B2 (en) | 2016-01-08 | 2018-06-19 | International Business Machines Corporation | Polymeric coatings and coating method |
KR20180108676A (ko) * | 2016-01-29 | 2018-10-04 | 사빅 글로벌 테크놀러지스 비.브이. | 집적기판, 이의 제조 방법, 및 집적기판을 포함하는 광학 장치 |
TWI738778B (zh) | 2016-05-25 | 2021-09-11 | 日商三菱鉛筆股份有限公司 | 氟系樹脂之非水系分散體、使用其之含氟系樹脂之熱硬化樹脂組成物及其硬化物、聚醯亞胺前驅物溶液組成物 |
TWI794172B (zh) | 2016-05-25 | 2023-03-01 | 日商三菱鉛筆股份有限公司 | 氟系樹脂之非水系分散體、使用其之含氟系樹脂之熱硬化樹脂組成物及其硬化物、聚醯亞胺前驅物溶液組成物 |
CN107226921A (zh) * | 2017-08-02 | 2017-10-03 | 桂林电器科学研究院有限公司 | 一种多层黑色聚酰亚胺薄膜及其制备方法 |
CN107312191A (zh) * | 2017-08-02 | 2017-11-03 | 桂林电器科学研究院有限公司 | 一种多层黑色亚光聚酰亚胺薄膜及其制备方法 |
CN107400250A (zh) * | 2017-08-02 | 2017-11-28 | 桂林电器科学研究院有限公司 | 一种黑色聚酰亚胺薄膜及其制备方法 |
CN107474269A (zh) * | 2017-08-02 | 2017-12-15 | 桂林电器科学研究院有限公司 | 一种黑色亚光聚酰亚胺薄膜及其制备方法 |
KR101951306B1 (ko) * | 2017-10-23 | 2019-02-22 | 에스케이씨코오롱피아이 주식회사 | 롤 타입 그라파이트 시트용 폴리이미드 필름 |
CN108102131A (zh) * | 2017-11-29 | 2018-06-01 | 宁波长阳科技股份有限公司 | 聚酰亚胺薄膜及其制备方法 |
CN108017910A (zh) * | 2017-12-15 | 2018-05-11 | 桂林电器科学研究院有限公司 | 一种亚光黑色聚酰亚胺薄膜制备方法 |
CN107987529A (zh) * | 2017-12-15 | 2018-05-04 | 桂林电器科学研究院有限公司 | 一种亚黑聚酰亚胺薄膜制备方法 |
CN107964109A (zh) * | 2017-12-15 | 2018-04-27 | 桂林电器科学研究院有限公司 | 一种消光黑色聚酰亚胺薄膜制备方法 |
CN108070102A (zh) * | 2017-12-15 | 2018-05-25 | 桂林电器科学研究院有限公司 | 一种多层低光泽黑色聚酰亚胺薄膜制备方法 |
CN107936556A (zh) * | 2017-12-15 | 2018-04-20 | 桂林电器科学研究院有限公司 | 一种黑色消光聚酰亚胺薄膜制备方法 |
CN108047717A (zh) * | 2017-12-15 | 2018-05-18 | 桂林电器科学研究院有限公司 | 一种黑色低光泽聚酰亚胺薄膜制备方法 |
CN107987528A (zh) * | 2017-12-15 | 2018-05-04 | 桂林电器科学研究院有限公司 | 一种亚光表面的黑色聚酰亚胺薄膜制备方法 |
CN108034062A (zh) * | 2017-12-15 | 2018-05-15 | 桂林电器科学研究院有限公司 | 一种黑色消光型聚酰亚胺薄膜制备方法 |
WO2021230121A1 (ja) * | 2020-05-12 | 2021-11-18 | 富士フイルム株式会社 | 着色組成物、膜、光学フィルタ、固体撮像素子および画像表示装置 |
TWI775421B (zh) * | 2021-05-05 | 2022-08-21 | 達邁科技股份有限公司 | 黑色消光之聚醯亞胺膜 |
CN115403794A (zh) * | 2021-05-27 | 2022-11-29 | 达迈科技股份有限公司 | 黑色消光之聚酰亚胺膜 |
TWI792818B (zh) * | 2021-12-29 | 2023-02-11 | 達邁科技股份有限公司 | 耐鹼之黑色消光聚醯亞胺膜 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09135067A (ja) * | 1995-09-08 | 1997-05-20 | Shin Etsu Chem Co Ltd | 遮光性カバーレイフィルム |
JP4736389B2 (ja) * | 2003-10-02 | 2011-07-27 | 宇部興産株式会社 | 易滑性の改良されたポリイミドフィルムおよびそれを用いた基板 |
KR101402635B1 (ko) * | 2006-04-18 | 2014-06-03 | 우베 고산 가부시키가이샤 | 메탈라이징용 폴리이미드 필름 및 금속적층 폴리이미드 필름 |
JP2008166556A (ja) * | 2006-12-28 | 2008-07-17 | Du Pont Toray Co Ltd | フレキシブルプリント配線板 |
JP2009019096A (ja) * | 2007-07-11 | 2009-01-29 | Du Pont Toray Co Ltd | カバーレイ |
US9631054B2 (en) * | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US20130196134A1 (en) * | 2009-08-03 | 2013-08-01 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US8574720B2 (en) * | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
JP5824818B2 (ja) * | 2011-02-14 | 2015-12-02 | 三菱瓦斯化学株式会社 | 着色遮光ポリイミドフィルム |
WO2012133665A1 (ja) * | 2011-03-30 | 2012-10-04 | 宇部興産株式会社 | ポリイミドフィルム |
TW201302858A (zh) * | 2011-06-24 | 2013-01-16 | Du Pont | 有色聚醯亞胺膜及與其有關之方法 |
JP2013028767A (ja) * | 2011-07-29 | 2013-02-07 | Kaneka Corp | 絶縁性黒色ポリイミドフィルム、カバーレイフィルム及びフレキシブルプリント配線板 |
TWI481646B (zh) * | 2011-12-16 | 2015-04-21 | Taimide Technology Inc | 由聚醯亞胺粉體構成之消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法 |
-
2013
- 2013-08-27 TW TW102130703A patent/TWI487745B/zh active
-
2014
- 2014-04-29 CN CN201410177387.8A patent/CN104419013B/zh active Active
- 2014-05-30 US US14/292,254 patent/US20150064484A1/en not_active Abandoned
- 2014-06-16 JP JP2014123352A patent/JP5902236B2/ja active Active
- 2014-06-16 KR KR20140072801A patent/KR20150024763A/ko active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
JP5902236B2 (ja) | 2016-04-13 |
US20150064484A1 (en) | 2015-03-05 |
JP2015044977A (ja) | 2015-03-12 |
KR20150024763A (ko) | 2015-03-09 |
TW201508030A (zh) | 2015-03-01 |
CN104419013A (zh) | 2015-03-18 |
TWI487745B (zh) | 2015-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104419013B (zh) | 呈色聚酰亚胺膜 | |
TWI492970B (zh) | 粉狀呈色消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法 | |
KR101470079B1 (ko) | 폴리이미드 분말로 이루어진 소광제, 상기 소광제를 포함하는 폴리이미드 필름, 및 이들의 제조 방법 | |
CN104277457B (zh) | 聚酰亚胺膜 | |
TWI493571B (zh) | 透明電極 | |
CN104553183B (zh) | 含有聚酰亚胺粉体消光剂的多层聚酰亚胺膜及其制造方法 | |
TW201446840A (zh) | 聚醯亞胺及其製造方法、聚醯胺酸及其製造方法、聚醯胺組成物、聚醯胺酸組成物、聚醯胺酸清漆、乾膜、膜、光學膜以及可饒性顯示器用基板 | |
CN104419205A (zh) | 黑色聚酰亚胺膜及其加工方法 | |
TWI490274B (zh) | 聚醯亞胺基聚合物、應用聚醯亞胺基聚合物之聚醯亞胺膜與應用聚醯亞胺基聚合物之聚醯亞胺積層板 | |
JP2021042382A (ja) | ポリイミドフィルム及び電子デバイス | |
EP3441428B1 (en) | Polyimide resin composition, method for producing same, and polyimide film | |
CN102260408A (zh) | 黑色聚酰亚胺薄膜及含所述薄膜的铜箔层合板 | |
CN111607225B (zh) | 聚酰亚胺膜及电子装置 | |
WO2019131896A1 (ja) | ポリイミド、ポリイミド溶液組成物、ポリイミドフィルム、及び基板 | |
TWI535759B (zh) | 由聚醯亞胺粉體構成之消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法 | |
US11718728B2 (en) | Single layer polymer films and electronic devices | |
TWI834630B (zh) | 聚醯亞胺、聚醯亞胺溶液組成物、聚醯亞胺膜及包含其的基材積層體、基板、顯示器,以及其製造方法 | |
TWI515230B (zh) | 聚醯亞胺高分子及應用聚醯亞胺高分子之聚醯亞胺膜 | |
JP2022051284A (ja) | タッチパネルディスプレイ用フィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |