CN104380714B - 拍摄元件和拍摄装置 - Google Patents

拍摄元件和拍摄装置 Download PDF

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Publication number
CN104380714B
CN104380714B CN201380029815.6A CN201380029815A CN104380714B CN 104380714 B CN104380714 B CN 104380714B CN 201380029815 A CN201380029815 A CN 201380029815A CN 104380714 B CN104380714 B CN 104380714B
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China
Prior art keywords
pixel
signal processing
signal
pixels
chip
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CN201380029815.6A
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English (en)
Chinese (zh)
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CN104380714A (zh
Inventor
村田宽信
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Nikon Corp
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Nikon Corp
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Priority to CN201811112546.0A priority Critical patent/CN109068074B/zh
Priority to CN201811107730.6A priority patent/CN109040626B/zh
Priority to CN201811112520.6A priority patent/CN109089061B/zh
Publication of CN104380714A publication Critical patent/CN104380714A/zh
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Publication of CN104380714B publication Critical patent/CN104380714B/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201380029815.6A 2012-06-08 2013-06-05 拍摄元件和拍摄装置 Active CN104380714B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201811112546.0A CN109068074B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811107730.6A CN109040626B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811112520.6A CN109089061B (zh) 2012-06-08 2013-06-05 拍摄元件和拍摄装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-131232 2012-06-08
JP2012131232 2012-06-08
PCT/JP2013/003533 WO2013183291A1 (ja) 2012-06-08 2013-06-05 撮像素子および撮像装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN201811107730.6A Division CN109040626B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811112520.6A Division CN109089061B (zh) 2012-06-08 2013-06-05 拍摄元件和拍摄装置
CN201811112546.0A Division CN109068074B (zh) 2012-06-08 2013-06-05 拍摄元件

Publications (2)

Publication Number Publication Date
CN104380714A CN104380714A (zh) 2015-02-25
CN104380714B true CN104380714B (zh) 2018-10-23

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
CN201380029815.6A Active CN104380714B (zh) 2012-06-08 2013-06-05 拍摄元件和拍摄装置
CN201811112546.0A Active CN109068074B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811107730.6A Active CN109040626B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811112520.6A Active CN109089061B (zh) 2012-06-08 2013-06-05 拍摄元件和拍摄装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201811112546.0A Active CN109068074B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811107730.6A Active CN109040626B (zh) 2012-06-08 2013-06-05 拍摄元件
CN201811112520.6A Active CN109089061B (zh) 2012-06-08 2013-06-05 拍摄元件和拍摄装置

Country Status (6)

Country Link
US (4) US9832408B2 (enExample)
EP (2) EP3496394A1 (enExample)
JP (3) JP6265120B2 (enExample)
CN (4) CN104380714B (enExample)
IN (1) IN2014DN11141A (enExample)
WO (1) WO2013183291A1 (enExample)

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CN104380714B (zh) 2012-06-08 2018-10-23 株式会社尼康 拍摄元件和拍摄装置
JP6217458B2 (ja) * 2014-03-03 2017-10-25 ソニー株式会社 半導体装置およびその製造方法、並びに電子機器
WO2016046685A1 (en) * 2014-09-26 2016-03-31 Semiconductor Energy Laboratory Co., Ltd. Imaging device
JP6608185B2 (ja) * 2015-06-18 2019-11-20 キヤノン株式会社 積層型イメージセンサおよび撮像装置
US9947700B2 (en) * 2016-02-03 2018-04-17 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
CN109196647B (zh) * 2016-03-31 2023-08-22 株式会社尼康 摄像元件以及摄像装置
EP3324545B1 (en) * 2016-11-22 2024-04-24 ams AG Image sensor and method for readout of an image sensor
JPWO2018109821A1 (ja) * 2016-12-13 2019-10-24 オリンパス株式会社 固体撮像装置および撮像装置
JP6869847B2 (ja) * 2017-08-01 2021-05-12 株式会社日立製作所 アナログデジタル変換器及びそれを用いた超音波診断装置用プローブ
JP7102119B2 (ja) * 2017-09-29 2022-07-19 キヤノン株式会社 半導体装置および機器
CA3034407C (en) * 2018-02-20 2021-05-04 Bradford Brainard Sensor to encoder signal converter
SE542767C2 (en) * 2018-05-15 2020-07-07 Xcounter Ab Sensor unit and radiation detector
JP7384212B2 (ja) * 2019-09-30 2023-11-21 株式会社ニコン 撮像素子、及び、撮像装置
JP7647262B2 (ja) * 2021-04-08 2025-03-18 株式会社ニコン 撮像素子および撮像装置
JP7574169B2 (ja) * 2021-11-12 2024-10-28 キヤノン株式会社 光電変換装置、光電変換システムおよび移動体

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JP4458678B2 (ja) * 1998-10-07 2010-04-28 浜松ホトニクス株式会社 高速視覚センサ装置
JP4232755B2 (ja) * 2005-04-05 2009-03-04 株式会社デンソー イメージセンサ及びイメージセンサの制御方法
TWI429066B (zh) * 2005-06-02 2014-03-01 新力股份有限公司 Semiconductor image sensor module and manufacturing method thereof
CN101228631A (zh) * 2005-06-02 2008-07-23 索尼株式会社 半导体图像传感器模块及其制造方法
JP2007096633A (ja) * 2005-09-28 2007-04-12 Matsushita Electric Ind Co Ltd 映像信号処理装置およびデジタルカメラ
JP4752447B2 (ja) * 2005-10-21 2011-08-17 ソニー株式会社 固体撮像装置およびカメラ
JP5106092B2 (ja) * 2007-12-26 2012-12-26 パナソニック株式会社 固体撮像装置およびカメラ
TWI504256B (zh) * 2008-04-07 2015-10-11 Sony Corp 固態成像裝置，其訊號處理方法，及電子設備
JP5392533B2 (ja) * 2008-10-10 2014-01-22 ソニー株式会社 固体撮像素子、光学装置、信号処理装置及び信号処理システム
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JP5359611B2 (ja) * 2009-06-29 2013-12-04 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および電子機器
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JP5716347B2 (ja) * 2010-10-21 2015-05-13 ソニー株式会社 固体撮像装置及び電子機器
JP5581982B2 (ja) * 2010-11-10 2014-09-03 株式会社ニコン 撮像装置
JP5633323B2 (ja) * 2010-11-11 2014-12-03 ソニー株式会社 固体撮像装置及び電子機器
JP5862126B2 (ja) * 2011-09-06 2016-02-16 ソニー株式会社 撮像素子および方法、並びに、撮像装置
US8890047B2 (en) * 2011-09-21 2014-11-18 Aptina Imaging Corporation Stacked-chip imaging systems
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CN104380714B (zh) * 2012-06-08 2018-10-23 株式会社尼康 拍摄元件和拍摄装置

Also Published As

Publication number Publication date
US20190260956A1 (en) 2019-08-22
US10321082B2 (en) 2019-06-11
US10652495B2 (en) 2020-05-12
US20180098016A1 (en) 2018-04-05
EP2860965A1 (en) 2015-04-15
IN2014DN11141A (enExample) 2015-09-25
JP2020061756A (ja) 2020-04-16
EP3496394A1 (en) 2019-06-12
JP2018082464A (ja) 2018-05-24
CN104380714A (zh) 2015-02-25
CN109089061A (zh) 2018-12-25
JP6631615B2 (ja) 2020-01-15
US20150163441A1 (en) 2015-06-11
WO2013183291A1 (ja) 2013-12-12
CN109040626B (zh) 2022-01-21
JP6265120B2 (ja) 2018-01-24
US20200244915A1 (en) 2020-07-30
US9832408B2 (en) 2017-11-28
CN109068074A (zh) 2018-12-21
JPWO2013183291A1 (ja) 2016-01-28
CN109089061B (zh) 2022-01-21
US11418747B2 (en) 2022-08-16
CN109068074B (zh) 2022-01-25
JP6977756B2 (ja) 2021-12-08
CN109040626A (zh) 2018-12-18
EP2860965A4 (en) 2016-01-06

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