CN1043341C - 制造气密焊接装置的方法和此方法在制造带有真空密封外壳的构件上的应用 - Google Patents

制造气密焊接装置的方法和此方法在制造带有真空密封外壳的构件上的应用 Download PDF

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CN1043341C
CN1043341C CN94192484A CN94192484A CN1043341C CN 1043341 C CN1043341 C CN 1043341C CN 94192484 A CN94192484 A CN 94192484A CN 94192484 A CN94192484 A CN 94192484A CN 1043341 C CN1043341 C CN 1043341C
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克劳斯·格斯纳
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Abstract

为了在陶瓷件与铜件之间进行真空密封焊接时简化焊接过程，首先在铜件(10、13、15)上电镀一个银层(20)，它与在它之下的铜件表面层一起构成焊料。在为焊接所要求进行热处理时，金属件(6、16、17)也能以此一样的方法与铜件焊接，例如波纹管(12)或真空开关管的屏蔽(16)。

Description

制造气密焊接装置的方法和此方法在制造带有真空密封外壳的构件上的应用
本发明属于真空电子学领域，并在采用一种焊料气密地焊接陶瓷件与铜件时可应用此发明。
在陶瓷件与铜件之间进行气密式焊接，在例如大功率管和真空开关管中是常见的。对真空开关管公开了一种焊接技术，其中，帽形的铜外壳与陶瓷板对接焊，这时进行一种所谓的夹封焊接。在这种情况下，首先使陶瓷板的焊接区金属化。为了进行焊接，在铜件与陶瓷件之间的过渡区放上一个钎焊环，在焊接所要求的热处理时钎焊环熔化，于是焊料将铜件与陶瓷件在它们接触界面区域内互相连接起来(EP 0040933 B1，图7和图8)。这时作为焊料通常采用所谓铜-银低共熔混合物钎料，它们的形状例如有薄膜状或线材线环状(“真空电子学手册”，Josef Eichmeier和Hinrich Heynisch著，慕尼黑/维也纳R,Oldenbourg出版社出版，1989年，第22页)。
为了在陶瓷件与金属件之间进行焊接，例如制造真空开关管时进行气密和牢固地焊接，公开了一种焊接技术，其中，使陶瓷件的焊接区金属化后，在陶瓷件上镀了第一层银和然后另一层铜。当它与要连接的构件接合后，在钎焊条件下形成了均匀的铜/银合金，它构成了真正的焊剂。此外，特别在焊接陶瓷件与薄铜板时规定，在金属化的陶瓷件上只电镀银层。在要连接的构件加热到961℃时，在薄铜板区形成了一种熔点约780℃的低共熔混合物(DE 3824900A1)。这种在铜件接合区表面形成真正的焊剂的焊接技术，看来只适合对焊，却不适用于夹封焊。
以具有权利要求1(DE 3824900 A1)前序部分所述特征的方法为出发点，本发明的目的是，通过形成大量焊剂，简化和改善这种焊接的实施。
为达到上述目的，按本发明规定，铜件在热处理前，无论是焊接区还是毗连真正焊接位置的表面区，都电镀以银层。
在这种方法中，往往非常困难的为焊接部位备制焊料的工作便成为多余。由于将铜件大的表面层都算作一种只是在焊接过程才产生的低共熔合金的组成部分，所以，包括电镀银层在内的焊接过程的操作大为简化，银层的厚度取决于焊接面积和铜件的几何尺寸，它可以在2～100微米之间。尤其在夹封时，用这种方法可制备足够多量的焊料。在特殊的使用情况下此时还存在这样的可能性，即利用铜件与陶瓷件进行连接的焊接过程同时进行另一项焊接，尤其是将铜件与另一个金属件连接起来。在这些情况下，铜件整个地可以有一个银层。例如在制造真空开关管时，亦即制造具有一个真空密封外壳的构件时，当铜件制成外壳帽罩或外壳法兰时，铜件同时与波纹管和轴套焊接，以导引活动的接触销。
应用新方法的实施例表示在图1至图4中，附图中：
图1为真空开关管在活动接触销区内的局部示图；
图2和图3所示为真空开关管在活动接触销导引区要焊接的构件；
图4所示同样为直接或间接地与陶瓷件连接的真空开关管的金属件。
图1表示了真空开关管的局部，属于此真空开关管的有圆柱形外壳1，环状的陶瓷绝缘子2和外壳帽3。活动接触头5的接触销4穿过外壳帽3。波纹管6将接触销4与外壳帽3真空密封地连接起来。此外，轴承套7与外壳帽3连接，轴承套7内装有接触销4的轴承8。
外壳帽3用铜制成，它的一侧与陶瓷绝缘子2对接焊。此外，外壳帽3还与钢制的波纹管6的一端对接焊，以及与铜合金制的轴承套7焊接。为了准备好焊接过程，一方面使陶瓷绝缘子的焊接区喷镀图中没有详细表示的金属层，除此之外，铜制的外壳帽3全部电镀厚度约20微米的银层。在焊接温度约800℃时，银层与外壳帽3的表面层形成了一种低共熔的合金，它作为焊料在不同的焊接部位起作用。以此方式，外壳帽3既与陶瓷绝缘子2，又与波纹管6的一端以及与轴承套7，在一个工序中焊接在一起。
图2和图3表示实施焊接过程前不同的应用情况。按图2，铜帽10上部分地电镀了图上用点划线表示的银层20。铜帽10放在圆柱形陶瓷绝缘子11的端面上。陶瓷绝缘子11的端面区设有金属化层21。
此外，对波纹管12如此设置，使它以其设计为圆柱形凸台的那一端，对接地贴靠在外壳帽10上。
如图3所示，基本上只在内表面镀有银层20的铜制外壳帽13，与陶瓷绝缘子11的端面平面地连接。波纹管12与铜帽13对接焊。
如图4所示，两个陶瓷绝缘子11和14通过一个中间环15互相连接，以及分别与毗连的外壳帽10和13连接。中间环15应附加地和屏蔽16连接，外壳帽13应附加地和屏蔽环17连接。此外，规定波纹管12与外壳帽10连接。为此目的，外壳帽10和13以及中间环15均用铜制。外壳帽10和13局部电镀银层20，而中间环15全部镀以银层20。屏蔽16和屏蔽环17同样由铜制成，而波纹管12用优质钢制造，它可以在焊接区设有一个非常薄的贵金属层，尤其是镀金层。因此，在外壳或真空开关管的这种结构中，可以在唯一的一道工序中，完成七项连接，无须为此采用特别的焊剂。

Claims (2)

1、在陶瓷件和铜件之间进行气密式焊接的方法，按此方法，首先使陶瓷件的焊接区金属化，然后将铜件放在陶瓷件上，借助于一种通过热处理形成的铜-银低共熔物构成的焊料，使铜件与陶瓷件连接起来，其特征在于：铜件(10、13、15)在热处理前，无论在焊接区，还是在与实际上的焊接部位毗连的表面区，均电镀以一个银层(20)。
2、如权利要求1所述方法在制造带有真空密封外壳的构件上的应用，其中，外壳具有一个铜的外壳部分，其特征在于：银层(20)还被敷在铜件(10、13、15)的这样一些区域内，即在这些区域，铜件还附加地要与其他一些金属件(6、16、17)焊接；以及在铜件与陶瓷件(11、14)焊接的同时进行铜件与那些金属件的焊接。
CN94192484A 1993-06-18 1994-06-10 制造气密焊接装置的方法和此方法在制造带有真空密封外壳的构件上的应用 Expired - Fee Related CN1043341C (zh)

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FR (1) FR2706448B1 (zh)
WO (1) WO1995000459A1 (zh)

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DE4320910C1 (de) 1994-09-08
FR2706448A1 (fr) 1994-12-23
US6533161B1 (en) 2003-03-18
JP3670008B2 (ja) 2005-07-13
FR2706448B1 (fr) 1995-11-24
WO1995000459A1 (de) 1995-01-05
JPH08511505A (ja) 1996-12-03
KR960703101A (ko) 1996-06-19
CN1125434A (zh) 1996-06-26

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