CN114799588A - 一种预成型盖板附着金锡焊环的电阻点焊预封装方法 - Google Patents
一种预成型盖板附着金锡焊环的电阻点焊预封装方法 Download PDFInfo
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- CN114799588A CN114799588A CN202210632323.7A CN202210632323A CN114799588A CN 114799588 A CN114799588 A CN 114799588A CN 202210632323 A CN202210632323 A CN 202210632323A CN 114799588 A CN114799588 A CN 114799588A
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- gold
- spot welding
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- resistance spot
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- 238000003466 welding Methods 0.000 title claims abstract description 225
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000011261 inert gas Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 14
- 229910000833 kovar Inorganic materials 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000003723 Smelting Methods 0.000 claims description 3
- 238000002848 electrochemical method Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000010884 ion-beam technique Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 20
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/10—Spot welding; Stitch welding
- B23K11/11—Spot welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Resistance Welding (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN202210632323.7A CN114799588B (zh) | 2022-06-07 | 2022-06-07 | 一种预成型盖板附着金锡焊环的电阻点焊预封装方法 |
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CN202210632323.7A CN114799588B (zh) | 2022-06-07 | 2022-06-07 | 一种预成型盖板附着金锡焊环的电阻点焊预封装方法 |
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CN114799588A true CN114799588A (zh) | 2022-07-29 |
CN114799588B CN114799588B (zh) | 2024-04-26 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115302130A (zh) * | 2022-09-01 | 2022-11-08 | 广东省索艺柏科技有限公司 | 一种预成型盖板附着金锡焊环的烧结依附预封装方法 |
CN117412517A (zh) * | 2023-12-14 | 2024-01-16 | 深圳市紫宸激光设备有限公司 | 基于视觉识别的复合焊接质量控制方法及系统 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08141745A (ja) * | 1994-11-22 | 1996-06-04 | Nippon Avionics Co Ltd | Icの気密封止方法 |
US20050121420A1 (en) * | 2003-12-05 | 2005-06-09 | Tad Janicki | Electric welder, electrode and method of use thereof for spot-weld tacking eutectic solder to thin film depositions on non-conductive substrates |
CN103028804A (zh) * | 2012-12-28 | 2013-04-10 | 汕尾市栢林电子封装材料有限公司 | 一种芯片密封盖板覆预成型焊片的方法 |
CN103056500A (zh) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | 半导体陶瓷外壳封帽的焊接方法 |
CN104952808A (zh) * | 2015-06-12 | 2015-09-30 | 广州先艺电子科技有限公司 | 一种预置金锡盖板及其制造方法 |
CN207077138U (zh) * | 2017-07-27 | 2018-03-09 | 广州先艺电子科技有限公司 | 一种精密焊接专用工装夹具 |
CN109514018A (zh) * | 2018-12-10 | 2019-03-26 | 贵州振华风光半导体有限公司 | 一种半导体器件的金锡环封盖工艺方法 |
CN110899978A (zh) * | 2019-12-26 | 2020-03-24 | 江阴丽晶电子科技有限公司 | 一种陶瓷盖板的金锡焊料激光附着组件及其附着方法 |
CN211438596U (zh) * | 2019-12-26 | 2020-09-08 | 江阴丽晶电子科技有限公司 | 一种陶瓷盖板的金锡焊料激光附着组件 |
-
2022
- 2022-06-07 CN CN202210632323.7A patent/CN114799588B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08141745A (ja) * | 1994-11-22 | 1996-06-04 | Nippon Avionics Co Ltd | Icの気密封止方法 |
US20050121420A1 (en) * | 2003-12-05 | 2005-06-09 | Tad Janicki | Electric welder, electrode and method of use thereof for spot-weld tacking eutectic solder to thin film depositions on non-conductive substrates |
CN103056500A (zh) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | 半导体陶瓷外壳封帽的焊接方法 |
CN103028804A (zh) * | 2012-12-28 | 2013-04-10 | 汕尾市栢林电子封装材料有限公司 | 一种芯片密封盖板覆预成型焊片的方法 |
CN104952808A (zh) * | 2015-06-12 | 2015-09-30 | 广州先艺电子科技有限公司 | 一种预置金锡盖板及其制造方法 |
CN207077138U (zh) * | 2017-07-27 | 2018-03-09 | 广州先艺电子科技有限公司 | 一种精密焊接专用工装夹具 |
CN109514018A (zh) * | 2018-12-10 | 2019-03-26 | 贵州振华风光半导体有限公司 | 一种半导体器件的金锡环封盖工艺方法 |
CN110899978A (zh) * | 2019-12-26 | 2020-03-24 | 江阴丽晶电子科技有限公司 | 一种陶瓷盖板的金锡焊料激光附着组件及其附着方法 |
CN211438596U (zh) * | 2019-12-26 | 2020-09-08 | 江阴丽晶电子科技有限公司 | 一种陶瓷盖板的金锡焊料激光附着组件 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115302130A (zh) * | 2022-09-01 | 2022-11-08 | 广东省索艺柏科技有限公司 | 一种预成型盖板附着金锡焊环的烧结依附预封装方法 |
CN117412517A (zh) * | 2023-12-14 | 2024-01-16 | 深圳市紫宸激光设备有限公司 | 基于视觉识别的复合焊接质量控制方法及系统 |
CN117412517B (zh) * | 2023-12-14 | 2024-03-12 | 深圳市紫宸激光设备有限公司 | 基于视觉识别的复合焊接质量控制方法及系统 |
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Effective date of registration: 20240310 Address after: 230031, 2nd Floor, Building 4, No. 1666 Ningxi Road, High tech Zone, Hefei City, Anhui Province Applicant after: Hefei Sox Surface Treatment Technology Co.,Ltd. Country or region after: China Address before: 516600 second floor, office building, No. 1, Qingxin Road, Hongcao high tech Zone, Shanwei City, Guangdong Province Applicant before: Guangdong suoyibe Technology Co.,Ltd. Country or region before: China Applicant before: Lin Yaowei |
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